Lenovo ThinkStation P7
Version: 8.0 | 03/05/2025
Product Information
| Product Name | P7 |
| Product Display Name | ThinkStation P7 |
| Information Date | 16-Jun-25 |
| Hardware Maintenance Manual | P7 HMM |
| Drivers & Software | P7 Drivers and Software |
| Available Whitepapers | Power Configurator, Memory Configurator, Storage Configurator, Intel VROC Configurator, Discrete RAID Configurator, Windows 11 Installation, Windows 10 Installation, Red Hat Enterprise Linux 9 Installation, Ubuntu Linux 22.04 LTS Installation, BMC Installation Guide, Intel AMT, ThinkStation WiFi Solutions |
Section I: Platform Overview
The Lenovo ThinkStation P7 is a powerful workstation featuring a new compute architecture and advanced thermal design in a rack-optimized chassis. It supports the latest Intel Xeon W processors with up to 56 cores, PCIe Gen 5 connectivity, DDR5 memory, and up to three NVIDIA RTX 6000 Ada GPUs, delivering high performance from a single-socket platform.
CPU
| Processor Support | 4th/5th Generation Intel Xeon Scalable Processors |
| Socket Type | Socket-E (LGA-4677) |
Operating Systems
| Preloaded | Windows 11 Pro 64-bit for Workstation |
| Supported | Ubuntu 22.04 LTS (configuration specific), Red Hat Enterprise Linux 8.7, Red Hat Enterprise Linux 9.2, Ubuntu 22.04 LTS |
Memory
| Slots | Up to 8 DIMMS |
| Channels | 8 Memory Channels |
| Type | DDR5, 288-Pin, ECC RDIMM and 3DS RDIMMS* |
| ECC Support | Yes |
| Speed | Up to 5600MT/s |
| Max DIMM Size | 64GB DDR5 ECC RDIMM, 128GB DDR5 ECC 3DS-RDIMM |
| Max System Memory | 1TB |
| Disclaimers | *Actual Memory Speed is dependent on the CPU |
Storage
| Total Bays/Size | 3 (2 std, 1 optional) |
| SATA | 3 x SATA 3.0 Connectors |
| PCIe (M.2) | 2 x M.2 NVMe 2280/22110 PCle Connectors Onboard (Gen5), 1x optional M.2 NVMe 2280/22110 Onboard (Gen4) |
| Disclaimers | *See Storage Whitepaper for details on the available usage options. |
Video
| Integrated Graphics | Not Available |
| Discrete Graphics | NVIDIA T400(MiniDP x3) - 4GB GDDR6, PCIe3, Single-Slot; NVIDIA T1000(MiniDP x4) - 8GB GDDR6, PCIe3, Single-Slot; NVIDIA RTX A2000(MiniDP x4) - 12GB GDDR6, PCIe4, Dual-Slot; NVIDIA RTX A4000 (DP x4) - 16GB GDDR6, PCIe4, Single-Slot; NVIDIA RTX A4500(DP x4) - 20GB, GDDR6, PCIe4, Dual-Slot; NVIDIA RTX A5000(DP x4) - 24GB, GDDR6, PCIe4, Dual-Slot; NVIDIA RTX A5500(DP x4) - 24GB GDDR6, PCIe4, Dual-Slot; NVIDIA RTX A6000 (DP x4) - 48GB GDDR6, PCIe4, Dual-Slot; NVIDIA RTX6000 Ada (DP x4) - 48GB GDDR6, PCIe4, Dual-Slot; NVIDIA RTX5880 Ada (DP x4) - 48GB GDDR6, PCIe4, Dual-Slot; NVIDIA RTX5000 Ada (DP x4)-32GB GDDR6, PCIe4, Dual-Slot; NVIDIA RTX4500 Ada (DP x4) - 24GB GDDR6, PCIe4, Dual-Slot; NVIDIA RTX4000 Ada (DP x4) - 20GB GDDR6, PCIe4, Single-Slot; NVIDIA RTX2000 Ada (MiniDP x4) - 16GB GDDR6, PCIe4, Dual-Slot; NVIDIA Quadro SYNC II card |
| Multi-GPU Support | Yes |
Slots
| Type | PCIe Add-In-Card |
| Bus Interface | PCIe x16 |
| Slot 1 | PCIe 5.0 x16, Full Height, Full Length, 75W |
| Slot 2 | PCle 4.0 x8, Full Height, Full Length, 25W, Open Ended |
| Slot 3 | PCIe 5.0 x16, Full Height, Full Length, 75W |
| Slot 4 | PCle 4.0 x4, Full Height, Full Length, 25W, Open Ended |
| Slot 5 | PCIe 5.0 x16, Full Height, Full Length, 75W |
| Slot 6 | PCle 4.0 x16, Full Height, Full Length, 75W |
| Slot 7 | PCIe 5.0 x4, Full Height, Full Length, 25W, Open Ended |
| Disclaimers | Note: Slot 7 will not support a full length card when the vertical M.2 option is installed |
Front I/O
| USB | 2 x USB-A 3.2 Gen 2 (10Gbps), 2 x USB-C 3.2 Gen 2 (10Gbps) |
| Audio | 1 x 3.5mm Global Headset Jack (Headphone + Mic in) |
| Media Card Reader | USB 3.0 15-in-1 Media card reader supporting SD UHS-II (Optional) |
