AURIX™ TC27x Variants Data Sheet Addendum

Naming Conventions

Prefix

• SAK: Ambient Temperature Range from -40 °C up to +125 °C
• SAL: Ambient Temperature Range from -40 °C up to +150 °C (packaged device)

Feature Package

• T - Standard type without HSM
• TP - Standard type with HSM enabled
• TC – Customer specific feature set

Variants BC Step

¹⁾ The address range starts at the lowest address defined in the User's Manual (See the Memory Maps chapter).

²⁾ Based on an EEPROM emulation algorithm with a wear levelling factor of 6 (size scales with number of program/erase cycles, for more details see User Manual).

³⁾ Featuring flash firmware (µCode) version 23H

Variants CA Step

¹⁾ STANDARD = serial production planned.

²⁾ The address range starts at the lowest address defined in the User's Manual (See the Memory Maps chapter).

³⁾ Based on an EEPROM emulation algorithm with a wear levelling factor of 6 (size scales with number of program/erase cycles, for more details see User Manual).

⁴⁾ Featuring flash firmware (µCode) version 23H

Variants DB Step

¹⁾ STANDARD = serial production planned.

²⁾ The address range starts at the lowest address defined in the User's Manual (See the Memory Maps chapter).

³⁾ Based on an EEPROM emulation algorithm with a wear levelling factor of 6 (size scales with number of program/erase cycles, for more details see User Manual).

⁴⁾ Featuring flash firmware (µCode) version 23H

Variants DC Step

¹⁾ STANDARD = serial production planned.

²⁾ The address range starts at the lowest address defined in the User's Manual (See Memory Maps chapter).

³⁾ Based on an EEPROM emulation algorithm with a wear levelling factor of 6 (size scales with number of program/erase cycles, for more details see User Manual).

⁴⁾ Featuring flash firmware (µCode) version 23H

Memory Maps of Variants

DF_EEPROM Variants:

Exemplary EEPROM size: 384 KB (64 KB @ 500k)

144 KB (24 KB @ 500k)

Core1/2 PSPR Variants: 32 KB

Diagram showing memory map for Core1/2 PSPR variants.

• 50100000H CPU2.PSPR (32 KB)
• 50108000H CPU1.PSPR (32 KB)

24 KB

• 50100000H CPU2.PSPR (24 KB)
• 60100000H CPU1.PSPR (24 KB)

Note: The diagrams show memory allocation with hatched areas indicating reserved or unavailable memory.

LMU Variants:

32 KB

• 9000 0000H LMURAM (32 KB)
• B000 0000H LMURAM (32 KB)

0 KB

• 9000 0000H Reserved
• B000 0000H Reserved

ETH Variants:

Yes

• F001 D000H ETH Control Register (256 B)
• F001 E000H ETH (8 KB)

Nc

• F001 D000H Reserved
• F002 0000H Reserved

HSM Variants:

Yes

• AF11 0000H DF_HSM (DF1) (64 KB)
• F004 0000H HSM (128 KB)
• FF11 0000H DF_HSM (DF1) (64 KB)

No

• AF11 0000H Reserved
• F004 0000H Reserved
• FF11 0000H Reserved

CAN FD Variants: No influence on Memory Map. CAN FD = “No” variants: all CAN register fields NCRx.FDEN have to be kept 0в.

Revision History

Trademarks

Trademarks of Infineon Technologies AG: AURIX™, C166™, CanPAK™, CIPOSTM, CIPURSETM, CoolGaNTM, CoolMOSTM, CoolSETTM, CoolSiCTM, CORECONTROLTM, CROSSAVETM, DAVETM, DI-POLTM, DrBLADETM, EasyPIMTM, EconoBRIDGETM, EconoDUALTM, EconoPACKTM, EconoPIMTM, EiceDRIVERTM, eupecTM, FCOSTM, HITFETTM, HybridPACKTM, ISOFACETM, IsoPACKTM, i-WaferTM, MIPAQTM, ModSTACKTM, my-dTM, NovalithICTM, OmniTuneTM, OPTIGATM, OptiMOSTM, ORIGATM, POWERCODETM, PRIMARIONTM, PrimePACKTM, PrimeSTACKTM, PROFETTM, PRO-SILTM, RASICTM, REAL3TM, ReverSaveTM, SatRICTM, SIEGETTM, SIPMOSTM, SmartLEWISTM, SOLID FLASHTM, SPOCTM, TEMPFETTM, thinQ!TM, TRENCHSTOPTM, TriCoreTM.

Other Trademarks: Advance Design SystemTM (ADS) of Agilent Technologies, AMBATM, ARMTM, MULTI-ICETM, KEILTM, PRIMECELLTM, REALVIEWTM, THUMBTM, µVisionTM of ARM Limited, UK. ANSITM of American National Standards Institute. AUTOSARTM of AUTOSAR development partnership. BluetoothTM of Bluetooth SIG Inc. CAT-iqTM of DECT Forum. COLOSSUSTM, FirstGPSTM of Trimble Navigation Ltd. EMVTM of EMVCo, LLC (Visa Holdings Inc.). EPCOSTM of Epcos AG. FLEXGOTM of Microsoft Corporation. HYPERTERMINALTM of Hilgraeve Incorporated. MCSTM of Intel Corp. IECTM of Commission Electrotechnique Internationale. IrDATM of Infrared Data Association Corporation. ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABTM of MathWorks, Inc. MAXIMTM of Maxim Integrated Products, Inc. MICROTECTM, NUCLEUSTM of Mentor Graphics Corporation. MIPITM of MIPI Alliance, Inc. MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO., MICROWAVE OFFICETM (MWO) of Applied Wave Research Inc., OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM of Openwave Systems Inc. RED HATTM of Red Hat, Inc. RFMDTM of RF Micro Devices, Inc. SIRIUSTM of Sirius Satellite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM, PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM, WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex.

Last Trademarks Update 2014-07-17

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Edition 2021-04-15

Published by Infineon Technologies AG, 81726 Munich, Germany

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