User Guide for infineon models including: XENSIVTM Sensor Shield, XENSIVTM, Sensor Shield, Shield
SHIELD XENSIV A XENSIV™ sensor shield user guide
Infineon, User guide
Infineon Technologies AG
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Infineon-SHIELD XENSIV A UG-UserManual-v02 00-EN SHIELD_XENSIV_A XENSIVTM sensor shield user guide
About this document
Scope and purpose
This user guide provides detailed information about the XENSIVTM sensor shield, which is a hardware add-on board for baseboards compatible with Arduino. It covers the shield's features, functionality, and usage, including its Infineon XENSIVTM sensors, supporting hardware, and other sensors, such as IMU, magnetometer, and humidity sensor. Additionally, this user guide covers the integration of Infineon's security devices, offering a comprehensive solution for secure and reliable sensing applications. Intended audience
The expansion board is intended for technical specialists familiar with IoT and sensing technologies, and is intended to be used under laboratory conditions.
User guide
Please read the sections "Important notice" and "Warnings" at the end of this document
www.infineon.com
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Important notice
Important notice
"Evaluation Boards and Reference Boards" shall mean products embedded on a printed circuit board (PCB) for demonstration and/or evaluation purposes, which include, without limitation, demonstration, reference and evaluation boards, kits and design (collectively referred to as "Reference Board").
Environmental conditions have been considered in the design of the Evaluation Boards and Reference Boards provided by Infineon Technologies. The design of the Evaluation Boards and Reference Boards has been tested by Infineon Technologies only as described in this document. The design is not qualified in terms of safety requirements, manufacturing and operation over the entire operating temperature range or lifetime.
The Evaluation Boards and Reference Boards provided by Infineon Technologies are subject to functional testing only under typical load conditions. Evaluation Boards and Reference Boards are not subject to the same procedures as regular products regarding returned material analysis (RMA), process change notification (PCN) and product discontinuation (PD).
Evaluation Boards and Reference Boards are not commercialized products, and are solely intended for evaluation and testing purposes. In particular, they shall not be used for reliability testing or production. The Evaluation Boards and Reference Boards may therefore not comply with CE or similar standards (including but not limited to the EMC Directive 2004/EC/108 and the EMC Act) and may not fulfill other requirements of the country in which they are operated by the customer. The customer shall ensure that all Evaluation Boards and Reference Boards will be handled in a way which is compliant with the relevant requirements and standards of the country in which they are operated.
The Evaluation Boards and Reference Boards as well as the information provided in this document are addressed only to qualified and skilled technical staff, for laboratory usage, and shall be used and managed according to the terms and conditions set forth in this document and in other related documentation supplied with the respective Evaluation Board or Reference Board.
It is the responsibility of the customer's technical departments to evaluate the suitability of the Evaluation Boards and Reference Boards for the intended application, and to evaluate the completeness and correctness of the information provided in this document with respect to such application.
The customer is obliged to ensure that the use of the Evaluation Boards and Reference Boards does not cause any harm to persons or third party property.
The Evaluation Boards and Reference Boards and any information in this document is provided "as is" and Infineon Technologies disclaims any warranties, express or implied, including but not limited to warranties of non-infringement of third party rights and implied warranties of fitness for any purpose, or for merchantability.
Infineon Technologies shall not be responsible for any damages resulting from the use of the Evaluation Boards and Reference Boards and/or from any information provided in this document. The customer is obliged to defend, indemnify and hold Infineon Technologies harmless from and against any claims or damages arising out of or resulting from any use thereof.
Infineon Technologies reserves the right to modify this document and/or any information provided herein at any time without further notice.
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Safety precautions
Safety precautions
Note:
Please note the following warnings regarding the hazards associated with development systems.
Table 1
Safety precautions
Caution: The evaluation or reference board contains parts and assemblies sensitive to electrostatic discharge (ESD). Electrostatic control precautions are required when installing, testing, servicing or repairing the assembly. Component damage may result if ESD control procedures are not followed. If you are not familiar with electrostatic control procedures, refer to the applicable ESD protection handbooks and guidelines.
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Table of contents
Table of contents
1 1.1 1.2 1.2.1 1.2.1.1 1.2.1.2 1.2.1.3 1.2.2 1.2.2.1 1.2.2.2 1.2.3 1.2.3.1 1.2.3.2 1.2.3.3 1.2.3.4 1.2.3.5 1.3 1.4 1.5
2 2.1 2.2
3 3.1 3.2 3.2.1 3.2.1.1 3.2.1.2 3.2.2 3.2.3 3.2.4 3.2.4.1 3.2.4.1.1 3.2.4.1.2
User guide
About this document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Safety precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Kit contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Connecting XENSIVTM sensor shield to CY8CKIT-062S2-43012 (PSOCTM 6 MCU) . . . . . . . . . . . . . . . . . 7 Creating an out-of-the-box (OOB) application and program using ModusToolboxTM . . . . . . . . . 7 Code examples supported for XENSIVTM sensor shield on CY8CKIT-062S2-43012 . . . . . . . . . . . 10 Additional configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Connecting XENSIVTM sensor shield to CYW920829M2EVK-02 (Bluetooth® LE MCU) . . . . . . . . . . . .11 Creating an out-of-box (OOB) application and programming using ModusToolboxTM . . . . . . . 12 Code examples supported for XENSIVTM sensor shield on CYW920829M2EVK-02 . . . . . . . . . . . 16
Sensor Hub Android application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Software requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Hardware requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Application UI description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Known limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Board details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Additional learning resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Technical support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Kit operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Theory of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Using the code example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Hardware functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Power supply system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Power supply inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Voltage regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
RESET interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 I2C and SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Sensor subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
XENSIVTM sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 XENSIVTM digital barometric pressure sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 XENSIVTM PAS CO2 sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
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Table of contents
3.2.4.2 3.2.4.3 3.2.4.4 3.2.5 3.2.5.1 3.2.6 3.2.6.1 3.2.6.2 3.2.6.3 3.2.7 3.2.7.1 3.2.8 3.2.9 3.2.10 3.3
6-axis IMU (accelerometer + gyroscope) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 3-axis magnetometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Digital humidity sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Audio subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 XENSIVTM MEMS digital microphones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Radar subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 XENSIVTM 60 GHz radar sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 External radar sensor shield interface connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Multiplexing of onboard and external RADAR interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 Security subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 OPTIGATM Trust M device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69 TFT display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 I2C interface connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73 Headers compatible with Arduino (J1, J2, J3, and J4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
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1 Introduction
1
Introduction
Thank you for your interest in the XENSIVTM sensor shield (SHIELD_XENSIV_A). This shield is designed to be a companion for adding common sensors to a baseboard based on Arduino UNO R3.
The kit package includes a XENSIVTM sensor shield that contains a 0.96-inch thin film field-effect transistor (TFT) display, a radar sensor, a humidity and temperature sensor, a motion sensor, a magnetometer sensor, a pressure sensor, a CO2 sensor, PDM microphones, OPTIGATM Trust M security controller, and a QWIIC connector.
You can use ModusToolboxTM to develop and debug your projects with the shield connected to a baseboard (such as CY8CKIT-062S2-43012). ModusToolboxTM consists of a set of tools that enable you to integrate Infineon devices into your existing development methodology.