| Flex Bay | Front access drive bay |
| Disclaimers | Note: Actual USB throughput will vary depending on the type and quantity of USB devices used. |
Rear I/O
| USB | 3x USB-A 3.2 Gen 1 (5Gbps), 2 x USB-A 2.0 (480Mbps), 1x USB-C 3.2 Gen 2x2 (20Gbps) |
| Audio | 2 x Rear (Line Out, Line In retasked as Mic) |
| DisplayPort | As Supported by GPU |
| HDMI | As Supported by GPU |
| Serial Port | Optional 1x Rear Port |
| Ethernet | 1 x 1GbE - RJ45, 1 x 10GbE - RJ45 |
| PS/2 | Optional PS/2 AIC PCIe adapter (2 port) |
| Optional Network Adapter | Broadcom 5720 Dual Port Gigabit PCIe Ethernet Adapter, Broadcom 5719 Quad Port Gigabit PCIe Ethernet Adapter, Bitland RTL8168H 1000M PCIE Ethernet Adapter, Intel 1210-T1 Single Port Gigabit Ethernet Adapter, Intel 1350-T2 Dual Port Gigabit Ethernet Adapter, Intel 1350-T4 Quad Port Gigabit Ethernet Adapter, Intel AX210 WIFI PCIe adapter with Internal Antennas, NVIDIA ConnectX-6 25G 2-Ports Adapter, Intel X710-DA2 Dual Port 10-Gigabit PCIe Ethernet Adapter, Intel X710-T2L Dual Port 10-Gigabit PCIe Ethernet Adapter |
| Disclaimers | Note: Actual USB throughout will vary depending on the type and quantity of USB devices used. |
Ethernet
| Vendor | Aquantia 10 GbE AQC113C-B1-C, Intel 1 GbE 1219 (Vpro, AMT) |
| Speeds | 10/100/1000/10000Mbps Aquantia AQC113C, 10/1000Mbps Intel 1219 |
| Functions | PXE, WOL, Jumbo Frames, ASF, Teaming (Intel only) |
| Connectors | 2 x RJ45 |
| Disclaimers | Note: Network speeds listed are theoretical. |
Audio
| Vendor | Realtek |
| Type | HD (2.0) |
| Internal Speaker | 1 x 1.5 watt 4 ohm |
| Connectors | 2 x Rear 3.5mm Jacks (Line Out, Line In retasked as Mic), 1 x Front 3.5mm Global Headset Jack (Headphone + Mic in) |
| Chipset | Realtek ALC897Q Codec (rear), Realtec ALC4032 (front) |
| Number of Channels | Rear Audio: 2 Channels, Front Audio: 2 Channels |
| Number of Bits/Audio Resolution | Rear Codec: 10 Channel DAC Supports 16/20/24-bit PCM, 2 Stereo ADC Supports 16/20/24-bit PCM; Front Codec: One stereo DAC supports 8/16/22.05/24/32/44.1/48/96/176.4/192KHz Sample Rate, 16/24-bit; One stereo ADC supports 8/16/22.05/24/32/44.1/48/96KHz Sample Rate, 16/24-bit |
| Disclaimers | *Note: Audio Codec ALC897Q can support 7.1 channel, but motherboard only has 2 rear jacks - MIC in and Line out, only 2 channel for Line out. |
Thermal
| Temp Sensors | Ambient Cabled Sensor - Thermistor, MB Header cabled to chassis front bezel; PCIe Zone 1 Sensor - Thermistor; PCIe Zone 2 Sensor - Thermistor; PCIe Zone 3 Sensor - Thermistor; PCIe Zone 4 Sensor - Thermistor; DIMM Right Sensor - Thermistor; DIMM Left Sensor - Thermistor; Storage (M.2) Sensor - Thermistor |
| Fans | 2x Front PCIe Fans (PCIel_4_FAN & PCIe5_7_Fan) - 4-pin cable connector; 1x Front BCB Optional 3 onal Fan (FAN_INT_STORG) -4-pin cable connector; 2x Memory Fans (MEM_FAN_B & MEM_FAN_T) - 4-pin cable connector; 1x Rear Fan (REAR_FANI) - 4-pin cable connector; 1x CPU Fan (FAN_CPU)-4-pin cable connector; 1x CPU Optional Fan (FAN_FRNT) - 8-pin cable connector; 1x Front Flex Bay Optional Fan (FLEX_BAY_FAN) - 4-pin cable connector; PSU Fans - provided by PSU vendor |
Power Specifications
| Power Supply | 1000W/1400W |
| Power Efficiency | 92% Efficient @ 50% Load |
| Main | C14 socket to std C13 line cord |
| Operating Voltage Range | 100-240V (autosensing) |
| Rated Voltage Range | 90-264VAC |
| Rated Line Frequency | 47Hz/63Hz |
| Operating Line Frequency Range | 50Hz/60Hz |
| Rated Input Current | 1000W: 6A-12A, 1400W: 9A-15A |
| Graphics | Up to 6 x 8-pin (6+2) PCIe* |
| Power Supply Fan | Yes |
| ENERGY STAR Qualified (config dependent) | Yes |
| 80 PLUS Compliant | Yes |
