User Manual for RENESAS models including: VK-RA8M1 V2, RA8 Series Voice Kit Micro Controller, RA8 Series, Voice Kit Micro Controller, Kit Micro Controller, Micro Controller, Controller
2024-05-31 — Clock signals. After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during ...
RA8M1 음성 키트(VK-RA8M1) - Renesas | Mouser
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DocumentDocumentUser' s Manual RA8M1 Group Voice Kit for RA8M1 Microcontroller Group VK-RA8M1 V2 User's Manual Renesas RA Family RA8 Series All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, including the Renesas Electronics Corp. website (http://www.renesas.com). www.renesas.com Rev.1.00 May 2024 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information. 2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples. 3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 4. You shall be responsible for determining what licenses are required from any third parties, and obtaining such licenses for the lawful import, export, manufacture, sales, utilization, distribution or other disposal of any products incorporating Renesas Electronics products, if required. 5. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering. 6. Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The intended applications for each Renesas Electronics product depends on the product's quality grade, as indicated below. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; industrial robots; etc. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc. Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user's manual or other Renesas Electronics document. 7. No semiconductor product is absolutely secure. Notwithstanding any security measures or features that may be implemented in Renesas Electronics hardware or software products, Renesas Electronics shall have absolutely no liability arising out of any vulnerability or security breach, including but not limited to any unauthorized access to or use of a Renesas Electronics product or a system that uses a Renesas Electronics product. RENESAS ELECTRONICS DOES NOT WARRANT OR GUARANTEE THAT RENESAS ELECTRONICS PRODUCTS, OR ANY SYSTEMS CREATED USING RENESAS ELECTRONICS PRODUCTS WILL BE INVULNERABLE OR FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE, HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION ("Vulnerability Issues"). RENESAS ELECTRONICS DISCLAIMS ANY AND ALL RESPONSIBILITY OR LIABILITY ARISING FROM OR RELATED TO ANY VULNERABILITY ISSUES. FURTHERMORE, TO THE EXTENT PERMITTED BY APPLICABLE LAW, RENESAS ELECTRONICS DISCLAIMS ANY AND ALL WARRANTIES, EXPRESS OR IMPLIED, WITH RESPECT TO THIS DOCUMENT AND ANY RELATED OR ACCOMPANYING SOFTWARE OR HARDWARE, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE. 8. When using Renesas Electronics products, refer to the latest product information (data sheets, user's manuals, application notes, "General Notes for Handling and Using Semiconductor Devices" in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges. 9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you. 10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions. 12. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document. 13. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics. 14. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products. (Note1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries. (Note2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. (Rev.5.0-1 October 2020) Corporate Headquarters TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. Contact information For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/. © 2024 Renesas Electronics Corporation. All rights reserved. General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products. 1. Precaution against Electrostatic Discharge (ESD) A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices. 2. Processing at power-on The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level at which resetting is specified. 3. Input of signal during power-off state Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Follow the guideline for input signal during power-off state as described in your product documentation. 4. Handling of unused pins Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible. 5. Clock signals After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable. 6. Voltage application waveform at input pin Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.). 7. Prohibition of access to reserved addresses Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these addresses as the correct operation of the LSI is not guaranteed. 