E72-2G4M05S1F CC2652RB Multifunctional SoC Wireless Module

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1 Introduction

1.1 Brief Introduction

The E72-2G4M05S1F is a self-developed, multi-protocol, 2.4GHz, SMD, wireless SoC module based on TI's CC2652RB. It features a transmit power of 5dBm, an integrated ARM microcontroller, and a high-performance wireless transceiver. With an integrated BAW (Bulk Acoustic Wave) resonator for generating the radio frequency carrier, no external 48MHz crystal is required.

The module exposes all IO ports of the MCU. It is powered by a 48 MHz Arm Cortex-M4F processor, includes an internal integrated power amplifier, and offers powerful peripherals along with up to 26 GPIOs, enabling multi-directional development. The CC2652RB has the potential to become a leading choice for wireless microcontrollers in smart home, IoT transformation, and industrial automation applications.

As this module is a System-on-Chip (SoC) module, it requires user programming before it can be used.

1.2 Features

• Powerful 48 MHz Arm Cortex-M4F processor.
• Rich resources: 352KB FLASH, 80KB RAM.
• 1.8-3.8V power supply; operation above 3.3V ensures optimal performance.
• Transmit power: 5dBm.
• Under ideal conditions, the communication distance can reach 350m with an external antenna.
• Includes an external 32.768K low-speed crystal oscillator.
• Industrial grade standard design, supporting operation from -40°C to 85°C for extended periods.
• 2-pin cJTAG and JTAG debugging support.
• Over-The-Air (OTA) update support.
• Wireless protocols: Thread, Zigbee®, Bluetooth® 5 Low Energy.
• Receiving sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded.

1.3 Application

Building automation solutions

• Building Security System: Motion Detector, electronic intelligent door lock, door and window sensor, Garage door system, gateway.
• HVAC: Thermostat, wireless sensor, HVAC system controller, gateway.
• Fire safety system: Smoke and temperature detectors, Fire Alarm Control Panel (FACP).
• Video surveillance: IP webcam.
• Elevators and escalators: Elevator mains, Elevator and escalator control panel.

Grid infrastructure

• Smart meter: Water meter, gas meter, electricity meter, and heat cost allocator.

Other applications

• Grid communication: Wireless communication, remote sensor applications.
• Industrial transport: Asset tracking.
• Plant automation and control.
• Medical devices.
• Electronic Point of Sale (EPOS): Electronic shelves.
• Label (ESL) applications.

2 Specification and parameter

2.1 Limit parameter

2.2 Operating parameter

3 Size and pin definition

The module has dimensions of 26*16mm. It uses a PCB or IPEX antenna with 50Ω impedance.

Diagram showing module dimensions and pin layout. The main body is labeled 'ANT' for antenna. Pin numbers are indicated around the perimeter.

4 Development

5 Basic operation

5.1 Hardware design

• Use a DC stabilized power supply with the smallest possible ripple factor and ensure reliable grounding.
• Pay close attention to the correct connection of the positive and negative poles of the power supply; reverse connection can cause permanent damage to the module.
• Ensure the power supply is within the recommended voltage range; exceeding the maximum voltage will permanently damage the module.
• Verify power supply stability; voltage should not fluctuate greatly or frequently.
• When designing the power supply circuit, reserve more than 30% margin for long-term stable operation.
• Position the module as far as possible from sources of large electromagnetic interference such as power supplies, transformers, and high-frequency wiring.
• Avoid high-frequency digital routing, high-frequency analog routing, and power routing on the bottom layer directly under the module. If routing is necessary, ensure the module is soldered to the Top Layer, with copper spread on the Top Layer contact area (well-grounded), and routed close to the module's digital part on the Bottom Layer.
• If the module is soldered or placed on the Top Layer, avoid random routing on the Bottom Layer or other layers, as this can negatively affect the module's spurs and receiving sensitivity.
• If devices with significant electromagnetic interference are present nearby, keep them away from the module based on interference strength. Isolation and shielding may be necessary.
• Similarly, if traces with large electromagnetic interference (high-frequency digital, analog, power) are around the module, maintain distance and consider isolation/shielding.
• Avoid physical layers that use the 2.4GHz band, such as USB3.0.
• The antenna's mounting structure significantly impacts performance. Ensure the antenna is exposed, preferably oriented vertically. If the module is mounted inside a case, use a good antenna extension cable to position the antenna externally.
• The antenna must not be installed inside a metal case, as this will greatly weaken transmission distance.

5.2 Programming

• The core of this module is the CC2630. Users can refer to the CC2630 chip manual for detailed operation instructions.
• Note: The module utilizes the chip's DC/DC converter.
• Burn program: For SOC modules with GPIO ports, program download is performed using the XDS100 dedicated downloader.

Program download interface definition:

Diagram illustrating the JTAG interface definition between E72 PINs and XDS100 PORTs, showing pin mappings like TMSC to TMS, TCKC to TCK, etc.

6 FAQ

6.1 Communication range is too short

• Communication distance is affected by obstacles.
• Data loss rate is influenced by temperature, humidity, and co-channel interference.
• The ground can absorb and reflect wireless radio waves, leading to poor performance when testing near the ground.
• Sea water has a high capacity for absorbing wireless radio waves, resulting in poor performance when testing near the sea.
• Signal strength is affected when the antenna is near metal objects or placed within a metal case.
• Incorrect power register settings or excessively high air data rates (which shorten distance) can cause issues.
• Low power supply voltage at room temperature, below the recommended value, reduces transmitting power.
• Antenna quality or poor matching between the antenna and module can also be a factor.

6.2 Module is easy to damage

• Ensure the power supply source is within the recommended voltage range; exceeding the maximum voltage will permanently damage the module.
• Verify the stability of the power source; voltage fluctuations should be minimal.
• Implement antistatic measures during installation and use, as high-frequency devices are susceptible to electrostatic discharge.
• Ensure humidity levels are within the specified range, as some components are sensitive to moisture.
• Avoid using modules under excessively high or low temperatures.

6.3 BER (Bit Error Rate) is high

• Nearby co-channel interference can cause high BER. Move away from interference sources or adjust frequency and channel to mitigate.
• An unreliable power supply can lead to messy code and high BER. Ensure the power supply is stable.
• Poor quality or excessively long extension lines and feeders can result in a high bit error rate.

7 Production guidance

7.1 Reflow soldering temperature

The following tables detail the recommended reflow soldering temperature profiles for Sn-Pb and Pb-Free assemblies.

Sn-Pb Assembly (Sn63/Pb37)

Pb-Free Assembly (Sn96.5/Ag3/Cu0.5)

7.2 Reflow soldering curve

Diagram illustrating a typical reflow soldering temperature curve. It shows temperature on the Y-axis and time on the X-axis, with distinct phases: Preheat (Tsmin to Tsmax), Ramp-up, Liquidous (TL), Peak (Tp), and Ramp-down, including critical zones and time durations.

8 E72 series

This table provides specifications for various modules in the E72 series.

9 Antenna recommendation

9.1 Recommendation

The antenna plays a crucial role in communication performance. Selecting a suitable antenna can significantly improve the communication system. EBYTE recommends the following antennas for wireless modules, offering excellent performance and reasonable pricing.

10 Bulk packing

Diagram illustrating the bulk packing method for the modules, showing a reel with dimensions and cavity layout for the modules. It indicates a quantity of 1000 pcs per tray.

Revision history

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