Introduction
The LB-LINK BL-M8189NS1 is a highly integrated Wireless Local Area Network (WLAN) module. It features a WLAN MAC, a 1T1R capable WLAN baseband, and radio. This module supports the IEEE 802.11b/g/n standard, delivering a maximum PHY rate of up to 150Mbps, and offers robust wireless connectivity with reliable throughput over extended distances.
Key Features
- Operating Frequencies: 2.4~2.4835GHz
- Host Interface: SDIO 2.0
- IEEE Standards: IEEE 802.11b/g/n
- Wireless PHY Rate: Up to 150Mbps
- Antenna Connection: External antenna via half hole pad
- Power Supply: DC 3.3V Main Power and DC 3.3V/1.8V I/O Power Supply
General Specifications
Module Name | BL-M8189NS1 |
---|---|
Chipset | RTL8189ES-VB |
WLAN Standards | IEEE 802.11b/g/n |
Host Interface | SDIO 2.0 for WLAN |
Antenna | External antenna via half hole pad |
Dimension (L*W*H) | 14*12.5*2.0mm |
Power Supply | DC 3.3V±0.2V @ 500 mA (Max) / DC 3.3V±0.2V or 1.8V±0.1V I/O |
Operation Temperature | -20°C to +70°C |
Operation Humidity | 10% to 95% RH (Non-Condensing) |
Electrical and RF Specifications
The document details various electrical parameters, including GPIO voltage levels for 3.3V and 1.8V interfaces, and current consumption across different operational modes (e.g., various data rates and transmission/reception scenarios). RF specifications cover frequency range, channels, modulation types, data rates up to 150Mbps, frequency tolerance, transmit power, and error vector magnitude (EVM).
Mechanical and Packaging
Mechanical dimensions of the module are provided, along with recommended PCB layout footprints and reflow soldering conditions. Packaging specifications include module quantities per roll and box, box dimensions, and storage recommendations to maintain module integrity, including ESD sensitivity precautions.
FCC Compliance and Integration
This section outlines the FCC compliance requirements for the BL-M8189NS1 module, including its FCC ID (2AL6KBL-M8189NS1). It details radiation exposure limits, conditions for OEM integrators, antenna specifications, and end-product labeling requirements. Information is provided for host manufacturers regarding testing and integration best practices.