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workstations :: thinkstation p series workstations :: thinkstation pxcontentdetail - Lenovo Support US
User Guide for Lenovo models including: PX Pinnacle of Workstation Technology, PX, Pinnacle of Workstation Technology, of Workstation Technology, Workstation Technology, Technology
File Info : application/pdf, 23 Pages, 1.29MB
DocumentDocumentLenovo PX rs Ve ion: 2.0 | 07/18/2023 w ds Do nloa H rdw r a a e Maintenance u Man al r rs w r D ive & Soft a e rs Available Whitepape H PX MM r rs d w r PX D ive an Soft a e: w r ur r Po e Config ato r ur r Memo y Config ato r ur r Sto age Config ato d ws 11 I s Win o n tallation d ws 10 I s Win o n tallation d H E r r s u 9 I s Re at nte p i e Lin x n tallation u u u 22 0 I s Ub nt Lin x . 4 LTS n tallation E I N I r r w S CT O : Platfo m Ove vie s r De c iption CPU r ss r u r P oce o S ppo t Socket Type s rs Di claime s d The pinnacle of Lenovo technology, the ThinkStation PX goe beyon s d s r r s r the limit of e ktop pe fo mance to enable even the mo t ext eme w r ws ur r d d ss s d s d w o kflo . Feat ing a the mally a vance cha i co- e igne ith s r s du I r ss rs A ton Ma tin, the late t al 4th Gen ntel® Xeon® Scalable p oce o , u 120 r s d su r r u ur N I I 6000 d p to co e , an ppo t fo p to fo V D A RTXTM Aa r s s w r s w r us ru s s Gene ation GPU , thi o k tation po e ho e n the mo t complex u w r ds s ss comp ting o kloa eamle ly. u r I r ss rs D al 4th Gene ation ntel Xeon Scalable P oce o E 6 Socket- (LGA-4 77) r s s Ope ating Sy tem r d d P eloa e u r d S ppo te s rs Di claime d ws 11 r 6 r r s Win o d ws 10 r 6 r r s Win o d ws 10 I Win o u u 22 0 ur s Ub nt P o 4-bit fo Wo k tation P o 4-bit fo Wo k tation OT . 4 LTS (config ation pecific) d ws 10 E r r s Ed Win o d H E r r s u 9 Re at u u 22 0 Ub nt nte p i e nte p i e Lin x . 4 LTS ition .x r Memo y s Slot s Channel Type E u r CC S ppo t d Spee I z Max D MM Si e s r Max Sy tem Memo y s rs Di claime 16 I 8 I s r Up to D MMS ( D MM pe CPU) 8 r s r Memo y Channel pe CPU 5 288 E I d 3 I DDR , -Pin, CC RD MM an DS RD MM* s Ye Up to 4800MHz 6 5 E I 4GB DDR 128 5 E 3 I GB DDR CC RD MM CC DS-RD MM 2TB u r d s d d *Act al Memo y Spee i epen ent on the CPU. r Sto age s z Total Bay /Si e SATA I 2 PC e (M. ) s rs Di claime Up to 4 3 8680 s x SFF- Receptacle 1 3 0 rs x SATA . Connecto 3 2 N 2280 I rs rd x M. 2 N 2280 r ss r s 4 x M. VMe VMe PC e Connecto Onboa F ont Acce ible D ive r r r d s us s *See Sto age Whitepape fo etail on the available age option . d Vi eo I r d r s nteg ate G aphic s r r s Di c ete G aphic u u r M lti-GPU S ppo t Type us I r B nte face s rs Di claime Not Available I dd I rd s w PC e A - n-Ca , Detail in Section Belo s Ye I dd I rd PC e A - n-Ca I PC e x16 Slots 1 Slot 2 Slot 3 Slot Slot 4 5 Slot 6 Slot Slot 7 8 Slot 9 Slot s rs Di claime I 0 16 u H u 5 2 PC e 4. x , F ll eight, F ll Length, 7 W (CPU ) I 0 16 u H u 5 2 PC e 4. x , F ll eight, F ll Length, 7 W (CPU ) I 5 0 16 u H u 5 2 PC e . x , F ll eight, F ll Length, 7 W (CPU ) I 5 0 16 u H u 5 2 PC e . x , F ll eight, F ll Length, 7 W (CPU ) I 0 8 u H u 25 E d d 2 PC e 4. x , F ll eight, F ll Length, W, Open n e (CPU ) I 5 0 16 u H u 5 1 PC e . x , F ll eight, F ll Length, 7 W (CPU ) I 0 16 u H u 5 1 PC e 4. x , F ll eight, F ll Length, 7 W (CPU ) I 5 0 16 u H u 5 1 PC e . x , F ll eight, F ll Length, 7 W (CPU ) I 0 16 u H u 5 1 PC e 4. x , F ll eight, F ll Length, 7 W (CPU ) Front I/O USB ud A io d rd d r Me ia Ca Rea e Flex Bay s rs Di claime 1 3 2 2 10 s x USB-A . Gen 1 3 2 2 10 s w w s r x USB-A . Gen 2 3 2 2 10 s x USB-C . Gen ( Gbp ) ( Gbp ) ( ( Gbp ) ith Al ay On Cha ging) 1 3 5 H ds H d x . mm Global ea et Jack ( ea phone + Mic in) N/A 3 r ss dr x F ont acce ive bay r r E sur r d w 2 d Rea Flex Sto age nclo e (Sha e ith n PSU Bay) N u r u u w r d d d ote: Act al USB th o gho t ill va y epen ing on the type an u d s us d q antity of USB evice e. Rear I/O USB ud A io s r Di playPo t HDMI r r Se ial Po t E r the net 2 PS/ N w r d r Optional et o k A apte 2 2 0 80 s x USB-A . (4 Mbp ) 3 2 1 5 s 4 x USB-A . Gen ( Gbp ) 1 3 2 2 2 20 s × x USB-C . Gen ( Gbp ) 2 r u I r s d s x Rea (Line O t, Line n eta ke a Mic) s u r d A S ppo te by GPU s u r d A S ppo te by GPU 1 r r Optional x Rea Po t 1 1 E 5 x Gb RJ4 1 10 E 5 x Gb RJ4 2 2 r I d r Optional PS/ ( po t) PC e a apte d 8168H 1000 I E r d r Bitlan RTL M PC e the net A apte I I210 1 r I E r d r ntel -T Single Po t Gigabit PC e the net A apte I I350 2 u r I E r d r ntel -T D al Po t Gigabit PC e the net A apte I I350 u d r I E r d r ntel -T4 Q a Po t Gigabit PC e the net A apte I 210 I I I d r w I r s ntel AX W F PC e A apte ith nte nal Antenna s rs Di claime Ethernet d r Ven o ds Spee u s F nction rs Connecto s rs Di claime Audio d r Ven o Type I r r nte nal Speake rs Connecto s Chip et Nu r s mbe of Channel Nu r s ud mbe of Bit /A io s u Re ol tion s rs Di claime Thermal s rs Temp Sen o N u r u u w r d d d ote: Act al USB th o gho t ill va y epen ing on the type an u d s us d q antity of USB evice e. u 10 E 113 1 Aq antia I 1 E I219 r ntel Gb Gb AQC C-B -C (Vp o, AMT) 1100//110000//11000000M /10bp 0s00InM tebl pI2s19Aquantia AQC113C E u r s PX , WOL, J mbo F ame I ASF, Teaming ( ntel only) 2 5 x RJ4 N N w r s ds s d r r ote: et o k pee li te a e theo etical. Realtek HD 2 0 ( . ) 1 1 5 w x . att 4 ohm 