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CMOSTEK CMT2210/17A

Low-Cost 300 – 960 MHz OOK Stand-Alone RF Receiver

Features

Applications

Descriptions

The CMT2210/17A devices are ultra low power, high performance, low-cost OOK stand-alone RF receivers for various 300 to 960 MHz wireless applications. The CMT2210A covers the frequency range from 300 to 480 MHz, while the CMT2217A covers the 300 to 960 MHz frequency range. They are part of the CMOSTEK NextGenRF™ family, which includes a complete line of transmitters, receivers, and transceivers. An embedded EEPROM allows the frequency, symbol rate, and other features to be programmed into the device using the CMOSTEK USB Programmer and RFPDK. Alternatively, in-stock products of 433.92/868.35 MHz are available for immediate demands without the need for EEPROM programming. When the CMT2210/17A is always on, it consumes only 3.8 mA current while achieving -113 dBm receiving sensitivity. It consumes even less power when working in duty-cycle operation mode via the built-in sleep timer. The CMT2210/17A receiver, together with the CMT211x transmitter, enables an ultra low-cost RF link.

Ordering Information

Table 1. BOM of 433.92/868.35 MHz Typical Application
Designator Descriptions Value (Match to 50Ω ANT) Value (Common Used ANT) Unit Manufacturer
433.92 MHz 868.35 MHz 433.92 MHz 868.35 MHz
U1 CMT2210/17A, low-cost 300-960 MHz OOK stand-alone RF receiver - - - CMOSTEK
X1 ±20 ppm, SMD32*25 mm, crystal 26 26 MHz EPSON
L1 ±5%, 0603 multi-layer chip inductor 27 6.8 33 6.8 nH Murata LQG18
L2[2] ±5%, 0603 multi-layer chip inductor, for QFN16 22 3.9 22 3.9 nH Murata LQG18
±5%, 0603 multi-layer chip inductor, for SOP16 15 -- 15 -- nH Murata LQG18
C1 ±0.25 pF, 0402 NP0, 50 V 3.3 2.7 2.7 2.7 pF Murata GRM15
C0 ±20%, 0402 X7R, 25 V 0.1 0.1 0.1 0.1 uF Murata GRM15
C2, C3 ±5%, 0402 NP0, 50 V 27 27 27 27 pF Murata GRM15

Note: [1]. The 868.35 MHz application is for CMT2217A only. [2]. CMT2210A devices in QFN16 and SOP16 packages share the same BOM except for the L2.

Table 2. Product Selection Table
Product Modulation/ Frequency Sensitivity Rx Current Embedded EEPROM Package
CMT2210A OOK/
300-480 MHz		 -113 dBm
(433.92 MHz, 1 ksps, 0.1% BER)		 3.8 mA
(433.92 MHz)		 ✔ QFN16(3x3)/
SOP16
CMT2217A OOK/
300-960 MHz		 -110 dBm
(868.35 MHz, 1 ksps, 0.1% BER)		 5.2 mA
(868.35 MHz)		 ✔ QFN16(3x3)

Abbreviations

Abbreviation Description Abbreviation Description
AGC Automatic Gain Control PC Personal Computer
AN Application Notes PCB Printed Circuit Board
BER Bit Error Rate PLL Phase Lock Loop
BOM Bill of Materials PN9 Pseudorandom Noise 9
BSC Basic Spacing between Centers POR Power On Reset
BW Bandwidth PUP Power Up
DC Direct Current QFN Quad Flat No-lead
EEPROM Electrically Erasable Programmable Read-Only Memory RF Radio Frequency
ESD Electro-Static Discharge RFPDK RF Products Development Kit
ESR Equivalent Series Resistance RoHS Restriction of Hazardous Substances
Ext Extended RSSI Received Signal Strength Indicator
IF Intermediate Frequency Rx Receiving, Receiver
LNA Low Noise Amplifier SAR Successive Approximation Register
LO Local Oscillator SOP Small Outline Package
LPOSC Low Power Oscillator SPI Serial Port Interface
Max Maximum TH Threshold
MCU Microcontroller Unit Tx Transmission, Transmitter
Min Minimum Typ Typical
MOQ Minimum Order Quantity USB Universal Serial Bus
NPO Negative-Positive-Zero VCO Voltage Controlled Oscillator
NC Not Connected WOR Wake On Radio
OOK On-Off Keying XOSC Crystal Oscillator
XTAL/Xtal Crystal

Electrical Characteristics

VDD = 3.3 V, TOP = 25 °C, FRF = 433.92 MHz, sensitivities are measured in receiving a PN9 sequence and matching to 50 Ω impedance, with the BER of 0.1%. All measurements are performed using the board CMT2210/17A-EM V1.0, unless otherwise noted.

