DFI EC180-CS Fanless AI-Enabled Embedded System

8th/9th Gen Intel® Core™

Fanless AI-Enabled Embedded System

Key Features

Certifications: FC, CE, RoHS, UKCA, Intel® IoT Solutions Alliance

Panel Overview

Front View

Features: Power Button, COM 1/2, LAN 1/2, CAN 1/2, 19V DC-in, DP, DP (from MXM), USB 3.1 Gen2 3/4, LAN Mic-in, Line-out

Rear View

Features: 19V DC-in, DP++, DP (from MXM), GbE1, GbE2, GbE3, GbE4, USB 3.1 Gen2 1/2, LAN Mic-in, Line-out

Right View

Features heatsink

Dimensions

Front View

Diagram showing front dimensions: W: 250mm, H: 180mm, D: 76mm

Left View

Diagram showing left side dimensions

Right View

Diagram showing right side dimensions

Rear View

Diagram showing rear dimensions

Wall Mounting

Diagram illustrating wall mounting brackets and screws

Specifications

System

CategoryDetail
ProcessorIntel® Core i7-9700TE (8 Core, 3.8 GHz, 35W TDP) to Intel® Celeron® G4900 (2 Core, 3.1 GHz, 54W TDP)
ChipsetIntel® H310/Q370 Chipset
MemoryDDR4 2400/2666MHz up to 64GB
BIOSAMI SPI 128Mbit (supports UEFI/Legacy mode)
ControllerIntel® UHD Graphics 630 (Pentium® G5400 and Celeron® G4900 support Intel® UHD Graphics 610)

Graphics

CategoryDetail
FeatureOpenGL 4.5, DirectX 12, OpenCL 2.1
DisplayHW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9; HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
Interface4 x DP (from MXM), 1 x DP++
ResolutionUp to 4096x2304@60Hz

AI Accelerator

CategoryDetail
Storage1 x MXM 3.1 slot (Type-A/B up to 60W)

Expansion

CategoryDetail
Internal1 x M.2 M key (2242/2280) slot (PCIe Gen3 x4/SATA), 1 x SATA III for 1 x 2.5" SSD
M.2 B key 3052 slotH310: PCIe Gen2 x1; Q370: PCIe Gen3 x4, SATA3.0
M.2 E key 2230 slotH310: USB 2.0, PCIe Gen2 x1; Q370: USB 2.0, PCIe Gen3 x1

Audio

CategoryDetail
Controller5.1 CH Audio Codec: Realtek ALC888S-VD2-GR

Ethernet

CategoryDetail
H3103 x Intel® I210AT, 1 x Intel® I219V
Q3703 x Intel® I210AT, 1 x Intel® I219LM with iAMT11.0 (Core i7/i5 support iAMT)

LED Indicators

Front I/O

Rear I/O

Watchdog Timer

CategoryDetail
Output & IntervalWatchdog timeout programmable via software from 1 to 255 seconds
TPMdTPM2.0 (default)

Security

OS Support

Environment

CategoryDetail
Operating Temperature0 to 45°C
Storage Temperature-40 to 85°C
Relative Humidity5 to 95% RH (non-condensing)

Mechanical

CategoryDetail
ConstructionAluminum extrusion + SGCC Metal
MountingWall mount (mounting brackets and screws)
Dimensions (W x H x D)250 x 180 x 76mm (excluding wall mount bracket)
Weight5 Kg
ShockIEC 60068-2-27, 15 g, 11 ms, 18 shocks ±X, Y, Z (3 times each axis)
VibrationIEC 60068-2-64 Test Fh: Vibration board-band random test, Frequency: 5 Hz to 500 Hz, Acceleration: 2g rms (X, Y, Z axes, 30 mins each axis, 90 mins total)

Standards and Certifications

Ordering Information

Model NamePart NumberDescription
EC180-CS750-EC1800-100GFanless, CS181-H310, i7-9700TE, DDR4 16GBx2, DC-in 19V, F/G SYSTEM ROHS
EC180-CS-9700-32G-A500750-EC1800-200GFanless, CS181-H310, i7-9700TE, DDR4 16GB x2, M.2 2280 512GB Gen4x4, MXM A500, DC-in 19V, F/G SYSTEM RoHS
EC180-CS-9700-32GB-A2000750-EC1800-000GFanless, CS181-H310, i7-9700TE, DDR4 16GB x2, M.2 2280 512GB Gen4x4, MXM A2000, DC-in 19V, F/G SYSTEM RoHS

Optional Items

Optional ItemsPart NumberDescription
Wifi Module612-RTL882-000GWi-Fi+BT(V5.0+LE and BR/EDR) M.2 2230 Combo Module Card RTL8822CE
A2000 MXM612-M3A200-000G60W, 2560 CUDA cores, 8.25 TFLOPS, 8GB GDDR6 with 4x DP outputs
A500 MXM612-SKYMXM-000G35W, 2048 CUDA cores, 6.54 TFLOPS, 4GB GDDR6 (computing only)

Packing List

For the latest specifications, please contact DFI sales representatives. All product names are trademarks of their respective companies. © June 25, 2025 DFI Inc.

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