Migrating from i.MX RT1060 to i.MX RT1170

This document outlines the key differences between the i.MX RT1170 and i.MX RT1060 processors and provides information to help users quickly evaluate and understand how to migrate from the i.MX RT1060 to the i.MX RT1170.

This document is suitable for:

System Integration Comparison

Table 1 provides a system integration comparison, with new features of the i.MX RT1170 highlighted in red text.

Table 1. System Integration Comparison
Comparison Itemi.MX RT1060i.MX RT1170
Core and On-Chip RAM
Core 0CM7 @ Up to 600 MHz
32 KB I-Cache
32 KB D-Cache
CM7 @ Up to 1 GHz
32 KB I-Cache
32 KB D-Cache
Core 1CM4 @ Up to 400 MHz
16 KB I-Cache
16 KB D-Cache
FLEX RAM512 KB512 KB
OCRAM512 KB512 KB +128 KB OCRAM1
512 KB +128 KB OCRAM2
256 KB (Shared with CM4 TCM)
External Memory Interface
SEMC - SDRAM8/16-bit SDRAM
up to 166 MHz
8/16/32-bit SDRAM
Up to 200 MHz
SEMC - NAND8/16-bit SLC NAND FLASH8/16-bit SLC NAND FLASH
SEMC - Parallel NOR FLASH/SRAMUp to 16 bitUp to 16 bit
uSDHC - SD/eMMCeMMC 4.5/SD 3.0eMMC 5.0/SD 3.0
Flex SPI22
Flex SPI - WidthUp to 8 bitUp to 16 bit
Flex SPI - Single/Dual/Quad SPI interface
Flex SPI - Hyper
Flex SPI - PSRAM
Flex SPI - OCT interface with XIP support
Image Processing, Display, and Camera Interfaces
LCDIF
LCDIFv2
PXP
GPU-
Parallel CSI
Parallel DSI
MIPI CSI-
MIPI DSI-
Communication Peripherals
USB22
10/100M ENET with IEEE158821
1G ENET with AVB-1
1G ENET with TSN-1
UART812
LPSPI46
I2C46
FlexCAN33
FlexIO32
EVMSIM2
GPIO149174
Audio Interfaces
SAI34
SPDIF11
ASRC1
PDM MIC1
MQS11
Timers
WDOG45
GPT66
QDC44
QTimer44
FlexPWM44
PIT12
Analog Peripherals
ACMP44
ADC20
LPADC02
ADC ETC11
DAC01
TSC10
Other
eDMA12
8 × 8 Keypad
Security

Package

The i.MX RT1170 utilizes a 289-pin MAPBGA package due to its increased functionality, while the i.MX RT1060 uses a 196-pin MAPBGA package.

Table 2. Package Comparison
RT1060RT1170
Package196-pin MAPBGA289-pin MAPBGA

Pin Multiplexing

Refer to Table 3 for information on new pin multiplexing options on the i.MX RT1170.

Table 3. Pin Multiplexing Information and Tools
Pin Multiplexing Information and ToolsDescription
Pin Multiplexing Options in ManualThis table lists all relevant pins for the device.
Pin Assignments in ManualThis table categorizes pins by function, listing all functions for each pin, including default pad configuration information.
Pin Assignment Excel FileThis Excel file lists the function assignment for each pin and provides common device pin assignment scenarios for user reference. This file can be found in the PDF attachment of this document.
Pin Assignment Tool in MCUXpresso IDE (built-in or standalone)A powerful graphical interface tool that assists customers with pin assignments for different applications.

Power Supply Changes

There are several changes in power supply between the i.MX RT1170 and RT1060. For detailed information, please refer to the Hardware Development Guide for the MIMXRT1170 Processor (Document MIMXRT1170HDUG) and the MIMXRT1170 EVK Board Hardware User's Guide (Document MIMXRT1170EVKHUG).

