QUECTEL AF31G Series Wi-Fi and Bluetooth Module User Manual

User Manual for QUECTEL models including: AF31G Series Wi-Fi and Bluetooth Module, AF31G Series, Wi-Fi and Bluetooth Module, Bluetooth Module

kelly

UserManual

Quectel Wireless Solutions Company Limited 202302AF31G XMR202302AF31G XMR202302AF31G 202302af31g

File Info : application/pdf, 58 Pages, 2.97MB

GetApplicationAttachment.html?id=6590829

AF31G
Hardware Design
Wi-Fi&Bluetooth Module Series Version: 1.0.1 Date: 2022-07-19 Status: Preliminary

Wi-Fi&Bluetooth Module Series
At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com
Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com.
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an "as available" basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.
Use and Disclosure Restrictions
License Agreements
Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.
Copyright
Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties ("third-party materials"). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel's or third-party's servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein. c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers' failure to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or

AF31G_Hardware_Design

53 / 53

metal powders.

Wi-Fi&Bluetooth Module Series

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

About the Document

Revision History

Version 1.0.0

Date

Author

2022-06-23 Barret XIONG/Logan ZHANG

1.0.1

2022-07-19 Barret XIONG

Description
Creation of the document
Preliminary
Preliminary 1. Updated the pin names: 20, 21,
24, 25, 27, 28, 58, 59, 60, 61, 62, 63 2. Updated the Pin Assignment (Figure 2) 3. Updated the weight of AF31G (Table 2) 4. Updated the SDIO routing requirements (Chapter 4.1.1.2) 5. Updated the packaging information (Chapter 8.3) 6. Updated the Absolute Maximum Ratings of VDD_IO (Table 23)

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

Contents
Safety Information ........................................................................................................................................3
About the Document ....................................................................................................................................5
Contents ........................................................................................................................................................ 6
Table Index ....................................................................................................................................................8
Figure Index .................................................................................................................................................. 9
1 Introduction .............................................................................................................................................10 1.1. Special Mark .................................................................................................................................. 10
2 Product Overview ................................................................................................................................... 11 2.1. Key Features ................................................................................................................................. 12 2.2. Functional Diagram ....................................................................................................................... 13 2.3. Pin Assignment ..............................................................................................................................14 2.4. Pin Description ...............................................................................................................................15
3 Operating Characteristics ..................................................................................................................... 19 3.1. Power Supply .................................................................................................................................19 3.1.1. Power Supply Pins ..............................................................................................................19 3.1.2. Reference Design for Power Supply .................................................................................. 19 3.1.3. Timing of Turning on the Module ........................................................................................21
4 Application Interfaces ............................................................................................................................22 4.1. Wireless Connection Interface ...................................................................................................... 22 4.1.1. Wi-Fi Application Interface ..................................................................................................22 4.1.1.1. PCIe Interface ........................................................................................................... 22 4.1.1.2. SDIO Interface .......................................................................................................... 24 4.1.1.3. WLAN_EN .................................................................................................................25 4.1.2. Bluetooth Application Interface ...........................................................................................26 4.1.2.1. PCM Interface ........................................................................................................... 26 4.1.2.2. BT_EN .......................................................................................................................27 4.1.2.3. BT_UART ..................................................................................................................27 4.2. Coexistence UART ........................................................................................................................ 28 4.3. WLAN_SLP_CLK ...........................................................................................................................28
5 RF Specifications ................................................................................................................................... 29 5.1. RF Antenna ....................................................................................................................................29 5.1.1. Antenna Interface & Frequency Bands .............................................................................. 29 5.1.2. Reference Design ............................................................................................................... 29 5.2. RF Performances ...........................................................................................................................30 5.2.1. Conducted RF Performance of Wi-Fi ................................................................................. 30 5.2.2. Conducted RF Performance of BLE ...................................................................................32 5.3. Reference Design of RF Routing .................................................................................................. 33

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
5.4. Antenna Requirements ..................................................................................................................34 5.5. RF Connector Recommendation ...................................................................................................35
6 Electrical Characteristics & ...................................................................................................................37
7 Reliability .................................................................................................................................................38 7.1. Absolute Maximum Ratings ...........................................................................................................38 7.2. Digital I/O Characteristic ................................................................................................................38 7.3. Power Consumption ...................................................................................................................... 39 7.3.1. Wi-Fi Power Consumption .................................................................................................. 39 7.3.2. BLE Power Consumption ....................................................................................................40 7.4. ESD Protection .............................................................................................................................. 41 7.5. Thermal Dissipation .......................................................................................................................41 7.6. Operating and Storage Temperatures .......................................................................................... 42
8 Mechanical Information ......................................................................................................................... 43 8.1. Mechanical Dimensions ................................................................................................................ 43 8.2. Recommended Footprint ...............................................................................................................45 8.3. Top and Bottom Views .................................................................................................................. 46
9 Storage, Manufacturing and Packaging .............................................................................................. 47 9.1. Storage Conditions ........................................................................................................................ 47 9.2. Manufacturing and Soldering ........................................................................................................ 48 9.3. Packaging Specifications .............................................................................................................. 49 9.3.1. Carrier Tape ........................................................................................................................ 50 9.3.2. Plastic Reel ......................................................................................................................... 50 9.3.3. Packaging Process ............................................................................................................. 51
10 Appendix References .......................................................................................................................... 53