2 r 3 5 s u I r s d s x Rea . mm Jack (Line O t, Line n eta ke a Mic) 1 r 3 5 H ds H d x F ont . mm Global ea et Jack ( ea phone + Mic in) 89 d r r Realtek ALC 7Q Co ec ( ea ) 032 r Realtec ALC4 (f ont) r ud 2 s Rea A io: Channel r ud 2 s F ont A io: Channel r d Rea Co ec: 10 u r s 16 20 2 Channel DAC S ppo t / / 4-bit PCM 2 r u r s 16 20 2 Ste eo ADC S ppo t / / 4-bit PCM r d F ont Co ec: s r su r s 8 16 22 05 2 32 1 8 96 1 6 192 Hz One te eo DAC ppo t / / . / 4/ /44. /4 / 16 2 Sample Rate, / 4-bit s r su r s 8 16 22 05 2 32 1 8 96 Hz One te eo ADC ppo t / / . / 4/ /44. /4 / 16 2 Rate, / 4-bit / 7 .4/ K K Sample N ud d 89 su r 1 u * ote: A io Co ec ALC 7Q can ppo t 7. channel, b t r rd s 2 r r s I d u 2 mothe boa only ha ea jack M C in an Line o t, only r u fo Line o t. channel d s r r s r H d r d ss s Ambient Cable Sen o The mi to , MB ea e cable to cha i r z f ont be el I 1 s r r s r PC e Zone Sen o The mi to I 2 s r r s r PC e Zone Sen o The mi to I 3 s r r s r PC e Zone Sen o The mi to I s r r s r PC e Zone 4 Sen o The mi to 2 1 s r r s r M. Zone Sen o The mi to 2 2 s r r s r M. Zone Sen o The mi to I s r r s r M SC Sen o The mi to H 1 s r I2 s r DD Sen o C Temp Sen o s Fan s rs Di claime H 2 s r I2 s r DD Sen o C Temp Sen o H 3 s r I2 s r DD Sen o C Temp Sen o 2 H s r I2 s r PSU Bay ( DD) Sen o C Temp Sen o 2 r s N N1 6 d 1 r r 2 x F ont Fan (FRO T_FA ) -pin blin connect Connecto pe s Fan 1 r N N2 d 1 r r 1 x F ont Fan (FRO T_FA ) 4-pin blin connect Connecto pe s Fan 1 r N N3 d 1 r r 1 x F ont Fan (FRO T_FA ) 4-pin blin connect Connecto pe s Fan 2 r s E N1 6 d 1 r r 2 x Rea Fan (R AR_FA ) -pin blin connect Connecto pe s Fan 1 1 1 N d r w 3 x CPU Fan (CPU _FA ) 4-pin hea e ith -pin key 1 2 2 N d r w 3 x CPU Fan (CPU _FA ) 4-pin hea e ith -pin key 1 H H N Ed r x PSU DD Fan (PSU_ DD_FA ) PSU ge Connecto 3 H s H N d r w 3 x DD Fan ( DD_FA _X) 4-pin hea e ith -pin key 2 1 s r x PSU Fan inte nal of PSU 2 2 s r x PSU Fan inte nal of PSU 1 1 r 1 u d r w 3 x CPU Memo y Fan CPU _P mp_DDR 4-pin hea e ith -pin key 1 2 r 2 u d r w 3 x CPU Memo y Fan CPU _P mp_DDR 4-pin hea e ith -pin key Power Specifications w r u Po e S pply w r E Po e fficiency Main r Ope ating Voltage Range d Rate Voltage Range d r u Rate Line F eq ency r r u Ope ating Line F eq ency Range d I u urr Rate np t C ent r s G aphic w r u Po e S pply Fan ENE u d RGY STAR® Q alifie d d (config epen ent) 80 PLUS Compliant u s I E B ilt-in Self Te t (B ST) L D s rs Di claime 1850 w s att 92 E @ 50 d % fficient % Loa C20 100 2 0 u s s 4 V (a to en ing) 90-264VAC 47Hz / 63Hz 50Hz / 60Hz 13 20A 8 8 6 2 I Up to x -pin ( + ) PC e* s Ye s Ye s Ye s Ye u r s w r s s ur d d *Q antity of G aphic po e cable i config ation epen ent w r ur r r dd d s *See Po e Config ation Whitepape fo a itional etail . BIOS d r Ven o s rs Di claime I AM Chassis Information r Colo PSU r u s The mal Sol tion s s Dimen ion Weight s rs Di claime r r Sto m G ay d 1850 u s s 92 80 u u d One Fixe 2 d 1850 u s s 92 80 u Optional: n u d Q alifie W, A to en ing, % PSU, PLUS Platin m Q alifie W, A to en ing, % PSU, PLUS Platin m 2 r s Rea Fan r s 4 F ont Fan 1 r s r Fan pe to age bay 1 r Fan pe CPU 2 s r Fan pe PSU r s ur d d Memo y Fan (config ation epen ent) 3 1 1 H w u 4 4.4mm/ 7. 0 1 3 H w 44 .4mm/ 7. 5 5 22 6 7 mm/ . D 220 8 mm/ .7 W ( itho t feet) ( ith feet) 38 kg / 83.9 slb Packaging Dimensions Height (mm/in) d Wi th (mm/in) Depth (mm/in) s s Weight (kg /lb ) s rs Di claime 658mm / 25.91 397mm / 15.63 802mm / 31.57 40.135 kg / 88.48 slb Security & Serviceability TPM ss A et ID r vP o u r Cable Lock S ppo t r r ud Se ial, Pa allel, USB, A io, N w r E s r et o k, nable/Di able Po t r Cont ol w r Po e -On Password u Set p Password NI E s r d C L D (integ ate ) ss Acce Panel Key Lock u r Boot Seq ence Cont ol d u r Pa lock S ppo t u rd Boot Witho t Keyboa I I 96 2 2 0 nfineon SP TPM SLB 7 TPM . s 102 8 Ye , 4 x bit s Ye s s Ye , Optional Ken ington Cable Lock s Ye s Ye s Ye s Ye s Ye s Ye No s Ye d r us an /o Mo e ss Acce Panel Hard r s D ive E s rds xpan ion Ca r ss r P oce o Socket r d d s r u Colo Co e U e To ch s Point r rd d s Colo -coo inate Cable d rs an Connecto r Memo y s rd Sy tem Boa s r Re to e CD/DVD/USB Set s rs Di claime ss d r Tool-le Si e Cove Removal ss Tool-le ss Tool-le ss Tool-le * s Ye s Ye ss Tool-le d w r ws Retaine ith Sc e N I ud d s r d w d r ot ncl e , Re to e Me ia Available via Lenovo Do r Se vice r r u u r o available th o gh Lenovo S ppo t. nloa Recove y N H s ss r u r s 30 * ote: CPU eat ink a embly eq i e a T bit. r E r Ope ating nvi onment r r ur Ai Tempe at e r Sto age Hu d mi ity ud Altit e r Vib ation Shock s rs Di claime r 10 35 50 95 Ope ating: C to C ( F to F) r 0 60 0 1 0 r r Sto age: -4 C to r 10 60 1 1 0 u r Sto age: - C to C (-4 F to 4 F) in O iginal Shipping Ca ton C ( 4F to 4 F) Witho t Ca ton Hu d r 10 80 d s Relative mi ity Ope ating: % to % (non-con en ing) Hu d r r s 10 90 d s Relative mi ity Sto age/T an it: % to % (non-con en ing) u r ur r 25 Wet B lb Tempe at e Ope ating: C (77F) max u r ur N r 0 10 Wet B lb Tempe at e on-ope ating: 4 C ( 4F) max r s d r s 1 1 8 r 300 1000 s Uppe limit ec ea e °C ( . °F) pe m ( ft) above ea level r r Ope ating Vib ation: d 0 2 5 500 Hz 30 u s r ur Ran om, . 7G at - , N r r on-Ope ating Vib ation: d 1 0 2 200 Hz 15 u s r ur Ran om, . 