| Built-in Self Test (BIST) LED | Yes |
| Disclaimers | Note: Power Output of 1400W PSU Limited to 1125W for 100-111.9 Input Voltage. *Quantity of Graphics power cables is configuration dependent. *See Power Configuration Whitepaper for additional details. |
BIOS
| Vendor | AMI |
Chassis Information
| Color | Storm Gray |
| PSU | One Fixed 1400W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified or One Fixed 1000W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified |
| Thermal Solutions | 3 Front PCIe Fans, 1 Rear Fan, 2 CPU Fans (1 optional, 200-250W CPU SKUS), 1 Front Access Storage Fan (optional, configuration dependent), 2 DIMM Memory Fans, 1 CPU Heatsink Fan, 2 Autonomous PSU Fans |
| Dimensions | 434mm/17.1" H (without feet), 440mm/17.3" (with feet), 508mm/20" D, 175mm/6.9" W |
| Weight | 23kg/49.6lbs (max config) |
Packaging Dimensions
| Height (mm/in) | 618mm/24.23" |
| Width (mm/in) | 324mm/12.8" |
| Depth (mm) | 695mm/27.4" |
| Weight (kgs/lbs) | 26.2kg/57.8lbs (max config) |
Security & Serviceability
| TPM | Infineon SPI TPM SLB9672 TPM 2.0 |
| Asset ID | Yes, 1024 x 8bit |
vPro
Yes
Cable Lock Support
Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control
Yes
Power-On Password
Yes
Setup Password
Yes
NIC LEDs (integrated)
Yes
Access Panel Key Lock
Yes
Boot Sequence Control
Yes - common or unique
Padlock Support
Yes
Boot Without Keyboard and/or Mouse
No
Access Panel
Yes
Hard Drives
Tool-less Side Cover Removal
Expansion Cards
Tool-less
Color-coordinated Cables and Connectors
Yes
Memory
Tool-less
System Board
Retained with Screws
Restore CD/DVD/USB Set
Not Included, Restore Media Available via Lenovo Download Recovery Service or available through Lenovo Support.
Disclaimers
*Note: CPU Heatsink assembly requires a T30 bit.
Operating Environment
| Air Temperature | Operating: 10°C to 35°C (50°F to 95°F), Storage: -40°C to 60°C (-40°F to 140°F) in Original Shipping Carton, Storage: -10°C to 60°C (14°F to 140°F) Without Carton |
| Storage Humidity | Relative Humidity Operating: 10% to 80% (non-condensing), Relative Humidity Storage/Transit: 10% to 90% (non-condensing) |
| Wet Bulb Temperature Operating | 25°C (77°F) max |
| Wet Bulb Temperature Non-operating | 40°C (104°F) max |
| Altitude | Upper limits decrease 1°C (1.8°F) per 300 m (1000 ft) above sea level |
| Vibration | Operating Vibration: Random, 0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z), Non-Operating Vibration: Random, 1.04G at 2-200 Hz, 15 Minutes Per Surface (X,Y,Z) |
| Shock | Operating: X,Y axis: ±15G/3ms Z axis: ±30G/3ms, Operating (Rack mounted): X,Y,Z axis: ±15G/3ms, Non-operating target: Trapezoidal shock, 35g average, 11ms |
| Disclaimers | Extended operating temperatures are possible - please contact your Lenovo Rep |
Motherboard Core
| Board Size | 15" x 11.57" (381mm x 294mm) |
| Layout | Lenovo Custom Extended ATX |
Motherboard Core
| Processor Support | Intel Xeon W-3500 series processors, Intel Xeon W-3400 series processors |
| Socket Type | Socket E (LGA 4677) |
| Memory Support | DDR5 up to 5600MT/s RDIMM/3DS RDIMM Memory |
| Voltage Regulator | Intel VR14.0 -400W TDP Capable |
| Chipset (PCH) | Intel Alder Lake S PCH W790 |
| Flash | 2 x 64MB |
| Super I/O | 1 x MEC1723(176 pin) |
| Clock | External Clock |
Supported Components
| Processor Level | Intel Xeon W-3500 Emerald Rapids Series Processors, Intel Xeon W-3400 Sapphire Rapids Series Processors |
| Processor | Intel Xeon W9-3595X, Intel Xeon W9-3575X, Intel Xeon W7-3565X, Intel Xeon W7-3555, Intel Xeon W7-3545, Intel Xeon W5-3535X, Intel Xeon W5-3525, Intel Xeon W9-3495X, Intel Xeon W9-3475X, Intel Xeon W7-3465X, Intel Xeon W7-3455, Intel Xeon W7-3445, Intel Xeon W5-3435X, Intel Xeon W5-3433, Intel Xeon W5-3425, Intel Xeon W5-3423 |