1.1 Recommended Operation Conditions

Table 3. Recommended Operation Conditions
Parameter Symbol Conditions Min Typ Max Unit
Operation Voltage Supply VDD 1.8 3.6 V
Operation Temperature TOP -40 85 °C
Supply Voltage Slew Rate 1 mV/us

1.2 Absolute Maximum Ratings

Table 4. Absolute Maximum Ratings[1]
Parameter Symbol Conditions Min Max Unit
Supply Voltage VDD -0.3 3.6 V
Interface Voltage VIN -0.3 VDD + 0.3 V
Junction Temperature TJ -40 125 °C
Storage Temperature TSTG -50 150 °C
Soldering Temperature TSDR Lasts at least 30 seconds 255 °C
ESD Rating [2] Human Body Model (HBM) -2 2 kV
Latch-up Current @ 85 °C -100 100 mA

Notes:

[1]. Stresses above those listed as “absolute maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

[2]. The CMT2210/17A is high-performance RF integrated circuits with VCON/P pins having an ESD rating < 2 kV HBM. Handling and assembly of this device should only be done at ESD-protected workstations.

Caution! ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage.

Receiver Specifications

Table 5. Receiver Specifications
Parameter Symbol Conditions Min Typ Max Unit
Frequency Range FRF CMT2210A 300 480 MHz
CMT2217A 300 960 MHz
Symbol Rate SR 0.1 40 ksps
Sensitivity FRF = 433.92 MHz, SR = 1 ksps, BER = 0.1% -113 dBm
FRF = 868.35 MHz, SR = 1 ksps, BER = 0.1% -110 dBm
Saturation Input Signal Level PLVL 10 dBm
Working Current IDD FRF = 433.92 MHz 3.8 mA
FRF = 868.35 MHz 5.2 mA
Sleep Current ISLEEP When sleep timer is on 440 nA
When sleep timer is off 60 nA
Frequency Resolution FRES 24.8 Hz
Frequency Synthesizer Settle Time TLOCK From XOSC settled 150 us
Blocking Immunity BI SR = 1 ksps, ±1 MHz offset, CW interference 52 dB
SR = 1 ksps, ±2 MHz offset, CW interference 74 dB
SR = 1 ksps, ±10 MHz offset, CW interference 75 dB
Image Rejection Ratio IMR IF = 280 kHz 35 dB
Input 3rd Order Intercept Point IIP3 Two tone test at 1 MHz and 2 MHz offset frequency. Maximum system gain settings -25 dBm
Receiver Bandwidth BW 50 500 kHz
Receiver Start-up Time TSTART-UP From power up to receive, in Always Receive Mode 7.3 ms
Receiver Wake-up Time TWAKE-UP From sleep to receive, in Duty-Cycle Receive Mode 0.61 ms

Crystal Oscillator

The crystal oscillator is used as the reference clock for the PLL frequency synthesizer and system clock for the digital blocks. A 26 MHz crystal should be used with appropriate loading capacitors (C2 and C3 in Figure 10 of Page 11). The values of the loading capacitors depend on the total load capacitance CL specified for the crystal. The total load capacitance seen between the XIN and XOUT pin should equal CL for the crystal to oscillate at 26 MHz.

CL = 1 / (1/C2 + 1/C3) + Cparasitic

The parasitic capacitance is constituted by the input capacitance and PCB tray capacitance. The ESR of the crystal should be within the specification in order to ensure a reliable start-up. An external signal source can easily be used in place of a conventional XTAL and should be connected to the XIN pin. The incoming clock signal is recommended to have a peak-to-peak swing in the range of 300 mV to 700 mV and AC-coupled to the XIN pin.

Table 6. Crystal Oscillator Specifications
Parameter Symbol Conditions Min Typ Max Unit
Crystal Frequency[1] FXTAL 26 26 26 MHz
Crystal Tolerance[2] ±20 ppm
Load Capacitance CLOAD 10 15 20 pF
Crystal ESR Rm 60 Ω
XTAL Startup Time [3] txTAL 400 us

Notes:

[1]. The CMT2210/17A can directly work with external 26 MHz reference clock input to XIN pin (a coupling capacitor is required) with peak-to-peak amplitude of 0.3 to 0.7 V.

[2]. This is the total tolerance including (1) initial tolerance, (2) crystal loading, (3) aging, and (4) temperature dependence. The acceptable crystal tolerance depends on RF frequency and channel spacing/bandwidth.

[3]. This parameter is to a large degree crystal dependent.

LPOSC

Table 7. LPOSC Specifications
Parameter Symbol Conditions Min Typ Max Unit
Calibrated Frequency[1] FLPOSC After calibration 1 kHz
Frequency Accuracy 1 %
Temperature Coefficient [2] -0.02 %/°C
Supply Voltage Coefficient[3] +0.5 %/V
Initial Calibration Time tLPOSC-CAL 4 ms

Notes:

[1]. The LPOSC is automatically calibrated to the crystal oscillator during the PUP state, and is periodically calibrated since then.

[2]. Frequency drifts when temperature changes after calibration.

[3]. Frequency drifts when supply voltage changes after calibration.

Pin Descriptions

The CMT2210/17A is available in QFN16 (3x3) and SOP16 packages. The pin assignments are detailed below.