This kit guide provides details on the shield contents, hardware, schematics, and BOM.
1.1
Kit contents
The kit includes the following contents, as shown in Figure 1. · XENSIVTM sensor shield · Quick start guide
Figure 1
SHIELD_XENSIV_A XENSIVTM sensor shield kit contents
Inspect the contents of the kit; if you find any part missing, contact your nearest Infineon sales office for help. For more information, see Technical Support.
1.2
Getting started
The following sections help you get acquainted with the kit:
· The Kit operation section describes the theory of operation and major features of the kit
· The Hardware section provides a detailed hardware description, kit schematics, and bill of materials (BOM)
The board is compatible with Arduino UNO-based Infineon development platforms. The SHIELD_XENSIV_A XENSIVTM sensor shield requires a baseboard with a microcontroller, such as the CY8CKIT-062S2-43012 or CYW920829M2EVK-02. This baseboard device needs firmware, which can be created using ModusToolboxTM (version 3.1 or later).
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1.2.1
Connecting XENSIVTM sensor shield to CY8CKIT-062S2-43012 (PSOCTM 6 MCU)
This section provides instructions on how to get started with the SHIELD_XENSIV_A XENSIVTM sensor shield using the CY8CKIT-062S2-43012 (baseboard) development kit and create the out-of-the-box (OOB) application. The OOB application demonstrates the shield's basic functionality and capabilities.
Figure 2
SHIELD_XENSIV_A XENSIVTM sensor shield connected with CY8CKIT-062S2-43012
1.2.1.1
Creating an out-of-the-box (OOB) application and program using ModusToolboxTM
The OOB application initializes several sensors on the SHIELD_XENSIV_A XENSIVTM sensor shield and displays the sensor data on the TFT display and serial terminal. For more details on the implementation, see the README file.
1. Connect the SHIELD_XENSIV_A XENSIVTM sensor shield to the baseboard kit (CY8CKIT-062S2-43012) as shown in Figure 2
2. To connect the baseboard to your PC, use the provided USB cable and connect it through the KitProg3 USB connector. KitProg3 operates in either CMSIS-DAP Bulk mode (default) or CMSIS-DAP HID mode. Additionally, KitProg3 supports CMSIS-DAP Bulk mode with two UARTs. Programming is faster in Bulk mode. In Bulk mode, the status LED is always ON, while in HID mode, it ramps at a 1 Hz rate. To switch between these modes, simply press and release the mode select button (SW3). If you do not see the desired LED status, see the KitProg3 user guide for details on the KitProg3 status and troubleshooting instructions
Note:
By default, only Bulk mode is enabled.
3. In the ModusToolboxTM IDE, import the "XENSIVTM Sensor Shield: OOB demo" code example (application) into a new workspace In the ModusToolboxTM IDE, import the "XENSIVTM Sensor Shield: OOB demo" code example (application) into a new workspace. To do this:
a. Click New Application from the Quick Panel
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Figure 3
Create a new application
b. Select the CY8CKIT-062S2-43012 in the Choose BSP Target window and click Next
Figure 4
New application creation: Choose target BSP
c. Select the application in the Select Application window and click Create
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Figure 5
New application creation
4. To build and program a PSOCTM 6 MCU application in the Project Explorer:
a. Select the <App_name> project
b. In the Quick Panel, scroll to the Launches section and click the <App_Name> Program (KitProg3_MiniProg4) configuration, as shown in Figure 6
Figure 6
User guide
Programming in ModusToolboxTM
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5. Open a terminal program and select the KitProg3 COM port. Set the serial port parameters to 8N1 and 115200 baud rate
6. After programming, the application starts automatically in three seconds, initializing all the sensors and displays present on the SHIELD_XENSIV_A XENSIVTM sensor shield. Confirm that the "XENSIVTM Sensor Shield: OOB demo" is displayed on the serial terminal and observe the startup screen with the Infineon logo on the display
7. Wait for the instructions screen to appear on the display, then follow the instructions displayed on the screen. Press the user button (SW2) on the baseboard to switch between the sensors. The output from the currently active sensor will then be displayed on both the serial terminal and the TFT display
The order of sensor switching is as follows:
· Radar sensor
· Humidity and temperature sensor
· Motion sensor
· Magnetometer sensor
· Pressure sensor
· CO2 sensor
Note:
Before switching to the next sensor, wait until the display shows the current sensor readings. Then, press the user button (SW2) to switch to the next sensor. If the TFT display does not switch to the next sensor upon button press, press the Reset button on the baseboard to restart the application.
1.2.1.2
Code examples supported for XENSIVTM sensor shield on CY8CKIT-062S2-43012
Table 2
List of code examples supported for SHIELD_XENSIV_A XENSIVTM sensor shield on CY8CKIT-062S2-43012
Code example Out-of-the-box (OOB) example SHT35 humidity sensor example Radar autonomous presence detection CO2 sensor example Motion sensor example Imagimob streaming protocol example Imagimob ready model deployment example OPTIGATM MQTT client example
GitHub mtb-example-ce239846-shield-xensiv-a-oob mtb-example-sht35-humidity-sensor-freertos mtb-example-sensors-radar-autonomous-presence mtb-example-sensors-pasco2 mtb-example-psoc6-motion-sensor-freertos mtb-example-imagimob-streaming-protocol mtb-example-ml-imagimob-deploy-ready-model mtb-example-optiga-mqtt-client
1.2.1.3
Additional configurations
1. To receive data from the serial terminal over UART, disable UART flow control on the CY8CKIT-062S2-43012. Connect the kit to your PC via KitProg3 USB, then open the 'fw-loader' tool (part of ModusToolboxTM) and execute the following command:
fw-loader --set-kp3-flow-control 0 none
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Figure 7
Flow control disable using fw-loader
Note:
Use the latest KitProg3 firmware to disable flow control.
2. When the CY8CKIT-062S2-43012 is powered only through the MCU USB connector (J7), connect the SHIELD_XENSIV_A XENSIVTM sensor shield's USB power supply (J11) using a USB Type-C cable. This provides an additional voltage source to the on-board radar sensor (1.5 V), radar shield interface (1.8 V), magnetometer sensor (1.8 V), and PDM microphones (1.8 V) through the USB Type-C connection, as the shield is not powered with 5 V Arduino-compatible power pins
3. For programming and debugging details, see the CY8CKIT-062S2-43012 Kit guide
1.2.2
Connecting XENSIVTM sensor shield to CYW920829M2EVK-02 (Bluetooth® LE MCU)
The section provides instructions on getting started with the SHIELD_XENSIV_A XENSIVTM sensor shield using the CYW920829M2EVK-02 (Bluetooth® LE MCU) development kit and creating the out-of-box (OOB) application. The OOB application demonstrates the shield's basic functionality and the CYW20829 Bluetooth® LE MCU's
capabilities by connecting it with Infineon's Sensor Hub Android application.
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Figure 8
SHIELD_XENSIV_A XENSIVTM sensor shield connected with CYW920829M2EVK-02
1.2.2.1
Creating an out-of-box (OOB) application and programming using ModusToolboxTM
The OOB application initializes several sensors on the SHIELD_XENSIV_A XENSIVTM sensor shield and displays the sensor data in the console output. Additionally, the Sensor Hub Android application can be used for visualizing data on an Android device. For more details on implementation, see the README file. For more details on the Infineon Sensor Hub Android application, see Sensor Hub Android application.