| Memory Type | RDIMMs-5600MT/s, CPU Dependent; RDIMMs-4800MT/s, CPU Dependent; 3DS-RDIMMs - 4800MT/s, CPU Dependent |
| Memory | 16GB DDR5 ECC RDIMM PC5-5600, 32GB DDR5 ECC RDIMM PC5-5600, 64GB DDR5 ECC RDIMM PC5-5600, 16GB DDR5 ECC RDIMM PC5-4800, 32GB DDR5 ECC RDIMM PC5-4800, 64GB DDR5 ECC RDIMM PC5-4800, 128GB DDR5 ECC 3DS-RDIMM PC5-4800 |
| Disclaimers | Additional CPU SKU's certified. |
Storage
| 3.5" SATA Hard Disk Drive (HDD) | 2TB SATA - 7200rpm, 6Gb/s, 3.5"; 4TB SATA-7200rpm, 6Gb/s, 3.5" (Enterprise Class); 6TB SATA - 7200rpm, 6Gb/s, 3.5" (Enterprise Class); 12TB SATA - 7200rpm, 6Gb/s, 3.5" (Enterprise Class) |
| M.2 PCIe Solid State Drive (SSD) | 512GB M.2 PCIe - SSD, 2280, Gen5 (x4), NVMe, TLC, OPAL2.0; 1024TB M.2 PCIe - SSD, 2280, Gen5 (x4), NVMe, TLC, OPAL2.0; 2048TB M.2 PCIe - SSD, 2280, Gen5 (x4), NVMe, TLC, OPAL2.0; 4096TB M.2 PCIe - SSD, 2280, Gen5 (x4), NVMe, TLC, OPAL2.0; 512GB M.2 PCIe - SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0; 1024GB M.2 PCIe - SSD, 2280, Gen4 (x4), NVMe, TLC, TLC, OPAL2.0; 2048GB M.2 PCIe - SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0; 4096GB M.2 PCIe - SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0 |
| Disclaimers | Additional storage devices certified |
RAID
| RAID Requirements | M.2 and SATA RAID via Intel VROC Controller |
| Notes | Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy. |
| RAID | Max supported RAID 0/1/5/10. Intel VROC - Basic, Supports 0/1/10; Intel Virtual RAID On CPU (VROC) - Premium, Supports 0/1/5/10 |
| Disclaimers | *NOTE: Some features available after launch |
Optical Drive/Removable Media
| Media Card Reader Specifications | 15-in-1 Media Card Reader Support: SD slot, Mini SD (requires adapter), Micro SD (requires adapter), SD High Capacity (SDHC), Mini SD High Capacity (requires adapter), Micro SD High Capacity (requires adapter), SD Extended Capacity Memory Card (SDXC), Micro SD Extended Capacity (requires adapter), SD Ultra High Speed II (SD UHSII), MultiMediaCard(MMC), RS-MMC (requires adapter), MMC-Micro (requires adapter), CF slot, CompactFlash Type I, CompactFlash Type II, Microdrive, MS slot, Memory Stick, Memory Stick Micro (requires adapter), Memory Stick Duo, Memory Stick PRO, Memory Stick PRO Duo, Memory Stick PRO-HG Duo, Memory Stick HG Micro (requires adapter), Memory Stick XC Duo, Memory Stick XC Micro (requires adapter), Memory Stick XC-HG Duo, Memory Stick XC-HG Micro (requires adapter) |
Keyboard and Pointing Devices
| Keyboard | USB Traditional Keyboard, PS/2 Traditional Keyboard, Smart Card Keyboard, USB Calliope Keyboard |
| Pointing Devices | USB Calliope Mouse, PS/2 Black Optical Mouse, USB Fingerprint Mouse |
Expansion Bays
| 5.25" External Access Bays | Front access drive bay |
| Internal Access Bays | Optional internal 3.5" drive bay |
PCle Adapters
| Network | Broadcom 5720 Dual Port Gigabit Ethernet Adapter, Broadcom 5719 Quad Port Gigabit Ethernet Adapter, Bitland RTL8168H 1000M PCIE Ethernet Adapter, Intel 1210-T1 Single Port Gigabit Ethernet Adapter, Intel 1350-T2 Dual Port Gigabit Ethernet Adapter, Intel 1350-T4 Quad Port Gigabit Ethernet Adapter, NVIDIA ConnectX-6 25G 2-Ports Adapter, Intel X710-DA2 Dual Port 10-Gigabit PCIe Ethernet Adapter, Intel X710-T2L Dual Port 10-Gigabit PCIe Ethernet Adapter |
| Thunderbolt | Rear Maple Ridge Thunderbolt PCle Adapter |
| WiFi Cards | Intel PCIe WiFi Card With BT Internal Antenna Kit (AX210 6E) |
| Parallel Card | PS/2 (2 Port) PCle adapter |
| Com port | Serial COM port cable with 5V transceiver |