QFN16 (3x3) Package

Figure 2. CMT2210/17A Pin Assignments in QFN16 (3x3) Package

The diagram shows a top view of the QFN16 package with pin numbers 1 through 16 arranged around the chip. Pin 1 is typically at the bottom left corner, and numbering proceeds counter-clockwise. Key pins include VDD, GND, RFIN, CSB, SDA, SCL, DOUT, CLKO, XOUT, XIN, nRSTO, VCOP, and VCON.

Table 8. CMT2210/17A Pin Descriptions in QFN16 (3x3) Package
Pin Number Name I/O Descriptions
1 CSB I 3-wire SPI chip select input for EEPROM programming, internally pulled high
2 SDA IO 3-wire SPI data input and output for EEPROM programming
3 SCL I 3-wire SPI clock input for EEPROM programming, internally pulled low
4,9 NC NA Not connected, leave floating
5 DOUT O Received data output
6 CLKO O Programmable clock output to drive an external MCU
7 XOUT O Crystal oscillator output
8 XIN I Crystal oscillator input or external reference clock input
10 nRSTO O Active-low power-on-reset output to reset an external MCU
11 VCOP IO VCO tank, connected to an external inductor
12 VCON
13, 15 GND I Ground
14 RFIN I RF signal input to the LNA
16 VDD I Power supply input

SOP16 Package

Figure 3. CMT2210A Pin Assignments in SOP16 Package

The diagram shows a top view of the SOP16 package with pin numbers 1 through 16 arranged around the chip. Pin 1 is typically at the bottom left corner, and numbering proceeds counter-clockwise. Key pins include VCOP, VCON, GND, RFIN, VDD, CSB, SDA, SCL, DOUT, CLKO, XOUT, XIN, and nRSTO.

Table 9. CMT2210A Pin Assignments in SOP16 Package
Pin Number Name I/O Descriptions
1 VCOP IO VCO tank, connected to an external inductor
2 VCON
3,5 GND I Ground
4 RFIN I RF signal input to the LNA
6 VDD I Power supply input
7 CSB I 3-wire SPI chip select input for EEPROM programming
8 SDA IO 3-wire SPI data input and output for EEPROM programming
9 SCL I 3-wire SPI clock input for EEPROM programming
10,15 NC Not connected, leave floating
11 DOUT O Received data output
12 CLKO O Programmable clock output to drive an external MCU
13 XOUT O Crystal oscillator output
14 XIN I Crystal oscillator input or external reference clock input
16 nRSTO O Active-low power-on-reset output to reset an external MCU

Typical Performance Characteristics

Figure 5. Current vs. Voltage, FRF = 433.92 / 868.35 MHz, SR = 1 ksps: This graph shows current consumption in mA versus supply voltage in V. For both 433.92 MHz and 868.35 MHz, current consumption increases with supply voltage, generally staying between 2.5 mA and 6.0 mA.

Figure 4. Current vs. Temperature, FRF = 433.92/868.35 MHz, SR = 1 ksps: This graph illustrates current consumption in mA versus temperature in °C. For both frequency bands and various supply voltages (1.8V, 3.3V, 3.6V), current consumption shows a slight increase with temperature.

Figure 7. Sensitivity vs. Supply Voltage, SR = 1 ksps, BER = 0.1%: This graph plots sensitivity in dBm versus supply voltage in V. For both 433.92 MHz and 868.35 MHz, sensitivity remains relatively stable across the supply voltage range, hovering around -108 dBm to -114 dBm.

Figure 6. Sensitivity vs. Temperature, FRF = 433.92 / 868.35 MHz, SR = 1 ksps, BER = 0.1%: This graph displays sensitivity in dBm versus temperature in °C. Sensitivity for both 433.92 MHz and 868.35 MHz shows a slight degradation (becomes less sensitive) as temperature increases, ranging from approximately -108 dBm to -116 dBm.

Figure 8. Sensitivity vs. SR, FRF = 433.92 / 868.35 MHz, VDD = 3.3V, BER = 0.1%: This graph shows sensitivity in dBm versus Symbol Rate (SR) in ksps. For both frequency bands, sensitivity decreases as the symbol rate increases, with values ranging from -90 dBm to -120 dBm.

Figure 9. Sensitivity vs. BER, FRF = 433.92 / 868.35 MHz, VDD = 3.3 V, SR = 1 ksps: This graph plots sensitivity in dBm versus Bit Error Rate (BER). For both 433.92 MHz and 868.35 MHz, sensitivity degrades as the BER increases, with values ranging from -108 dBm to -117 dBm.

Typical Application Schematic

Figure 10. Typical Application Schematic: This schematic illustrates a typical application circuit for the CMT2210/17A. It includes the CMT2210/17A IC, a 26 MHz crystal (X1) with load capacitors (C2, C3), an antenna connection (ANT) via an inductor (L1), power supply (VDD, GND), and an optional connector (J1) for EEPROM access. Inductors L2 and capacitors C0, C1 are also part of the RF matching and filtering network. The diagram shows pin connections for VDD, GND, RFIN, XIN, XOUT, CSB, SDA, SCL, DOUT, CLKO, nRSTO, VCOP, and VCON.