8. Differences between products Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems. The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product. Renesas VK-RA8M1 Disclaimer By using this VK-RA8M1, the User accepts the following terms, which are in addition to, and control in the event of disagreement, with Renesas' General Terms and Conditions available at https://www.renesas.com/en-us/legal/disclaimer.html. The VK-RA8M1 is not guaranteed to be error free, and the entire risk as to the results and performance of the VK-RA8M1 is assumed by the User. The VK-RA8M1 is provided by Renesas on an "as is" basis without warranty of any kind whether express or implied, including but not limited to the implied warranties of good workmanship, fitness for a particular purpose, title, merchantability, and non-infringement of intellectual property rights. Renesas expressly disclaims any implied warranty. Renesas does not consider the VK-RA8M1 to be a finished product and therefore the VK-RA8M1 may not comply with some requirements applicable to finished products, including, but not limited to recycling, restricted substances and electromagnetic compatibility regulations. Refer to Certifications section, for information about certifications and compliance information for the VK-RA8M1. It is the kit User's responsibility to make sure the kit meets any local requirements applicable to their region. Renesas or its affiliates shall in no event be liable for any loss of profit, loss of data, loss of contract, loss of business, damage to reputation or goodwill, any economic loss, any reprogramming or recall costs (whether the foregoing losses are direct or indirect) nor shall Renesas or its affiliates be liable for any other direct or indirect special, incidental or consequential damages arising out of or in relation to the use of this VK-RA8M1, even if Renesas or its affiliates have been advised of the possibility of such damages. Renesas has used reasonable care in preparing the information included in this document, but Renesas does not warrant that such information is error free nor does Renesas guarantee an exact match for every application or parameter to part numbers designated by other vendors listed herein. The information provided in this document is intended solely to enable the use of Renesas products. No express or implied license to any intellectual property right is granted by this document or in connection with the sale of Renesas products. Renesas reserves the right to make changes to specifications and product descriptions at any time without notice. Renesas assumes no liability for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas cannot verify, and assumes no liability for, the accuracy of information available on another company's website. Precautions This Voice Kit is only intended for use in a laboratory environment under ambient temperature and humidity conditions. A safe separation distance should be used between this and any sensitive equipment. Its use outside the laboratory, classroom, study area, or similar such area invalidates conformity with the protection requirements of the Electromagnetic Compatibility Directive and could lead to prosecution. The product generates, uses, and can radiate radio frequency energy and may cause harmful interference to radio communications. There is no guarantee that interference will not occur in a particular installation. If this equipment causes harmful interference to radio or television reception, which can be determined by turning the equipment off or on, you are encouraged to try to correct the interference by one or more of the following measures: · Ensure attached cables do not lie across the equipment. · Reorient the receiving antenna. · Increase the distance between the equipment and the receiver. · Connect the equipment into an outlet on a circuit different from that which the receiver is connected. · Power down the equipment when not in use. · Consult the dealer or an experienced radio/TV technician for help. Note: It is recommended that wherever possible shielded interface cables are used. The product is potentially susceptible to certain EMC phenomena. To mitigate against them it is recommended that the following measures be undertaken: · The user is advised that mobile phones should not be used within 10 m of the product when in use. · The user is advised to take ESD precautions when handling the equipment. The Voice Kit does not represent an ideal reference design for an end product and does not fulfill the regulatory standards for an end product. User's Manual Renesas RA Family VK-RA8M1 V2 Contents 1. Kit Contents.............................................................................................................................4 2. Kit Ordering Information...........................................................................................................4 3. Kit Overview ............................................................................................................................4 4. Kit Architecture ........................................................................................................................6 4.1 System Block Diagram ............................................................................................................................ 6 4.2 Jumper Settings ...................................................................................................................................... 6 4.2.1 Traditional Pin Header Jumpers............................................................................................................ 