| PCle to M.2 Adapter Card | ThinkStation PCIe Gen3 Quad M.2 SSD Adapter, ThinkStation PCIe Gen4 Quad M.2 SSD Adapter, ThinkStation PCIe Gen5 Quad M.2 SDD Adapter |
| Other | BMC PCIe Adapter |
Section III: Supported Component Detail
CPU Specifications Group 1
| CPU | Intel Xeon W9-3495X, Intel Xeon W9-3475X, Intel Xeon W7-3465X, Intel Xeon W7-3455, Intel Xeon W7-3445 |
CPU Specifications Group 2
| CPU | Intel Xeon W5-3435X, Intel Xeon W5-3433, Intel Xeon W5-3425, Intel Xeon W5-3423 |
| Disclaimers | 4.6 |
HDD Specifications
| Drive | 3.5" SATA Hard Disk Drive (HDD), 2.5" SATA Hard Disk Drive (HDD) |
| Connector | SATA |
| Transfer Rate (Gb/sec) | SATA: Average data rate, read/write 156MB/s, Sustained data transfer rate 216 - 226MB/s |
| Spindle Speed (RPM) | 7,200 |
| DC Power to Drive Ready (sec) | <10.0, <17.0 |
| Average Latency (msec) | 4.2, 4.16, 4.5 |
| Input (VDC) | 5 |
| Typical (Watts) | 1.9, 6.19, 8.13, 6.7, 7.35, 4.5, 5.45 |
| Idle (Watts) | 0.7 |
| Physical Dimensions | 69.85mm x 100.34mm x 7mm, 101.6mm x 146.99mm x 19.88mm, 101.6mm x 146.99mm x 26.1mm, 101.85mm x 147mm x 26.1mm |
| Weight (grams) | 90, 420, 535, 680, 705 |
| Operating (C) Ambient | 0 to 60, 5 to 60 |
| Operating (C) Base Casting | 60 |
| Non-Operating (C) Ambient | (-40 to 70) |
| Gradient (C per Hour) | 20 |
| Operating (Gs @ 2ms) | 400, 350, 80, 300 |
| Non-Operating (Gs @ 2ms) | 1000, 70, 250 |
| Disclaimers | Read 70 Gs/ Write 40 Gs |
Solid State Storage Specifications Group 1
| Drive | 512GB NVMe M.2 SSD TLC, 256GB NVMe M.2 SSD TLC, 1024GB NVMe M.2 SSD TLC, 2048GB NVMe M.2 SSD TLC, 480GB AIC Optane SSD, 1.5TB U.2 Optane SSD |
| Dimensions Millimeters (W x D x H) | 22 x 80 x 2.3, 20 x 168 x 104, 70 x 100 x 15 |
| Interface Type | PCIe Gen 3.0 x4 NVMe, PCIe Gen 3.0 x4 NVMe, PCIe Gen 3.0 x4 NVMe, PCIe Gen 3.0 x4 NVMe, PCIe Gen 3.0 x4 NVMe, PCIe Gen 3.0 x4 NVMe |
| Power Active (AVG) | 5W, 18W |
| Power Idle | 50mW, 7W |
| Typical Sequential Read | 3000MB/s, 3200MB/s, 3500MB/s, 2700MB/s |
| Typical Sequential Write | 1300MB/s, 1600MB/s, 3000MB/s, 2200MB/s |
| Operating Temperature Range | 0 to 55C, 0 to 85C |
| Endurance Rating (Lifetime Writes) | 85TB, 150TB, 300TB, 600TB, 8.76PB, 27.3PB |
| Mean Time Between Failures (MTBF) | 2.0M POH |
| Hardware Encryption | AES 256 bit, No |
| Disclaimers | SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set. Sequential measurements are with 1 Thread, Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32. |
Solid State Storage Specifications Group 1
| Drive | 1024GB NVMe M.2 SSD TLC, 2048GB NVMe M.2 SSD TLC |
| Dimensions Millimeters (W x D x H) | 22 x 80 x 2.3 |
| Interface Type | PCIe Gen 3.0 x4 NVMe |
| Power Active (AVG) | 5W |
| Power Idle | 50mW |
| Typical Sequential Read | 3500MB/s |
| Typical Sequential Write | 3000MB/s |
| Operating Temperature Range | 0 to 55C |
| Endurance Rating (Lifetime Writes) | 600TB |
| Mean Time Between Failures (MTBF) | 2.0M POH |
| Hardware Encryption | AES 256 bit |
| Disclaimers | SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set. Sequential measurements are with 1 Thread, Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32. |
HDD Controllers
| PCI Bus | PCH Integrated |
| PCI Modes | SATA 3.0 |
| RAID Levels | 0/1/5/10 |
| Data Transfer Rates | 6Gb/s |
| Internal Connectors | 2 x MiniSAS HD (2 ports each) + 3 x SATA |
| Disclaimers |
Optical Drive Specifications
| Operating Systems Supported | Windows 10 Pro for Workstations (Preload), Windows 7 Pro 64, Red Hat Enterprise Linux 7.3, Ubuntu 16.04 and 18.04.2 |
| Temperature | 10-35°C (50-95°F) |
| Relative Humidity | 10%-80% (non-condensing) |
| Maximum Wet Bulb Temperature | 25°C max |
| Disclaimers |
Discrete Graphics Adapter Group 1