1. Ensure the SHIELD_XENSIV_A XENSIVTM sensor shield is disconnected from the CYW920829M2EVK-02 baseboard. The configuration of the CYW920829M2EVK-02 does not support programming when the SHIELD_XENSIV_A XENSIVTM sensor shield is connected
2. To connect the baseboard to your PC, use the provided USB micro cable and connect it through the KitProg USB connector
3. Ensure that switch SW6 on the baseboard is set to SWD
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Figure 9
CYW920829M2EVK-02 SW6 configuration
4. In the ModusToolboxTM IDE, import the 'XENSIVTM Sensor Hub' code example into a new workspace. To do this:
a. Click New Application from the Quick Panel
b.
User guide
Figure 10
Create a new application
Select the CYW920829M2EVK-02 in the Choose BSP Target window and click Next
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Figure 11
New application creation: Choose target BSP
c. Select the Bluetooth® LE XENSIVTM Sensor Hub Sensing Service application in the Select
Application window and click Create
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Figure 12
Select Application: Choose Bluetooth® LE XENSIVTM Sensor Hub Sensing Service project
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5. To build and program the CYW20829 MCU application in the Project Explorer: a. Select the XENSIVTM Sensor Hub project b. In the Quick Panel, scroll to the Launches section and click the XENSIVTM Sensor Hub Program (KitProg3_MiniProg4) configuration
Figure 13
Programming in ModusToolboxTM
6. Once programmed:
a. Remove the USB cable from the PC
b. Reconnect the SHIELD_XENSIV_A XENSIVTM sensor shield to the CYW920829M2EVK-02 baseboard
c. Reconnect the USB cable to the PC
7. Open a terminal program and select the KitProg3 COM port. Set the serial port parameters to 8N1 and a baud rate of 115200
8. After programming, the application starts automatically by initializing all the sensors present on the SHIELD_XENSIV_A XENSIVTM sensor shield. Confirm that 'XENSIVTM Sensor Hub Service' is displayed on the serial terminal, along with a prompt to enter a number between 1 and 6 to enable a specific sensor
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Figure 14
XENSIVTM Sensor Hub Service terminal output
9. Enter a number displayed in the prompt to enable the corresponding sensor. The acquired sensor data
will be displayed in the terminal
10. To control the CYW920829M2EVK-02 and the SHIELD_XENSIV_A XENSIVTM sensor shield with Infineon's
Sensor Hub Android mobile application, see section Sensor Hub Android application
1.2.2.2
Code examples supported for XENSIVTM sensor shield on CYW920829M2EVK-02
Table 3
List of code examples supported for SHIELD_XENSIV_A XENSIVTM sensor shield on CYW920829M2EVK-02
Code example XENSIVTM Sensor Hub SHT35 Temperature humidity sensor BMI270 IMU sensor BMM350 Magnetometer sensor XENSIVTM BGT60LTR11AIP Radar sensor XENSIVTM PASCO2 Carbon dioxide sensor (table continues...)
GitHub
https://github.com/Infineon/mtb-example-btstackfreertos-cyw20829-xensiv-sensorhub
https://github.com/Infineon/mtb-example-btstackfreertos-cyw20829-relative-humidity-sht35
https://github.com/Infineon/mtb-example-btstackfreertos-cyw20829-imu-bmi270
https://github.com/Infineon/mtb-example-btstackfreertos-cyw20829-magnetometer-bmm350
https://github.com/Infineon/mtb-example-btstackfreertos-cyw20829-xensiv-bgt60ltr11aip-autonomous
https://github.com/Infineon/mtb-example-btstackfreertos-cyw20829-xensiv-pasco2v15
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Table 3
(continued) List of code examples supported for SHIELD_XENSIV_A XENSIVTM sensor shield on CYW920829M2EVK-02
Code example XENSIVTM DPS368 Pressure sensor
GitHub
https://github.com/Infineon/mtb-example-btstackfreertos-cyw20829-xensiv-dps368
1.2.3
Sensor Hub Android application
The Sensor Hub Android application is used to connect to and acquire data from the Code examples supported for XENSIVTM sensor shield on CYW920829M2EVK-02 with Bluetooth®. Note that this app is not available on the
Google Play Store and is released as an .APKfile. For assistance or application-related queries, contact Infineon Support . The following services and characteristics are supported:
Table 4
Bluetooth® services and characteristics supported
Service name
XENSIVTM sensor shield
XENSIVTM sensor shield
XENSIVTM sensor shield
XENSIVTM sensor shield
XENSIVTM sensor shield
XENSIVTM sensor shield
XENSIVTM sensor shield
Characteristi Buffer length
c name
(bytes)
SHT35
8
Data
Relative humidity (%) and temperature (°C)
Visualization in app Graph plots
BMM350
4
X, Y, Z, and temperature (°C) Graph plots
BMI270
1
Board orientation
Text only
BGT60LTR11 2
PASCO2
2
Motion, direction of motion (target approaching/ departing)
CO2 parts per million (ppm)
Virtual LED Graph plot
DPS368
8
Sensor
1
enable
Pressure (hPa) and temperature (°C)
Sensor to enable for data acquisition
Graph plots N/A
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1.2.3.1
Software requirements
Android OS: Version 12 or later (API level 32), with the latest version recommended.
1.2.3.2
Hardware requirements
Android device: Equipped with Bluetooth® 4.0 or later.
1.2.3.3
Installation
1. Download or copy the released .APK file to your Android device 2. Click on the .APK file to install it
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Figure 15
App installation
1.2.3.4
Application UI description
This section describes the app layout along with the various components and their functionality. 1. Navigation bar: The app uses a tab navigation layout with a navigation bar at the bottom of the screen.
Below is a description of the available screens: · Hub screen: Provides options to scan, connect to, and disconnect from the CYW920829M2EVK-02 · Sensors screen: Provides options to select a sensor and read its characteristics · Activity screen: Displays logs of Bluetooth® events and activity
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Figure 16
Navigation tab
2. Hub screen:
a. Press the XRES button on the EVK to start the firmware
b. Press Scan to discover the EVK. Allow user permissions when prompted. Discovered devices will be populated in the Select a BLE device drop-down menu
Note:
The EVK will stop its Bluetooth® advertisement after 360 seconds. Ensure that scanning starts as soon as the XRES button is pressed so the Bluetooth® connection can be
established within that period
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Figure 17
User permissions
c. A toast notification is displayed once the EVK is discovered. The names and Bluetooth® IDs of the
EVK are populated in the drop-down menu for user selection
Note:
The app can only be connected to a single EVK at any given time. To connect with another EVK, the existing EVK must be disconnected first
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Figure 18
Discovery: successful
d. 1. Select the EVK from the drop-down menu and press Connect
2. If the connection is successful, a toast notification will be displayed
3. In case of an error, repeat this step. If the connection is still not successful, reset the EVK
and start the process again
Note:
Once connected, the Connect button title will be updated to Disconnect. Note that if the app is closed, Bluetooth® connectivity is not retained. The connection
process must be repeated, starting with resetting the EVK
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Figure 19 3. Sensor screen:
Connection: successful
a. Once the EVK is connected, the SELECT A SENSOR drop-down menu will be populated with a list of available sensor devices
Note:
In case of code examples for an individual sensor, only that specific sensor will be shown in the drop-down menu
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Figure 20
Drop down: populated
b. Select a sensor to set it in the firmware. Additionally, the visualization is initialized for data
acquisition, and a toast notification is displayed if the sensor is successfully set. See Table 4 for
details on data illustration
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Figure 21
Drop down: SHT35 sensor set
c. Press Read to start data acquisition. A toast notification will be displayed, and the visualizations
will be continuously updated. The most recent data values are also displayed below the plot
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Figure 22
Drop down: SHT35 read started
d. Press Stop to halt data acquisition and reset the visualization. A toast notification will also be
displayed
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Figure 23
Drop down: SHT35 read stopped
e. Repeat the same steps above to see data acquisition from another sensor.