  • The i.MX RT1170 has more power domains than the RT1060, notably the new NVCC_LPSR domain. This requires VDD_LPSR_DIG to be stable for 1 ms before powering up VDD_SOC_IN during the power-up sequence.
  • The i.MX RT1170 uses the VDD_SNVS_DIG (1.8 V) domain's POR pin reset. If external pull-ups or external POR logic are added, the voltage level must be correct.
  • The i.MX RT1170 has two internal DCDC outputs: one 1.0 V and one 1.8 V. The i.MX RT1060 has only one output.
  • For automotive-grade i.MX RT1170 products, due to limited internal DCDC load capacity, an external PMIC is required for high-power operation. For the i.MX RT1060, internal DCDC can be used directly for various applications.

Clocking

Overview

The i.MX RT1170 features a completely redesigned clocking architecture, comprising three parts:

  • Clock sources: Crystal/OSC/PLL/PLL_PFD
  • Independent clock sources and divider settings for each root clock.
  • Clock gating for enabling/disabling clocks.

For other important related information, such as the System Clocks Table (mapping IP clocks to system clock sources), Clock Tree (paths from clock sources to root clocks), Clock Sources List, Clock Roots List (available sources for each root clock), Clock Gate Table, and Clock Group (synchronous clocks), refer to the i.MX RT1170 Processor Reference Manual (Document IMXRT1170RM).

Crystal and PLL

Table 4. Crystal and PLL Comparison
Crystal and PLLRT1060RT1170
Crystal Oscillator 24 MHz
Crystal Oscillator 32 KHz
RC Oscillator 32 KHz
RC Oscillator 16 MHz
RC Oscillator 24 MHz
RC Oscillator 48 MHz
RC Oscillator 400 MHz
PLL1ARM PLL (Up to 600 MHz core)ARM PLL (Up to 1 GHz core)
PLL2SYS PLL (Dedicated 528 MHz)SYS PLL1 (Dedicated 1 GHz)
PLL3USB1 PLL (Dedicated 480 MHz)SYS PLL2 (Dedicated 528 MHz)
PLL4AUDIO PLL (650-1300 MHz)SYS PLL3 (Dedicated 480 MHz)
PLL5VIDEO PLL (650-1300 MHz)AUDIO PLL (650-1300 MHz)
PLL6ENET PLL (Dedicated 500 MHz)VIDEO PLL (650-1300 MHz)
PLL7USB2 PLL (Dedicated 480 MHz)

Power Mode Management

Compared to the i.MX RT1060, the i.MX RT1170 adopts a new power management architecture. For more detailed information, please refer to the power mode management chapters in the i.MX RT1170 Processor Reference Manual (Document IMXRT1170RM) and the document RT1170 Clock and Low Power Features (Document AN13104).

DMA

Table 5. DMA Comparison for i.MX RT1060 and i.MX RT1170
Comparison Itemi.MX RT1060i.MX RT1170
eDMA (32 channel)
eDMA_LPSR (32 channel)-

Memory Map

This section highlights key memory map differences. For comprehensive details, consult the i.MX RT1170 Processor Reference Manual (Document IMXRT1170RM).