Notes:

Table 10. BOM of 433.92/868.35 MHz Typical Application [1]
Designator Descriptions Value (Match to 50Ω ANT) Value (Common Used ANT) Unit Manufacturer
433.92 MHz 868.35 MHz 433.92 MHz 868.35 MHz
U1 CMT2210/17A, low-cost 300-960 MHz OOK stand-alone RF receiver - - - CMOSTEK
X1 ±20 ppm, SMD32*25 mm, crystal 26 26 MHz EPSON
L1 ±5%, 0603 multi-layer chip inductor 27 6.8 33 6.8 nH Murata LQG18
L2[2] ±5%, 0603 multi-layer chip inductor, for QFN16 22 3.9 22 3.9 nH Murata LQG18
±5%, 0603 multi-layer chip inductor, for SOP16 15 -- 15 -- nH Murata LQG18
C1 ±0.25 pF, 0402 NP0, 50 V 3.3 2.7 2.7 2.7 pF Murata GRM15
C0 ±20%, 0402 X7R, 25 V 0.1 0.1 0.1 0.1 uF Murata GRM15
C2, C3 ±5%, 0402 NP0, 50 V 27 27 27 27 pF Murata GRM15

Note: [1]. The 868.35 MHz application is for CMT2217A only. [2]. CMT2210A devices in QFN16 and SOP16 packages share the same BOM except for the L2.

Functional Descriptions

5.1 Overview

The CMT2210/17A devices are ultra low power, high performance, low-cost OOK stand-alone RF receivers for various 300 to 960 MHz wireless applications. The CMT2210A covers the frequency range from 300 to 480 MHz, while the CMT2217A covers the 300 to 960 MHz frequency range. They are part of the CMOSTEK NextGenRF™ family, which includes a complete line of transmitters, receivers, and transceivers. The chip is based on a fully integrated, low-IF receiver architecture. The low-IF architecture facilitates a very low external component count and does not suffer from powerline-induced interference problems. The synthesizer contains a VCO and a low noise fractional-N PLL with an output frequency resolution of 24.8 Hz. The VCO operates at 2x the Local Oscillator (LO) frequency to reduce spurious emissions. Every analog block is calibrated on each Power-on Reset (POR) to the internal reference voltage. The calibration helps the device to finely work under different temperatures and supply voltages. The baseband filtering and demodulation is done by the digital demodulator. The demodulated signal is output to the external MCU via the DOUT pin. No external MCU control is needed in the applications.

The 3-wire SPI interface is only used for configuring the device. The configuration can be done with the RFPDK and the USB Programmer. The RF Frequency, symbol rate, and other product features are all configurable. This saves cost and simplifies the design, development, and manufacture. Alternatively, in-stock products of 433.92/868.35 MHz are available for immediate demands with no need of EEPROM programming. The CMT2210/17A operates from 1.8 to 3.6 V, so that it can finely work with most batteries to their useful power limits. The receive current is only 3.8 mA at 433.92 MHz and 5.2 mA at 868.35 MHz. The CMT2210/17A receiver, together with the CMT211x transmitter, enables an ultra low-cost RF link.

5.2 Modulation, Frequency and Symbol Rate

The CMT2210/17A supports OOK demodulation with the symbol rate from 0.1 to 40 ksps. The CMT2210A continuously covers the frequency range from 300 to 480 MHz, including the license-free ISM frequency bands around 315 MHz and 433.92 MHz. And the CMT2217A covers the frequency range from 300 MHz to 960 MHz, including the license-free ISM frequency bands around 315 MHz, 433.92 MHz, 868.35 MHz, and 915 MHz. The internal frequency synthesizer contains a high-purity VCO and a low-noise fractional-N PLL with an output frequency resolution of 24.8 Hz. See the table below for the demodulation, frequency, and symbol rate information.

Table 11. Modulation, Frequency and Symbol Rate
Parameter Value Unit
Demodulation OOK -
Frequency (CMT2210A) 300 to 480 MHz
Frequency (CMT2217A) 300 to 960 MHz
Frequency Resolution 24.8 Hz
Symbol Rate 0.1 to 40 ksps

5.3 Embedded EEPROM and RFPDK

The RFPDK is a PC application developed to help the user configure the CMOSTEK NextGenRF™ products in the most intuitive way. The user only needs to connect the USB Programmer between the PC and the device, fill in/select the proper value of each parameter on the RFPDK, and click the "Burn" button to program the configurations into the device. The configurations of the device will then remain unchanged until the next programming. No external MCU control is required in the application program.

The RFPDK also allows the user to save the active configuration into a list by clicking on the “List” button, so that the saved configuration can be directly reloaded from the list in the future. Furthermore, it supports exporting the configuration into a hexadecimal file by clicking on the "Export" button. This file can be used to burn the same configuration into a large amount of devices during mass production. See the figure below for accessing the EEPROM.