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
Table Index
Table 1: Special Mark .................................................................................................................................. 10 Table 2: Brief Introduction of the Module .................................................................................................... 11 Table 3: Key Features ................................................................................................................................. 12 Table 4: Parameters Definition .................................................................................................................... 15 Table 5: Pin Description ...............................................................................................................................15 Table 6: Pin Definition of Power Supply ......................................................................................................19 Table 7: Pin Definition of PCIe Interface ..................................................................................................... 22 Table 8: Pin Definition of SDIO Interface .................................................................................................... 24 Table 9: Pin Definition of WLAN_EN ...........................................................................................................25 Table 10: Pin Definition of PCM Interface ................................................................................................... 26 Table 11: Pin Definition of BT_EN ...............................................................................................................27 Table 12: Pin Definition of BT_UART ..........................................................................................................27 Table 13: Pin Definition of Coexistence UART ........................................................................................... 28 Table 14: Pin Definition of WLAN_SLP_CLK ..............................................................................................28 Table 15: Pin Definition of RF Antenna Interface ........................................................................................29 Table 16: Operating Frequency of AF31G (Unit: GHz) ...............................................................................29 Table 17: Conducted RF Output Power at 2.4 GHz (Unit: dBm) ................................................................30 Table 18: Conducted RF Output Power at 5 GHz (Unit: dBm) ...................................................................31 Table 19: Conducted RF Receiving Sensitivity at 2.4 GHz (Unit: dBm) .....................................................31 Table 20: Conducted RF Receiving Sensitivity at 5 GHz (Unit: dBm) ........................................................32 Table 21: Conducted RF Performance of BLE (Unit: dBm) ........................................................................32 Table 22: Antenna Requirements ................................................................................................................34 Table 23: Absolute Maximum Ratings (Unit: V) .......................................................................................... 38 Table 24: Recommended Operating Conditions (Unit: V) .......................................................................... 38 Table 25: General DC Electrical Characteristics .........................................................................................39 Table 26: Power Consumption of the Module (Normal Operation; Unit: mA) ............................................ 39 Table 27: BLE Power Consumption During Non-signaling .........................................................................40 Table 28: Electrostatics Discharge Characteristics (25 °C, 45 % Relative Humidity; Unit: kV) .................41 Table 29: Operating and Storage Temperatures (Unit: °C) ........................................................................ 42 Table 30: Recommended Thermal Profile Parameters .............................................................................. 49 Table 31: Carrier Tape Dimension Table (Unit: mm) ..................................................................................50 Table 32: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 51 Table 33: Related Documents ..................................................................................................................... 53 Table 34: Terms and Abbreviations ............................................................................................................ 53

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
Figure Index
Figure 1: Functional Diagram ...................................................................................................................... 13 Figure 2: Pin Assignment (Top View) ..........................................................................................................14 Figure 3: Reference Circuit for VDD_PA .....................................................................................................20 Figure 4: Reference Circuit for VDD_IO ......................................................................................................20 Figure 5: Power-up Timing .......................................................................................................................... 21 Figure 6: Wi-Fi Application Interface Connection ........................................................................................22 Figure 7: PCIe Interface Connection ........................................................................................................... 23 Figure 8: SDIO Interface Connection .......................................................................................................... 24 Figure 9: Block Diagram of Bluetooth Application Interface Connection ................................................... 26 Figure 10: Block Diagram of PCM Interface Connection ............................................................................26 Figure 11: BT_UART Interface Connection ................................................................................................ 27 Figure 12: Coexistence UART Interface Connection ..................................................................................28 Figure 13: Reference Design for RF Antenna Interface ............................................................................. 30 Figure 14: Microstrip Design on a 2-layer PCB ...........................................................................................33 Figure 15: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 33 Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 33 Figure 17: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 34 Figure 18: Dimensions of the Receptacle (Unit: mm) ................................................................................. 35 Figure 19: Specifications of Mated Plugs (Unit: mm) ..................................................................................35 Figure 20: Space Factor of the Mated Connectors (Unit: mm) ...................................................................36 Figure 21: Placement and Fixing of the Heatsink ....................................................................................... 42 Figure 22: Carrier Tape Dimension Drawing .............................................................................................. 50 Figure 23: Plastic Reel Dimension Drawing ................................................................................................50 Figure 24: Packaging Process .....................................................................................................................52

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

1 Introduction
This document, describing AF31G and its air interface and hardware interfaces connected to your applications, informs you of the interface and RF specifications, electrical and mechanical details, as well as other related information of the module.
With the application notes and user guides provided separately, you can easily use the module to design and set up mobile applications.