Table 6. On-Chip/Off-Chip Memory Space Mapping
Comparison Itemi.MX RT1060i.MX RT1170
CM7 FLEX RAM ITCM0x0000_0000-0x0001_FFFF (Default 128 KB)0x0000_0000-0x0003_FFFF (Default 256 KB)
CM7 FLEX RAM DTCM0x2000_0000-0x2001_FFFF (Default 128 KB)0x2000_0000-0x2003_FFFF (Default 256 KB)
CM7 OCRAM (mapping from CM4 TCM)0x2020_0000-0x2023_FFFF (256 KB)
CM7 OCRAM10x2020_0000-0x2027_FFFF (512 KB)0x2024_0000-0x202B_FFFF (512 KB)
CM7 OCRAM20x202C_0000-0x2033_FFFF (512 KB)
CM7 OCRAM1 ECC0x2034_0000-0x2034_FFFF (64 KB)
CM7 OCRAM2 ECC0x2035_0000-0x2035_FFFF (64 KB)
CM7 OCRAM(FLEX RAM ECC)0x2036_0000-0x2037_FFFF (128 KB)
CM7 FLEX RAM OCRAM0x2028_0000-0x2028_FFFF (Default 256 KB)0x2038_0000-0x2038_0000 (Default 0 KB, maximum 512 KB)
CM4 ITCM0x1FFE_0000-0x1FFF_FFFF (128 KB)
CM4 DTCM0x2000_0000-0x2001_FFFF (128 KB)
CM4 OCRAM (From CM4 TCM)0x2020_0000-0x2023_FFFF (256 KB)
CM4 OCRAM10x2024_0000-0x202B_FFFF (512 KB)
CM4 OCRAM20x202C_0000-0x2033_FFFF (512 KB)
CM4 OCRAM1 ECC0x2034_0000-0x2034_FFFF (64 KB)
CM4 OCRAM2 ECC0x2035_0000-0x2035_FFFF (64 KB)
CM4 OCRAM(From FLEX RAM ECC)0x2036_0000-0x2037_FFFF (128 KB)
CM4 OCRAM (From CM7 FLEX RAM)0x2038_0000-0x2038_0000 (Default 0 KB, maximum 512 KB)
SEMC0x8000_0000-0xDFFF_FFFF (1.5 GB)0x8000_0000-0xDFFF_FFFF (1.5 GB)
FlexSPI10x6000_0000-0x6FFF_FFFF (256 MB)0x3000_0000-0x3FFF_FFFF (256 MB)
FlexSPI20x7000_0000-0x7EFF_FFFF (240 MB)0x6000_0000-0x6FFF_FFFF (256 MB)

ECC

Refer to Table 7 for ECC feature comparison.

Table 7. ECC Comparison
Comparison Itemi.MX RT1060i.MX RT1170
FLEX RAM ECC-
OCRAM MECC64-
External XECC-

Image Processing and Display Interfaces

Graphics Accelerator (GPU2D)

The Graphics Accelerator (GPU2D) provides high-performance, low-power, and high-quality graphics acceleration. It supports raster and vector graphics processing common in embedded graphics scenarios. The SDK offers hardware and OS-independent APIs for GPU utilization.

  • OpenVG 1.1 API Standard Vector Graphics Acceleration Interface: A royalty-free, cross-platform API maintained by the Khronos Group, providing hardware acceleration for vector graphics libraries like Flash and SVG, and enhancing human-machine interfaces and text rendering.
  • VGLite Graphics API: Optimized for overall system resource usage, VGLite aims for maximum performance with minimal memory footprint. It supports a subset of Khronos OpenVG CTS features, including Porter-Duff compositing, gradient control, fast clear, arbitrary rotation, path fill rules, path rendering, and pattern path filling. The VGLite API categories include Initialization, Pixel Buffer Management, Matrix Control, Blit operations, Vector Path Control, and Drawing operations. SDK documentation provides detailed explanations.

LCDIFv2

LCDIFv2 is a new graphics processing and display IP on the i.MX RT1170 with the following features:

  • Supports up to 8 layers of alpha blending.
  • One Background (BG) layer for static background images.
  • One Video Foreground (FG) layer.
  • Six User Interface (UI) layers for icons, text, cursors, etc. UI layers are suitable for small images stored in OCRAM.
  • Each layer supports color indexing (1/2/4/8 bpp) with independent Color Look-Up Tables (CLUTs) for conversion to 32-bit ARGB pixels.
  • Each layer supports programmable screen pixel dimensions (width/height/stride), X/Y offsets, background color, embedded and global alpha blending, and color indexing (1/2/4/8 bpp).
  • Encoding format support includes RGB565/ARGB1555/ARGB4444, RGB888/ARGB8888/ABGR8888, and YCbCr422 (supporting up to two layers of YCbCr interleaving).
  • Supports parallel camera interface input and the following CSI-2 data formats: YUV422/RGB888/RGB666/RGB565/RGB555/RGB444.

Audio Peripherals

Asynchronous Sample Rate Converter (ASRC)

The Asynchronous Sample Rate Converter (ASRC) is a new IP on the i.MX RT1170 that converts the sampling rate of signals related to an input clock to signals related to a different output clock. ASRC supports up to 10 channels of parallel sample rate conversion with approximately -120dB THD+N and up to 3 pairs of sample rate processing. Input audio data can come from different sources with different sampling rates, and the output audio data can have different sampling rates, associated with the output clock, which is asynchronous to the input clock.