Figure 12. Accessing Embedded EEPROM: This diagram illustrates the setup for accessing the embedded EEPROM. It shows the CMT2210/17A connected to an EEPROM via an interface. The interface is connected to a CMOSTEK USB Programmer, which in turn is connected to a PC running the RFPDK software. The connections shown are CSB, SCL, and SDA.

For more details of the CMOSTEK USB Programmer and the RFPDK, please refer to "AN103 CMT211xA-221xA One-Way RF Link Development Kits Users Guide".

5.4 All Configurable Options

Besides demodulation, frequency, and symbol rate, more options can be used to customize the device. The following is a table of all configurable options. On the RFPDK, the Basic Mode offers a few options for easy and fast configurations. The Advanced Mode shows all options for deeper customization. The options in "Basic Mode" are a subset of those in "Advanced Mode".

Table 12. Configurable Parameters in RFPDK
Category Parameters Descriptions Default Mode
RF Settings Frequency (CMT2210A) The receive radio frequency, the range is from 300 to 480 MHz, with resolution of 0.001 MHz. 433.920 MHz Basic / Advanced
Frequency (CMT2217A) The receive radio frequency, the range is from 300 to 960 MHz, with resolution of 0.001 MHz. 868.350 MHz Basic / Advanced
Demodulation The demodulation type, only OOK demodulation is supported in this product. OOK Basic / Advanced
Symbol Rate The receiver symbol rate, the range is from 0.1 to 40 ksps, with resolution of 0.1 ksps. 2.4 ksps Basic / Advanced
Squelch TH (CMT2210A/CMT2217A) The threshold of the squelch circuit to suppress the noise, the range is from 0 to 255. 54 / 40 Basic / Advanced
Xtal Tol. | Rx BW (CMT2210A/CMT2217A) The sum of the crystal frequency tolerance of the Tx and the Rx, the range is from 0 to ±300 ppm. And the calculated BW is configured and displayed. ±150 ppm | 200 kHz / ±40 ppm | 100 kHz Basic / Advanced
Xtal Stabilizing Time Time for the device to wait for the crystal to get settled after power up. The options are: 78, 155, 310, 620, 1240 or 2480 us. 310 us Basic / Advanced
Operation Settings Duty-Cycle Mode Turn on/off the duty-cycle receive mode, the options are: on or off. On Basic / Advanced
Sleep Time The sleep time in duty-cycle receive mode, the range is from 3 to 134,152,192 ms. 3 ms Basic / Advanced
Rx Time The receive time in duty-cycle receive mode, the range is from 0.04 to 2,683,043.00 ms. 2,000 ms Basic / Advanced
Rx Time Ext The extended receive time in duty-cycle receive mode, the range is from 0.04 to 2,683,043.00 ms. It is only available when WOR is on. 200.00 ms Advanced
Wake-On Radio Turn on/off the wake-on radio function, the options are: on or off. Off Advanced
Wake-On Condition The condition to wake on the radio. The options are: Extended by Preamble, or Extended by RSSI. It is only available when WOR is on. Extended by Preamble Advanced
System Clock Output Turn on/off the system clock output on CLKO, the options are: on or off. Off Advanced
System Clock Frequency The system clock output frequency, the options are: 13.000, 6.500, 4.333, 3.250, 2.600, 2.167, 1.857, 1.625, 1.444, 1.300, 1.182, 1.083, 1.000, 0.929, 0.867, 0.813, 0.765, 0.722, 0.684, 0.650, 0.619, 0.591, 0.565, 0.542, 0.520, 0.500, 0.481, 0.464, 0.448, 0.433, 0.419 or 0.406 MHz. It is only available when System Clock Output is on. 6.5 MHz Advanced
OOK Settings Demod Method The OOK demodulation methods, the options are: Peak TH, or Fixed TH Peak TH Advanced
Fixed Demod TH (CMT2210A/CMT2217A) The threshold value when the Demod Method is "Fixed TH", the minimum input value is the value of Squelch Threshold set on the RFPDK, the maximum value is 255. 60 / 50 Advanced
Decode Settings Peak Drop Turn on/off the RSSI peak drop function, the options are on, or off. On Advanced
Peak Drop Step The RSSI peak drop step, the options are: 1, 2, 3, 5, 6, 9, 12 or 15. 1 Advanced
Peak Drop Rate The RSSI peak drop rate, the options are: 1 step/4 symbols, 1 step/2 symbols, 1 step /1 symbol, or 1 step/0.5 symbol. 1 step / 4 symbols Advanced
AGC Automatic Gain Control, the options are: on or off. On Advanced
Preamble The size of the valid preamble, the options are: 1-byte, 2-byte, 3-byte, or 4-byte. It is only available when WOR is on. 2-byte Advanced

Internal Blocks Description

5.5.1 RF Front-end and AGC

The CMT2210/17A features a low-IF receiver. The RF front-end consists of a Low Noise Amplifier (LNA), I/Q mixer, and a wide-band power detector. A low-cost inductor and capacitor are required for matching the LNA to common antennas. The input RF signal is amplified and down-converted to the IF frequency. The Automatic Gain Control (AGC) loop regulates the RF front-end's gain for optimal linearity, selectivity, and sensitivity, even with strong out-of-band interference.

