Sony NWZ-X1050/X1051/X1060/X1061 Service Manual
Version: 1.0, 2009.05
Note: Ensure your PC is updated with the latest anti-virus software for service and checking. Contact Service Headquarters if a virus-affected unit is found during service.
Specifications
Category | Details |
---|---|
Supported File Formats | Music (Includes podcasts)
|
Maximum Recordable Number of Songs and Time (Approx.) | Based on 4-minute MP3 songs.
|
Maximum Recordable Time of Videos (Approx.) | Based on video transfer only.
|
Capacity | NWZ-X1050: 16 GB (Approx. 14.6 GB usable) NWZ-X1060: 32 GB (Approx. 29.6 GB usable) |
Output (Headphones) | Frequency Response: 20-20,000 Hz. Total Noise Suppression Ratio: Approx. 17 dB (equivalent to 98% reduction). |
FM Radio | Frequency Range: 87.5-108.0 MHz. IF: 128 kHz. Antenna: Headphone cord. |
Wireless LAN | Standards: IEEE 802.11b/g. Range: Approx. 50 m (160 ft). Modulation: DSSS/OFDM. Security: WEP/WPA/WPA2. |
Interface | Headphone: Stereo mini-jack. WM-PORT: 22 pins. Hi-Speed USB (USB 2.0). |
Operating Temperature | 5°C to 35°C (41°F to 95°F). |
Power Source | Built-in rechargeable lithium-ion battery; USB power. |
Charging Time | Approx. 3 hours (full charge), Approx. 1.5 hours (80%). |
Battery Life (Continuous Playback) | Varies by settings (e.g., Equalizer, VPT, DSEE, WLAN off). Approximate times provided for various audio/video formats and noise canceling settings. |
Display | 3-inch OLED, WQVGA (432x240 pixels), 262,144 colors. |
Dimensions | Approx. 52 x 96.5 x 9.8 mm (without projecting parts). |
Mass | Approx. 98 g (3.5 oz). |
Supplied Accessories | Headphones, USB cable, Earbuds (S, L), Attachment, Audio input cable, Plug adaptor (in-flight), CD-ROM (software), Operation Guide (PDF), Quick Start Guide. |
Servicing Notes
- Chip Component Replacement: Do not reuse disconnected chip components. Be cautious of heat damage to tantalum capacitors.
- Flexible Circuit Board Repairing: Maintain soldering iron temperature around 270°C. Avoid touching the same conductor repeatedly. Do not apply excessive force on conductors.
- Unleaded Solder: Boards may be marked with an 'LF' symbol. Unleaded solder melts at a higher temperature (approx. 40°C higher) and has stronger viscosity. Use caution to prevent solder bridges.
- System Requirements (for PC software): IBM PC/AT compatible, Windows OS (XP SP2+, Vista SP1+), Pentium 4 1.0 GHz+, 512 MB RAM, 380 MB HDD space, CD-ROM drive, Sound board, USB port. Requires .NET Framework, QuickTime, Internet Explorer, Windows Media Player, Adobe Flash Player. Broadband internet recommended for EMD/web access.
Main Board Replacement Notes
When replacing the main board, follow specific procedures. If the MAC address has changed, it needs to be reset by the user.
Disassembly and Test Modes
The manual details a step-by-step disassembly process for various components, including the rear panel, hold assembly, main board, battery, HP jack, flexible print boards, indicator elements, buttons, and touch panel module.
A comprehensive 'Test Mode' section outlines procedures for checking various functions and components:
- Power Checks: Voltage (VCHK), Consumption Current (ACHK), Standby Current (DSVCHK), Charge Current (CHGCHK), Battery Voltage (BATTCHK).
- Audio Checks: Output, S/N, Frequency Characteristics (F1, F2), Channel Separation (SEPLR, SEPRL), Maximum Output (MAXOUT), Normalizer (NMLZR), Sound Pressure Regulation (SPCHK), Speaker Check (SPKCHK), various user content playback checks (USER1, USER2, USER3).
- Video Checks: LCD display checks, user content playback (USER1 MP4).
- Other Checks: Clock, Key operation, Touch panel position, Firmware version, NAND capacity, CLESTE settings, DAC settings, Wi-Fi functions (power, connection, information, transmission/reception tests, RSSI), FM reception check, Noise Cancelling (NC) adjustments, Shutdown.
Diagrams and Parts
- Schematic Diagram: Provides a detailed circuit diagram of the main board, showing component interconnections.
- Printed Wiring Board: Illustrates the physical layout of components on the main board (Side A and Side B).
- Exploded Views: Visual breakdowns of the device's assembly for different sections (Panel, Main Board, Touch Panel).
- Electrical Parts List: Lists components with part numbers, descriptions, and remarks, categorized by type (Resistors, Capacitors, Semiconductors, Switches, etc.).
- Accessories: Lists included accessories such as headphones, cables, and manuals for various regions.
Revision History
The manual was first released in version 1.0 in May 2009.