PDM MIC Interface

Compared to the i.MX RT1060, the i.MX RT1170 adds support for a 4-wire, 8-channel PDM D-MIC audio input. Key features include:

  • Decimation Filter: Fixed filtering characteristics for audio applications, 24-bit signed filter output, dynamic range <140dB (0dBFS) for a 1 KHz tone. Features an internal clock divider for programmable PDM clock generation, independent enable control for all or partial channels, programmable decimation rate, programmable de-DC functionality, range adjustment, and FIFO with interrupt and DMA capabilities, storing 8 samples per FIFO.
  • Hardware Voice Activity Detection (HWVAD): Supports interrupts and zero-crossing detection.

Low-Speed Peripherals

FlexIO

Table 8. FlexIO Parameter Comparison
Comparison Itemi.MX RT1060i.MX RT1170
Number of Instances32
Port SizeMax 32 bitMax 32 bit
Shifter Count48
Timer Count48

EMVSIM

The EMVSIM module is a new IP on the i.MX RT1170 compared to the i.MX RT1060. Key features include:

  • Independent transmit/receive clock + independent register read/write interface clock.
  • Bidirectional 16-byte FIFO for transmit and receive.
  • Automatic NACK generation on parity error and receive FIFO overflow.
  • Forward and reverse conventions.
  • Retransmission based on smart card NACK requests, with programmable retransmission thresholds.
  • Automatic detection of initial characters and data format settings for forward and reverse reception.
  • NACK reception detection.
  • Two general-purpose counters for software applications, with programmable counter clocks.
  • FIFO supports DMA transfers, operating in interrupt or DMA mode.
  • Programmable prescaler for card clock generation and baud rate divider for arbitrary F/D ratio transmission/reception ETU clock.
  • Deep sleep and wake-up via smart card status detection interrupt.
  • Automatic power-down of smart card detection port logic.
  • Support for generating 8-bit LRC and 16-bit CRC for transmitted data, and checking checksums for received data.

Watchdog Timers

Refer to Table 9 for watchdog timer comparison.

Table 9. Watchdog Timer Comparison
Comparison Itemi.MX RT1060i.MX RT1170
Watchdog22
RTWDOG12
External Watchdog Monitor (EWM)11

Analog Peripherals

The RT1170 does not have a TSC (Touch Screen Controller). The RT1170's ADC peripheral is a newly designed LPADC, structurally different from the i.MX RT1060. Refer to the i.MX RT1170 Processor Reference Manual (Document IMXRT1170RM) for details. Table 10 compares its features with the i.MX RT1060.

Table 10. ADC Feature Comparison for i.MX RT1060 and i.MX RT1170
Comparison Itemi.MX RT1060i.MX RT1170
Sampling Rate1 MS/s4.2 MS/s
Analog Input Channels1620
13-bit Differential Mode
FIFO
Command Buffers15
Channel Scaling

Boot Process

Table 11 outlines the system boot differences between the i.MX RT1060 and i.MX RT1170.

Table 11. i.MX RT1060 and i.MX RT1170 System Boot Differences
FeatureDescriptioni.MX RT1060i.MX RT1170
Boot Device- Serial NOR/NAND
- Raw NAND
- SD/MMC
- 1-bit SPI NOR/EEPROM
SupportedSupported
- Parallel NORSupportedNot Supported
Serial DownloadProtocolsdphostblhost
- USB-HID
- UART
SupportedSupported
Boot CoreN/ACM7CM7/CM4
External RAM- DCDSupportedSupported
- XMCDNot SupportedSupported
Internal RAM with ECCN/ANot SupportedSupported

Security

Table 12 details the main security differences between the i.MX RT1060 and i.MX RT1170.