5.5.2 IF Filter

Signals are filtered by an integrated 3rd-order band-pass image rejection IF filter, providing over 35 dB image rejection. The IF center frequency is dynamically adjusted for optimal performance. The IF bandwidth is computed based on RF frequency, Xtal tolerance, and symbol rate.

5.5.3 RSSI

Multistage I/Q Log amplifiers process the IF filter output. Receive Signal Strength Indicator (RSSI) generators produce DC voltages proportional to the input signal level. The resulting RSSI is a sum of both I and Q paths, offering over 66 dB dynamic range. A patented DC-offset cancellation engine enhances receiver sensitivity performance.

5.5.4 SAR ADC

An on-chip 8-bit SAR ADC digitalizes the RSSI for OOK demodulation.

5.5.5 Crystal Oscillator

The crystal oscillator serves as the reference clock for the PLL frequency synthesizer and system clock. A 26 MHz crystal is used with loading capacitors (C2, C3). The total load capacitance CL is critical for oscillation. The formula for CL is: CL = 1 / (1/C2 + 1/C3) + Cparasitic. Parasitic capacitance includes input and PCB tray capacitance. ESR should be within specification for reliable start-up. An external signal source can be used, connected to the XIN pin, with a peak-to-peak swing of 300 mV to 700 mV.

Table 6. Crystal Oscillator Specifications
Parameter Symbol Conditions Min Typ Max Unit
Crystal Frequency[1] FXTAL 26 26 26 MHz
Crystal Tolerance[2] ±20 ppm
Load Capacitance CLOAD 10 15 20 pF
Crystal ESR Rm 60 Ω
XTAL Startup Time [3] txTAL 400 us

Notes:

[1]. The CMT2210/17A can directly work with external 26 MHz reference clock input to XIN pin (a coupling capacitor is required) with peak-to-peak amplitude of 0.3 to 0.7 V.

[2]. This is the total tolerance including (1) initial tolerance, (2) crystal loading, (3) aging, and (4) temperature dependence. The acceptable crystal tolerance depends on RF frequency and channel spacing/bandwidth.

[3]. This parameter is to a large degree crystal dependent.

5.5.6 Frequency Synthesizer

A fractional-N frequency synthesizer generates the LO frequency for the down-conversion I/Q mixer. It is integrated except for the VCO tank inductor, enabling ultra low-power design. Using a 26 MHz reference clock, it can generate any receive frequency between 300 to 480 MHz with a 24.8 Hz resolution. The VCO operates at 2x LO frequency. A high Q VCO tank inductor is recommended for optimal oscillation, low power consumption, and good phase noise performance. Inductor values for different LO frequency bands are provided.

Table 13. VCO Inductor for 315/433.92/868.35/915 MHz Frequency Band
LO Frequency Band (MHz) 315 433.92 868.35 915
VCO Inductor for QFN16 package (nH) 33 22 3.9 3.9
VCO Inductor for SOP16 package (nH) 27 15 -- --

Multiple subsystem calibrations ensure reliable frequency synthesizer operation.

5.5.7 LPOSC

An internal 1 kHz low-power oscillator drives the sleep timer for periodic wake-ups from sleep state. Sleep Time can be configured from 3 to 134,152,192 ms. The LPOSC is automatically calibrated during PUP and periodically thereafter to maintain frequency tolerance within ±1%, despite temperature and supply voltage variations.

5.6 Operation Mode

The "Duty-Cycle On-Off" option on the RFPDK determines the device's behavior. The device operates in two modes:

Figure 13. Two different operation modes: This figure shows two state diagrams. The left diagram represents "Always Receive Mode" (Duty-Cycle Mode set to Off) and shows the sequence: Power Up (PUP) -> SLEEP -> RX. The right diagram represents "Duty-Cycle Receive Mode" (Duty-Cycle Mode set to On) and shows the sequence: Power Up (PUP) -> SLEEP -> XTAL -> TUNE -> RX.

PUP State: Includes Power-On Reset (POR), crystal turn-on, and internal block calibration. Takes ~4 ms in Always Receive Mode and ~9.5 ms in Duty-Cycle Receive Mode (due to LPOSC and sleep timer calibration). Average current is ~0.9 mA.

SLEEP State: Internal blocks are powered down except the sleep timer. Sleep time is ~3 ms in Always Receive Mode. In Duty-Cycle Receive Mode, sleep time is configurable via RFPDK. Sleep current is ~60 nA (Always Receive Mode) or ~440 nA (Duty-Cycle Receive Mode).

XTAL State: Exists only in Duty-Cycle Receive Mode. Crystal oscillator restarts. "XTAL Stabilizing Time" on RFPDK defines settling time. Current consumption is ~520 uA.

TUNE State: Device tunes to the desired frequency. Takes ~300 us. Current consumption is ~2 mA.

RX State: Receives incoming signals and outputs demodulated data via DOUT. In Duty-Cycle Receive Mode, duration is defined by "Rx Time". Current consumption is ~3.8 mA.