6 4.2.2 Copper Jumpers .................................................................................................................................... 7 5. MCU Port Mapping ..................................................................................................................8 6. Implementation Details ............................................................................................................9 6.1 OSPI NOR flash ...................................................................................................................................... 9 6.2 PMOD .................................................................................................................................................... 10 6.3 Microphones .......................................................................................................................................... 10 6.4 Audio out ............................................................................................................................................... 11 6.5 LEDs ...................................................................................................................................................... 12 6.6 Buttons .................................................................................................................................................. 12 6.7 Audio breakout to MIC board ................................................................................................................ 13 6.8 Debug .................................................................................................................................................... 13 6.9 Power Requirements ............................................................................................................................. 15 6.9.1 Power Supply Options ......................................................................................................................... 15 6.9.2 Option 1: Debug USB .......................................................................................................................... 15 6.9.3 Option 2: USB C Full Speed................................................................................................................ 15 6.9.4 Option 3: External Power Supply ........................................................................................................ 15 6.9.5 Power-up Behavior .............................................................................................................................. 15 6.10 USB ....................................................................................................................................................... 16 6.11 MIC-Board ............................................................................................................................................. 16 6.11.1 Microphones ........................................................................................................................................ 16 6.11.2 Audio out ............................................................................................................................................. 19 6.11.3 Audio breakout .................................................................................................................................... 19 7. Certifications..........................................................................................................................20 7.1 EMC/EMI Standards.............................................................................................................................. 20 8. Design and Manufacturing Information ..................................................................................20 R30UZ0206EE0100 Rev.1.00 May.31.24 Page 1 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual 9. Website and Support .............................................................................................................21 Revision History............................................................................................................................22 Figures Figure 1. VK-RA8M1 Kit Contents ................................................................................................................... 4 Figure 2. System Block Diagram ..................................................................................................................... 6 Figure 3. Copper Jumpers ............................................................................................................................... 7 Figure 4. PMOD connector ............................................................................................................................ 10 Figure 5. Audio out ........................................................................................................................................ 12 Figure 6. Power Supply Options .................................................................................................................... 