1.1. Special Mark

Table 1: Special Mark

Mark [...]

Definition
Brackets ([...]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

2 Product Overview
AF31G is an automotive grade Wi-Fi and Bluetooth module with low power consumption. It is complying with IEEE 802.11a/b/g/n/ac 2.4 GHz & 5 GHz WLAN standards and Bluetooth 5.0 standard, which enables seamless integration of WLAN and Bluetooth Low Energy technologies.
It supports a low-power PCIe Gen2 interface for Wi-Fi and a UART/PCM interface for Bluetooth, and it also supports LTE & Wi-Fi/Bluetooth coexistence interface.

Table 2: Brief Introduction of the Module
AF31G Footprint Pin numbers Size Weight Wireless network functions

LGA 112 (23 ±0.2) mm × (23 ±0.2) mm × (3 ±0.2) mm 3.11 g Wi-Fi and Bluetooth 5.0

AF31G_Hardware_Design

53 / 53

2.1. Key Features

Wi-Fi&Bluetooth Module Series

Table 3: Key Features

Parameter Power Supply Frequency Range
Wi-Fi Transmission Data Rates
Protocol Features Wi-Fi Modulation

Details
VDD_PA: 3.143.46 V Typical: 3.3 V VDD_IO: 1.711.89 V Typical: 1.8 V
Wi-Fi: 2.4 GHz: 2.4002.4835 GHz 5 GHz: 5.1505.850 GHz Bluetooth: 2.4 GHz: 2.4022.480 GHz
802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48
Mbps, 54 Mbps 802.11n: HT20 (MCS 0-7), HT40 (MCS 0-7) 802.11a: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48
Mbps, 54 Mbps 802.11ac: VHT20 (MCS 0-8), VHT40 (MCS 0-9), VHT80 (MCS 0-9) IEEE 802.11a/b/g/n/ac Bluetooth 5.0
BPSK, QPSK, CCK, 16QAM, 64QAM and 256QAM

Bluetooth Modulation Wi-Fi Operating Modes Wireless Connection Interface WLAN_SLP_CLK Antenna Interfaces

GFSK, 8-DPSK and /4-DQPSK
AP STA Wi-Fi: PCIe Gen2 interface used for Wi-Fi function Bluetooth: UART and PCM interfaces used for Bluetooth function 32 kHz clock interface, provide clock function when the module is under low power consumption mode Wi-Fi & Bluetooth antenna interfaces 50 characteristic impedance

AF31G_Hardware_Design

53 / 53

Operating Temperature RoHS

Wi-Fi&Bluetooth Module Series
Operating Temperature Range: -40 °C to +85 °C 1 Storage temperature range: -40 °C to +95 °C All hardware components are fully compliant with EU RoHS directive.

2.2. Functional Diagram
The following figure shows a block diagram of the module and illustrates the major functional parts.
Power management Baseband Radio frequency Peripheral interfaces

Figure 1: Functional Diagram

1 To meet normal operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this temperature range, the module's related indicators can meet IEEE and Bluetooth specifications.

AF31G_Hardware_Design

53 / 53

2.3. Pin Assignment

Wi-Fi&Bluetooth Module Series

Figure 2: Pin Assignment (Top View)
NOTE 1. Please keep all RESERVED pins open. 2. SDIO interface and PCIe interface exist in different hardware modules respectively. Modules
supporting PCIe interface do not support SDIO interface. At this time, it is necessary to suspend the pins of all SDIO interfaces, and vice versa.

AF31G_Hardware_Design

53 / 53

2.4. Pin Description

Wi-Fi&Bluetooth Module Series

Table 4: Parameters Definition
Parameter AI AO DI DO OD PI PO

Description Analog input Analog output Digital Input Digital output Open drain Power input Power output

Table 5: Pin Description

Power Supply

Pin Name VDD_PA VDD_IO GND

Pin No.

I/O Description

DC Characteristics

Comments

101, 102, 105, 106

Main Power supply for module

3.3 V

It must be provided with sufficient current up to 1.5 A.

It must be

Voltage supply for I/O

1.8 V

provided with sufficient current

up to 300 mA.

6, 11, 14, 17, 23, 26, 29, 36, 38, 43, 44, 46, 47, 52, 53, 55, 56, 67, 70, 78, 80,

81, 82, 84, 87, 88, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 103, 104, 107,

108, 109, 110, 111, 112

Bluetooth Application Interface

Pin Name

Pin No.

BT_WAKEUP_HOST 39

HOST_WAKEUP_BT 40

I/O Description

Bluetooth Wakeup Host

Host Wakeup Bluetooth

DC Characteristics

Comments

1.8 V

VDD_IO power domain.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

BT_EN

PCM_DIN

PCM_SYNC

PCM_CLK

PCM_DOUT

BT_TXD

BT_RXD

BT_RTS BT_CTS SDIO Interface Pin Name

72 73
Pin No.