4G at - , Min te Pe S face (X,Y,Z) ± ± ± Min te Pe S face ( X, Y, Z) r s 15 3 s s 30 3 s Ope ating: X,Y axi : +- G/ m Z axi : +- G/ m r u d s 15 3 s Ope ating (Rack mo nte ): X,Y,Z axi : +- G/ m N r r r z d s 35 r 11 s on-ope ating ta get: T ape oi al hock, g ave age, m E I N II r S CT O : Platfo m Detail rd z Boa Si e u Layo t 16.26 x 15.43 13 (4 mm x 392mm) us E d d Lenovo C tom xten e ATX r rd r Mothe boa Co e r ss r u r P oce o S ppo t Socket Type r u r Memo y S ppo t I r CPU-CPU nte connect u r Voltage Reg lato s H Chip et (PC ) s Fla h u r I S pe /O Clock ud A io E r the net I r ds r ss rs u d ntel Sapphi e Rapi r Silve ) Xeon Scalable P oce o (Platin m, Gol , E 6 Socket (LGA 4 77) 5 u 800 Hz I 3 I r DDR p to 4 M RD MM / DS RD MM Memo y I I 2 0 3 s 2 s ds 12 8 s 1 d 16 s ntel UP v . , link , x 4, at pee . GT/ , 4.4GT/S an GT/ I 1 0 00 ntel VR 4. 4 W TDP Capable I E s ur I 1 r s ntel mmit b g ( ntel C74 Se ie ) 2 6 x 4MB 2 E 1 23 1 6 x M C 7 ( 7 pin) E r xte nal Clock r d 89 r I Rea Co ec: Realtek ALC 7Q (Rea /O) r d 032 I F ont Co ec: Realtek ALC4 (FP O) u 10 113 1 Aq antia I 1 I219 ntel Gb Gb AQC C-B -C u r d s S ppo te Component r ss r P oce o Level Processor r Memo y Type r Memo y s rs Di claime I u ntel Xeon Platin m I d ntel Xeon Gol I r ntel Xeon Silve I E N r ntel X O Sapphi e ds u Rapi Platin m 8 90H 4 I E N r ntel X O Sapphi e ds u 8 68 Rapi Platin m 4 I E N r ntel X O Sapphi e ds d 6 30 Rapi Gol 4 I E N r ntel X O Sapphi e ds d 5 20 Rapi Gol 4+ I E N r ntel X O Sapphi e ds d 5 16 Rapi Gol 4S I E N r ntel X O Sapphi e ds r 16 Rapi Silve 44 + I E N r ntel X O Sapphi e ds r 10 Rapi Silve 44 Y I E N r ntel X O Sapphi e ds r 10 Rapi Silve 44 T I s 800 Hz RD MM 4 d Depen ent M , CPU 3 I s 800 Hz DS-RD MM 4 d Depen ent M , CPU 16 5 E I 5 GB DDR 800 4 32 5 E I 5 GB DDR 800 4 6 5 E I 5 4GB DDR 800 4 CC RD MM PC CC RD MM PC CC RD MM PC - 128 5 E 3 I GB DDR 5 800 PC -4 CC DS-RD MM dd s r d A itional CPU SKU' ce tifie . r Sto age 3 5 H rd s r . SATA a H( DD) Di k D ive 2 I d r M. PC e Soli State D ive (SSD) s rs Di claime 2 200r 6 s 3 5 TB SATA 7 6 200r 6 s 3 5 E r r s ss TB SATA 7 12 200r 6 s 3 5 E r r s ss TB SATA 7 pm, Gb/ , . pm, Gb/ , . ( nte p i e Cla ) pm, Gb/ , . ( nte p i e Cla ) 512 2 I 2280 N 2 0 GB M. PC e SSD, 102 2 I 2280 N 2 0 4GB M. PC e SSD, 20 8 2 I 2280 N 2 0 4 GB M. PC e SSD, 096 2 I 2280 N 2 0 4 GB M. PC e SSD, , Gen4 (x4), VMe, TLC, OPAL . , Gen4 (x4), VMe, TLC, OPAL . , Gen4 (x4), VMe, TLC, OPAL . , Gen4 (x4), VMe, TLC, OPAL . dd r d s r d A itional Sto age evice ce tifie . I RA D I u r s RA D Req i ement N s ote Intel VROC s rs Di claime 2 d I I r r M. an SATA RA D via ntel VROC Cont olle u r d I s r s s w r r s d S ppo te RA D level fo a y tem ill va y f om the tate s I r r du d d s u r capabilitie of the RA D cont olle e to epen encie on the n mbe d s d s s s s d us r an capacity of phy ical i k in the y tem an on c tome r u r s r r r u r r d r du d eq i ement fo pe fo mance, fa lt tole ance, o ata e n ancy. su r d I 0 1 5 10 Max ppo te RA D / / / . I r u I s u r s 0 1 10 ntel Vi t al RA D On CPU (VROC) Ba ic, S ppo t / / I r u I r u u r s 0 1 5 10 ntel Vi t al RA D On CPU (VROC) P emi m, S ppo t / / / N E ur s r u * OT : Some feat e available afte la nch r d Optical D ive/Removable Me ia rd d s Keyboa an Pointing Device rd Keyboa s Pointing Device r d rd USB T a itional Keyboa 2 r d rd PS/ T a ition Keyboa r rd rd Sma t Ca Keyboa rd USB Calliope Keyboa r r us USB Finge p int Mo e us USB Calliope Mo e 2 us PS/ Black Optical Mo e E s s xpan ion Bay 5 25 E r ss s . xte nal Acce Bay s rs Di claime 3 r ss dr s x F ont acce ive bay 1 r s r sur z s 2 d x Rea PSU bay to age enclo e (Utili e n PSU bay)* r ur w r r d d us See Sto age Config ation hitepape fo etaile s ur s *Only available on ingle PSU config ation age I d rs PC e A apte Network rds WiFi Ca 2 PS/ r Com po t d 8168H 1000 IE E r d r Bitlan I I210 1 r E r d r ntel I I350 2 u r E r d r ntel I I350 u d r E r d r ntel RTL M PC the net A apte -T Single Po t Gigabit the net A apte -T D al Po t Gigabit the net A apte -T4 Q a Po t Gigabit the net A apte I I rd I r 210 6E ntel PC e WiFi Ca With BT nte nal Antenna Kit (AX ) 2 2 r I d r PS/ ( -Po t) PC e a apte r r w 5 r s r Se ial COM po t cable ith V t an ceive E I N III u r d S CT O : S ppo te Component Detail s CPU Specification CPU r s # of Co e r ds # of Th ea r ss r s r u P oce o Ba e F eq ency ur r u Max T bo F eq ency I I I I I I I I I I I I I I I I I I III n n n n n n n n n n n n n n n n n n nnn t t t t t t t t t t t t t t t t t t ttt el el el el el el el el el el el el el el el el el el e e e XXXXXXXXXXXXXXXXXXl l l e e e e e e e e e e e e e e e e e e XXX o o ooooooooooooooooeee n n n n n n n n n n n n n n n n n n ooo P P GGGGGGGGGGGGGGGGn n n I I I L L O O O O O O O O O O O O O O O O S S S AAL L L L L L L L L L L L L L L L T I N T I N D 6 2 D 6 1 D 6 2 D 6 1 D 6 1 D 6 2 D 6 2 D 6 1 D 6 2 D 6 1 D 5 2 D 5 1 D 5 1 D 5 2 D 5 11 D 5 11 L V E L V E L V E 5 U U 8 8 M M 4 21 5 4 4 2 4 2 36 38 T 3 4 3 4 30 28 22 22 20 T 18 8 5 RRR 4 2 4 11 4 2 1 61 86 65 00 T 28 2 4 18 18 16 16 12 22 8 8 20 6 4 4 1 4 16 12 10 16 12 8 12 10 10 56 4 8 36 36 32 32 2 4 4 4 16 16 4 0 12 8 8 28 32 2 4 20 32 2 4 16 2 4 20 2 2 . 7 G H 2 .1 G H z 3 .1 G H z 3 G H z 2 .8 G H 2 .6 G H 3 G H z 19. G H z 3 .3 G H 3 .2 G H 2 .1 G H z 3 . 4 G H 3 .8 G H 3 .6 G H 2 .2 G H 2 .3 G H 2 .3 G H 2 . 