15 Figure 7. MIC-Board view .............................................................................................................................. 17 Tables Table 1. Default Jumper Settings .................................................................................................................... 7 Table 2. Default Copper Jumper Settings ....................................................................................................... 7 Table 3. MCU Port Assignments ..................................................................................................................... 8 Table 4. OSPI Flash Port Assignments ........................................................................................................... 9 Table 5. PMOD Port Assignments (J5) ......................................................................................................... 10 Table 6. Analog MEMS Microphone left channel (M1) Port Assignments .................................................... 10 Table 7. Analog MEMS Microphone left channel (M2) Port Assignments .................................................... 11 Table 8. Digital I2S MEMS Microphone channels (M3) Port Assignments ................................................... 11 Table 9. Digital I2S MEMS Microphone channels (M4) Port Assignments ................................................... 11 Table 10. Headphone Jack Pin Assignments................................................................................................ 11 Table 11. User LED Port Assignments .......................................................................................................... 12 Table 12. User Button Port Assignment (S1) ................................................................................................ 12 Table 13. Connector Port Assignment (J7) ................................................................................................... 13 Table 14. Supported Debug Modes............................................................................................................... 13 Table 15. Jumper Connection Summary for Different Debug ....................................................................... 13 Table 16. Debug USB Connector .................................................................................................................. 14 Table 17. 10-pin JTAG/SWD Connector (J12) .............................................................................................. 14 Table 18. 20-pin JTAG/SWD Connector (J13) .............................................................................................. 14 Table 19. Debug Port Signal Assignments.................................................................................................... 15 Table 20. USB Type-C Signal Assignments (J2) .......................................................................................... 16 Table 21. Digital PDM MEMS Microphone channels (M5) Port Assignments............................................... 17 Table 22. Digital PDM MEMS Microphone channels (M6) Port Assignments............................................... 17 Table 23. Digital PDM MEMS Microphone channels (M7) Port Assignments............................................... 18 Table 24. Digital PDM MEMS Microphone channels (M8) Port Assignments............................................... 18 Table 25. Digital PDM MEMS Microphone channels (M9) Port Assignments............................................... 18 Table 26. Digital PDM MEMS Microphone channels (M10) Port Assignments............................................. 18 R30UZ0206EE0100 Rev.1.00 May.31.24 Page 2 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual Table 27. Stereo Headphone Jack Pin Assignments .................................................................................... 19 Table 28. MIC-Board PMOD Port Assignments (J14) ................................................................................... 19 Table 29. VK-RA8M1 Design Package Contents .......................................................................................... 20 R30UZ0206EE0100 Rev.1.00 May.31.24 Page 3 of 22 Renesas RA Family 1. Kit Contents The following components are included in the kit: 1. VK-RA8M1 board 3. Mic Board 2. Micro USB device cable (type-A male to micro-B male) VK-RA8M1 V2 - User's Manual Figure 1. VK-RA8M1 Kit Contents 2. Kit Ordering Information VK-RA8M1 kit orderable part number: RTK0EG0005D00001BE 3. Kit Overview VK-RA8M1 is an edge voice user interface Voice kit designed to be used by Ecosystem Partners, Application Engineers, Field Application Engineers, and for Business Development opportunities. The primary purpose is to evaluate the functionality of projects developed by Ecosystem Partners, and to facilitate the development of additional partner projects. The kit design uses the RA8M1 MCU with LQFP 100pin package as the core logic device, with OSPI flash, OPAMP and power devices chosen from the Renesas product portfolio. · Renesas RA8M1 Microcontroller