WLAN_WAKEUP_HO ST

WLAN_SDIO_CLK

WLAN_SDIO_CMD

WLAN_SDIO_DATA0 27

WLAN_SDIO_DATA1 28

WLAN_SDIO_DATA2 21

WLAN_SDIO_DATA3 20

PCIe Interface

Pin Name

Pin No.

WLAN_EN

PCIE_CLK_P

Bluetooth enable control

DI PCM data input

PCM data frame sync

DI PCM clock

PCM data output

Bluetooth UART transmit

Bluetooth UART receive

Request To Send

DI Clear To Send

VDD_IO power domain. Active high.
VDD_IO power domain.

I/O Description

DC Characteristics

Comments

SDIO wake up Host

VDD_IO power domain. Active low.

WLAN SDIO bus clock

DIO

WLAN SDIO bus command

DIO

WLAN SDIO data bus D0

1.8 V

VDD_IO power

DIO

WLAN SDIO data bus D1

domain.

DIO

WLAN SDIO data bus D2

DIO

WLAN SDIO data bus D3

I/O Description

Wi-Fi enable control

DC Characteristics
1.8 V

Comments
VDD_IO power domain.

AI PCIe reference

Require

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

PCIE_CLK_M PCIE_TX_P PCIE_TX_M PCIE_RX_P PCIE_RX_M PCIE_CLKREQ_N PCIE_WAKE_N PCIE_RST_N Coexistence UART Pin Name

18 15 16 12 13 9 8 7
Pin No.

COEX_TXD

COEX_RXD

Sleep Clock Interface

Pin Name

Pin No.

WLAN_SLP_CLK

RF Antenna Interface

Pin Name

Pin No.

ANT_WIFI0/BT

clock (+)

PCIe reference clock (-)

PCIe transmit (+)

PCIe transmit (-)

PCIe receive (+)

AI PCIe receive (-)

PCIe clock request

PCIe wakes up 1.8 V host

DI PCIe reset

differential impedance of 85 .
VDD_IO power domain.

I/O Description

LTE/WLAN &

Bluetooth coexistence

transmit

LTE/WLAN &

Bluetooth coexistence

receive

DC Characteristics

Comments

1.8 V

VDD_IO power domain. If unused, keep this pin open.

I/O Description

DC Characteristics

Comments

External 32.768 DI kHz sleep clock 1.8 V
input

VDD_IO power domain.

I/O Description

DC Characteristics

Comments

2.4/5 GHz Wi-Fi

antenna

IO interface 0 and

characteristic

Bluetooth

impedance.

antenna

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

ANT_WIFI1
Reserved Interface Pin Name RESERVED

interface

2.4/5 GHz Wi-Fi

IO antenna

interface 1

Pin No.

Comments

10, 31, 32, 33, 34, 37, 41, 42, 48, 49, 50, 51, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 77, 79, 83, 85, 86, 89

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

3 Operating Characteristics

3.1. Power Supply
3.1.1. Power Supply Pins
The following table shows the power supply pins and the ground pins of AF31G.

Table 6: Pin Definition of Power Supply

Pin Name VDD_PA VDD_IO GND

Pin No.

I/O Description

Comments

101, 102, 105, 106 PI

Main power supply for module

It must be provided with sufficient current up to 1.5 A.

Voltage supply for I/O

It must be provided with sufficient current up to 300 mA.

6, 11, 14, 17, 23, 26, 29, 36, 38, 43, 44, 46, 47, 52, 53, 55, 56, 67, 70, 78, 80, 81, 82, 84,

87, 88, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 103, 104, 107, 108, 109, 110, 111, 112

3.1.2. Reference Design for Power Supply
AF31G is powered by VDD_PA, and it is recommended to use a power supply chip with maximum output current exceeding 1.5 A. The following figure shows a reference design for VDD_PA is controlled by WLAN_PWR_EN1.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

Figure 3: Reference Circuit for VDD_PA
The power supply for I/O in AF31G is from VDD_IO, and it is recommended to use a power supply chip with maximum output current exceeding 300 mA. The following figure shows a reference design for VDD_IO is controlled by WLAN_PWR_EN2.

Figure 4: Reference Circuit for VDD_IO

AF31G_Hardware_Design

53 / 53

3.1.3. Timing of Turning on the Module

Wi-Fi&Bluetooth Module Series

Figure 5: Power-up Timing

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
4 Application Interfaces
4.1. Wireless Connection Interface
AF31G supports low power PCIe Gen2 interface or SDIO 3.0 for Wi-Fi function and UART as well as PCM interfaces for Bluetooth function.
4.1.1. Wi-Fi Application Interface
The following figure shows the Wi-Fi application interface connection between AF31G and AG52x series modules. SDIO interface and PCIe interface exist in different hardware modules respectively. Please make sure witch AF31G module used.

