NXP IW623: 2x2 Tri-Band Wi-Fi 6E and Bluetooth Combo Solution

The NXP IW623 is a highly integrated Wi-Fi 6E device enabling Tri-Band (2.4 GHz, 5 GHz, and 6 GHz) Wi-Fi 6E and Bluetooth/BLE operation. It supports a 2x2 MIMO configuration in the 2.4 GHz and 5-7 GHz bands. The IW623 system-on-chip (SoC) implements advanced features including MU-MIMO, OFDMA, target wake-up time (TWT), and Bluetooth LE Audio.

With integrated 2.4 GHz and 5-7 GHz TX power amplifiers (PA), RX low noise amplifiers (LNA), and TX/RX switches (T/R SW), along with a full Bluetooth/Bluetooth Low Energy radio, the design is simplified. The IW623 incorporates advanced real-time Wi-Fi and Bluetooth arbitration hardware with software algorithms to optimize coexistence performance. NXP's Edgelock technology is integrated, providing an embedded security subsystem that supports hardware crypto-accelerated secure boot, key management firmware authentication, secure life cycle management, and anti-rollback protection. The IW623 features dedicated CPUs and memories for both the Wi-Fi and Bluetooth subsystems, enabling real-time, independent protocol processing. Host interfaces include PCIe and SDIO for Wi-Fi, and UART for Bluetooth.

A photograph shows a white security camera with a black lens, mounted on a bracket, suggesting an application for wireless IP and security cameras.

Connectivity Benefits

The IW623 is a performance-oriented 2x2 Wi-Fi 6E + Bluetooth wireless connectivity solution designed for smart home applications, supporting high-performance or visually connected services and advanced Bluetooth/Bluetooth LE audio capabilities. For industrial and commercial applications, the IW623 offers high-bandwidth, long-reaching Wi-Fi connectivity to support high-concurrency networks serving many clients and to provide access to 6 GHz Wi-Fi networks, which can relieve congestion from campus or corporate Wi-Fi deployments.

Wi-Fi 6E support enables offloading from crowded 2.4 GHz or channel-limited 5 GHz network spectrum, providing maximum forward longevity for next-generation Wi-Fi networks. Bluetooth LE Audio enables a significant advancement in Bluetooth audio capabilities, allowing multiple streams of user-specific content and broadcast or one-to-many audio sharing services.

The IW623 delivers high-performance multi-radio connectivity, enabling devices to benefit from the latest global Wi-Fi and Bluetooth network deployments and services. It provides high-integration multi-radio connectivity with extended temperature support (-40°C to +85°C) and flexible design options. NXP solutions offer built-in coexistence management for both integrated and external radios on the same PCB. NXP's connectivity solutions also enable accelerated certification for both Wi-Fi Alliance and Bluetooth standards, helping to ensure global regulatory emissions and cybersecurity conformance in a fast-changing regulatory compliance landscape.

Feature Overview

Wi-Fi Key Features

• 2x2 radios
• Wi-Fi 6E Tri-Band (2.4 GHz, 5 GHz, and 6 GHz)
• STA and mobile AP
• Wireless multi-streaming
• Adaptive scheduler
• Agile channel switching
• Wi-Fi TSF host clock sync between AP and STA
• PCIe and SDIO host interface

Bluetooth Key Features

• High speed, long range, advertising extensions
• Isochronous channels supporting LE Audio
• Integrated PA (+13 dBm)/LNA/SW
• UART host interface

Technical Details

Orderable Part Numbers

Internal Block Diagram

The internal block diagram illustrates the IW623 system-on-chip architecture. Key components include a Wi-Fi CPU and a Bluetooth CPU, each with dedicated MAC/BB and Link Layer respectively. The chip features 2x2 Wi-Fi 6E capabilities and Bluetooth RF. It integrates 2.4 GHz and 5-7 GHz Power Amplifiers (PA), Low Noise Amplifiers (LNA), and Single Pole Double Throw (SPDT) switches, with a second diplexer enabling Bluetooth antenna sharing with the 5-7 GHz RF Path B. Host interfaces include PCIe 1.0, SDIO 3.0, UART, and I2S/PCM. Power is managed by a 1.8V and 3.3V power regulator. Security features and advanced coexistence management are also integrated, with support for external coexistence.

Operating Characteristics

• Supply voltage: 1.8 V and 3.3 V
• Operating temperature: Automotive AEC-Q100 Grade 2: -40°C to 105°C
• Storage temperature: -55°C to 125°C

Package Options

• HVQFN148 (dual-row) 11 mm x 11 mm x 0.85 mm with 0.5 mm pitch

Modules

• Broad array of module offerings from industry-leading global suppliers

Target Applications

• Wireless power over Ethernet (POE) hub
• Smart home hub
• Internet of things (IoT) gateways
• Wireless IP and security cameras
• Video-enabled smart appliances
• Wireless Edge Connectivity
• Visual Smart Home
• Wireless Medical Connectivity
• Industrial Connectivity