Group Arm® Cortex®-M85 core with HeliumTM LQFP 100pin package Maximum operating frequency: 480 MHz 2MB code flash memory 12KB data flash memory Flash Cache (FCACHE) 1MB SRAM 1KB Standby SRAM · Connectivity One USB micro AB full speed connector for the Main MCU SEGGER J-Link® On-board (OB) interface for debugging and programming. A 10 pin JTAG/SWD interface is also provided for connecting optional external debuggers and programmers. One PMOD connector R30UZ0206EE0100 Rev.1.00 May.31.24 Page 4 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual One Auxiliary Port connector · Multiple Clock Sources Main clock oscillator (MOSC) (8 to 48 MHz) Sub-clock oscillator (SOSC) (32.768 kHz) High-speed on-chip oscillator (HOCO) (16/18/20/32/48 MHz) Middle-speed on-chip oscillator (MOCO) (8 MHz) Low-speed on-chip oscillator (LOCO) (32.768 kHz) · Microphones: 2 I2S MEMS digital microphones and 2 MEMS analog microphones. · Mic-Board Microphones: 6 MEMS digital microphones · Audio out: One stereo audio headphone jack supporting mono output on both channels. · Mic-Board Audio out: One stereo audio headphone jack supporting mono output on both channels. · LEDs: Five LEDs, D1 (Red), D2 (Green) and D3 (Blue) configurable by user, D6 (Blue) as a 3.3V power indicator, D8(Green) as a JLOB (J-LINK on board) indicator. · Buttons: One RESET button (S2), and one USER button (S1). · Debug: J-Link On-Board debug interface, supporting JTAG or SWD debug port. · USB: Micro USB-B (J9) for power input and J-Link On-Board function, USB-C (J2) for power input and RA8M1 USB Full Speed port as a USB device. R30UZ0206EE0100 Rev.1.00 May.31.24 Page 5 of 22 Renesas RA Family 4. Kit Architecture 4.1 System Block Diagram VK-RA8M1 V2 - User's Manual Figure 2. System Block Diagram 4.2 Jumper Settings Two types of jumpers are provided on the VK-RA8M1 board. 1. Traditional pin header jumpers copper jumpers 2. Copper jumpers (trace-cut type and solder bridge type) 4.2.1 Traditional Pin Header Jumpers These jumpers are traditional small pitch jumpers that require an external shunt to open/close them. The traditional pin jumpers on the VK-RA8M1 board are 2.54mm pitch headers and require compatible 2.54mm shunt jumpers. Default Jumper Configuration The following table describes the default settings for each jumper on the VK-RA8M1 board. This includes copper jumpers (Ex designation) and traditional pin jumpers (Jx designation.) Functional details for many of the listed jumpers may be found in sections associated with each functional area of the kits. R30UZ0206EE0100 Rev.1.00 May.31.24 Page 6 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual Table 1. Default Jumper Settings Location J3 J4 Default Open/Closed Open Open J6 Short J7 Open J10 Open Function Short to route I2C SDA signal to PMOD connector pin 4 Close to configures the RA8M1 MCU enter USB boot mode, code can be download through J2 USB TYPE-C connector. For MCU current measurement, remove this jumper wire and serial with a current meter to measure MCU current. Short with MIC Board to enable Audio breakout Short with a jumper wire to set on board debug RA4M2 MCU(U7) in RESET for disable on board debug. 4.2.2 Copper Jumpers Copper jumpers are of two types, designated trace-cut and solder-bridge. A trace-cut jumper is provided with a narrow copper trace connecting its pads. The silk screen overlay printing around a trace-cut jumper is a solid box. To isolate the pads, cut the trace between pads adjacent to each pad, then remove the connecting copper foil either mechanically or with the assistance of heat. Once the etched copper trace is removed, the trace-cut jumper is turned into a solder-bridge jumper for any later changes. A solder-bridge jumper is provided with two isolated pads that may be joined together by one of three methods: Solder may be applied to both pads to develop a bulge on each and the bulges joined by touching a soldering iron across the two pads. A small wire may be placed across the two pads and soldered in place. A SMT resistor, size 0805, 0603, or 0402, may be placed across the two pads and soldered in place. A zero-ohm resistor shorts the pads together. For any copper jumper, the connection is considered closed if there is an electrical connection between the pads (default for trace-cut jumpers.) The connection is considered open if there is no electrical connection between the pads (default for the solder-bridge jumpers.) Figure 3. Copper Jumpers Table 2. Default Copper Jumper Settings Location E1 E2 E5 E6 E7 E8 E9 E10 Default Open/Closed Function SWCLK SWDIO VCOM_TXD VCOM_RXD DA0/ DA out to OPAMP, audio out AN000 to VOUT2 U3, Analog microphone left channel AN001 to VOUT1 U3, Analog microphone right channel P201/MD signal, cut it then the J12, J13 can be debug out function R30UZ0206EE0100 Rev.1.00 May.31.24 Page 7 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual 5. MCU Port Mapping Table 3. MCU Port Assignments Port P000 P001 P002 P003 P004 P005 P006 P007 P008 P013 P014 P015 P100 P101 P102 P103 P104 P105 P106 P107 P112 P113 P114 P115 P201 P200 P205 P206 P208 P209 P210 P211 P212 P213 P300 P301 P302 