Figure 6: Wi-Fi Application Interface Connection

4.1.1.1. PCIe Interface

Table 7: Pin Definition of PCIe Interface

Pin Name

Pin No.

I/O

PCIE_REFCLK_P

PCIE_REFCLK_M 18

PCIE_TX_P

PCIE_TX_M

Description PCIe reference clock (+) PCIe reference clock (-) PCIe transmit (+) PCIe transmit (-)

Comments
Require differential impedance of 85 .

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

PCIE_RX_P

PCIE_RX_M

PCIE_CLKREQ_N 9

PCIE_WAKE_N

PCIE_RST_N

PCIe receive (+)

PCIe receive (-)

PCIe clock request

PCIe wakes up host

PCIe reset

VDD_IO power domain

The following figure shows the PCIe interface connection between AF31G and AG52x series modules.

Figure 7: PCIe Interface Connection
In order to ensure the integrity of PCIe signal, C1 and C2 components must be placed close to AG52x series modules. The extra stubs of traces must be as short as possible.
The following principles of PCIe interface design should be complied with, to meet PCIe Gen2 specifications.
It is important to route the PCIe signal traces (PCIE_TX/PCIE_RX/PCIE_REFCLK) as differential pairs with total grounding. And the differential impedance is 85 ±10%.
For PCIe signal traces, the maximum length of each differential data pair (PCIE_TX/PCIE_RX/ PCIE_REFCLK) is recommended to be less than 300 mm, and each differential data pair mat ching should be less than 0.7 mm (5 ps).
The trace space between TX differential data pair and RX differential data pair should be three times wider than PCIe trace width.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
The trace space between PCIe signals and the other signals should be four times wider than PCIe trace width.
Do not route signal traces under crystals, oscillators, magnetic devices, or RF signal traces. It is important to route the PCIe differential traces in inner-layer of the PCB and surround the traces with ground on that layer and with ground planes above and below.

4.1.1.2. SDIO Interface

Table 8: Pin Definition of SDIO Interface

Pin Name

Pin No. I/O

WLAN_WAKEUP_HOST 30

WLAN_SDIO_CLK

WLAN_SDIO_CMD

DIO

WLAN_SDIO_DATA0

DIO

WLAN_SDIO_DATA1

DIO

WLAN_SDIO_DATA2

DIO

WLAN_SDIO_DATA3

DIO

Description
SDIO wake up Host
WLAN SDIO bus clock WLAN SDIO bus command WLAN SDIO data bus D0 WLAN SDIO data bus D1

Comments VDD_IO power domain. Active low.
VDD_IO power domain.

WLAN SDIO data bus D2

WLAN SDIO data bus D3

The following figure shows the SDIO interface connection between AF31G and AG52x series modules.

Figure 8: SDIO Interface Connection AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:
It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50 ±10%.
Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc.
It is recommended to keep matching length between WLAN_SDIO_CLK and WLAN_SDIO_DATA[0:3]/WLAN_SDIO_CMD less than 1 mm and total routing length less than 50 mm. AF31G has 14 mm of internal tracing and 36 mm of external tracing.
It is recommended that keep termination resistors within 1524 on clock lines near the module and keep the route distance from the module clock pins to termination resistors less than 5 mm.
Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15 pF.

4.1.1.3. WLAN_EN
WLAN_EN is used to control the Wi-Fi function of AF31G. Wi-Fi function will be enabled when WLAN_EN is at high level.

Table 9: Pin Definition of WLAN_EN

Pin Name

Pin No.

I/O

WLAN_EN 68

Description Wi-Fi enable control

Comments VDD_IO power domain.

NOTE
WLAN_EN is a sensitive signal, and it should be ground shielded and routed as close as possible to AF31G.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
4.1.2. Bluetooth Application Interface
The following figure shows the block diagram of Bluetooth application interface connection between AF31G and AG52x series modules:

Figure 9: Block Diagram of Bluetooth Application Interface Connection

4.1.2.1. PCM Interface AF31G provides PCM interface for Bluetooth voice application.

Table 10: Pin Definition of PCM Interface

Pin Name PCM_DIN PCM_SYNC PCM_CLK PCM_DOUT

Pin No. I/O

Description PCM data input PCM data frame sync PCM clock PCM data output

Comments VDD_IO power domain.

The following figure shows the PCM interface connection between AF31G and AG52x series modules.

Figure 10: Block Diagram of PCM Interface Connection AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

4.1.2.2. BT_EN
BT_EN is used to control the Bluetooth function of AF31G. Bluetooth function will be enabled when BT_EN is at high level.

Table 11: Pin Definition of BT_EN

Pin Name Pin No. I/O

BT_EN

Description Bluetooth enable control

Comments
VDD_IO power domain. Active high.

4.1.2.3. BT_UART

Table 12: Pin Definition of BT_UART

Pin Name Pin No.