In case of the:
· XENSIVTM BGT60LTR11AIP 60GHz Doppler Radar sensor: Motion and direction of motion are displayed, not time-domain data
· BMI270 IMU sensor: Orientation is displayed as text
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Figure 24
Drop down: XENSIVTM BGT60LTR11AIP read started
f. Once data acquisition on the Sensors screen is complete, make sure the EVK is properly
disconnected by pressing Disconnect on the Hub screen. On successful disconnection, a toast
notification is displayed, and the connection status on the Hub screen is changed to Not
connected
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Figure 25
Disconnection: successful
4. Activity screen: The Activity screen generates logs for each activity performed in the app, such as button presses, drop-down selections, etc., along with a timestamp indicating when each activity was performed. The logs are displayed in order from most recent to least recent. The following is the format for the logs:
· Name of the screen
· Success/Error message
· Timestamp of the Activity (local region format)
All logs can be erased by pressing the Clear all button
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Figure 26
Logs
1.2.3.5
Known limitations
If a switch is made and another sensor is selected via the UART console during data acquisition on the Sensors screen, the user is not notified, and acquisition is paused. Acquisition can be resumed if the UART console is used to switch back to the previous sensor.
1.3
Board details
The board features the following components:
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1. XENSIVTM radar sensor (BGT60LTR11AIP): A built-in motion and direction detector that allows for autonomous operation, detecting human motion and direction (approaching or departing), and equipped with two on-board LEDs to illustrate sensor output
2. XENSIVTM barometric pressure sensor (DPS368): Offers high accuracy and low power consumption, measuring both pressure and temperature
3. XENSIVTM PAS CO2 sensor: Leverages photoacoustic spectroscopy for accurate carbon dioxide (CO2) detection in a compact form factor
4. XENSIVTM digital MEMS microphones (IM72D128): Provides ultra-high performance with low noise and distortion, making it ideal for applications requiring superior audio quality
5. OPTIGATM Trust M security controller: A security solution that provides robust protection for embedded systems
6. Digital humidity and temperature sensor (SHT35): A highly reliable sensor that uses an I2C interface to transfer data
7. Motion sensor (BMI270): An ultra-low power inertial measurement unit (IMU) providing a 6-axis sensor that combines a 16-bit tri-axial gyroscope and a 16-bit tri-axial accelerometer
8. Digital geomagnetic sensor (BMM350): Capable of measuring the earth's magnetic field in three perpendicular axes
9. SPI-based 0.96 inch TFT LCD: Offers 80 x 160 pixel resolution 10. External radar module interface: Allows connection of different sensor shields, such as XENSIVTM
BGT60TR13C, XENSIVTM BGT60UTR11AIP and so on 11. I2C connector: Enables connection of any I2C components using the QWIIC interface 12. I/O headers: Compatible with Arduino UNO R3 The SHIELD_XENSIV_A XENSIVTM shield pinout is shown in Figure 27. For pin assignment details, see the Headers compatible with Arduino (J1, J2, J3, and J4) section.
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Figure 27
SHIELD_XENSIV_A XENSIVTM sensor shield pin assignment
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Arduino pin Shield pin
A0
J2.1
A1
J2.3
A2
J2.5
A3
J2.7
A4
J2.9
A5
J2.11
A8
J2.2
A9
J2.4
A10
J2.6
A11
J2.8
A12
J2.10
A13
J2.12
D0
J4.1
D1
J4.2
D2
J4.3
D3
J4.4
D4
J4.5
D5
J4.6
D6
J4.7
D7
J4.8
D8
J3.1
D9
J3.2
D10
J3.3
D11
J3.4
D12
J3.5
D13
J3.6
SDA
J3.9
User guide
PSOCTM pin
Shield function
(CY8CKIT-062S2-43
012)
P10[0]
SPI_DC_DS (TFT display command pin)
P10[1]
IRQ_RADAR (radar interrupt)
P10[2]
RADAR_RST (radar reset signal)
P10[3]
CO2_PWR_EN (CO2 5 V power enable signal)
P10[4]
PDM_CLK (PDM microphone clock signal)
P10[5]
PDM_DATA (PDM microphone data signal)
P9[0]
RADAR_ADC1 (ADC out from the radar sensors)
P9[1]
RADAR_ADC2 (ADC out from the radar sensors)
P9[2]
IMU_INT1 (interrupt signal from the IMU sensor)
P9[3]
IMU_INT2 (interrupt signal from the IMU sensor)
P9[4]
MAG_INT (interrupt signal from the magnetometer sensor)
P9[5]
RS_OD_LED (radar shield open drain LED)
P5[0]
Not connected
P5[1]
Not connected
P5[2]
MAIN_RST (main reset signal for the sensors with the buffer)
P5[3]
Not connected
P5[4]
RDR_GPIO2 (radar sensor GPIO signal)
P5[5]
RDR_GPIO1 (radar sensor GPIO signal)
P5[6]
RDR_SEL (selection signal to select the on-board BGT60LTR11AIP radar sensor or the other radar shields)
P5[7]
SEN_INT (interrupt signal ORing from various sensors)
P7[5]
Not connected
P7[6]
CS_SEL0 (selection signal to select the SPI slave select)
P12[3]
CS (SPI slave select, connected to PSOCTM and the SPI devices in the shield)
P12[0]
MOSI (SPI MOSI signal, connected to PSOCTM and the SPI devices in the shield)
P12[1]
MISO (SPI MISO signal, connected to PSOCTM and the SPI devices in the shield)
P12[2]
CLK (SPI clock signal, connected to PSOCTM and the SPI devices in the shield)
P6[1]
I2C_SDA (connected to PSOCTM and the I2C devices in the shield)
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Arduino pin Shield pin
SCL
J3.10
PSOCTM pin
Shield function
(CY8CKIT-062S2-43
012)
P6[0]
I2C_SCL (connected to PSOCTM and the I2C devices in the shield)
1.4
Additional learning resources
· For more information about ModusToolboxTM software functionality and releases, see ModusToolboxTM software
· For a list of trainings on ModusToolboxTM, see ModusToolboxTM software training
· An overview of PSOCTM devices is available on the PSOCTM 6 webpage. This webpage includes a list of PSOCTM device families, integrated design environments (IDEs), and associated development kits. Additionally, refer to the following documents to get started with PSOCTM 6 devices:
- AN228571 Getting started with PSOCTM 6 MCU on ModusToolboxTM
- PSOCTM 6 technical reference manuals
· For more information about the XENSIVTM PAS CO2 sensor portfolio and technical documentation, see CO2 sensors
· For more information about the XENSIVTM pressure sensor portfolio and technical documentation, see Pressure sensors
· For more information about the XENSIVTM 60 GHz radar sensor product portfolio and technical documentation, see XENSIVTM 60 GHz RADAR MMICs
· For more information about the XENSIVTM MEMS microphone portfolio and technical documentation, see XENSIVTM MEMS microphones for consumer electronics
· For more information about the OPTIGATM Trust portfolio and technical documentation, see OPTIGATM Trust
1.5
Technical support
For assistance, see Infineon support or post your questions in the Infineon developer community platform. You can also use the Self-help (Technical Documents) support resources for quick assistance.