P303 P304 P305 P306 P307 P308 P400 P401 P402 Assigned Function(s) Optional header for GPIOs Optional header for GPIOs Optional header for GPIOs Optional header for GPIOs Analog microphone left channel Analog microphone right channel Not Used Not Used Not Used VREFL DA0/ DA out to OPAMP, audio out Not Used OSPI_DQ0 OSPI_DQ3 OSPI_DQ4 OSPI_DQ2 Test point P104 OSPI_INT# OSPI_RESET OSPI_CS# SSISCK0 SSILRCK0 SSIRXD0 SSITXD0 NMI, pull-high with 10K Boot Mode, The MCU enter SCI and USB boot mode if the MD pin is held low on release the reset signal, it is for download code to MCU flash memory. SCL1 of J7 Audio breakout to MIC board SDA1 of J7 Audio breakout to MIC board TDIR TDOR SWDIO SWCLK Clock Crystal, optional, not populated on this kit Clock Crystal, optional, not populated on this kit Test point P300 Test point P301 Test point P302 Not Used Not Used Not Used Not Used Not Used Not Used IRQ0 for user button S1 Not Used Not Used R30UZ0206EE0100 Rev.1.00 May.31.24 Page 8 of 22 Renesas RA Family Port P403 P404 P405 P406 P407 P408 P409 P410 P411 P412 P413 P414 P415 P600 P609 P610 P708 P800 P801 P802 P803 P804 P808 P809 P814 P815 Assigned Function(s) Not Used User LED, red color User LED, green color User LED, blue color USB VBUS, USB cable connection monitor pin PMOD SPI MISO / UART RXD / I2C SCL PMOD SPI MOSI / UART TXD / I2C SDA PMOD SCK PMOD SS / UART CTS_RTS PMOD GPIO PMOD GPIO PMOD GPIO PMOD IRQ8 DA7218# of J7 Audio breakout to MIC board VCOM_RXD to J-LINK OB VCOM_TXD to J-LINK OB Not Used OSPI_DQ5 OSPI_DS OSPI_DQ6 OSPI_DQ1 OSPI_DQ7 OSPI_CK Not Used USBFS_DP USBFS_DM VK-RA8M1 V2 - User's Manual 6. Implementation Details 6.1 OSPI NOR flash There is one OSPI Flash on board. The device is ISSI IS25LX512M-JHLE 512 Mbit, 133 MHz in a 24-ball TFBGA 6x8mm (5x5 ball array) package. Table 4. OSPI Flash Port Assignments MCU Port P808 P107 P100 P803 P103 P101 P102 P800 P802 P804 OSPI Signal CLK Chip Select DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 OSPI Pin C2 B2 D3 D2 C4 D4 D5 E3 E2 E1 R30UZ0206EE0100 Rev.1.00 May.31.24 Page 9 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual 6.2 PMOD One PMOD type 2A/3A/6A connector (2x6 pin, dual row, right angle socket) is included. Table 5. PMOD Port Assignments (J5) MCU Port P411 P409 P408 P410 P415 P414 P413 P412 PMOD Type 2A Signal CS MOSI MISO SCK GND +3.3V INT GPIO GPIO GPIO GND +3.3V PMOD Type 3A Signal CTS_RTS TXD RXD GND +3.3V INT GPIO GPIO GPIO GND +3.3V PMOD Type 6A Signal NC NC SCL SDA GND +3.3V INT GPIO GPIO GPIO GND +3.3V PMOD connector Pin 1 2 3 4 5 6 7 8 9 10 11 12 Figure 4. PMOD connector 6.3 Microphones This board includes a pair of analog MEMS microphones (M1 & M2, 3SM121LZB1HA). These 2 analog microphone signals are amplified by Renesas READ2302GSP OPAMP, then fed to RA8M1 AN channels 0 & 1. A pair of digital I2S MEMS microphone (M3 & M4, ZillTek ZTS6672) is also provided, which is connected to RA8M1 SSI channel. The physical distance between each microphone is 14mm. Table 6. Analog MEMS Microphone left channel (M1) Port Assignments MCU Port P005 MEMS microphone Pin M1.1 OUT M1.2 GND M1.3 GND M1.4 GND M1.5 VDD R30UZ0206EE0100 Rev.1.00 May.31.24 Page 10 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual Table 7. Analog MEMS Microphone left channel (M2) Port Assignments MCU Port P004 MEMS microphone Pin M2.1 OUT M2.2 GND M2.3 GND M2.4 GND M2.5 VDD Table 8. Digital I2S MEMS Microphone channels (M3) Port Assignments MCU Port P113 P114 SSI Signal SSILRCK0 GND for Select as left channel GND SSIRXD0 3.3V SSIBCK0 MEMS microphone Pin M3.1 LRC M3.2 SELECT M3.3 GND M3.4 BCLK M3.5 VDD M3.6 DATA M3.7 CONFIG Table 9. Digital I2S MEMS Microphone channels (M4) Port Assignments MCU Port P113 P114 SSI Signal SSILRCK0 3.3V for Select as right channel GND SSIRXD0 3.3V SSIBCK0 MEMS microphone Pin M4.1 LRC M4.2 SELECT M4.3 GND M4.4 BCLK M4.5 VDD M4.6 DATA M4.7 CONFIG 6.4 Audio out A headphone jack is connected to the MCU DAC. The DAC signals are connected through an OPAMP. The device is Renesas READ2302GSP, in ultra-small 8 pins TSSOP packages. Table 10. Headphone Jack Pin Assignments MCU Port P014 (DA0) Audio out Signal VOUT1 VOUT2 VOUT2 Headphone Jack Pin 1 (Sleeve) 2 (Mono signal) 3 (Mono signal) R30UZ0206EE0100 Rev.1.00 May.31.24 Page 11 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual Figure 5. Audio out 6.5 LEDs 3 LEDs are included on the board and are connected to the MCU I/O. These are Red, Green, and Blue, and can be used for any user defined functions. Table 11. User LED Port Assignments MCU Port Connected User LED P404 Red (D1) P405 Green (D2) P406 Blue (D3) D6 (blue) is power LED, and D8 (Green) is debug status LED to indicate the status of the JLOB connection. 