DFI PR610-C621

1st/2nd Gen Intel® Xeon® Scalable Processor Family ATX Motherboard

Key Features

Ordering Information

Model NameP/NGbERS-232USB 3.1 Gen1USB 2.0VGAIPMI-MgntBMC ModuleTPM 2.0Temp.
PR610-C621DR770-PR6101-000G226500000~60°C
PR610-C621DRV770-PR6101-100G226510SEM2510-VGA00~60°C
PR610-C621DRI770-PR6101-200G226511SEM2500-VGA/IPMI00~60°C
PR610-C621DR770-PR6101-300G226500010~60°C
PR610-C621DRV770-PR6101-400G226510SEM2510-VGA10~60°C
PR610-C621DRV770-PR6101-500G226511SEM2500-VGA/IPMI10~60°C

Motherboard Overview

Visual representation of the PR610-C621 motherboard, highlighting key components and connectors. Notable elements include the LGA 3647 CPU socket, DDR4 DIMM slots, PCIe x16 and x8 slots, PCI slot, M.2 slot, SATA 3.0 ports, USB 2.0 and 3.1 Gen1 ports, COM ports, VGA connector, and IPMI module connector. Also shows front panel connectors for USB, COM, and SMBus.

Mechanical Dimensions

A technical drawing illustrating the physical dimensions of the ATX form factor motherboard. It provides measurements in millimeters for overall size and placement of key mounting points and connectors, indicating a standard ATX layout.

System Block Diagram

A block diagram illustrating the system architecture. It shows the Intel® C621 chipset connecting to the 1st/2nd Gen Intel® Xeon® Scalable processors. Memory channels (A-F) connect to DDR4 DIMMs. PCIe lanes connect to PCIe x16, x8, and x1 slots, as well as the M.2 slot. Other connections include SATA 3.0, USB 3.1 Gen1, USB 2.0, GbE LAN (including IPMI), COM ports, VGA, Audio, SPI BIOS, and Super IO.

