DFI ERX810-C741 Server Motherboard | 5th/4th Gen Intel® Xeon® Scalable

DFI ERX810-C741 Server Motherboard

5th/4th Gen Intel® Xeon® Scalable Family | Server-grade

Key Features

  • Processor Support: Dual LGA 4677 sockets for 5th and 4th Generation Intel® Xeon® Scalable Processors.
  • Memory: 16 DDR5 ECC-RDIMM slots supporting up to 1024GB at speeds up to 5600MHz.
  • Expansion: Multiple expansion slots including 4x PCI Express (PCIe) x16 (Gen 5), 2x PCIe x8 (Gen5), and 1x M.2 M key 2280 slot.
  • Networking: 4x Intel® Gigabit Ethernet (GbE) ports and 1x Dedicated IPMI LAN port.
  • Storage: 4x SATA 3.0 ports with RAID 0/1/5/10 support.
  • I/O: Rich I/O including multiple USB 3.2 Gen1 and USB 2.0 ports, DisplayPort (DP), and Serial Ports (COM).
  • Management: Integrated Intelligent Platform Management Interface (IPMI) with Out-of-Band (OOB) Remote Management capabilities.
  • Chipset: Intel® C741 Chipset.

The DFI ERX810-C741 is a robust server-grade motherboard designed for high-performance computing environments. It features dual sockets for the latest Intel® Xeon® Scalable processors, extensive DDR5 memory support, and advanced PCIe 5.0 connectivity for demanding workloads.

Visual Description: The motherboard is depicted from a top-down view, clearly labeling key components such as the dual LGA 4677 CPU sockets, sixteen DDR5 RDIMM slots, various expansion slots (PCIe x16, PCIe x8), M.2 slot, and a comprehensive array of rear and internal I/O ports including LAN, DisplayPort, USB, and Serial ports.

Technical Architecture

Block Diagram Overview: The block diagram illustrates the system architecture, detailing the connectivity between the dual Intel® Xeon® Scalable Processors (CPU0, CPU1) and various system components. It highlights the DDR5 memory channels (A-H) supporting ECC RDIMMs up to 5600MHz, the Intel® C741 Chipset, and the extensive PCI Express (PCIe) lanes, including PCIe 5.0 x16 and x8 slots, and MCIO connectors. The diagram also maps out the DMI interface, LAN controllers (Intel I210AT), USB controllers (3.2 Gen1, 2.0), SATA ports, BMC (AST2600) for management, TPM 2.0, Audio, and various internal and external I/O headers.

Mechanical Drawing: A technical drawing provides the physical dimensions and layout of the ERX810-C741 motherboard. It includes precise measurements for mounting points and component placement, indicating a standard server motherboard form factor suitable for rackmount or server chassis integration.

Specifications

Category Details
System
  • Processor: 5th/4th Generation Intel® Xeon® Scalable Processor Family, LGA 4677 Socket, TDP up to 270W. (Detailed list of supported processors available in original document).
  • Chipset: Intel® C741 Chipset.
  • Memory: 16 x ECC-RDIMM up to 1024GB, DDR5 Max. 5600MHz.
  • BIOS: Insyde, BMC AST2600.
Graphics
  • Display: 1 x DisplayPort (DP).
  • Single Display: Supports DP output.
Expansion
  • 4 x PCI Express (PCIe) x16 (Gen 5).
  • 2 x PCI Express (PCIe) x8 (Gen5).
  • 1 x M.2 M key 2280 slot.
Audio
  • Audio Codec: Realtek ALC888S.
  • Controller: HD Audio.
Ethernet
  • 4 x Intel® I210 Gigabit Ethernet (GbE).
  • IPMI Controller: Realtek RTL8211F.
  • 1 x Dedicated IPMI LAN port.
Rear I/O
  • Serial: 1 x RS-232/422/485 (DB-9 connector).
  • Ethernet: 4 x Gigabit Ethernet (GbE).
  • USB: 4 x USB 3.2 Gen1 ports.
  • Display: 1 x DisplayPort (DP).
  • PS/2: 1 x PS/2 keyboard/mouse port.
Internal I/O
  • Serial: 1 x RS-232/422/485 header.
  • USB: 2 x USB 3.2 Gen1 headers, 2 x USB 2.0 headers, 1 x Vertical USB 2.0 header.
  • Audio: 1 x Front Panel Audio header.
  • DIO: 16-bit Digital Input/Output (DIO) header.
  • LPC: Low Pin Count (LPC) interface.
  • SATA: 4 x SATA 3.0 ports with RAID 0/1/5/10 support.
  • SMBus: System Management Bus (SMBus) header.
  • MCIO: 2 x Modular Connectivity I/O (MCIO) connectors.
  • TPM: Trusted Platform Module (TPM) 2.0 header.
Security TPM 2.0 support.
Power ATX form factor.
Environment
  • Temperature: Operating: 0°C to 60°C.
Mechanical
  • Dimensions: 305 x 365 mm.
  • PCB: TBD.
  • Top Side: TBD.
  • Bottom Side: TBD.

Packing List & Optional Items

Included in Packing List:

  • ERX810-C741 Motherboard
  • 1x M.2 screw
  • 1x M.2 standoff
  • 1x I/O Shield
  • 1x Serial ATA data cable (Length: 500mm)
  • 2x Cooler Carrier

Optional Items:

  • CPU Cooler, LGA 4677 (118*82*106mm)

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