I/O

BT_TXD

BT_RXD

BT_RTS

BT_CTS

Description Bluetooth UART transmit Bluetooth UART receive Request To Send Clear To Send

Comments VDD_IO power domain.

The following figure shows the reference design for BT_UART connection between AF31G and AG52x series modules.

Figure 11: BT_UART Interface Connection AF31G_Hardware_Design

53 / 53

4.2. Coexistence UART

Wi-Fi&Bluetooth Module Series

Table 13: Pin Definition of Coexistence UART

Pin Name COEX_TXD COEX_RXD

Pin No. I/O

Description
LTE/WLAN & Bluetooth coexistence transmit LTE/WLAN & Bluetooth coexistence receive

Comments
VDD_IO power domain. If unused, keep this pin open.

The following figure shows the reference design for coexistence UART interface connection between AF31G and AG52x series modules.

Figure 12: Coexistence UART Interface Connection

4.3. WLAN_SLP_CLK
The 32.768 kHz clock can be used in low power consumption mode, such as power saving mode and sleep mode, in which basic logic operations can be maintained.

Table 14: Pin Definition of WLAN_SLP_CLK

Pin Name

Pin No. I/O Description

Comments

WLAN_SLP_CLK 22

DI External 32.768 kHz sleep clock input VDD_IO power domain.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

5 RF Specifications

5.1. RF Antenna
The characteristic impedance of the antenna ports should be controlled to 50 .

5.1.1. Antenna Interface & Frequency Bands

Table 15: Pin Definition of RF Antenna Interface

Pin Name

Pin No. I/O Description

ANT_WIFI0/BT 45

2.4/5 GHz Wi-Fi antenna interface 0 and Bluetooth antenna interface

ANT_WIFI1

IO 2.4/5 GHz Wi-Fi antenna interface 1

NOTE
50 characteristic impedance.

Table 16: Operating Frequency of AF31G (Unit: GHz)

Parameter 2.4 GHz Wi-Fi 5 GHz Wi-Fi Bluetooth

Frequency Bands 2.4002.4835 5.1505.850 2.4022.480

5.1.2. Reference Design
AF31G provides an RF antenna pin for Wi-Fi/Bluetooth antenna connection. The RF trace in host PCB connected to the module's RF antenna pin should be microstrip line or other types of RF trace, with characteristic impendence close to 50 . This module comes with grounding pins which are next to the antenna pin in order to give a better grounding.
It is recommended to reserve a -type and LCs matching circuit for better RF performance, and add a TVS for ESD protection. The -type matching components (C3, C4, R1), the LCs (L1, C1, L2, C2) and

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
TVS (D1) should be placed as close to the antenna as possible. The capacitors and inductors are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF.

Figure 13: Reference Design for RF Antenna Interface

5.2. RF Performances

5.2.1. Conducted RF Performance of Wi-Fi

Table 17: Conducted RF Output Power at 2.4 GHz (Unit: dBm)

Standard 802.11b 802.11b 802.11g 802.11g 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40

Data Rate 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS 0 MCS 7 MCS 0 MCS 7

Typ. TBD TBD TBD TBD TBD TBD TBD TBD

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

Table 18: Conducted RF Output Power at 5 GHz (Unit: dBm)

Standard 802.11a 802.11a 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 802.11ac, VHT20 802.11ac, VHT20 802.11ac, VHT40 802.11ac, VHT40 802.11ac, VHT80 802.11ac, VHT80

Data Rate 6 Mbps 54 Mbps MCS 0 MCS 7 MCS 0 MCS 7 MCS 0 MCS 8 MCS 0 MCS 9 MCS 0 MCS 9

Typ. TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

Table 19: Conducted RF Receiving Sensitivity at 2.4 GHz (Unit: dBm)

Standard 802.11b 802.11b 802.11g 802.11g 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40

Data Rate 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS 0 MCS 7 MCS 0 MCS 7

Typ. TBD TBD TBD TBD TBD TBD TBD TBD

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

Table 20: Conducted RF Receiving Sensitivity at 5 GHz (Unit: dBm)

Standard 802.11a 802.11a 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 802.11ac, VHT20 802.11ac, VHT20 802.11ac, VHT40 802.11ac, VHT40 802.11ac, VHT80 802.11ac, VHT80

Data Rate 6 Mbps 54 Mbps MCS 0 MCS 7 MCS 0 MCS 7 MCS 0 MCS 8 MCS 0 MCS 9 MCS 0 MCS 9

Typ. TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

5.2.2. Conducted RF Performance of BLE

Table 21: Conducted RF Performance of BLE (Unit: dBm)

Frequency 0 19 39

Transmitting Power (Typ.) TBD TBD TBD

Receiving Sensitivity (Typ.) TBD TBD TBD

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
5.3. Reference Design of RF Routing
For user's PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials' dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures.
Figure 14: Microstrip Design on a 2-layer PCB
Figure 15: Coplanar Waveguide Design on a 2-layer PCB

Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

Figure 17: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
In order to ensure RF performance and reliability, follow the principles below in RF layout design:
Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 .
Design the GND pins adjacent to RF pins as thermal relief pads, and fully connect them to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the
right-angle traces should be changed to curved ones. Reserve clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 × W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.
For more details about RF layout, please refer to document [2].