6.6 Buttons There are two mechanical push-button switches on the board. One button is for system/MCU reset (S2). The second button is a user programmable button (S1). Table 12. User Button Port Assignment (S1) MCU Port P400 User Button Interrupt IRQ0 R30UZ0206EE0100 Rev.1.00 May.31.24 Page 12 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual 6.7 Audio breakout to MIC board One connector (2x5 pin, dual row, right angle socket) is included (J7) and is used for the Audio Breakout connector. Plug with MIC BOARD will pull low DA7218#, I2S bus will automatic mux to DA7218. Table 13. Connector Port Assignment (J7) MCU Port P600 P205 P206 Connector Signal GND +3.3V DA7218# NA I2S_DAT_IN1 I2S_DAT_OUT1 2S_LRCK1 I2S_BCK1 SCL1 SDA1 Connector Pin 1 2 3 4 5 6 7 8 9 10 6.8 Debug The VK-RA8M1 board supports following three debug modes. Table 14. Supported Debug Modes Debug Modes Debug MCU (one that connects to the IDE on PC) Target MCU (one that is being debugged) Debug on-board RA4M2 (on-board) RA8M1 (on-board) Debug in External debugging tools RA8M1 (on-board) Debug out RA4M2 (on-board) Any external RA MCU Notes: · Please cut E10 for Debug out function · See Table 16 for the Debug USB connector pin definition. · See Table 17 for the 10-pin JTAG connector pin definition. · See Table 18 for the 20-pin JTAG connector pin definition. Debugging Interface/Protocol SWD, JTAG SWD, JTAG SWD, JTAG Connector Used Micro USB (J9) 20-pin connector (J13) NoP or 10-pin connector (J12) 20-pin connector (J13) NoP or 10-pin connector (J12) Table 15. Jumper Connection Summary for Different Debug Debug Modes Debug on-board Debug in Debug out J10 Open Closed Open R30UZ0206EE0100 Rev.1.00 May.31.24 Page 13 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual The J-Link On-Board (JLOB) debug interface supports JTAG, SWD debug interface and also supports the VCOM (Virtual COM port) function. The debug MCU is a Renesas RA4M2, programmed with J-Link firmware licensed by SEGGER. This interface includes one USB micro-B connector (J9) for host debug through the JLink MCU, one 10-pin and one 20-pin debug header (supporting JTAG and SWD). Table 16. Debug USB Connector Debug USB Connector(J9) RA4M2 Pin Description Signal / Bus J9-1 +5VDC VBUS2 / TP5 J9-2 Data- D_N J9-3 Data+ D_P J9-4 USB ID, jack internal switch, cable inserted N.C. J9-5 Ground GND Table 17. 10-pin JTAG/SWD Connector (J12) Pin J12-1 J12-2 J12-3 J12-4 J12-5 J12-6 J12-7 J12-8 J12-9 J12-10 JTAG Pin Name Vtref TMS GND TCK GND TDO Key TDI GND Detect nSRST SWD Pin Name Vtref SWDIO GND SWCLK GND Key GND Detect nSRST Signal/Bus +3V3 P108/SWDIO GND P300/SWCLK GND N.C. GND RESET# Table 18. 20-pin JTAG/SWD Connector (J13) Pin J13-1 J13-2 J13-3 J13-4 J13-5 J13-6 J13-7 J13-8 J13-9 J13-10 J13-11 J13-12 J13-13 J13-14 J13-15 J13-16 J13-17 J13-18 J13-19 J13-20 JTAG Pin Name Vtref TMS GND TCK GND TDO Key TDI GND Detect nSRST N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A SWD Pin Name Vtref SWDIO GND SWCLK GND Key GND Detect nSRST N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A Signal/Bus +3V3 P108/SWDIO GND P300/SWCLK GND P109 N.C. P110 GND RESET# GND N.C. GND N.C. GND N.C. GND N.C. GND N.C. R30UZ0206EE0100 Rev.1.00 May.31.24 Page 14 of 22 Renesas RA Family Table 19. Debug Port Signal Assignments RA8M1 MCU Port P108 P109 P110 P300 Debug signal usage TMS/SWDIO TDO TDI TCK/SWCLK VK-RA8M1 V2 - User's Manual 6.9 Power Requirements VK-RA8M1 is designed for +5V operation. An on-board Low Dropout Regulator (LDO) is used to convert the 5V supply to 3.3V, which is then used to power the main MCU and many of the peripheral features of the VKRA8M1. 6.9.1 Power Supply Options VK-RA8M1 can be powered in three different ways as described in this section. Figure 6. Power Supply Options 6.9.2 Option 1: Debug USB 5V may be supplied from an external USB host to the USB Debug connector (J9). Power from this source is connected to the Main System 5V Power. Reverse current protection is provided between this connector and the Main System 5V Power. 6.9.3 Option 2: USB C Full Speed 5V may be supplied from an external USB host to the USB C connector (J2) labelled USB C on the board. Power from this source is connected to the Main System 5V Power. Reverse current protection is provided between this connector and the Main System 5V Power. 6.9.4 Option 3: External Power Supply 5V may be supplied from an external header (J1). 6.9.5 Power-up Behavior When powered, the blue D6 LED will light up. See the VK-RA8M1 Getting Started Guide for further information on initial power up behavior. R30UZ0206EE0100 Rev.1.00 May.31.24 Page 15 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual 6.10 USB The board includes one USB TYPE-C connector (J2), supporting USB Full Speed device mode. Table 20. USB Type-C Signal Assignments (J2) MCU Port DA_P DA_N DA_P DA_N USB-C Signal Name Ground TX1+ TX1VBUS Configuration Detection (CC1) DP1 DN1 Configuration Detection (SBU1) VBUS RX2RX2+ Ground 2 Ground 2 TX2+ TX2VBUS Configuration Detection (CC2) DP2 DN2 Configuration Detection 2(SBU2) VBUS RX1RX1+ Ground G USB-C Connection A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 6.11 MIC-Board MIC-Board can be connected to J7 in VK-RA8M1 to add I2S MEMS microphones. 