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2
Kit operation
This chapter introduces you to various features of the SHIELD_XENSIV_A XENSIVTM sensor shield, including the theory of operation. The shield comes with firmware that interfaces the sensors present on the shield with the baseboard.
2.1
Theory of operation
The SHIELD_XENSIV_A XENSIVTM sensor shield is compatible with Arduino, allowing for easy interfacing of multiple sensors with the baseboard kits. This shield contains PDM microphones, a radar sensor, a barometric pressure sensor, and a CO2 sensor from Infineon's XENSIVTM family, as well as a motion sensor, a magnetometer sensor from Bosch, a digital humidity and temperature sensor from Sensirion, and a 0.96-inch TFT display.
Figure 28
SHIELD_XENSIV_A XENSIVTM sensor shield functional block diagram
The components on the SHIELD_XENSIV_A XENSIVTM sensor shield are shown in Figure 29.
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Figure 29
SHIELD_XENSIV_A XENSIVTM sensor shield board details
The board has the following peripherals:
1. XENSIVTM digital barometric air pressure sensor (U2): This is an Infineon digital barometric pressure sensor with a built-in temperature sensor. This sensor uses an I2C interface to transfer the sensor data
2. I2C connector (J16): This connector is used to connect various sensors and other components using the QWIIC interface without the need for soldering or wires
3. Radar shield connectors (J5, J15): These are the Hirose connectors used to plug in the external radar shields
4. XENSIVTM 60 GHz radar sensor BGT60LTR11AIP (U1): This is an Infineon XENSIVTM radar sensor that has a built-in motion and direction of motion detector
5. BGT60LTR11AIP radar sensor status LEDs (D1, D2): These LEDs are used to represent the status of motion and direction of motion
6. Motion sensor (U14): This is a 6-axis motion sensor, also known as an inertial measurement unit (IMU) that combines a 16-bit tri-axial gyroscope and a 16-bit tri-axial accelerometer. This sensor uses an I2C interface to transfer the sensor data
7. USB device connector (J11): The USB Type-C cable can be connected to provide an additional voltage source for the on-board radar sensor, radar shield interface, magnetometer sensor, and PDM microphones when shield is not powered with 5 V Arduino-compatible power pin
8. Digital humidity and temperature sensor (U17): This is a highly reliable digital humidity and temperature sensor that uses an I2C interface to transfer data
9. Power header compatible with Arduino UNO R3 (J1): This is an Arduino-compatible header designed to interface with the baseboard. It features an Arduino-compatible interface female connector, which provides power to this shield
10. Digital geomagnetic sensor (U13): This is a digital geomagnetic sensor capable of measuring the earth's magnetic field in three perpendicular axes. This sensor uses an I2C interface to transfer the sensor data
11. I/O headers compatible with Arduino UNO R3 (J2, J3, J4): These are the Arduino-compatible headers used to interface the baseboard. The baseboard features an Arduino-compatible interface female connector, providing the I/O interface between the baseboard and the shield
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12. XENSIVTM PAS CO2 sensor (U3): This is an Infineon XENSIVTM disruptive CO2 sensor based on photoacoustic spectroscopy (PAS). This sensor uses an I2C interface to transfer the sensor data
13. 0.96-inch TFT display (DISP1): This is a 0.96-inch, 80 x 160 TFT display, which can interface with the baseboard via the SPI interface
14. XENSIVTM digital MEMS microphones (U4, U5): These are two Infineon digital MEMS microphones used to capture sound and generate digital audio data, which is transferred through the PDM interface
15. I2C and RESET multiplexing switch (SW1): This switch is used to enable or disable the I2C lines and RESET signal to sensors
16. Interrupt selection switch (SW2): This switch is used to enable or disable the interrupt signals of the sensors
17. OPTIGATM Trust M controller (U6): OPTIGATM Trust M is a high-security solution from Infineon. This uses the I2C interface
18. I2C selection switch (SW3): This switch is used to enable or disable the I2C lines to sensors
See Hardware functional description for details on various hardware blocks.
2.2
Using the code example
The XENSIVTM sensor shield is supported by ModusToolboxTM software examples with the Arduino UNO-based Infineon development platforms (referred as the "baseboard"). The Getting started section provides the list of code examples compatible with the XENSIVTM sensor shield, along with the instructions on creating a project to run on the baseboard.
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3
Hardware
3.1
Schematics
Refer to the schematic files available on the Kit webpage.
3.2
Hardware functional description
3.2.1
Power supply system
3.2.1.1
Power supply inputs
The power supply inputs to the XENSIVTM sensor shield through the Headers compatible with Arduino (J1, J2, J3, and J4) and on-board USB connector (J11) are:
· 3.3 V supply from the baseboard: This supply voltage is used to power all digital supplies of 3.3 V operated devices on the sensor shield, including the OPTIGATM Trust M device, sensors, and other components
· 5 V supply from the baseboard: This supply voltage is used as an input to the voltage regulator subsystem, which generates multiple supply voltages for the sensor shield
· 5 V supply from USB connector on shield: This supply voltage is used to provide additional power requirements for the radar subsystem
Power block diagram
3.3 V
Arduino header interface 5 V
USB connector
5 V_USB
DNI
2.5 V buck 2.5 V converter
1.8 V LDO voltage 1.8 V_R regulator for RADAR
Resistor 1.8 V
1.5 V LDO voltage 1.5 V_R regulator for RADAR
3.3 V LDO voltage 3.3 V_R regulator for RADAR
Legend Microcontroller
Sensors Security Non-IFX parts No-Load
5 V
3.3 V 3.3 V
Load switch
I2C Interface connector TFT display
3.3 V 5 V_CO2
PAS CO2 sensor
(PASCO2V15AUMA1)
1.8 V 3.3 V
Digital MEMS microphone
(IM72D128V01XTMA1) x 2
3.3 V_R 1.8 V_R
RADAR shield interface
3.3 V
OPTIGATM Trust M
3.3 V 1.5 V_R
Pressure sensor
(DPS368)
RADAR sensor
(BGT60LTR11AIP)
3.3 V
6-axis IMU
(BMI-270)
1.8 V 3.3 V
3-axis magnetometer
(BMM-350)
3.3 V
Humidity sensor
(SHT35)
Figure 30
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Block diagram of the power architecture of the sensor shield
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Note:
The XENSIVTM sensor shield consumes higher power when the RADAR sensor is configured in continuous wave mode and the PAS CO2 sensor is operated simultaneously. This can exceed the base board's power capabilities, leading to issues with sensor operation and system performance.