5.4. Antenna Requirements

Table 22: Antenna Requirements

Parameter Frequency range: VSWR Gain: Max Input Power: Input Impedance:

Requirements 2.4002.4835 GHz (Cable Insertion Loss: < 1 dB) 5.1505.850 GHz (Cable insertion loss: <1 dB) <2
1 dBi
50 W
50

AF31G_Hardware_Design

53 / 53

Polarization Type

Vertical

Wi-Fi&Bluetooth Module Series

5.5. RF Connector Recommendation
If the RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connectors provided by Hirose.

Figure 18: Dimensions of the Receptacle (Unit: mm) U.FL-LP series connectors listed in the following figure can be used to match the U.FL-R-SMT.

Figure 19: Specifications of Mated Plugs (Unit: mm) The following figure describes the space factor of the mated connector.
AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
Figure 20: Space Factor of the Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
6 Electrical Characteristics &

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

7 Reliability

7.1. Absolute Maximum Ratings

Table 23: Absolute Maximum Ratings (Unit: V)

Parameter VDD_IO VDD_PA Digital I/O Input Voltage

Min. -0.3 -0.3 -0.3

Max. 3.6 3.6 VDDIO + 0.2

NOTE VDDIO is the supply voltage associated with the input pin to which the test voltage is applied.
The following table shows the recommended operating conditions of AF31G.

Table 24: Recommended Operating Conditions (Unit: V)

Parameter VDD_IO VDD_PA

Min. 1.71 3.14

Typ. 1.8 3.3

Max. 1.89 3.46

7.2. Digital I/O Characteristic

AF31G_Hardware_Design

53 / 53

Table 25: General DC Electrical Characteristics

Parameter VIH VIL VOH VOL IiL IoL

Description

Min.

High Level Input Voltage 0.7 × VDD_IO

Low Level Input Voltage -0.3

High Level Output Voltage 0.9 × VDD_IO

Low Level Output Voltage 0

Input Leakage Current

-5.0

Input Leakage Current

Wi-Fi&Bluetooth Module Series

Max.

Unit

VDD_IO + 0.2

0.3 × VDD_IO

VDD_IO

0.3 × VDD_IO

5.0

µA

-11

7.3. Power Consumption
7.3.1. Wi-Fi Power Consumption
Under the maximum transmit power, the Wi-Fi power consumption test results are as follows:

Table 26: Power Consumption of the Module (Normal Operation; Unit: mA)

Description Conditions

IVDD_
CORE_VL

802.11b

TX 1 Mbps @ TBD dBm TBD TX 11 Mbps @ TBD dBm TBD

IVDD_
CORE_VM
TBD
TBD

IVDD_
CORE_VH
TBD
TBD

IVDD_IO IVDD_PA_A TBD TBD TBD TBD

IVDD_PA_
B
TBD
TBD

802.11g
802.11n (2.4 GHz)
802.11a

TX 6 Mbps @ TBD dBm TBD

TX 54 Mbps @ TBD dBm TBD

TX HT20 MCS 0 @TBD dBm TX HT20 MCS 7 @TBD dBm TX HT40 MCS 0 @ TBD dBm TX HT40 MCS 7 @ TBD dBm

TBD TBD TBD TBD

TX 6 Mbps @ TBD dBm TBD

TBD TBD TBD TBD TBD TBD TBD

TBD TBD

TBD TBD TBD TBD

TBD TBD TBD TBD TBD TBD TBD

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

(5 GHz) 802.11n (5 GHz)
802.11ac (5 GHz)

TX 54 Mbps @ TBD dBm TBD

TX HT20 MCS 0 @ TBD dBm TX HT20 MCS 7 @ TBD dBm TX HT40 MCS 0 @ TBD dBm TX HT40 MCS 7 @ TBD dBm TX VHT20 MCS 0 @ TBD dBm TX VHT20 MCS 8 @ TBD dBm TX VHT40 MCS 0 @ TBD dBm TX VHT40 MCS 9 @ TBD dBm TX VHT80 MCS 0 @ TBD dBm TX VHT80 MCS 9 @ TBD dBm

TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

7.3.2. BLE Power Consumption
BLE power consumption during non-signaling is here as follows:

Table 27: BLE Power Consumption During Non-signaling

Description

Power

Non-signaling TBD dBm

Power Supply 3.3 V 1.8 V

Consumed Current TBD TBD

NOTE
For more details about current consumption, please contact Quectel Technical Supports for the power consumption test report of the module.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

7.4. ESD Protection
Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

Table 28: Electrostatics Discharge Characteristics (25 °C, 45 % Relative Humidity; Unit: kV)

