DFI TGU9A2 COM Express® Mini

11th Gen Intel® Processor

Features

* Populated by default

Certifications: DDR4, 4K2K Display, Wide Temperature, FC, CE, RoHS, UKCA

Block Diagram

A block diagram illustrates the connectivity of the TGU9A2 module. Key components include the Intel ULT SOC (Tiger Lake - UP3), various I/O interfaces like GLAN, SATA, USB 2.0, USB 3.2, DDI ports, eDP, PCIe lanes, LPC, SPI, and SMBus. It also shows connections to onboard memory (LPDDR4x) and potential expansion options like NVMe SSD and embedded controller.

Visual Description of Block Diagram: The diagram shows a central block labeled 'Intel ULT SOC Tiger Lake - UP3'. From this SOC, various interfaces branch out. On the left, under 'COM Express Row A/B (Type10)', are connections for GLAN1, SATA 0/1, HDA, USB 2.0 P0~7, USB3.2 P0~1, DDI Port 1, eDP, and PCIe_LANE 0~3. Below these are connections for SPI, LPC, MDI, and TPM 2.0. A separate section on the right shows 'MEMORY DOWN 8G & 16G' with 'Channel A LPDDR4x X32'. Connections for CPU_PCIE Gen4 Port 0-3 are shown leading to an NVMe SSD. Other interfaces include I2C BUS, SMBUS, GPIO 8bit, SPI BUS, and eSPI BUS, connecting to components like an Embedded Controller (ITE8528) and SPI Flash BIOS.

Specifications

System

Processor: Intel® Core™ i7-1185G7E, i7-1185GRE, i5-1145G7E, i5-1145GRE, i3-1115G4E, i3-1115GRE, Celeron® 6305RE.

Graphics

Memory: Memory Down up to 16GB Single Channel LPDDR4X 4266MHz.

BIOS: AMI SPI 256Mbit.

Controller Feature: Intel® Iris® Xe graphics, OpenGL 5.0, DirectX 12, OpenCL 2.1.

Display: Dual Displays (DDI + eDP). eDP resolution up to 3840x2160 @ 60Hz, HDMI resolution up to 3840x2160 @ 30Hz, DP++ resolution up to 4096x2160 @ 60Hz.

Expansion

Interface: 1 x PCIe x4 (Gen 3), 1 x I2C, 1 x SMBus, 2 x SPI, 2 x UART (TX/RX).

Audio

Interface: HD Audio.

Ethernet

Controller: 1 x Intel® Ethernet I225IT (10M/100M/1000M/2.5Gbps).

I/O

USB: 2 x USB 3.2 Gen.2, 8 x USB 2.0.

SATA: 2 x SATA 3.0 (up to 6Gb/s).

NVMe SSD

1 x 128GB/256GB/512GB/1024GB on board SSD (available upon request).

DIO

1 x 8-bit DIO.

Watchdog Timer

Output & Interval: System Reset, Programmable via Software from 1 to 255 Seconds.

Security

TPM: BIOS default support FTPM, TPM2.0 by request.

Power

Type: ATX mode: 4.75V~20V, 5VSB, VCC_RTC. AT mode: 4.75V~20V, VCC_RTC.

OS Support

Windows: Windows 10 IoT Enterprise 64-bit. Linux.

Environment

Temperature: Operating: -5 to 65°C, Storage: -40 to 85°C. Extended Operating: -40 to 85°C.

Humidity: Operating: 10 to 90% RH. Storage: 10 to 90% RH.

MTBF: 1,230,760 hrs @ 25°C; 845,813 hrs @ 45°C; 598,810 hrs @ 60°C; 464,366 hrs @ 70°C; 309,043 hrs @ 85°C. Calculation Model: Telcordia Issue 4.

Mechanical

Dimensions: COM Express® Mini, 84mm (3.3") x 55mm (2.16").

Standards and Certifications

Compliance: PICMG COM Express® R3.0, Type 10.

Certification: CE, FCC, RoHS, UKCA.

Ordering Information

Model Name CPU Memory eDP DIO TPM SSD Operating temp. Part Number
TGU9A2-T16-1185GRE i7 1185GRE 16 GB eDP DIO TPM 2.0 128 GB -40-85°C 770-TGU9A22-000G
TGU9A2-T86-1185GRE i7 1185GRE 8 GB eDP DIO TPM 2.0 128 GB -40-85°C 770-TGU9A22-100G
TGU9A2-T16-1145GRE i5 1145GRE 16 GB eDP DIO N/A 128 GB -40-85°C 770-TGU9A22-200G
TGU9A2-B86-1115G4E i3 1115G4E 8 GB eDP DIO N/A 128 GB -5-65°C 770-TGU9A22-300G
TGU9A2-B86-6305E Celeron 6305E 8 GB eDP DIO N/A 128 GB -5-65°C 770-TGU9A22-400G

Packing List

Optional Items

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