4 G H 2 .1 G H z 2 .1 G H z 2 .5 G H 2 .2 G H z zz zz zzzzzzz zz 4343333343333333333333 G H z . 7 G H G H z . 7 G H .9 G H . 7 G H . 7 G H . 7 G H G H z . 7 G H .9 G H . 7 G H .9 G H . 7 G H .2 G H .9 G H .2 G H .2 G H .2 G H G H z .5 G H .2 G H z zzzzz zzzzzzzzzz zz Cache TDP 332222232221 1 1 1 21 1 21 1 8 3 2 2 0 9 6 6 9 2 6 3 2 6 . 44 4 5 2 5 2 5 5 2 5 5 M .7 .7 M M .7 . 5 5 5 5 5 5 5 5 5 M B BB 4 4 7. .7 .7 . M . . . MM . M M. 7 M. B BM BM 3 B L MM BB L 3 L 3 MMMMB BBBB L 3 L 3 MB B L 3 B L 3 M B L 3 BM LB 3 3L B L 3 2 15 2 2 15 15 15 12 13 13 12 11 10 10 10 12 10 8 00000005 005 5 5 5 5 5 5 5 5 0 0 W WWWWWWWWWWWWWW W WW Intel ARK Spec Link s rs Di claime I I I I I I I I I I I I I I I I I I III n n n n n n n n n n n n n n n n n n nnn t t t t t t t t t t t t t t t t t t ttt el el el el el el el el el el el el el el el el el el e e e XXXXXXXXXXXXXXXXXXl l l e e e e e e e e e e e e e e e e e e XXX o o ooooooooooooooooeee n n n n n n n n n n n n n n n n n n ooo P P GGGGGGGGGGGGGGGGn n n I I I L L O O O O O O O O O O O O O O O O S S S AAL L L L L L L L L L L L L L L L T I N T I N D 6 2 D 6 1 D 6 2 D 6 1 D 6 1 D 6 2 D 6 2 D 6 1 D 6 2 D 6 1 D 5 2 D 5 1 D 5 1 D 5 2 D 5 11 D 5 11 L V E L V E L V E 5 U U 8 8 M M 4 21 5 4 4 2 4 2 36 38 T 3 4 3 4 30 28 22 22 20 T 18 8 5 RRR 4 2 4 11 4 2 1 61 86 65 00 T H s DD Specification rD ive 3 5 H rd s r . SATA a H( DD) Di k D ive 2 5 H rd s r . SATA a H( DD) Di k D ive r Connecto r s r s T an fe Rate (Gb/ ec) d d Spin le Spee (RPM) w r r d DC Po e to D ive Rea y s( ec) r s Ave age Latency (m ec) I u np t (VDC) s Typical (Watt ) Id s le (Watt ) s s s Phy ical Dimen ion r s Weight (g am ) r Ope ating (C) Ambient r s s Ope ating (C) Ba e Ca ting N r on-Ope ating (C) Ambient r d r H ur G a ient (C pe o ) 500GB SATA 200r 7 pm, 6 s 2 5 Gb/ , . Not Available s Ye 1TB SATA 200r 7 pm, 6 s 3 5 Gb/ , . s Ye Not Available SATA r16e0adMB/s OD 7,200 3.5 SATA r Ave age d r ata ate, r d wr ea / ite 156 s MB/ 7,200 <10.0 2TB SATA 200r 7 pm, 6 s 3 5 Gb/ , . 4TB SATA 200r 7 pm, 6 s 3 5 Gb/ , . 6TB SATA 200r 7 pm, 6 s 3 5 Gb/ , . s Ye s Ye s Ye Not Available SATA r Ave age d r ata ate, r d wr ea / ite 156 s MB/ 7,200 1 0 < 7. Not Available Not Available SATA us d S taine d r s r ata t an fe r 216 ate 226 s MB/ 7,200 1 0 < 7. SATA us d S taine d r s r ata t an fe r 216 ate 226 s MB/ 7,200 1 0 < 7. 2 4. 5 1.9 0.7 61090.8.354mmmmxx 7mm 90 0 to 60 60 0 0 (-4 to 7 ) 20 4.16 5 6.19 6 4. 111094.618.6.89m m 9m m mm x x 420 0 to 60 60 0 0 (-4 to 7 ) 20 4.16 5 6.7 5 4. 1124 0661..16.m 9m 9mm mm x x 535 0 to 60 60 0 0 (-4 to 7 ) 20 4.16 5 7.35 5.45 1214 0671..1m 8m5m m mxm x 680 5 to 60 60 0 0 (-4 to 7 ) 20 4.16 5 8.13 6.21 1214 0671..1m 8m5m m mxm x 705 5 to 60 60 0 0 (-4 to 7 ) 20 r s @ 2 s Ope ating (G m) 400 N r s @ 2 s on-Ope ating (G m) s rs Di claime 1000 70 350 80 300 d 0 s Rea 7 G r 0 / W ite 4 sG 300 d 0 s Rea 7 G r 0 / W ite 4 sG 250 d r s Soli State Sto age Specification rD ive s s rs Dimen ion Millimete H D x ) (W x I r nte face Type w r Po e Active (AVG) w r Po e Idle u d Typical Seq ential Rea u r Typical Seq ential W ite r r ur Ope ating Tempe at e Range E dur n ance Rating (Lifetime r s W ite ) w ur s Mean Time Bet een Fail e (MTBF) H rdw r E r a a e nc yption s rs Di claime 256G B 2.5 SATA SSD 512G B 2.5 SATA SSD 12T.5B SATA SSD 22T .5B SATA SSD 256G B NVM 2 e M. SSD TLC 512G B NVM 2 e M. SSD TLC 1024 GB NVM 2 e M. SSD TLC 2048 GB NVM 2 e M. SSD TLC 480 IGB AC Opta neTM SSD 1 5. TB 2 U. Opta ne TM SSD 1770.000xx 1770.000xx 1770.000xx 1770.000xx 282.203xx 22 80 2.3 x x 282.203xx 22 80 2.3 x x 21160084xx 1170500xx IIISATA - IIISATA - IIISATA - IIISATA - I PC e 3 0 Gen . Nx4 VM e I PC e 3 0 Gen . Nx4 VM e I PC e 3 0 Gen . Nx4 VM e I PC e 3 0 Gen . Nx4 VM e I PC e 3 0 Gen . Nx4 VM e I PC e 3 0 Gen . Nx4 VM e 1.8W 1.9W 2.2W 6W 5W 5W 5W 5W 18W 18W 50m 50m 50m 50m 50m 50m 50m 50m 7W 7W W W W W W W W W 5M4B0/s 5M4B0/s 5M4B0/s 530 s MB/ 300 0MB s/ 3200 s MB/ 3200 s MB/ 3500 s MB/ 2M7B0/0s 2M7B0/0s 500 500 500 500 1300 1600 1600 300 2200 2200 s s s s s s s 0s MB/ MB/ MB/ MB/ MB/ MB/ MB/ MB / s s MB/ MB/ 055t°oC 055t°oC 055t°oC 055t°oC 055t°oC 055t°oC 055t°oC 055t°oC 085t°oC 085t°oC 85TB 150T 300T 600T 85TB 150T 300T 600T 8.76 2 37. P B B B B B B PB B P 2.O 0HM P 2.O 0HM P 2.O 0HM P 2.O 0HM P 2.O 0HM P 2.O 0HM P 2.O 0HM P 2.O 0HM P 2.O 0HM P 2.O 0HM A 25E6S A 25E6S A 25E6S A 25E6S A 25E6S A 25E6S A 25E6S A 25E6S No No bit bit bit bit bit bit bit bit r r sur d w r s s r rs 6 0 2 w SSD pe fo mance mea e ith C y tal Di k Ma k ve ion . . ith d u 1000 d s u sur s r w 1 the efa lt MB ata et. Seq ential mea ement a e ith r d u u 32 d sur s r w r ds Th ea , Q e e-Depth . Ran om mea ement a e ith 4 th ea d u u d 32 an q e e- epth . H r rs DD Cont olle I PC Bus I d s PC Mo e H I r d PC nteg ate 3 0 SATA . I s RA D Level r s r s Data T an fe Rate I r rs nte nal Connecto s rs Di claime 0/1/5/10 6 s Gb/ 2 H 2 r s 3 x MiniSAS D ( po t each) + x SATA Optical Drive Specifications r s s Ope ating Sy tem u r d S ppo te r ur Tempe at e Hu d Relative mi ity u u Maxim m Wet B lb r ur Tempe at e s rs Di claime d ws 10 r r r s s r d Win o d ws r 6 Win o d H E r r s u 3 Re at u u 16 0 d 18 0 2 Ub nt P o fo Wo k tation 7P o 4 nte p i e Lin x 7. . 4 an . 