Tested Interfaces VDD GND Antenna Interfaces

Contact Discharge TBD TBD TBD

Air Discharge TBD TBD TBD

7.5. Thermal Dissipation
The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range.
The following principles for thermal consideration are provided for reference:
Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply.
Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:
- Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
- Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
- Choose the heatsink with adequate fins to dissipate heat; - Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and
good wettability and place it between the heatsink and the module;

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
- Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

Figure 21: Placement and Fixing of the Heatsink

7.6. Operating and Storage Temperatures

Table 29: Operating and Storage Temperatures (Unit: °C)

Parameter Operating temperature range 2 Storage temperature range

Min. -40 -40

Typ. +25

Max. +85 +95

2 To meet normal operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this temperature range, the module's related indicators can meet IEEE and Bluetooth specifications.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
8 Mechanical Information
This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.
8.1. Mechanical Dimensions

Figure 22: Module Top and Side Dimensions

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

Figure 23: Module Bottom Dimension (Bottom View)
NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard.

AF31G_Hardware_Design

53 / 53

8.2. Recommended Footprint

Wi-Fi&Bluetooth Module Series

Figure 24: Recommended Footprint
NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.

AF31G_Hardware_Design

53 / 53

8.3. Top and Bottom Views

Wi-Fi&Bluetooth Module Series

Figure 25: Top View of the Module
NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

9 Storage, Manufacturing and
Packaging

9.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.
1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 3560 %.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours 3 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition; Violation of the third requirement mentioned above; Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours; Before module repairing. 5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 ±5 °C; The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put
in a dry environment such as in a dry cabinet.

3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
NOTE
1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
9.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be TBD mm. For more details, please refer to document [1].
The peak reflow temperature should be 235246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Figure 26: Recommended Reflow Soldering Thermal Profile

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

Table 30: Recommended Thermal Profile Parameters

Factor

Recommendation

Soak Zone

Max slope

1 to 3 °C/s

Soak time (between A and B: 150 °C and 200 °C) 70 to 120 s

Reflow Zone

Max slope

1 to 3 °C/s

Reflow time (D: over 217 °C)

40 to 70 s

Max temperature

235 to 246 °C

Cooling down slope

-1.5 to -3 °C/s

Reflow Cycle

Max reflow cycle

NOTE
1. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [1][2].

9.3. Packaging Specifications
This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery.
The module adopts carrier tape packaging and details are as follow:

AF31G_Hardware_Design

53 / 53

9.3.1. Carrier Tape
Dimension details are as follow:

Wi-Fi&Bluetooth Module Series

Figure 22: Carrier Tape Dimension Drawing

Table 31: Carrier Tape Dimension Table (Unit: mm)

0.4

23.5

3.5

6.8

20.2

1.75

9.3.2. Plastic Reel

Figure 23: Plastic Reel Dimension Drawing AF31G_Hardware_Design

53 / 53

Table 32: Plastic Reel Dimension Table (Unit: mm)

øD1

øD2

330

100

9.3.3. Packaging Process

Wi-Fi&Bluetooth Module Series
W 44.5

Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules.

Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.

Place the vacuum-packed plastic reel into the pizza box.

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series
Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules.
Figure 24: Packaging Process

AF31G_Hardware_Design

53 / 53

Wi-Fi&Bluetooth Module Series

10 Appendix References

Table 33: Related Documents Document Name [1] Quectel_Module_Secondary_SMT_Application_Note [2] Quectel_RF_Layout_Application_Note

Table 34: Terms and Abbreviations

Abbreviation bps CDMA CHAP CS CTS ESD GND HSIC IEEE LGA LTE MCS PCB PCM

Description Bytes per second Code Division Multiple Access Challenge Handshake Authentication Protocol Coding Scheme Clear To Send Electrostatic Discharge Ground High Speed Inter Chip Institute of Electrical and Electronics Engineers Land Grid Array Long Term Evolution Modulation and Coding Scheme Printed Circuit Board Pulse Code Modulation

AF31G_Hardware_Design

53 / 53

PSK QAM QPSK RF RoHS RTS SMS UART Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin VOHmin VOLmax VSWR WLAN

Wi-Fi&Bluetooth Module Series
Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Request To Send Short Message Service Universal Asynchronous Receiver/Transmitter Maximum Voltage Nominal Voltage Minimum Voltage Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Voltage Standing Wave Ratio Wireless Local Area Network

AF31G_Hardware_Design

53 / 53

FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body and must not transmit simultaneously with any other antenna or transmitter.
3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202302AF31G.
4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:
Buletooth:3.67dBi Buletooth(LE):3.67dBi Wi-Fi 2.4G:4.35dBi Wi-Fi 5G:5.4dBi
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module's FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:"Contains Transmitter Module FCC ID: XMR202302AF31G." or "Contains FCC ID: XMR202302AF31G." must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user's manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party

responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the equipment.