| Adapter | T400, T1000, RTX A2000, RTX A4000, RTX A4500, RTX A5500, RTX A6000, RTX 6000 Ada |
| Bus Interface | PCIe 3.0 x16, PCIe 4.0 x16 |
| Display Interface | 3 x mDP 1.4, 4 x mDP 1.4a, 4 x DP 1.4a, 4 x DP 1.4 |
| Graphics Chipset | Turing, Ampere, Coming Soon |
| Memory Clock Frequency (MHz) | Coming Soon, 2000MHz |
| Memory Size | 2GB GDDR6, 4GB GDDR6, 16GB GDDR6, 20GB GDDR6, 24GB GDDR6, 48GB GDDR6 |
| Memory Interface | 64-bit, 128-bit, 256-bit, 384-bit |
| Memory Bandwidth | 80GB/s, 160GB/s, 448 GB/s, Up to 768GB/s |
| GPU Cores | CUDA Cores: 384, CUDA Cores: 896, CUDA Cores: 6411, Tensor Cores: 192, RT Cores: 48, CUDA Cores: 10,752, Tensor Cores: 336, RT Cores: 84 |
| Maximum Power Consumption | 30W, 50W, 140W, Coming Soon, 300W |
| Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital) | 4 x 4096×2160 @ 120Hz, 4 x 5120×2880 @ 60Hz, 2 x 7680x4320 @ 60Hz, Coming Soon |
| Thermal Solution | Active, Coming Soon |
| Dimension | 2.7" H x 6.1" L, Single Slot, 4.4" H x 9.5" L, Single Slot, Coming Soon, 4.4" H x 10.5" L, Dual Slot, Full Height |
| Advanced Display | Coming Soon |
| SYNC 2 | Coming Soon |
| SLI/NVLink Support | Coming Soon, NVLink |
| Disclaimers |
Ethernet Specifications Group 1 Part 1
| Card | Intel 1210-T1 Single Port Gigabit Ethernet Adapter (Springville), Intel 1350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2), Intel 1350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4), Intel X540-T2 Dual Port Copper 10Gb Ethernet Adapter, Intel X710-DA2 Dual Port Fiber 10Gb Ethernet Adapter |
| Supplier PN | 1210T1, MM# 941033, 1350T2G1P20, MM# 928941, 1350T4G1P20, MM# 928942, MM#928955, MM# 952103 |
| Data Rates Supported | 10/100/1000Mbps copper, 10/100/1000Mbps (Copper), 1000Mbps (Fiber), 100/1000Mbps and 10Gbps Copper, 1GbE/10GbE Optical fiber, 10GbE Direct Attach (DAC) |
| Controller Details | Intel Ethernet Controller 1210, Intel Ethernet Controller 1350, Intel Ethernet Controller 1351, Intel Ethernet Controller X540, Intel Ethernet Controller X710-AM2 |
| Controller Bus Architecture | PCIe 2.1 (5GT/s), PCIe 3.0 (8GT/s) |
| Data Transfer Mode | Ethernet |
| Power Consumption | 0.81W, Copper: 1350-T2 V2=4.4W, Fiber: 1350-F2= 5.5W, Copper: 1350T4V2=5W, LC-Fiber: 1350F4=6W, X540-T2: 10Gps= 17.4W, 1Gbps= 9.5W, 100Mbps=6.6W, X540-T1: 10Gbps=10.8W, 1Gbps= 7.7W, 100Mbps= 6.4W, Dual-port 10GBASE-SR= 4.3W typ/4.8W max, Dual-port 1000BASE-SX= 4W typ/4.3W max, Dual-port 10GBASE-LR= 4.5W typ/5.1W max, Dual-port Direct Attach (Twinax) = 3.3W typ/3.7W max |
| IEEE Standards Compliance | IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T, IEEE 802.3 100/1000/10BASE-T, IEEE 802.3 1/1010GBASE-SR/LR, SFF-8431, 10GSFP+DAC |
| Boot ROM Support | PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI |
| Network Transfer Mode (Full/Half Duplex) Supported | 1,000Mbps Full Duplex |
| Network Transfer Rate | |
| Operating System Driver Support | Windows 7/8/10, Linux, Free BSD, XEN, Vmware, Windows 2008, 2012; RHEL 6.5/7.0, FreeBSD 9/10, Vmware ESXi 5.x |
| Manageability | Supported |
| Manageability Capabilities Alerting | Supported |
| TDP | Firmware Based Thermal Management |
| Operating Temperature Range | 0C to 55C (32F to 131F) |
Ethernet Specifications Group 1 Part 2
| Model | i210-T1, 1350 T2/F2, 1350 T4/F4, x540 T2, x710 DA2 |
| Connector | RJ-45 Copper, 2 x Ports RJ-45 Copper or 2 x Ports LC-Fiber, 4 x Ports RJ-45 Copper or 4 x Ports LC-Fiber, 2 x Ports RJ-45 Copper, 2 x SFPs Receptable |
| Website | i210 T1, 1350 T2/F2, 1350 T4/F4, x540 T2, x710 DA2 |
| IEEE* 802.3* Auto-negotiaton | IEEE* 802.3* Auto-negotiaton |
| Intel vPro | Not Available, Supported |