Detailed Specifications

CategoryItemDetails
SYSTEMProcessor1st Generation Intel® Xeon® Scalable Processor Family, LGA 3647 Socket, TDP upto 165W: Intel® Xeon® Platinum 8160T (24 Cores, 27.5M Cache, up to 3.7 GHz); 150W; Intel® Xeon® Gold 6138T (20 Cores, 27.5M Cache, up to 3.7 GHz); 125W; Intel® Xeon® Gold 6138 (20 Cores, 27.5M Cache, up to 3.7 GHz); 125W; Intel® Xeon® Gold 6130T (16 Cores, 22M Cache, up to 3.7 GHz); 125W; Intel® Xeon® Gold 6130 (16 Cores, 22M Cache, up to 3.7 GHz); 125W; Intel® Xeon® Gold 6126T (12 Cores, 19.25M Cache, up to 3.7 GHz); 125W; Intel® Xeon® Gold 6126 (12 Cores, 19.25M Cache, up to 3.7 GHz); 125W; Intel® Xeon® Gold 5120T (14 Cores, 19.25M Cache, up to 3.2 GHz); 105W; Intel® Xeon® Gold 5119T (14 Cores, 19.25M Cache, up to 3.2 GHz); 85W; Intel® Xeon® Gold 5118 (12 Cores, 16.5M Cache, up to 3.2 GHz); 105W; Intel® Xeon® Silver 4116T (12 Cores, 16.5M Cache, up to 3.0 GHz); 85W; Intel® Xeon® Silver 4116 (12 Cores, 16.5M Cache, up to 3.0 GHz); 85W; Intel® Xeon® Silver 4114T (10 Cores, 13.75M Cache, up to 3.0 GHz); 85W; Intel® Xeon® Silver 4110 (8 Cores, 11M Cache, up to 3.0 GHz); 85W; Intel® Xeon® Silver 4109T (8 Cores, 11M Cache, up to 3.0 GHz); 70W; 2nd Generation Intel® Xeon® Scalable Processor Family, LGA 3647 Socket, TDP upto 165W: Intel® Xeon® Gold 6252N (24 Cores, 35.75M Cache, up to 3.6 GHz); 150W; Intel® Xeon® Gold 6238T (22 Cores, 30.25M Cache, up to 3.7 GHz); 125W; Intel® Xeon® Gold 6230T (20 Cores, 27.5M Cache, up to 3.9 GHz); 125W; Intel® Xeon® Gold 6230N (20 Cores, 27.5M Cache, up to 3.5 GHz); 125W; Intel® Xeon® Gold 6230 (20 Cores, 27.5M Cache, up to 3.9 GHz); 125W; Intel® Xeon® Gold 6226 (12 Cores, 19.25M Cache, up to 3.7 GHz); 125W; Intel® Xeon® Gold 5220T (18 Cores, 24.75M Cache, up to 3.9 GHz); 105W; Intel® Xeon® Gold 5218T (16 Cores, 22M Cache, up to 3.8 GHz); 105W; Intel® Xeon® Gold 5218N (16 Cores, 22M Cache, up to 3.7 GHz); 110W; Intel® Xeon® Gold 5215 (10 Cores, 13.75M Cache, up to 3.4 GHz); 85W; Intel® Xeon® Silver 4216 (16 Cores, 22M Cache, up to 3.2 GHz); 100W; Intel® Xeon® Silver 4215 (8 Cores, 11M Cache, up to 3.5 GHz); 85W; Intel® Xeon® Silver 4214 (12 Cores, 16.5M Cache, up to 3.2 GHz); 85W; Intel® Xeon® Silver 4210 (10 Cores, 13.75M Cache, up to 3.2 GHz); 85W; Intel® Xeon® Silver 4209 (8 Cores, 11M Cache, up to 3.2 GHz); 70W
SYSTEMChipsetIntel® C621 Chipset
SYSTEMMemorySix 288-pin ECC-RDIMM up to 384GB; Single Channel DDR4 up to 2933 MHZ; Support Optane DC persistent memory module(DCPMM) in DIMM3 and DIMM6 (2nd Gen Xeon Scalable (62xx/52xx/4215) processors only)
SYSTEMBIOSInsyde SPI 128Mbit
GRAPHICSDisplay1 x VGA (only with SEM2500/SEM2510)
GRAPHICSSingle Displays InterfaceVGA (only with SEM2500/SEM2510)
EXPANSION2 x PCIe x16 (Gen 3)
EXPANSION2 x PCIe x8 (Gen 3)
EXPANSION1 x PCI; Note: PCIe x8 slot is OPEN edge.
AUDIOAudio CodecALC887
ETHERNETController2 x Intel® I210AT PCIe (10/100/1000Mbps)
ETHERNETEthernet2 x GbE (RJ-45); 1 x dedicated IPMI LAN (only with SEM2500)
REAR I/OUSB4x USB 3.1 Gen1
REAR I/ODisplay1 x VGA (only with SEM2500/SEM2510)
REAR I/OSerial2 x RS-232 (DB-9)
INTERNAL I/OUSB2x USB 2.0 header (2x USB 2.0); 1x USB 2.0 vertical Type A
INTERNAL I/OSATA6 x SATA 3.0 (up to 6Gb/s); RAID 0/1/5/10
INTERNAL I/OSMBus1 x SMBus
WATCHDOG TIMEROutput & IntervalSystem Reset, Programmable via Software from 1 to 255 sec/Min
SECURITYTPMTPM 2.0 (opt.)
POWERTypeATX
POWERConnector8-pin ATX 12V power; 24-pin ATX power
POWERConsumptionTypical: 5120T: 3.3V @ 0.42A (1.386Watt); 5V @2.33A (11.65Watt); 12V @ 2.34A (28.08Watt); Max.: 5120T:3.3V @ 0.43A (1.419Watt); 5V @ 2.4A (12.0Watt); 12V @ 12.51A (150.12Watt)
POWERRTC BatteryCR2032 Coin Cell
OS SUPPORTWindows 10 IoT Enterprise LTSB RS5(64-bit); Windows Server 2016; Windows Server 2012R2; Linux
ENVIRONMENTTemperatureOperating: 0 to 60°C; Storage: -40 to 85°C
ENVIRONMENTHumidityOperating: 5 to 90% RH, Non-condensing; Storage: 5 to 90% RH, Non-condensing
ENVIRONMENTMTBF493,780 hrs @ 25°C; 290,407 hrs @ 45°C; 187,006 hrs @ 60°C; Calculation Model: Telcordia Issue 4; Environment: GB, GC - Ground Benign, Controlled
MECHANICALDimensionsATX Form Factor; 305mm (12") x 244mm (9.6")
MECHANICALHeightPCB: TBD; Top Side: TBD mm; Bottom Side: TBD

Package Contents

Included Items

Optional Items

DFI reserves the right to change specifications at any time prior to product release. Changes thereafter will be based on product revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © August 13, 2025 DFI Inc.

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