5.7 Always Receive Mode

With Duty-Cycle Mode off, the device follows PUP -> SLEEP (~3 ms) -> Tune -> RX. The device continuously receives RF signals and outputs data. Configurable system clock is output on CLKO if enabled. The figure below shows timing and current consumption.

Figure 14. Timing and Current Consumption for Always Receive Mode: This timing diagram shows the sequence of states (PUP, SLEEP, TUNE, RX) and their durations. It also illustrates the corresponding current consumption levels: ~900 uA during PUP, ~440 nA during SLEEP, ~2.0 mA during TUNE, and ~3.8 mA during RX.

5.8 Duty-Cycle Receive Mode

With Duty-Cycle Mode on, the device automatically repeats the sequence SLEEP, XTAL, TUNE, and RX. This allows regular re-tuning for optimal performance. The PUP sequence takes ~9.5 ms. The system clock is output on CLKO during TUNE and RX states. The figure below shows timing and current consumption.

Figure 15. Timing and Current Consumption for Duty-Cycle Receive Mode: This timing diagram shows the cyclical sequence of states (SLEEP, XTAL, TUNE, RX) and their durations. It illustrates current consumption: ~440 nA during SLEEP, ~520 uA during XTAL, ~2.0 mA during TUNE, and ~3.8 mA during RX. The Sleep Time and Rx Time are configurable.

Advantages of Duty-Cycle Receive Mode:

Easy Duty-Cycle Configurations

For users prioritizing system stability and performance over power consumption, "Easy Configuration" allows duty-cycle mode operation without complex calculations. The example below illustrates this.

Figure 16. Tx and Rx relationship of Easy Configuration: This diagram shows the timing relationship between TX data packets and the RX state. A TX packet has a length of 50 ms. The RX state's non-receive time (Sleep, XTAL, Tune) is approximately 3.61 ms. The Rx Time is set to 1000 ms, ensuring at least one packet is received even if some are missed during the non-receive period. The DOUT pin outputs logic 0 during non-receive time.

In the example, with a Tx data rate of 1.2 ksps and 60 symbols per packet (50 ms packet length), the user can:

This configuration ensures reliable data capture. For applications where power consumption is critical, "Precise Configuration" and "Wake-On Radio" techniques are recommended. Refer to "AN108 CMT2210/17A Configuration Guideline" for details.

5.10 The nRSTO

An active-low reset signal is generated by the internal POR and output via the nRSTO pin. It can be used to reset an external MCU if required.

Figure 17. nRSTO Timing Characteristics: This diagram shows the VDD voltage rising from 0V to its stabilized level. After VDD crosses the threshold voltage (Vth, ~1.2V), the Power-On Reset (POR) circuit changes its state from logical 0 to 1 after a time TPOR. The nRSTO signal follows VDD. TPOR varies with VDD rise time.

Table 14. TPOR Timing Characteristics
TRISE (us) TPOR (us)
3,000 500
1,000 300
300 160
100 100
30 70
10 60

When VDD falls, nRSTO follows simultaneously.

5.11 The CLKO

A divided clock from the crystal oscillator is output on the CLKO pin if "System Clock Output" is set to "On" on the RFPDK. This clock can drive an external MCU and is available during XTAL, TUNE, and RX states. The clock frequency is selected via the "System Clock Frequency" option. Refer to "AN108 CMT2210/17A Configuration Guideline" for details.

Ordering Information

Table 15. CMT2210/17A Ordering Information
Part Number Descriptions Package Type Package Option Operating Condition MOQ / Multiple
CMT2210A-EQR[1] Low-Cost 300 – 480 MHz OOK Stand-Alone RF Receiver QFN16 (3x3) Tape & Reel 1.8 to 3.6 V,
-40 to 85 °C		 5,000
CMT2210A-ESR[1] Low-Cost 300 – 480 MHz OOK Stand-Alone RF Receiver SOP16 Tape & Reel 1.8 to 3.6 V,
-40 to 85 °C		 2,500
CMT2210A-ESB [1] Low-Cost 300 – 480 MHz OOK Stand-Alone RF Receiver SOP16 Tube 1.8 to 3.6 V,
-40 to 85 °C		 1,000
CMT2217A-EQR[1] Low-Cost 300 – 960 MHz OOK Stand-Alone RF Receiver QFN16 (3x3) Tape & Reel 1.8 to 3.6 V,
-40 to 85 °C		 5,000

Note:

[1]. "E" stands for extended industrial product grade, supporting -40 to +85 °C. "Q" for QFN16 (3x3) package, "S" for SOP16 package. "R" for tape and reel (MOQ 5,000 for QFN, 1,000 for SOP). "B" for tube package (MOQ 1,000 for SOP16). Default frequency for CMT2210A is 433.920 MHz, and for CMT2217A is 868.350 MHz. Refer to Table 12 for other settings.

Visit www.cmostek.com/products to know more about the product line.

Contact sales@cmostek.com or your local sales representatives for more information.