Table 12. Main Differences in Security for i.MX RT1060 and i.MX RT1170
FeatureTypei.MX RT1060i.MX RT1170
Secure BootVerification and Encrypted Boot- Supported- Supported
Signature Mode- CMS PKCS#1- CMS PKCS#1
Public Key Type- RSA public keys (1024-bit, 2048-bit, 3072-bit and 4096-bit)- RSA public keys (1024-bit, 2048-bit, 3072-bit and 4096-bit)
- ECC (P256/P384/P-521)
Certificate Format- X.509v3 certificates- X.509v3 certificates
Encrypted XIP- BEE
- AES-128 ECB and CTR
- Decrypt cypher context of FlexSPI
- OTFAD1/2
- CTR-AES (128 bit)
- Decrypt cypher context of FlexSPI
- IEE
- XTS-AES 256, 512 bit
- CTR-AES 128, 256 bit
- RAM encryption/decryption
- FlexSPI decryption only
Cryptographic EngineHash Algorithm Engine- DCP
- SHA-1, SHA-256
- CAAM
- SHA-1, SHA-2 (224/256/384/512)
- MD5
- HMAC
Symmetric Algorithm Engine- DCP
- AES-128 (ECB and CBC modes)
- CAAM
- AES 128, 192, 256 with baseline modes (additional modes include GCM, CMAC)
- 3DES/DES
Asymmetric Algorithm Engine- DCP
- Not Supported
- CAAM
- RSA (up to 4096 bits)
- ECDSA (up to 521)
- ECDH
- Scalar-number Arithmetic
- ECC point Arithmetic
RNG- SA-TRNG
- Entropy source
- CAAM
- RNG4 seeded by TRNG
Key ManagementKey Management- OCOTP
- OTPMK
- SW_GP2
- OCOTP
- OTPMK
- USER_KEY1/2/3/4/5
- PUF
Persistent Supply DomainSecure Non-Volatile Storage (SNVS)- Secure Real-time Clock (SRTC)
- Zero Master Key (ZMK 128 bits)
- Digital Low-Voltage Detector
- Power glitch detector
- Secure Real-time Clock (SRTC)
- Zero Master Key (ZMK 256 bits)
- Digital Low-Voltage Detector
- Power glitch detector
- 4 KB secure retention RAM
- Provides a 1 K bit register protected by tamper
- Voltage, temperature and Frequency Tamper detector (RT1173 only)
- 10 external Tamper PINs (RT1173 only)
Secure DebugChallenge-Response Mechanism- SJC (56 bit response)- JTAGC (128 bit response)
OtherAccess Protection- CSU- RDC
- xRDC
- IEE_APC
Generation Protection (MP)- Not Supported- Supported

For tamper-related applications, refer to How to use Tamper Function (Document AN13078).

Software Porting Considerations

The i.MX RT1170 software ecosystem is based on MCUXpresso SDK/IDE/Tools, similar to the i.MX RT1060. Refer to Table 13 for comparison.

Table 13. Software Ecosystem Comparison
Comparison Itemi.MX RT1060i.MX RT1170
MCUXpresso SDK
MCUXpresso IDE
MCUXpresso Config Tools
MCUXpresso Secure Provisioning Tools
IAR
Keil
GCC

For new features in the i.MX RT1170, such as clocking, power management modes, and new IPs, significant differences from the i.MX RT1060 may require code porting or even redesign for specific software modules. For IPs that are similar or identical between the i.MX RT1170 and i.MX RT1060, most code can be reused, but consider potential impacts from different SDK versions.

Reference Materials

  • i.MX RT1170 Processor Reference Manual (Document IMXRT1170RM)
  • i.MX RT1170 Crossover Processors Data Sheet for Consumer Products (Document IMXRT1170CEC)

Revision History

Table 14. Revision History
Rev.DateDescription
0December 30, 2020Initial release
1February 18, 2021Updated RT1050/60 with RT1060

How To Reach Us

Information in this document is provided solely to enable system and software implementers to use NXP products. No express or implied copyright licenses are granted hereunder to design or fabricate any integrated circuits based on this information. NXP reserves the right to make changes without further notice to any products herein.

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Date of release: February 18, 2021

Document identifier: AN13106

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