4. (P eloa ) 10° 35°C (50° 95°F) 10 80 d s %- % (non-con en ing) 25°C max Integrated Graphics Adapter s rs Di claime Discrete Graphics Adapter d r A apte us I r B nte face s I r Di play nte face r s s G aphic Chip et Q arodu P 04 0 Q arP 2od06u Q arP 0od10u 0 Q arP 2od02u 0 T 040 T 060 T 010 0 Q arodu RT X 4 000 Q arodu RT X 50 00 Q arodu RT X 60 00 Q arodu RT X 80 00 RT X A 004 0 RT X A 005 0 RT X A 006 0 Q arodu G 10V 0 P I30e.C P I30e.C P I30e.C P I30e.C P I30e.C P I30e.C P I30e.C P I30e.C P I30e.C P I30e.C P I30e.C IPC e 04. IPC e 04. IPC e 04. P I30e.C x61 x61 x61 x61 x61 x61 x61 x61 x61 x61 x61 x61 x61 x61 x61 3x 4 4 4 3x 4 4 3x 4 4 4 4 4 4 4 m 1DP .4 x m 1DP .4 x m 1DP .4 x 1DP .4 m 1DP .4 x m 1DP .4 x m 1DP .4 DP 1.4 1 x rVi ut alL x DP 1.4 1 x rVi ut x DP 1.4 1 x rVi ut x DP 1.4 1 x rVi ut x 1DP .4 a x 1DP .4 a x 1DP .4 a x 1DP .4 ink alL alL alL ink ink ink u u u u u u u Pa Pa Pa Pa T T T T T T T A s s s s r r r r r r r c c c c in in in in in in in m A m A m Vo lta al al al al g g g g g g g r r r pe e pe e pe e r r u Memo y Clock F eq ency Hz (M ) r z Memo y Si e r I r Memo y nte face r dw d Memo y Ban i th r s GPU Co e r r u Hz GPU Co e F eq ency (M ) u w r Maxim m Po e su Con mption u r d s u s d S ppo te Re ol tion an r s s Hz Max Ref e h Rate ( ) N d r ( ote: Analog an /o Digital) 1003 MHz 1252 MHz 1253 MHz 1251 MHz 1625 MHz 1M7H50z 1M7H50z 1M7H50z 2000 858 MHz MHz 2 2 5 2 8 16 G G 4G G G 4G 4G G 24 48 16 24 48 32 B G D B G D B G D B G D B G D B G D B G D B G D GB G D GB G D GB G D GB G D GB G D GB G D GB HB 2 M 5 5 5 5 6 6 6 6 6 6 6 6 6 6 DR DR DR DR DR DR DR DR DR DR DR DR DR DR X 64 - 12 8- 12 8- 16 0- 64 - 12 8- 12 8- 25 6- 25 6- 38 4- 38 4- 25 6- 38 4- 38 4- 4 960 bit bit bit bit bit bit bit bit bit bit bit bit bit bit - bit Up t3o2 sGB / Up t8o0 sGB / Up t8o2 sGB / Up t2o0 0G sB/ 80 sGB / 16 0G sB/ 16 0G sB/ Up to 14 6G sB/ Up to 844 G sB/ Up to 67 2G sB/ Up to 67 2G sB/ 844 sGB / Up to 67 8G sB/ Up to 67 8G sB/ Up to 87 0G sB/ CU CU CU CU CU D D D D D A A A A A r s r s r s r s r s Co e Co e Co e Co e Co e :25 :51 62 :604 :12 80 :38 4 1H2z28M 1H2z66M 1H2z66M 30 40 47 75 30 WWWWW 34 6×0x29 4 4 6×0x29 4 4 6×0x29 4 4 6×0x29 CU CU CU CU CU D D D D D A A A A A r s r s r s r s r s Co e Co e Co e Co e Co e :604 :89 6 :23 04 :30 72 :4 068 Te sn ro Te sn ro Te sn ro r s r s r s Co e Co e Co e :28 8 :38 4 :567 RT RT RT r s r s r s Co e Co e Co e :36 8: 4 2: 7 1000 1005 1620 MHz MHz MHz 0 50 4 To To To W W tal tal tal bo dr dr dr a bo a bo a p wr16:oe p wr2:6oe p wr2:9oe 05 5 WWW To To To r r r tal g tal g tal g ap ap ap s s s hic hic hic p wr12:oe p wr2:3oe p wr2:6oe 5 00 WWW 4 308×x42 4 4 6×0x29 4 4 6×0x29 4 308xx4 CU CU CU CU CU D D D D D A A A A A r s r s r s r s r s Co e Co e Co e Co e Co e :4 068 Te sn ro r s Co e :567 :6114 Te sn ro r s Co e :19 2 9:8,21 Te sn ro r s Co e :25 6 :17205, Te sn ro r s Co e :33 :51 20 Te sn ro r s Co e :604 6 RT RT RT r s Co e 2: 7 r s Co e 8: 4 r s Co e 6: 4 RT r s Co e 8: 4 1M4H4z0 1H3z95M 1H13z2M 1 To 4 0 tal 203 300 205 bo W dra W W W p wr2:9oe 5 W To rtal g ap shic p wr2:6oe 0 W 4 4 6×0x29 4 4 6×0x29 4 4 6×0x29 4 4 6×0x29 r u The mal Sol tion s Dimen ion d d s A vance Di play I N u r SL / VLink S ppo t s rs Di claime 160 160 160 160 160 160 160 216 160 160 160 160 @ @ @ @ @ @ @ 0@ @ @ @ @ 60H 60H 60H 120 120 120 120 120 120 120 120 120 z z z Hz Hz Hz Hz Hz Hz Hz Hz Hz 151x2 4 512x 4 512x 4 512x 4 512x 4 512x 4 512x 4 512x 4 512x 4 512x 4 512x 4 512x 808×02 808×02 808×02 808×02 808×02 808×02 808×02 808×02 808×02 808×02 808×02 808×02 @@@@@@@@@@@@ 60H 60H 60H 60H 60H 60H 60H 60H 60H 60H 60H 60H zzzzzzzzzzzz 34 7062×x084 327062×x084 327062×x084 327062×x084 327062×x084 327062×x084 327062×x084 327062×x084 @@@@@@@@ 60H 60H 60H 60H 60H 60H 60H 60H zzzzzzzz Ult rauq Ult rauq Ult rauq Ult rauq Ac tiv e Ac tiv e Ac tiv e Ult rauq Ult rauq Ult rauq Ult rauq Ac tiv e Ac tiv e Ac tiv e Ult rauq iet iet iet iet iet iet iet iet iet Ac Ac Ac Ac Ac Ac Ac Ac Ac tiv tiv tiv tiv tiv tiv tiv tiv tiv e e e e e e e e e s s s s Fa ni Fa ni Fa ni Fa ni s s s s Fa ni Fa ni Fa ni Fa ni sFa ni nk nk nk nk nk nk nk nk nk 21H3.7" 5x .7 " L 21H3.7" 5x .7 " L 21H3.7" 5x .7 " L 4. 4 H 9x 7. L 2 .H7 x6.1 L 2 .H7 x6.1 L 2 .H7 x6.1 L 4. 4 H x9.5 Sin Sin Sin L 4. 4 H x150. 4. 4 H x150. 4. 4 H x150. 4. 4 H x9.5 L 4. 4 H x150. 4. 4 H x150. 4. 4 H x150. u u u u u u Sin Sin Sin Sin gle gle gle Sin L L L Sin L L L gle gle gle gle Sl Sl Sl gle D D D gle D D D Sl Sl Sl Sl ot ot ot Sl al al al Sl al al al ot, ot, ot, ot ot Sl Sl Sl ot Sl Sl Sl w w w Lo Lo Lo Pr Pr Pr ofil ofil ofil u u u ot, F ot, F ot, F H H H ll e ll e ll e u u u ot, F ot, F ot, F H H H ll e ll e ll e e e e ig ig ig ig ig ig ht ht ht ht ht ht Not Avai labl e Not Avai labl e Not Avai labl e Not Avai labl e N SY 2 C N SY 2 C N SY 2 C N SY 2 C N SY 2 C N SY 2 C N SY 2 C Not Avai labl e Not Avail able Not Avail able Not Avail able Not Avail able Not Avail able NVL ink NVL ink NVL ink NVL ink NVL ink NVL ink I E r s ntel® the net Specification Card II2n1t0el-T1 r Single Po t E r Gigabit the n et d A apt re Intel I3502T uD al r Po t E r Gigabit the n et d A apt re II3n5te0l - T4 u d Q a r Po t E r Gigabit the n et d A apt re Intel 5 0 X 4 2T uD al r Po t Coppe r 10Gb E r the n et Intel 10 X7 2 DA uD al r Po t r Fibe 10Gb E r the n et Intel E r the n et SFP+ SR s Optic du Mo le Intel uD al d Ban r Wi ele ss-AC 260 7 ASM Intel s Win to rm P 82e6ak5 2×2 AC+BT 2 4. r Vp o u r N S pplie P s u r d Data Rate S ppo te r r s Cont olle Detail r r us r ur Cont olle B A chitect e r s r d Data T an fe Mo e w r su Po e Con mption r (Sp in gville) I210T1, M 94M10#33 1c/M01o0b/pp 10p 0s0e0r Intel® E r the n et r Cont o I21r0 lle I PC e 2 1. 