Raspberry Pi Camera Module 3 Sensor Assembly
Published July 2025
Overview
Raspberry Pi Camera Module 3 Sensor Assemblies offer the same IMX708 12-megapixel sensor with high-dynamic-range (HDR) support, and the same Phase Detection Autofocus (PDAF) capabilities as Camera Module 3, in a compact footprint suitable for integration into smaller-form-factor OEM products. Standard and wide-angle variants are available, with or without an infrared cut filter.
Camera Module 3 Sensor Assemblies can be used to take full HD video as well as stills photographs, and provide a natural path to scale for customers who have prototyped with Camera Module 3. Their operation is fully supported by the libcamera library.
Reference schematics and a bill of materials are provided to assist customers in integrating the required support components into their products.
For a bill of materials visit rpltd.co/sa-bom.
For the reference schematic visit rpltd.co/sa-reference-schematic.
Specifications
| Sensor | Sony IMX708 featuring:
|
| Resolution | 11.9 megapixels |
| Sensor size | 7.4 mm sensor diagonal |
| Common video modes | 1080p50, 720p100, 480p120 |
| Output | RAW10 |
| Pixel size | 1.4 µm × 1.4 µm |
| Horizontal/vertical | 4608 x 2592 pixels |
| IR cut filter | Integrated in standard variants; not present in NoIR variants |
| Autofocus system | Phase Detection Autofocus |
| Operating temperature | 0°C to 50°C |
| Compliance | For a full list of local and regional product approvals, please visit pip.raspberrypi.com |
| Production lifetime | The Raspberry Pi Camera Module 3 Sensor Assembly will remain in production until at least January 2030 |
| List price | See variants table below |
Physical Specifications
Standard lens
Diagram description: The standard lens assembly shows a rectangular component with a circular lens opening. Key dimensions are provided: overall height approximately 10.8 mm, width approximately 8.9 mm. The lens diameter is approximately 5.75 mm. The field of view is described by angles: 41 degrees vertical, 66 degrees horizontal, and a focal ratio (F-stop) of F1.8. The focal length is 4.74 mm.
Wide lens
Diagram description: The wide lens assembly is similar in form factor to the standard lens. Key dimensions are approximately 10.8 mm height and 8.9 mm width. The lens diameter is approximately 6.95 mm. The field of view is wider: 67 degrees vertical, 102 degrees horizontal, with a focal ratio (F-stop) of F2.2. The focal length is 2.75 mm.
Note: all dimensions are in millimeters.
Variants
| Part number | Standard | Standard NoIR | Wide | Wide NoIR |
|---|---|---|---|---|
| Focus range | 10 cm–∞ | 10 cm–∞ | 5 cm–∞ | 5 cm–∞ |
| Focal length | 4.74 mm | 4.74 mm | 2.75 mm | 2.75 mm |
| Diagonal field of view | 75 degrees | 75 degrees | 120 degrees | 120 degrees |
| Horizontal field of view | 66 degrees | 66 degrees | 102 degrees | 102 degrees |
| Vertical field of view | 41 degrees | 41 degrees | 67 degrees | 67 degrees |
| Focal ratio (F-stop) | F1.8 | F1.8 | F2.2 | F2.2 |
| Infrared-sensitive | No | Yes | No | Yes |
| List price | $15 | $15 | $25 | $25 |
Warnings
- This product should be operated in a well-ventilated environment; if used inside a case, the case should not be covered.
- Whilst in use, this product should be firmly secured or placed on a stable, flat, non-conductive surface, and should not come into contact with conductive items.
- All peripherals used with this product should comply with relevant standards for the country of use and be marked accordingly to ensure that safety and performance requirements are met.
Safety Instructions
To avoid malfunction or damage to this product, please observe the following:
- This device should be operated in a dry environment at 0°C to 50°C.
- Do not expose to water or moisture, or place on a conductive surface whilst in operation.
- Do not expose to heat from any source; Raspberry Pi Camera Module 3 Sensor Assembly is designed for reliable operation at normal ambient temperatures.
- Store in a cool, dry location.
- Avoid rapid changes of temperature, which can cause moisture to build up in the device, affecting image quality.
- Take care whilst handling to avoid mechanical or electrical damage to the printed circuit board and connectors.