To mitigate this issue, consider using the external USB power supply option (J11) provided on the XENSIVTM sensor shield if simultaneous operation is required.
Figure 31
Schematic of external power supply from USB connector on sensor shield
Each sensor on the XENSIVTM sensor shield features a dedicated header with a jumper option, which allows for the current measurement of every sensor. This capability enables accurate monitoring of sensor power consumption, providing valuable insights to identify and address potential power-related issues.
3.2.1.2
Voltage regulators
The XENSIVTM sensor shield features a voltage regulator subsystem that efficiently generates multiple supply voltages from the 5 V input.
· The buck voltage regulator (U48) generates a 2.5 V supply from the 5 V input, which is generated from the base board or the USB supply from the J11 connector on the shield (output of the power ORing diode circuitry). This 2.5 V supply serves as an input to the low dropout linear voltage regulators
· The 2.5 V supply powers the generation of low-noise 1.8 V and 5 V supplies. Additionally, the 5 V supply from the baseboard is used to produce a low noise 3.3 V supply using low dropout linear voltage regulators (U47, U15, and U38). These supply voltages power the radar subsystem of the XENSIVTM sensor shield
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Figure 32
Schematic for the buck voltage regulator of the sensor shield
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Figure 33
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Schematic for the LDO linear voltage regulators in the radar subsystem of the sensor shield
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3.2.2
RESET interface
The default reset source for the XENSIVTM sensor shield is the MAIN_RST signal from the host MCU on the base board through the Headers compatible with Arduino (J1, J2, J3, and J4). To prevent signal loading, the selected reset source is connected to a logic buffer (U59), which ensures that the reset signal can effectively drive the reset function of multiple devices without being affected by signal loading.
Figure 34
RESET signal buffer schematic
The XENSIVTM sensor shield provides a flexible reset mechanism, allowing users to select the reset source for the devices on the shield. The reset source can be either the buffered host MCU reset signal or a MAIN_RST signal controlled by the GPIO of the host MCU connected to the Headers compatible with Arduino (J1, J2, J3, and J4). A 3-pin header (J12) with a jumper option is provided to users for selecting the required reset source. Additionally, a dip switch (SW1) is used to connect and disconnect the selected reset source signal to the required devices on the XENSIVTM sensor shield.
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Figure 35
RESET signal source selection and multiplexing switch schematic
3.2.3
I2C and SPI interface
The I2C and SPI interfaces from the host MCU on the base board are level-translated on the XENSIVTM sensor shield and shared across the devices. Since all I2C interface-based sensors are configured to operate at 3.3 V, the I2C level translator (U34) translates the signals to the 3.3 V level.
Figure 36
Schematic of the I2C level translator
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A DIP switch (SW3) is provided to connect and disconnect the I2C interface with different sensors on the shield, offering flexibility to the user. This feature enables users to selectively enable specific devices with I2C interfaces and facilitates troubleshooting.
Figure 37
Schematic of the I2C interface multiplexing switch
The SPI interface is shared across the display and radar subsystem. The SPI interface shared with the TFT display is level-translated to 3.3 V to support the TFT display's I/O level. Additionally, the radar subsystem's SPI is level-translated based on the radar selection, whether it is the onboard radar or an external radar shield.
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Figure 38
Schematic of SPI interface multiplexing
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3.2.4
Sensor subsystem
3.2.4.1
XENSIVTM sensors
3.2.4.1.1
XENSIVTM digital barometric pressure sensor
The XENSIVTM sensor shield features Infineon's advanced digital barometric pressure sensor (U2), DPS368XTSA1, which includes a built-in temperature sensor. This sensor communicates with the host MCU via the interintegrated circuit (I2C) protocol. Although the sensor also supports the serial peripheral interface (SPI) protocol, this shield is designed to operate exclusively with I2C.
I2C device address configuration: The serial data out (SDO) pin of the pressure sensor is pulled down with a 2.2K resistor (R1), which determines the 7-bit I2C device address of the sensor. The address of the sensor is dependent on the configuration of the SDO pin.
· Default configuration: If the pull-down resistor is loaded, the I2C device address is 0 x 76
· Alternative configuration: If the pull-down resistor is not loaded, the I2C device address is 0 x 77
Sensor interface and power supply: The DPS368XTSA1 pressure sensor uses an I2C interface to communicate with the host MCU, accompanied by an interrupt signal, PSEN_INT_LS. The sensor has a separate I/O power supply pin (VDDIO) and main supply pin (VDD), which are connected to a 3.3 V supply.
Figure 39
Schematic of XENSIVTM digital barometric pressure sensor interface
Level translation and interface: To ensure compatible logic levels between the sensor and the host MCU, an I2C level translator (U34) and an I/O level translator (U23) for interrupt signals are used. The level-translated I2C interface and level-translated interrupt signal, routed through an OR logic gate (U20, U25, and U31), are connected to the Headers compatible with Arduino (J1, J2, J3, and J4) for seamless interface with the base board.
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Figure 40
Schematic of pressure sensor interrupt level translator interface
3.2.4.1.2
XENSIVTM PAS CO2 sensor
The XENSIVTM sensor shield features Infineon's XENSIVTM PAS CO2 5 V sensor, PASCO2V15 (U3). The sensor communicates with the host MCU via the I2C protocol and has an I2C device address of 0 x 28. Although the sensor also supports the UART protocol and pulse width modulation (PWM) output, this shield is designed to exclusively operate with I2C.
Sensor interface and power supply: The PASCO2V15 CO2 sensor uses an I2C interface to communicate with the host MCU. It is accompanied by an interrupt signal, INT_CO2_LS. The sensor has a separate I/O power supply pin (VDD3.3) connected to a 3.3 V supply and a main supply pin (VDD5) connected to a 5 V supply through a load switch (U9).
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Figure 41
Schematic of XENSIVTM PAS CO2 sensor interface
Figure 42
Schematic of CO2 sensor power enable interface
Note:
Ensure the 5 V supply is enabled before initializing the PAS CO2 sensor in the application firmware of the host MCU.
Level translation and interface: To ensure compatible logic levels between the sensor and the host MCU, an I2C level translator (U34) and an I/O level translator (U11) for interrupt signals are used. The level-translated I2C interface and level-translated interrupt signal, routed through an OR logic gate (U20, U25, and U31), are connected to the Headers compatible with Arduino (J1, J2, J3, and J4) for seamless interface with the base board.
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Figure 43
Schematic of CO2 sensor interrupt level translator interface
3.2.4.2
6-axis IMU (accelerometer + gyroscope)
The XENSIVTM sensor shield features a 6-axis motion sensor (U14), also known as the inertial measurement unit (IMU), which provides precise 3-axis acceleration and 3-axis gyroscopic angular rate data in each spatial direction. This allows for accurate measurement of the sensor's orientation, position, and movement. Sensor interface and configuration: The sensor utilizes an I2C interface for communication with the host MCU, along with two interrupt signals connected to the INT1 and INT2 pins of the sensor. These interrupt signals can be used to trigger specific actions or events within the system. I2C address configuration · Default I2C address: 0 x 69 · Configurable I2C address: 0 x 68 (by removing R57 and populating R61)
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Figure 44
Schematic of the 6-axis IMU (accelerometer + gyroscope)
To ensure compatible logic levels between the sensor and the host MCU, an I2C level translator (U34) and an I/O level translator (U12) for interrupt signals are employed. The interrupts are configured with active high logic and are pulled down with 10K resistors (R52, R33) by default, thereby ensuring reliable and accurate communication between the sensor and the host MCU.