5 s ( GT/ ) E r the n et 0.81W (Stony 2Lake T) G I315P02T02, M 92M8#941 1/M010b/p 100s00 (Copp re ), 1000M s bp r (Fibe ) Intel E r the n et r Cont o I35r0 lle I PC e 2 1. 5 s ( GT/ ) E r the n et Coppe r: I3502 2 T V = 4.4W r Fibe : I3502F = 5 5. W (Stony Lake T4) IG315P02T04, M 922M8#94 1/M010b/p 100s00 (Copp re ), 1000M s bp r (Fibe ) Intel E r the n et r Cont o r I351 lle I PC e 2 1. 5 s ( GT/ ) E r the n et Coppe r: I350T4 2V = 5W LC- r Fibe : I350F4 6 = W d A apt re M 28M9#595 0s11s000aG 0nM/bd1bp0p rCoppe Intel E r the n et r Cont o r lle 5 0 X 4 I PC e 2 1. 5 s ( GT/ ) E r the n et 1p 1191X T07G 02.s5.5G 04b =:4W W M 6p p0.ssb 6-== W X T 1s0=15:G 140b0.8p1 s W Gbp = 7.7W 100Mb sp = 6.4W d A apt re M 95M2#103 10GGbbEE/1 Optical r fibe 10 E Gb r Di ect Attach (DAC) Intel E r the n et r Cont o r lle 10 X7 2 AM I PC e 3 0. 8 s ( GT/ ) E r the n et uD alr po t 10GBA ES - SR= 3 4. W 8 typ/4. W max uD alr po t 1000B E AS - SX= 3 4W typ/4. W max uD alr po t 10GBA ES 5 LR= 4. W 5 1typ/ .W max uD alr po t r Di ect w Attach (T ina 3 3 x)= .W 9 12 3 MM#: 44 Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le 7260H MWDT X.R, M 93M6#170 Intel uD al d Ban r Wi ele ss-AC 260 7 Intel uD al d Ban r Wi ele ss-AC 260 7 , uD al d Ban , 2 2× , WiFi+B T I PC e 2 M. W (80iF2i .11 ac), 2 Hz .4G 5 Hz , G Not Availab le 2 M. Combo M 984M6#6:5 Intel uD al d Ban r Wi ele s8s265 -AC Intel uD al d Ban r Wi ele ss-AC 8265, 2 2× , WiFi+B IT, MU- M MO I PC e 2 M. W (80iF2i .11 ac), 2 Hz .4G 5 Hz , G Not Availab le IEEE d rds Stan a Compliance u r Boot ROM S ppo t N w r r s r d et o k T an fe Mo e u H u (F ll/ alf D plex) N w r r s r et o k T an fe Rate r s r r Ope ating Sy tem D ive u r S ppo t IEEE 080B2A.3S/E1 -T, 100BA ES -TX, 1000B E AS -T E PX boot, Intel I iSCS Remot e Boot rfo d Win o ws, u Lin x d an w r Vm a Ie, ntel BootA gent w Soft a re via E r PX o BootP, WDMS ro E I U F u r S ppo d te 1 000 , M s bp uF ll uD plex wWsindo 8 10 7/ / , u Lin x, rF ee BSD, EN X ,V w r m a e IEEE 080B2A.3S/E1 -T, 100BA ES -TX, 1000B E AS -T E PX boot, Intel I iSCS Remot e Boot rfo d Win o ws, u Lin x d an w r Vm a Ie, ntel BootA gent w Soft a re via E r PX o BootP, WDMS ro E I U F u r S ppo d te 1 000 , M s bp uF ll uD plex wWsindo 8 10 7/ / , u Lin x, rF ee BSD, EN X ,V w r m a e IEEE 080B2A.3S/E1 -T, 100BA ES -TX, 1000B E AS -T E PX boot, Intel I iSCS Remot e Boot rfo d Win o ws, u Lin x d an w r Vm a Ie, ntel BootA gent w Soft a re via E r PX o BootP, WDMS ro E I U F u r S ppo d te 1 000 , M s bp uF ll uD plex wWsindo 8 10 7/ / , u Lin x, rF ee BSD, EN X ,V w r m a e IEEE G 018000B02/A/1.310S0E -T E PX boot, Intel I iSCS Remot e Boot rfo d Win o ws, u Lin x d an w r Vm a Ie, ntel BootA gent w Soft a re via E r PX o BootP, WDMS ro E I U F u r S ppo d te 1 000 , M s bp uF ll uD plex wWsindo wW 7/s8in/d10o, r r Se ve u Lin x, rF eeBS D 3 typ/ .7 W max IEEE 1G 8/0B 102A1.30SE SR/LR, SFF- 8 31 4 10GSF P+DAC E PX boot, Intel I iSCS Remot e Boot rfo d Win o ws, u Lin x d an w r Vm a Ie, ntel BootA gent w Soft a re via E r PX o BootP, WDMS ro E I U F u r S ppo d te 1 000 , M s bp uF ll uD plex W wsindo e5F V D 622R00..rm Hx5Ee901/ES2ew/78LX B 1;.a0,0iSr,, Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le IEEE 802.11a b 80gn2.,11a c8,02.11d ,888000222...111111eih, , w,802.11 Not Availab le Not Availab le 36s 07M 0/b8p d Win o ws 10, 32-bit*, d Win o ws 10, 64- bit*, d Win o ws 8 1. , 32-bit*, d Win o ws 8 1. , 64- bit*, d Win o ws 8, 32-bit*, d Win o ws 8, 64- bit*, IEEE 802.11a b 80gn2.,11a c8,02.11d ,888000222...111111eih, , w88,88(p0000,e2222n....1111d1111kvri,, ng) Not Availab le Not Availab le 8p6s 7Mb 6W w4si-n1d0o, bit*, d Win o ws 8 1. , 64- bit*, d Win o ws 7, 32-bit*, d Win o ws 7, 64u bit*, Lin x* Manageability s Manageability Capabilitie r Ale ting TDP r r ur Ope ating Tempe at e Range r s # of Po t r r Data Rate Pe Po t s I r Sy tem nte face Type N d d I r C Si eban nte face u r s u r d J mbo F ame S ppo te 1000Base-T IEEE 1588 u r d d r r S ppo te Un e vP o s rs Di claime u r S ppo d te u r S ppo d te r w Fi m ra e s d Ba e r The m al Manag ement 0°C to 55°C 32 ( °F 131to °F) 1 1/M010b/p 100s00 r(coppe ) I PC e 2 1 Gen . Not Availab le s Ye s Ye u r S ppo d te Not Availab le u r S ppo d te u r S ppo d te r w Fi m ra e s d Ba e r The m al Manag ement 0°C to 55°C 32 ( °F 131to °F) 2 1/M010b/p 100s00 (coppe r), 1000M s bp r (fibe ) I PC e 2 1 Gen . Not Availab le s Ye s Ye u r S ppo d te Not Availab le u r S ppo d te u r S ppo d te r w Fi m ra e s d Ba e r The m al Manag ement 0°C to 55°C 32 ( °F 131to °F) 4 1/M010b/p 100s00 (coppe r), 1000M s bp r (fibe ) I PC e 2 1 Gen . Not Availab le s Ye s Ye u r S ppo d te Not Availab le u r S ppo d te u r S ppo d te r w Fi m ra e s d Ba e r The m al Manag ement 0°C to 55°C 32 ( °F 131to °F) 2 0s1s100,0G 0M/b1bp,0p I PC e 2 1 Gen . Not Availab le s Ye s Ye Not Availab le Not Availab le u r S ppo d te u r S ppo d te Not Availab le 0°C to 55°C 32 ( °F 131to °F) 2 1 s Gbp , 1s0Gbp 3P.C0Ie s Ye s Ye Not Availab le u r S ppo d te Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le Not Availab le d Win o ws 7, 32-bit*, d Win o ws 7, 64u bit*, Lin x* Not Availab le Not Availab le Not Availab le 0°C to 80°C 32 ( °F 1 6 to 