Package Outline

16-Pin QFN 3x3 Package

Figure 18. 16-Pin QFN 3x3 Package: This figure shows the top, side, and bottom views of the 16-pin QFN 3x3 package, illustrating its dimensions and pin layout. The dimensions are detailed in the table below.

Table 16. 16-Pin QFN 3x3 Package Dimensions
Symbol Min Max Size (millimeters)
A 0.7 0.8
A1 0.05
b 0.18 0.30
c 0.18 0.25
D 2.90 3.10
D2 1.55 1.75
e 0.50 BSC
E 2.90 3.10
E2 1.55 1.75
L 0.35 0.45

SOP16 Package

Figure 19. SOP16 Package: This figure displays the top, side, and bottom views of the SOP16 package, detailing its dimensions and pin arrangement. The dimensions are listed in the table below.

Table 17. SOP16 Package Package Dimensions
Symbol Min Typ Max Size (millimeters)
A - - 1.75
A1 - 0.05 0.225
A2 - 1.30 1.40 1.50
A3 - 0.60 0.65 0.70
b - - 0.39 0.48
c - 0.21 0.26
D - 9.70 9.90 10.10
E - 5.80 6.00 6.20
E1 - 3.90 4.10
e - - 1.27 BSC
h - 0.25 0.50
L - 0.50 0.80
L1 - 1.05 BSC
θ 0 - 8°

Top Marking

CMT2210/17A Top Marking in QFN16 Package

Figure 20. CMT2210 (Left) and CMT2217A (Right) Top Marking in QFN16 Package: This figure shows the laser marking on the QFN16 package. The CMT2210A marking includes "210A" on the first line, "1234" (internal tracking), and "YWW" (date code) on the second line. The CMT2217A marking includes "217A" on the first line, "1234" (internal tracking), and "YWW" (date code) on the second line. A pin 1 mark (dot) is also present.

Table 18. CMT2210/17A QFN16 Top Marking Explanation
Mark Method Description
Laser
Pin 1 Mark Circle's diameter = 0.3 mm
Font Size 0.5 mm, right-justified
Line 1 Marking 210A, represents part number CMT2210A
217A, represents part number CMT2217A
Line 2 Marking ①②③④ Internal tracking number
Line 3 Marking Date code assigned by the assembly house. Y represents the last digit of the mold year and WW represents the workweek

CMT2210A Top Marking in SOP16 Package

Figure 21. CMT2210A Top Marking in SOP16 Package: This figure shows the laser marking on the SOP16 package. The marking includes "CMT2210A" on the first line, "YYWW" (date code) followed by "123456" (internal tracking) on the second line. A pin 1 mark (dot) is present.

Table 19. CMT2210A SOP16 Top Marking Explanation
Mark Method Description
Laser
Pin 1 Mark Circle's diameter = 1 mm
Font Size 0.35 mm, right-justified
Line 1 Marking CMT2210A, represents part number CMT2210A
Line 2 Marking YYWW is the Date code assigned by the assembly house. YY represents the last two digits of the mold year and WW represents the workweek
Line 3 Marking 123456 is the internal tracking number

Other Documentations

Table 20. Other Documentations for CMT2210/17A
Brief Name Descriptions
AN103 CMT211xA-221xA One-Way RF Link Development Kits Users Guide User's Guides for CMT211xA and CMT221xA Development Kits, including Evaluation Board and Evaluation Module, CMOSTEK USB Programmer and RFPDK.
AN107 CMT221x Schematic and PCB Layout Design Guideline Details of CMT2210/13/17/19A and CMT2210L PCB schematic and layout design rules, RF matching network and other application layout design related issues.
AN108 CMT2210/17A Configuration Guideline Details of configuring CMT2210/17A features on the RFPDK.

Document Change List

Table 21. Document Change List
Rev. No. Chapter Description of Changes Date
0.9 All Initial released version 2014-06-14
1.0 5 Update Section 5.7 and Figure 14 2014-06-30
1.1 All Add Product CMT2217A to the datasheet 2015-01-23
1.2 All Add SOP16 to product CMT2210A 2015-05-04
1.3 All Update the VCO inductor for CMT2210A in SOP16 package 2015-06-17

Contact Information

Hope Microelectronics Co., Ltd

Address: 2/F, Building3, Pingshan Private Enterprise science and Technology Park, Xili Town, Nanshan District, Shenzhen, China

Tel: +86-755-82973805

Fax: +86-755-82973550

Email: sales@cmostek.com

Email: hoperf@gmail.com

Website: http://www.hoperf.com

Website: http://www.hoperf.cn

Copyright. CMOSTEK Microelectronics Co., Ltd. All rights are reserved.

The information furnished by CMOSTEK is believed to be accurate and reliable. However, no responsibility is assumed for inaccuracies and specifications within this document are subject to change without notice. The material contained herein is the exclusive property of CMOSTEK and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of CMOSTEK. CMOSTEK products are not authorized for use as critical components in life support devices or systems without express written approval of CMOSTEK. The CMOSTEK logo is a registered trademark of CMOSTEK Microelectronics Co., Ltd. All other names are the property of their respective owners.

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