6.11.1 Microphones This board includes 6 digital I2S MEMS microphones (M5, M6, M7, M8, M9 & M10, 3SM222KMB1HA). Uses two topologies. Topology 1: Square array of 4 mics spaced by 40mm (edge length). Microphones M5, M6, M7, M8. (short J16, pin1-2). Topology 2: Equilateral triangle array of 3 mics located to the corners, spaced by 40mm (edge length) and the fourth mic at the center. Microphones M5, M6, M9, M10. (short J16, pin2-3). MIC board includes the Renesas DA7218 IC Audio codec. R30UZ0206EE0100 Rev.1.00 May.31.24 Page 16 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual Figure 7. MIC-Board view Table 21. Digital PDM MEMS Microphone channels (M5) Port Assignments MCU Port DA7218 Port DMIC1N DMIC1CLK P112_SSISCK0 P113_SSILRCK0 P115_SSITXD0 P114_SSIRXD0 I2S_BCK1 I2S_LRCK1 I2S_DAT_IN1 I2S_DAT_OUT1 MEMS microphone Pin M5.1 LRC M5.2 SELECT - GND M5.3 GND M5.4 CLK M5.5 VDD Table 22. Digital PDM MEMS Microphone channels (M6) Port Assignments MCU Port DA7218 Port DMIC1N DMIC1CLK P112_SSISCK0 P113_SSILRCK0 P115_SSITXD0 P114_SSIRXD0 I2S_BCK1 I2S_LRCK1 I2S_DAT_IN1 I2S_DAT_OUT1 MEMS microphone Pin M6.1 LRC M6.2 SELECT - 3.3V M6.3 GND M6.4 CLK M6.5 VDD R30UZ0206EE0100 Rev.1.00 May.31.24 Page 17 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual Table 23. Digital PDM MEMS Microphone channels (M7) Port Assignments MCU Port DA7218 Port DMIC2N DMIC2CLK P112_SSISCK0 P113_SSILRCK0 P115_SSITXD0 P114_SSIRXD0 I2S_BCK1 I2S_LRCK1 I2S_DAT_IN1 I2S_DAT_OUT1 MEMS microphone Pin M7.1 LRC M7.2 SELECT - GND M7.3 GND M7.4 CLK M7.5 VDD Table 24. Digital PDM MEMS Microphone channels (M8) Port Assignments MCU Port DA7218 Port DMIC2N DMIC2CLK P112_SSISCK0 P113_SSILRCK0 P115_SSITXD0 P114_SSIRXD0 I2S_BCK1 I2S_LRCK1 I2S_DAT_IN1 I2S_DAT_OUT1 MEMS microphone Pin M8.1 LRC M8.2 SELECT - 3.3V M8.3 GND M8.4 CLK M8.5 VDD Table 25. Digital PDM MEMS Microphone channels (M9) Port Assignments MCU Port DA7218 Port DMIC2N DMIC2CLK P112_SSISCK0 P113_SSILRCK0 P115_SSITXD0 P114_SSIRXD0 I2S_BCK1 I2S_LRCK1 I2S_DAT_IN1 I2S_DAT_OUT1 MEMS microphone Pin M9.1 LRC M9.2 SELECT - GND M9.3 GND M9.4 CLK M9.5 VDD Table 26. Digital PDM MEMS Microphone channels (M10) Port Assignments MCU Port DA7218 Port DMIC2N DMIC2CLK P112_SSISCK0 P113_SSILRCK0 P115_SSITXD0 P114_SSIRXD0 I2S_BCK1 I2S_LRCK1 I2S_DAT_IN1 I2S_DAT_OUT1 MEMS microphone Pin M10.1 LRC M10.2 SELECT - 3.3V M10.3 GND M10.4 CLK M10.5 VDD R30UZ0206EE0100 Rev.1.00 May.31.24 Page 18 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual 6.11.2 Audio out A stereo headphone jack is connected to the Audio CODEC. The device is Renesas DA7218. Table 27. Stereo Headphone Jack Pin Assignments Audio CODEC Port B4 A5 A3 Audio out Signal HP_SENSE HPL HRP Headphone Jack Pin 1 (Sleeve) 2 (Mono signal) 3 (Mono signal) 6.11.3 Audio breakout One interface (2x5 pin, dual row, right angle socket) is included (J14) and is used as Audio Breakout connector with J7 in VK-RA8M1 Motherboard. Plug with MIC BOARD, I2S bus will automatic mux to DA7218. Table 28. MIC-Board PMOD Port Assignments (J14) Audio CODEC Port J7 Connector Port MCU Port C7 1B1 C9 4B1 D8 2B1 D6 3B1 C11 D12 P205 P206 Interface Signal PMOD connector Pin GND 1 +3.3V 2 GND 3 NA 4 I2S_DAT_IN1 5 I2S_DAT_OUT1 6 2S_LRCK1 7 I2S_BCK1 8 SCL1 9 SDA1 10 R30UZ0206EE0100 Rev.1.00 May.31.24 Page 19 of 22 Renesas RA Family 7. Certifications 7.1 EMC/EMI Standards · FCC Notice (Class A) VK-RA8M1 V2 - User's Manual This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE- This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/television technician for help. · Innovation, Science and Economic Development Canada ICES-003 Compliance: CAN ICES-3 (A)/NMB-3(A) · CE Class A (EMC) This product is herewith confirmed to comply with the requirements set out in the Council Directives on the Approximation of the laws of the Member States relating to electromagnetic Compatibility Directive 2004/108/EEC. Warning This is a Class A product. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures to correct this interference. 8. Design and Manufacturing Information The design and manufacturing information for the VK-RA8M1 V2 kit is available in the "VK-RA8M1 V2 Design Package" available on renesas.com/vk-ra8m1. · Design package file name: VK-RA8M1-V2-designpackage.zip · Design package contents Table 29. VK-RA8M1 Design Package Contents Design Package Contents File Type File (PDF) File (PDF) File (PDF) File (PDF) Folder Folder Content Schematics Mechanical Drawing 3D Drawing BOM Manufacturing Files Design Files File/Folder Name VK-RA8M1-V2-schematics VK-RA8M1-V2-mechdwg VK-RA8M1-V2-3d VK-RA8M1-V2-bom Manufacturing Files Design Files-Altium R30UZ0206EE0100 Rev.1.00 May.31.24 Page 20 of 22 Renesas RA Family VK-RA8M1 V2 - User's Manual 9. Website and Support Visit the following URLs to learn about the kit and the RA family of microcontrollers, download tools and documentation, and get support. VK-RA8M1 Resources RA Product Information RA Product Support Forum Renesas Support www.renesas.com/vk-ra8m1 www.renesas.com/ra www.renesas.com/ra/forum www.renesas.com/support R30UZ0206EE0100 Rev.1.00 May.31.24 Page 21 of 22 Renesas RA Family Revision History Rev. 1.00 Date May.31.24 VK-RA8M1 V2 - User's Manual Description Page Summary - First release document R30UZ0206EE0100 Rev.1.00 May.31.24 Page 22 of 22 VK-RA8M1 V2 - User's Manual Publication Date: May.31.24 Published by: Renesas Electronics Corporation VK-RA8M1 V2 User's Manual R30UZ0206EE0100