| Intel Standard Manageablity | Supported, Not Available |
| Power Optimizer Platform Low-power Management Systems | Supported |
| Energy Efficient Ethernet | Supported |
| TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6) | Supported |
| Receive Side Scaling | Yes |
| Dual Tx and Rx Queues | Supported |
| Jumbo Frames (up to 9KB) | Supported |
| Teaming | Supported |
| Wake from Deep Sx | Supported |
| Server Operating System Support | Windows Server 2008, 2012, 2016. 2019 Linux (RHEL/SLES), Free BSD, Xen, Vmware, Windows Server 2008, 2012, 2016. 2019 Linux (RHEL/SLES), Free BSD, Xen, Vmware, Windows Server 2008, 2012, 2016. 2019 Linux (RHEL/SLES), Free BSD, Xen, Vmware, Windows Server 2003, 2008; RHEL 4, Linux/SLES 11, Vmware, Windows 2008, 2012; RHEL 6.5/7.0, FreeBSD 9/10, Vmware ESXi 5.x |
| Disclaimers | Not Available |
Ethernet Specifications Group 2 Part 1
| Card | Intel Ethernet SFP+ SR Optics Module, Intel Dual Band Wireless-AC 7260 ASM, Intel Dual Band Wireless-AC 8265 2×2 AC+BT 4.2 Vpro M.2 Combo |
| Supplier PN | MM#: 941243, 7260HMWDTX.R, MM# 936170, MM#: 946658 |
| Data Rates Supported | Not Available, WiFi (802.11ac), 2.4GHz, 5GHz |
| Controller Details | Not Available, Intel Dual Band Wireless-AC 7260, Intel Dual Band Wireless-AC 8265 |
| Controller Bus Architecture | Not Available, PCIe M.2 |
| Data Transfer Mode | Not Available |
| Power Consumption | Not Available |
| IEEE Standards Compliance | Not Available, IEEE 802.11abgn, 802.11ac, 802.11d, 802.11e, 802.11i, 802.11h, 802.11w |
| Boot ROM Support | Not Available |
| Network Transfer Mode (Full/Half Duplex) | Not Available |
| Network Transfer Rate | Not Available, 300/867Mbps, 867Mbps |
| Operating System Driver Support | Not Available, Windows 10, 32-bit*, Windows 10, 64-bit*, Windows 8.1, 32-bit*, Windows 8.1, 64-bit, Windows 8, 32-bit, Windows 8, 64-bit*, Windows 7, 32-bit, Windows 7, 64-bit*, Linux*, Windows 10, 64-bit*, Windows 8.1, 64-bit*, Windows 7, 32-bit*, Windows 7, 64-bit*, Linux* |
Ethernet Specifications Group 2 Part 2
| Model | AC 7260 NGW, AC 8265 NGW |
| Connector | 2 x Antennas |
| Website | 7260 NGW, 8265 NGW |
| Intel vPro | Supported |
| Intel Standard Manageablity | Not Available |
| Power Optimizer Platform Low-power Management Systems | Supported |
| Energy Efficient Ethernet | Not Available |
| TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6) | Not Available |
| Receive Side Scaling | Not Available |
| Dual Tx and Rx Queues | Not Available |
| Jumbo Frames (up to 9KB) | Not Available |
| Teaming | Not Available |
| Wake from Deep Sx | Not Available |
| Server Operating System Support | Not Available |
| Network Proxy/ARP Support | Not Available |
| Disclaimers | Not Available |
Media Card Reader
| Description | 9-in-1 (USB 2.0) |
| Disclaimers |
Section IV: BIOS/Certifications/Standards/Environmental
BIOS Specifications
| WMI Support | Compliant With Microsoft WBEM and the DMTF Common Information Model |
| ROM-Based Setup Utility (F1) | System Configuration Setup Program (text only interface) Available at Power-on With F1 Key |
| Bootblock Recovery | Recovers System BIOS if the Flash ROM Becomes Corrupted |
| Replicated Setup | Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems |
| Boot Control | Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on |
| Memory Change Alert | Power-on Error Message in the Event of a Decrease in System Memory |
| Thermal Alert | Power-on Error message in the Event of a Fan Failure |
| Asset Tag | Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field |
| System/Emergency ROM Flash Recovery With Video | Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted |
