Diodes Incorporated KBP2005G-KBP210G Series

Product Summary

Features and Benefits

• Glass Passivated Die Construction
• High Case Dielectric Strength of 1,500 VRMS
• Low Reverse Leakage Current
• Surge Overload Rating to 65A Peak
• Ideal for Printed Circuit Board Applications
• UL Listed Under Recognized Component Index, File Number E95060
• Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
• For automotive applications requiring specific change control (e.g., parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact Diodes Incorporated or your local Diodes representative. More information.

Mechanical Data

• Package: KBP
• Package Material: Molded Plastic. UL Flammability Classification Rating 94V-0
• Terminals: Finish - Tin Plated Leads. Solderable per MIL-STD-202, Method 208
• Polarity: Marked on Body
• Marking: Type Number
• Weight: 1.52 grams (Approximate)

Ordering Information

Notes:

• 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.
• 2. See Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free.
• 3. For packaging details, go to Diodes Incorporated's website.

Marking Information

The marking on the device includes the Product Type Marking Code (e.g., KBP201G, KBP202G, KBP204G, KBP206G, KBP208G, KBP210G for KBPXXXG, or KBP2005G for KBPXXXXG), a Manufacturer's Code Marking, and the Date Code Marking (YWW, where Y is the last digit of the year and WW is the week code).

Maximum Ratings

(@TA = +25°C, unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.)

Thermal Characteristics

Notes: 4. Thermal resistance from junction to case per element. Device mounted on 75mm x 75mm x 1.6mm Cu plate heatsink.

Electrical Characteristics

(@TA = +25°C, unless otherwise specified.)

Note: 5. Short duration pulse test used to minimize self-heating effect.

Graphical Data Descriptions

Figure 1: Forward Current Derating Curve
This graph illustrates the Forward Current Derating Curve, showing the relationship between average rectified current (ID) and ambient temperature (TA). It depicts how the maximum allowable current decreases as the temperature increases, with separate lines for different operating conditions like 'Average' and 'Peak'.

Figure 2: Typical Forward Characteristics
This graph presents the Typical Forward Characteristics, plotting instantaneous forward current (IF) against forward voltage (VF). It shows multiple curves representing different case temperatures (TC), illustrating how forward voltage drop varies with current and temperature.

Figure 3: Maximum Non-Repetitive Surge Current
This graph displays the Maximum Non-Repetitive Surge Current (IFSM) as a function of the number of cycles at 60Hz. It shows the device's capability to withstand short, high-current pulses, with a note indicating 'Pulse width 8.3ms single half sine-wave'.

Figure 4: Typical Total Capacitance
This graph illustrates the Typical Total Capacitance (CT) per element as a function of reverse voltage (VR). It shows how the junction capacitance changes with applied reverse bias.

Figure 5: Typical Reverse Characteristics
This graph shows the Typical Reverse Characteristics, plotting instantaneous reverse current (IR) against the percentage of rated peak reverse voltage. It includes curves for different junction temperatures (TJ), demonstrating leakage current behavior under reverse bias.

Figure 6: Non-Repetitive Surge Current
This graph depicts the Non-Repetitive Surge Current (IFSM) versus the number of cycles. It shows the device's surge capability for both 'Sine Wave' and 'Square Wave' conditions at different junction temperatures (TJ).

Package Outline Dimensions

The package outline shows a KBP type component with four leads. The diagram includes dimensions labeled A, D, A3, a, b, b2, c, E, e, L, L1, and z, with a chamfered corner indicated by '2.7 x 45° TYP'. The polarity is marked with '+' and '-' symbols on the component body.

All Dimensions in mm

Important Notice

Diodes Incorporated (Diodes) and its subsidiaries make no warranty of any kind, express or implied, with regards to any information contained in this document, including, but not limited to, the implied warranties of merchantability, fitness for a particular purpose or non-infringement of third party intellectual property rights.

The information herein is for informational purposes only and illustrates the operation of Diodes’ products and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes’ products.

Diodes’ products may be used to facilitate safety-related applications; however, customers and users are responsible for selecting appropriate products, evaluating their suitability, ensuring compliance with applicable legal and regulatory requirements, and designing with appropriate safeguards to minimize risks.

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Diodes’ products are provided subject to Diodes’ Standard Terms and Conditions of Sale (link) or other applicable terms. This document does not alter or expand applicable warranties.

Diodes’ products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws and regulations. Customers and users will be solely responsible for any damages, losses, or penalties arising from contravention of laws or regulations or unintended applications, and will indemnify Diodes against such claims.

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