7 °F) Not Availab le Not Availab le I PC e 2 M. Not Availab le Not Availab le Not Availab le Not Availab le u r S ppo d te Not Availab le Not Availab le Not Availab le 0°C to 80°C 32 ( °F 1 6 to 7 °F) Not Availab le Not Availab le I PC e 2 M. Not Availab le Not Availab le Not Availab le Not Availab le u r S ppo d te Ethernet d Mo el r Connecto s Web ite u N A to- egotiation I r ntel® vP oTM I d rd ntel® Stan a Manageablity w r z r r Po e Optimi e Platfo m w w r Lo -po e Management s s Sy tem E r E E r ne gy fficient the net su d TCP/UDP Check m an d I Segmentation Offloa ( Pv4 d I 6 an Pv ) d Receive Si e Scaling u d u u s D al Tx an Rx Q e e u r s u 9 J mbo F ame ( p to KB) Teaming r Wake f om Deep Sx r r r s Se ve Ope ating Sy tem u r S ppo t i210-T1 5 RJ-4 r Coppe i210 T1 A I8E0uE2tEo.3*-* negotiat on Not Availabl e u r S ppo t de u r S ppo t de uD al r Po t r Coppe I350 = - 2 2 T V uD al r Po t LC- r Fibe = I350 2 -F 2 x r s Po t 5 RJ-4 r Coppe r 2 o x r s Po t r LC-Fibe iT325/0F2 A I8E0uE2tEo.3*-* negotiat on Not Availabl e u r S ppo t de u r S ppo t de uD al r Po t r Coppe I350 = - 2 T4 V uD al r Po t LC- r Fibe = I350-F4 4 x r s Po t 5 RJ-4 r Coppe ro 4 x r s Po t r LC-Fibe i350 T4/F4 A I8E0uE2tEo.3*-* negotiat on Not Availabl e u r S ppo t de u r S ppo t de uD al r Po t r Coppe 5 0 = X 4 2T 2 x r s Po t 5 RJ-4 r Coppe x540 T2 A I8E0uE2tEo.3*-* negotiat on Not Availabl e u r S ppo t de u r S ppo t de 10 X7 2 DA 2 s x SFP Recepta ble xD7A102 A I8E0uE2tEo.3*-* negotiat on Not Availabl e u r S ppo t de u r S ppo t de A 7N2C G6W 0 2 x sAntenna 7N2G6W 0 Not Availabl e u r S ppo t de Not Availabl e u r S ppo t de A NC GW 8265 2 x sAntenna 8265 NGW Not Availabl e u r S ppo t de Not Availabl e u r S ppo t de u r S ppo t de u r S ppo t de u r S ppo t de s Ye u r S ppo t de u r S ppo t de u r S ppo t de W s222000Si011ne26d8r,.vo , ewr u r S ppo t de u r S ppo t de u r S ppo t de s Ye u r S ppo t de u r S ppo t de u r S ppo t de W s222000Si011ne26d8r,.vo , ewr u r S ppo t de u r S ppo t de u r S ppo t de s Ye u r S ppo t de u r S ppo t de u r S ppo t de W s222000Si011ne26d8r,.vo , ewr Not Availabl e u r S ppo t de u r S ppo t de s Ye Not Availabl e u r S ppo t de Not Availabl e W s22R00HSi00neEd38rLvo ,; e4wr, u r S ppo t de u r S ppo t de u r S ppo t de s Ye u r S ppo t de u r S ppo t de Not Availabl e 62R W s 0.H25i1n0/E2d70L;.o08w,, Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e Not Availabl e N w r r u r et o k P oxy/ARP S ppo t s rs Di claime 2019 u Lin x HE (R L/ E SL S), rF ee BSD, w r Xen, Vm a e u r S ppo t de 2019 u Lin x HE (R L/ E SL S), rF ee BSD, w r Xen, Vm a e u r S ppo t de 2019 u Lin x HE (R L/ E SL S), rF ee BSD, w r Xen, Vm a e u r S ppo t de u Lin x/S E 11 L S , w r Vm a e u r S ppo t de rF eeBS 9 10 D / , w r Vm a e E 5 SXi .x u r S ppo t de Not Availabl e Not Availabl e Media Card Reader s r De c iption s rs Di claime 9 1 2 0 -in- (USB . ) SECTION IV: I r s d rds E r B OS/Ce tification /Stan a / nvi onmental BIOS Specifications I u r WM S ppo t s d u 1 ROM-Ba e Set p Utility (F ) r Bootblock Recove y d u Replicate Set p r Boot Cont ol r r Memo y Change Ale t r r The mal Ale t ss A et Tag s E r Sy tem/ me gency ROM s r d Fla h Recove y With Vi eo u Remote Wake p/Remote u d w Sh t o n u su Q ick Re me Time r s E d I r Compliant With Mic o oft WB M an the DMTF Common nfo mation d Mo el s ur u r r r Sy tem Config ation Set p P og am (text only inte face) Available at w r 1 Po e -on With F Key rs s I s s rru d Recove Sy tem B OS if the Fla h ROM Become Co pte s s ur s s d Save Sy tem Config ation Setting to a File That Can Then be U e to s r s s Replicate the Setting to Othe Sy tem r r u s d u r 12 Boot Cont ol Available Th o gh ROM-ba e Set p Utility o With F w r Key at Po e -on w r Err r ss E r s s r Po e -on o Me age in the vent of a Dec ea e in Sy tem Memo y w r Err r ss E ur Po e -on o me age in the vent of a Fan Fail e u r s I 2 s rd ss d S ppo t Ability to Set SMB OS Type Ba eboa A et Tag Fiel u r s r ss r s I s S ppo t P oce to Recove the Sy tem B OS if the Fla h ROM s rru d Become Co pte s d w r u r r Sy tem A min Can Po e On/Off a Client Comp te f om a Remote r d Location to P ovi e Maintenance u r s w w r 3 sus d d r su s S ppo t Lo Po e S ( pen to RAM) an P ompt Re me Time s ROM Revi ion Level rd ss r Keyboa -le Ope ation r r r Pe -po t Cont ol d A aptive Cooling ur Sec ity I ud s ntel(R) AMT (incl 2 0. ) e ASF Intel(R) TXT r d s Memo y Mo e Windows 10 d Rea y s E I I rs r d I 0 ru ur d Sy tem U F (B OS) Ve ion Repo te in SMB OS Type I u in B OS Set p St ct e an s d u rd Sy tem Can be Boote Witho t a Keyboa ws I r s I d du E d s d r u Allo /O Po t to be n ivi ally nable /Di able Th o gh ROM- s d u r I I r ba e Set p o WM nte face rs u s r r w r Offe M ltiple Setting fo Fan Cont ol Ranging Bet een Bette r r d r us s Pe fo mance an Bette Aco tic s r d d s r r ssw rds r d s d U e an A mini t ato Pa o Can P otect Boot an u Set p u r E r S ppo t lect onic Lock ss s I rus Cha i nt ion Detection E I ur u r U F Sec e Boot S ppo t H ssw rd r H DD Pa o Can P otect DD Data d ws E I r w r d u r Win o U F Fi m a e Up ate S ppo t u rd u r Device G a S ppo t ss s d d Optional Acce Panel Lock, Ken ington Lock, an Pa ROM-ba e Lock ws s u r d r Allo Sy tem to be S ppo te f om a Remote Location I rus d E u r d s ur u d ntel(R) T te xec tion Technology P ovi e a Sec ity Fo n ation u d r s s w r s d s to B il P otection Again t Soft a e Ba e Attack u r s rr r d r r d s S ppo t Mi o ing, Lock Step, an Spa ing Memo y Mo e u r s d ws 10 u r s r ur s E I 2 6 S ppo t Win o Req i ement fo Sec e Fla h, U F v . Device u rd u r G a S ppo t Spec Industry Standard Specification Support UEFI I d d ACP (A vance ur d w r Config ation an Po e I r management nte face) 2 0 ASF . I E ATA ( D ) CD Boot EHCI I PC I PC Express SATA TPM UHCI USB I SMB OS XHCI d E s r w r I r 2 Unifie xten ible Fi m a e nte face v .7 d d ur d w r I r 6 1 A vance Config ation an Po e nte face v . r d rd r 2 0 DMTF Ale t Stan a Fo mat Specification v . 