| Remote Wakeup/Remote Shutdown | System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance |
| Quick Resume Time | Supports Low Power S3 (suspend to RAM) and Prompt Resume Times |
| ROM Revision Level | System UEFI (BIOS) Version Reported in SMBIOS Type O Structure and in BIOS Setup |
| Keyboard-less Operation | System Can be Booted Without a Keyboard |
| Per-port Control | Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface |
| Adaptive Cooling | Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics |
| Security | User and Administrator Passwords Can Protect Boot and ROM-based Setup, HDD Password Can Protect HDD Data |
| Intel(R) AMT (includes ASF 2.0) | Support Electronic Lock |
| Intel(R) TXT | Chassis Intrusion Detection |
| Memory Modes | UEFI Secure Boot Support |
| Windows 10 Ready | Windows UEFI Firmware Update Support |
| Device Guard Support | Device Guard Support |
Industry Standard Specification Support
| UEFI | Unified Extensible Firmware Interface v2.7 |
| ACPI (Advanced Configuration and Power management Interface) | Advanced Configuration and Power Interface v6.1 |
| ASF 2.0 | DMTF Alert Standard Format Specification v2.0 |
| ATA (IDE) | AT Attachment 6 with Packet Interface (ATA/ATAPI-6) |
| CD Boot | El Torito Bootable CD-Rom Format Specification, v1.0 |
| EHCI | Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0 |
| PCI | NA (No PCI slot) |
| PCI Express | PCI Express Base Specification v3.0 |
| SATA | Serial ATA Revision 3.0 Specification |
| TPM | Trusted Computing Group TPM Specification v2.0 |
| UHCI | Universal Host Controller Interface Design Guide, Revision v1.1 |
| USB | Universal Serial Bus Revision v1.1, Universal Serial Bus v2.0, Universal Serial Bus v3.0 |
| SMBIOS | DMTF System Management Spec v3.2.1 |
| XHCI | XHCI SPEC Revision v1.2 |
Social and Environmental Responsibility
| Quality Control | Lenovo is a member of an eco declaration system that enforces regular independent quality control |
| Hazardous Substances and Preparation | Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1) Products do not contain Asbestos Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment |
| Batteries | Not Available |
Safety, EMC Connection to the Telephone Network and Labeling
Not Applicable, no Connection to a Telephone Network
System Software Manager
Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage
Regulations & Standards
| EMC & Safety | FCC DOC for North America, VCCI Certification for Japan, BSMI Certification for Taiwan, EU/EFTA CE Mark & DoC, UL/CUL(P920, P720, P520, P520c), cTUVus(P330), UL-GS(P920, P720, P520, P520c), TUV-GS(P330), IEC60950-1 CB Report/Certificate, Saudi Arabia SASO, Kuwait KUCAS, China CCC Mark, Hong Kong SAR (CB report), Singapore PSB, South Africa SABS, Russia-EAC, Morocco-CM, Mexico-NOM, Kazakhstan-EAC, Belarus-EAC, Serbia KVALITET, Ukraine UKrCEPRO, India-BIS, USA Chemical Emission Test |
Environmentals
| Energy Star | ENERGY STAR v7.0 |
| EPEAT | EPEAT Silver Certification Available on Select Models |
| Greenguard | Greenguard |
| ROHS | RoHS Compliant |
| ErP Lot-3 2013 | Yes |
| Hazardous Substances | Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE), Products do not contain Asbestos, Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide, Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation, Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP, Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week |
| TCO Certification | 9.0 |
| Disclaimers | EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country. |
EPEAT Registry
workstations :: thinkstation p series workstations :: thinkstation p7contentdetail - Lenovo Support US