The level-translated interrupt signal is routed through an OR logic gate (U20, U25, and U31), enabling efficient and reliable signal transmission. Additionally, the level-translated I2C interface and level-translated interrupt signal, processed through the OR logic gate, are connected to the Headers compatible with Arduino (J1, J2, J3, and J4), ensuring a seamless interface with the base board. This allows for seamless integration and easy development of the system.
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Figure 45
Schematic of the 6-axis IMU interrupt signal level translator
3.2.4.3
3-axis magnetometer
The XENSIVTM sensor shield is equipped with a 3-axis magnetometer sensor (U13), which delivers precise measurements of the direction and strength of the geomagnetic field.
Sensor interface and configuration: The sensor uses an I2C interface to communicate with the Host MCU, accompanied by an interrupt signal connected to the INT pin of the sensor. The default I2C address is 0 x 14.
Figure 46
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Schematic of a 3-axis magnetometer
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Level translation and interface: To ensure compatible logic levels between the sensor and the host MCU, an I2C level translator (U34) and an I/O level translator (U11) for the interrupt signals. The interrupt is configured with active high logic and is pulled down by default with a 10K resistor (R48), ensuring reliable and accurate communication between the sensor and the host MCU. The level-translated interrupt signal is routed through an OR logic gate (U20, U25, and U31), enabling efficient and reliable signal transmission. Both the level-translated I2C interface and the level-translated interrupt signal are connected to the Headers compatible with Arduino (J1, J2, J3, and J4), ensuring a seamless interface with the base board. This facilitates easy integration and development of the system.
Figure 47
Schematic of the 3-axis magnetometer interrupt signal level translator
3.2.4.4
Digital humidity sensor
The XENSIVTM sensor shield features a digital humidity sensor SHT35 (U17), which comes equipped with a builtin temperature sensor. This sensor communicates with the host MCU via the I2C protocol.
I2C device address configuration: The ADDR pin of the humidity sensor is pulled down with a 10K resistor (R69). This configuration determines the 7-bit I2C device address of the sensor, which is dependent on the ADDR pin configuration.
· Default configuration: If the pull-down resistor is loaded, the I2C device address is 0 x 44
· Alternative configuration: If the pull-up resistor (R68) is loaded, the I2C device address is 0 x 45
Sensor interface and power supply: The SHT35 humidity sensor uses an I2C interface to communicate with the host MCU, accompanied by an interrupt signal, HS_INT_LS. Additionally, the sensor's power supply pin (VDD) is connected to a 3.3 V supply.
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Figure 48
Schematic of the digital humidity sensor interface
Level translation and interface: To ensure compatible logic levels between the sensor and the host MCU, an I2C level translator (U34) and an I/O level translator (U23) for interrupt signals are used. The level-translated I2C interface and the level-translated interrupt signal, which are routed through an OR logic gate (U20, U25, and U31), are connected to the Headers compatible with Arduino (J1, J2, J3, and J4) for seamless interface with the base board.
Figure 49
Schematic of the humidity sensor interrupt level translator interface
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3.2.5
Audio subsystem
3.2.5.1
XENSIVTM MEMS digital microphones
The XENSIVTM sensor shield features two Infineon's digital PDM MEMS microphones, IM72D128V01XTMA1 (U5 and U4), which share a common PDM bus.
PDM microphone configuration: Each PDM microphone has a SELECT pin that determines the edge of the PDM clock on which the PDM data is available:
· If the SELECT pin is connected to GND, the PDM data is available on the falling edge of the PDM clock · If the SELECT pin is connected to VDD, the PDM data is available on the rising edge of the PDM clock Microphone interface configuration: The XENSIVTM sensor shield is configured as follows:
· The left PDM microphone (U5) has its SELECT pin tied to GND, making the PDM data available on the falling edge of the PDM_CLK_IN
· The right PDM microphone (U4) has its SELECT pin tied to VDD_MIC, making the PDM data available on the rising edge of the PDM_CLK_IN
Power supply options
The microphones can be powered from either 3.3 V or 1.8 V through a header (J10) and a jumper, providing flexibility in design and implementation.
Figure 50
Schematic of XENSIVTM MEMS digital microphone interface
Level translation and interface: The PDM interface signals are level-translated to the baseboard I/O levels using level translators U44 and U45. These translators are connected to the Headers compatible with Arduino (J1, J2, J3, and J4) for seamless interface with the base board.
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Figure 51
Schematic of PDM interface level translators
3.2.6
Radar subsystem
3.2.6.1
XENSIVTM 60 GHz radar sensor
The XENSIVTM sensor shield features Infineon's XENSIVTM 60 GHz radar sensor (U1) BGT60LTR11AIP monolithic microwave-integrated circuit (MMIC), which is equipped with integrated transmitting and receiving antennas. This sensor incorporates the antennas in package (AIP) concept, eliminating the need for antenna design complexity at the user's end and enabling the use of standard FR4 materials for PCB designing. See the Radar sensor webpage for more details. The BGT60LTR11AIP radar sensor uses the TDET and PDET pins connected to LEDs (D1 and D2) to indicate motion detection and the direction of motion.
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Figure 52
Schematic of the onboard radar sensor interface
The radar sensor uses external sample and hold capacitors for the analog IF signals coming out of the sensor.
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Figure 53
Schematic of the onboard radar sample and hold capacitors
External low-pass filters are used for filtering IF signals on the onboard radar sensor.
Figure 54
Schematic of the external IF low-pass filters used on the onboard radar sensor
A current measurement header (J7) is provided to measure the onboard radar sensor.
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Figure 55
Schematic of the onboard radar sensor current measurement header
Figure 36 illustrates how an onboard crystal (Y1) feeds a 38.4 MHz clock input to the radar sensor.
Figure 56
Schematic of the crystal used for the radar sensor clock input
The radar sensor parameters can configured using resistor provisions provided on the sensor shield. The onboard radar is configured to autonomous mode by default.
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Figure 57
Schematic of the onboard radar MIMC mode and quad state settings
To enable other modes of the onboard radar sensor, see Table 5.
Table 5
MIMC and quad state configurations for the onboard radar sensor operating modes
Resistor setting Mount R19 with 0 resistor Open R91 and R19 resistors Mount R91 with 100 k resistor Mount R91 with 0 resistor
Operating mode Autonomous CW mode Autonomous pulsed mode SPI mode with external 9.6 MHz clock enabled SPI mode
3.2.6.2
External radar sensor shield interface connector
The XENSIVTM sensor shield features two Hirose DF40HC(3.5)-20DS-0.4 V connectors (J15 and J5), offering highdensity, high-reliability interfaces for external radar sensors. To connect to these interfaces, an external radar interface board with a matching mating connector (DF40C-20DP-0.4 V) is required.