6 w I r I 6 AT Attachment ith Packet nte face (ATA/ATAP - ) E r r 1 0 l To ito Bootable CD-Rom Fo mat Specification, v . E d H s r r I r r rs r us s nhance 1 0 v . o t Cont olle nte face fo Unive al Se ial B , Revi ion N N I s A ( o PC lot) I E r ss s 3 0 PC xp e Ba e Specification v . r s 3 0 Se ial ATA Revi ion . Specification rus d u r u 2 0 T te Comp ting G o p TPM Specification v . rs H s r r I r s u d s 1 1 Unive al o t Cont olle nte face De ign G i e, Revi ion v . rs r us s 1 1 Unive rs r us 2 0 Unive rs r us 3 0 Unive al Se ial B al Se ial B al Se ial B Revi ion v . v. v. s 3 2 1 DMTF Sy tem Management Spec v . . H I E s 1 2 X C SP C Revi ion v . d E r s s Social an nvi onmental Re pon ibility u r Q ality Cont ol H z rd us u s s d a a o S b tance an r r P epa ation r s Batte ie E Safety, MC Connection to N w r d the Telephone et o k an Labeling s r d r s s r s r u r Lenovo i a membe of an eco ecla ation y tem that enfo ce d d u r in epen ent q ality cont ol eg la r du s d r 0 1 d 0 01 d u 0 1 · P o ct o not contain mo e than; . % lea , . % ca mi m, . % r ur 0 1 r u 0 1 r d s me c y, . % hexavalent ch omi m, . % polyb ominate biphenyl r 0 1 r d d rs E (PBB) o . % polyb ominate iphenyl ethe (PBD ). (See legal r r d N 1 efe ence an ote B ) r du s d s s s · P o ct o not contain A be to r du s d z u s s · P o ct o not contain O one Depleting S b tance : r u r r s dr r u r r s H Chlo ofl o oca bon (CFC), hy ob omofl o oca bon ( BFC), dr r u r r s H H s r r r d 1 1 1 hy ochlo ofl o ca bon ( CFC), alon , ca bontet achlo i e, , , - r r r d t ichlo oethane, methyl b omi e r du s d r 0 005 r d · P o ct o not contain mo e than; . % polychlo inate biphenyl 0 005 r d r r r (PCB), . % polychlo inate te phenyl (PCT) in p epa ation r du s d r 0 1 s r r r s · P o ct o not contain mo e than . % ho t chain chlo opa affin w 10 13 r s s 8 r (SCCP) ith - ca bon atom in the chain containing at lea t 4 % pe ss r ma of chlo ine in the SCCP r s w d r d r d s d r s · Pa t ith i ect an p olonge kin contact o not elea e nickel in r s 0 5 r r w ² concent ation above . mic og am/cm / eek E H r 33 r u su s s r s s R AC A ticle info mation abo t b tance in a ticle i available at: www s r s s us r r du http:// .lenovo.com/ ocial_ e pon ibility/ /en/ThinkG een_p o c s r t .html#envi onment Not Available N N w r ot Applicable, no Connection to a Telephone et o k us N s E ss s r Aco tic oi e mi ion Decla ation E N w r Safety, MC Connection to the Telephone et o k d an Labeling s w r r Sy tem Soft a e Manage u r s w r s Lenovo ThinkStation S ppo t Soft a e Management Tool by Lenovo Vantage u s d rds Reg lation & Stan a EMC & Safety r N r r FCC DoC fo o th Ame ica I r r VCC Ce tification fo Japan I r r w BSM Ce tification fo Tai an E E E r U/ FTA C Ma k & DoC 920 20 520 520 us 330 UL/CUL(P ,P7 ,P ,P c), cTUV (P ) 920 20 520 520 330 UL-GS(P ,P7 ,P ,P c), TUV-GS(P ) IE 60950 1 r r C - CB Repo t/Ce tificate ud r Sa i A abia SASO uw K ait KUCAS r China CCC Ma k H r r ong Kong SAR (CB epo t) r Singapo e PSB u r So th Af ica SABS uss E R ia- AC r Mo occo-CM N Mexico- OM z s E Ka akh tan- AC rus E Bela - AC r I E Se bia KVAL T T r r E Uk aine UK C PRO I d I n ia-B S E ss s USA Chemical mi ion Te t Environmentals E r r ne gy Sta E EP AT r u rd G eeng a H Ro S ErP 3 Lot- 2013 Hazardous u s s S b tance r TCO Ce tification s rs Di claime ENE 0 RGY STAR® v7. E E r r d s P AT® Silve Ce tification Available on Select Mo el r u rd G eeng a H Ro S Compliant s Ye r du s d r 0 1 d 0 01 d u 0 1 · P o ct o not contain mo e than; . % lea , . % ca mi m, . % r ur 0 1 r u 0 1 r d s me c y, . % hexavalent ch omi m, . % polyb ominate biphenyl r 0 1 r d d rs E (PBB) o . % polyb ominate iphenol ethe (PBD ) r du s d s s s · P o ct o not contain A be to r du s d z u s s · P o ct o not contain O one Depleting S b tance : r u r r s dr r u r r s H Chlo ofl o oca bon (CFC), hy ob omofl o oca bon ( BFC), dr r u r r s H H s r r r d 1 1 1 hy ochlo ofl o ca bon ( CFC), alon , ca bontet achlo i e, , , - r r r d t ichlo oethane, methyl b omi e r du s d r 0 005 r d · P o ct o not contain mo e than; . % polychlo inate biphenyl 0 005 r d r r r (PCB), . % polychlo inate te phenyl (PCT) in p epa ation r du s d r 0 1 s r r r s · P o ct o not contain mo e than . % ho t chain chlo opa affin w 10 13 r s s 8 r (SCCP) ith - ca bon atom in the chain containing at lea t 4 % pe ss r ma of chlo ine in the SCCP r s w d r d r d s d r s · Pa t ith i ect an p olonge kin contact o not elea e nickel in r s 0 5 r r w concent ation above . mic og am/cm_/ eek 9.0 E E r s r d w r E E r s r r s P AT egi te e he e applicable. P AT egi t ation va ie by u r www r r s r s us u r co nt y. See .epeat.net fo egi t ation tat by co nt y.