These connectors provide a comprehensive set of signals, including:
· Power supply lines: 3.3 V, 1.8 V, 1.5 V, and GND, ensuring reliable power delivery to the external radar sensor
· Digital interfaces: SPI interface enabling communication between the host MCU and the external radar sensor
· Control GPIO: Dedicated general-purpose input/output lines (GPIO) for controlling the external radar sensor
· Analog IF signals: High-frequency analog signals from the external radar sensor, enabling advanced radar processing and analysis from the ADC of host device in the base board
· GPIOs with configurable functionalities: Programmable GPIO lines that can be configured to support various functions, such as interrupt handling, clock signals, or other custom applications
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Figure 58
Schematic of the external radar interface connectors
3.2.6.3
Multiplexing of onboard and external RADAR interfaces
The XENSIVTM sensor shield multiplexes RADAR interface signals between the onboard RADAR and the external interface connector, enabling seamless switching between the two interfaces. The RADAR_SEL_LS signal, a digital control signal, is responsible for selecting between the onboard RADAR interface (when RADAR_SEL_LS = 0) and the external interface (when RADAR_SEL_LS = 1). The multiplexing is achieved using analog switches that select between the onboard and external RADAR signals based on the RADAR_SEL_LS signal. The specific multiplexing configurations are as follows: · RADAR Reset signal · RADAR Analog IF signal · RADAR SPI interface · RADAR GPIO signals
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Figure 59
Schematic of RADAR reset signal multiplexing
Apart from the MAIN_RST and XRES of host MCU as reset source, an additional dedicated reset signal provided from the baseboard through Arduino headers.
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Figure 60
Schematic of RADAR Analog IF signal multiplexing
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Figure 61
Schematic of RADAR SPI interface multiplexing
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Figure 62
Schematic of RADAR GPIO multiplexing
These multiplexed signals were level translated to the RADAR sensor I/O levels.
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Figure 63
Schematic of the onboard RADAR digital interface signal level translators
Figure 64
Schematic of the external RADAR digital interface signal level translators
3.2.7
Security subsystem
3.2.7.1
OPTIGATM Trust M device
The XENSIVTM sensor shield features an OPTIGATM Trust M device (U6), a highly secure embedded security device that provides advanced security features for IoT applications. The OPTIGATM Trust M device is interfaced over I2C, enabling secure communication and data exchange between the device and the baseboard.
Power supply
The OPTIGATM Trust M device is powered by a 3.3 V power supply, ensuring reliable and efficient operation.
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Figure 65
Schematic of OPTIGATM Trust M device interface
I2C interface and level translation: To ensure compatible logic levels between the OPTIGATM Trust M device and the host MCU signal levels, an I2C level translator (U34) is utilized. The level-translated I2C interface is connected to the Headers compatible with Arduino (J1, J2, J3, and J4) for seamless interface with the base board.
Reset signal and level translation: The reset signal from the baseboard is also level-translated to 3.3 V on the shield using an I/O level translator (U43), ensuring a clean and stable signal to the OPTIGATM Trust M device.
Figure 66
Schematic of OPTIGATM Trust M reset signal level translator
3.2.8
TFT display
The XENSIVTM sensor shield features a 0.96-inch TFT IPS display with a resolution of 80 x 160, powered by the ST7735S controller. The display is equipped with an IPS (in-plane switching) panel, offering a wide viewing direction and supporting 4K/65K/262K colors.
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Display interface and connectivity The host MCU communicates with the display via the 4-wire SPI protocol. The display is connected through an 8-pin FPC connector (J17), with provisions available on the shield to connect chip-on-flex (COF) style display modules.
Figure 67
Schematic of TFT display interface
Power supply and level translation
The display uses a 3.3 V supply for both the TFT IPS LCD and backlight. The SPI interface and other control signals from the host MCU, transmitted through the Headers compatible with Arduino (J1, J2, J3, and J4), are level-translated using I/O level translators (U24, U30, and U19).
Reset signal
The reset signal for the display, originating from the DIP switch (SW1), is level-translated and then connected to the display.
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Figure 68
Schematic of TFT display I/O level translator interface
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3.2.9
I2C interface connector
The XENSIVTM sensor shield features a 4-pin connector (J16) that extends the 3.3 V I/O level translated I2C interface from the baseboard, providing an extension capability specifically designed for adding I2C-based add-
on boards. This design allows for expanded functionality and flexibility.
Compatibility with QWIIC connection system
The interface connector is compatible with QWIIC connection system boards, a product of SparkFun. By using the 4-pin connector (J16), you can easily attach QWIIC boards to the shield, expanding its functionality and enabling it to connect and interact with multiple system boards that support the QWIIC system.
Figure 69
Schematic of the I2C interface connector
3.2.10
Headers compatible with Arduino (J1, J2, J3, and J4)
The XENSIVTM sensor shield features four headers compatible with Arduino: J1, J2, J3, and J4. These headers
provide a convenient interface for connecting the baseboard to the sensor shield, enabling the power supply, I2C interface, SPI interface, Analog I/O interface, PDM interface, and control I/O of sensors and display.
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Figure 70
Schematic of the Arduino-compatible header interface
Pin assignments and signal mapping
For detailed information on the pin assignment of the Arduino-compatible headers and signal mapping to the baseboard, see the Board details section.
3.3
Bill of materials
See the Kit webpage for the bill of materials.
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Glossary
Glossary
ADC Analog-to-digital converter
BOM Bill of materials
CO2 Carbon dioxide
DC Direct current
ECO External crystal oscillator
ESD Electrostatic discharge
GPIO General-purpose I/O
I2C Inter-integrated circuit
IC Integrated circuit
IDE Integrated development environment
IMU Inertial measurement unit
IoT Internet of things
LED Light emitting diode
MEMS Micro-electromechanical system
MIC Microphone
PAS Photoacoustic spectroscopy
PC Personal computer
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Glossary
PCM Pulse code modulation PDET Phase detect PDL Peripheral driver library PDM Pulse density modulation PSOCTM Programmable system-on-chip SDK Software development kit SPI Serial peripheral interconnect SRAM Static random-access memory SWD Single wire debug TDET Target detect UART Universal asynchronous receiver or transmitter USB Universal serial bus
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Revision history
Revision history
Document version
**
*A
Date of release
2024-09-27
2024-12-05
Description of changes
Initial release
Added the following sections: · Connecting XENSIVTM sensor shield to CYW920829M2EVK-02 Bluetooth® LE
MCU · Creating an out-of-box (OOB) application and programming using
ModusToolboxTM · Code examples supported for XENSIVTM sensor shield on
CYW920829M2EVK-02 · Sensor Hub Android application · Software requirements · Hardware requirements · Installation · Application UI description · Known limitations
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Trademarks All referenced product or service names and trademarks are the property of their respective owners.
Edition 2024-12-05 Published by Infineon Technologies AG 81726 Munich, Germany
© 2024 Infineon Technologies AG All Rights Reserved.
Do you have a question about any aspect of this document? Email: erratum@infineon.com
Document reference IFX-mfy1711943784226
For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( www.infineon.com)
Warnings Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies' products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.
References
Antenna House PDF Output Library 7.2.1831
Infineon Developer Community & Support Forum
PSOC™ 6 technical reference manuals | PSOC™ 6 Documentation
GitHub - Infineon/mtb-example-btstack-freertos-cyw20829-imu-bmi270
Semiconductor & System Solutions | Infineon Technologies