Eaton HPAL1V1040 High Current Inductor

Technical Data 11083 | Effective February 2025

Product Features

High current carrying capacity
Low core losses
Magnetically shielded, low EMI
Inductance range from 0.22 μH to 47 μH
Current range from 2.8 A to 60 A
11.5 mm x 10.3 mm footprint surface mount package in a 4.0 mm height
Iron powder core material
Moisture Sensitivity Level (MSL) 1

Applications

Voltage Regulator Module (VRM)
Multi-phase regulators
Point-of-load modules (PoL)
Desktop and server VRMs and EVRDs
Base station equipment
Notebook and laptop regulators
Battery power systems
Graphics cards
Data networking and storage systems

Environmental Compliance and General Specifications

Storage temperature range (Component): -55 °C to +125 °C
Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise)

Pb HF HALOGEN FREE RoHS

Product Specifications

The following table details the specifications for various HPAL1V1040 models:

Part number	OCL (μH) ± 20% minimum	FLL (μH) minimum	Irms (A)	Isat (A)	DCR (mΩ) typical @ +20 °C	DCR (mΩ) maximum @ +20 °C	SRF (MHz) typical	K-factor
HPAL1V1040-R22-R	0.22	0.124	35	60	0.8	1.0	112	616
HPAL1V1040-R30-R	0.30	0.168	35	45	0.9	1.1	96	499
HPAL1V1040-R36-R	0.36	0.202	30	45	1.02	1.2	90	428
HPAL1V1040-R47-R	0.47	0.264	30	40	1.35	1.7	83	698
HPAL1V1040-R56-R	0.56	0.314	25	33	1.7	1.8	63	457
HPAL1V1040-R68-R	0.68	0.381	23	30	2.06	2.4	63	381
HPAL1V1040-R80-R	0.8	0.448	23	29	2.2	2.7	50	427
HPAL1V1040-1R0-R	1.0	0.56	19	28	2.8	3.3	44	293
HPAL1V1040-1R5-R	1.5	0.84	16	24	4.0	4.2	38	296
HPAL1V1040-2R2-R	2.2	1.24	12	16.5	6.3	7.0	25	277
HPAL1V1040-3R3-R	3.3	1.85	11	16	9.8	11.8	20	208
HPAL1V1040-4R7-R	4.7	2.64	9.0	13	13	20	17	169
HPAL1V1040-6R8-R	6.8	3.81	8.5	12	20	25	14	208
HPAL1V1040-8R2-R	8.2	4.60	8.0	9.0	24	27	15	127
HPAL1V1040-100-R	10	5.60	7.8	8.5	27	30	12	134
HPAL1V1040-150-R	15	8.4	5.2	7.0	41	45	9.8	89
HPAL1V1040-220-R	22	12.3	4.3	5.5	60	66	6.8	129
HPAL1V1040-330-R	33	18.5	3.3	5.0	83	92	5.9	68
HPAL1V1040-470-R	47	26.3	2.8	3.5	134	145	4.7	73

Notes on Test Parameters:

1. Open circuit inductance (OCL) test parameters: 100 kHz, 1.0 V, 0.0 Adc, +25 °C.
2. Full load inductance (FLL) test parameters: 100 kHz, 1.0 Vrms, Isat, +25 °C.
3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst-case operating conditions verified in the end application.
4. Isat: Peak current for approximately 30% rolloff @ +25 °C.
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. (Bp-p: Gauss, K: K-factor, L: Inductance in μH, ΔI: Peak to peak ripple current in Amps).
6. Part Number Definition: HPAL1V1040-xxx-R. HPAL1V1040 = Product code and size. xxx = inductance value in all, "R" = decimal point; if no "R" is present, then the third digit equals the number of zeros. -R suffix = RoHS compliant.

Dimensions (mm)

Diagram: A 2D representation showing the dimensions of the inductor with labels A, B, C, D, and E.

Part Number Dimensions:

Part number	A	B	C	D	E
HPAL1V1040-xxx-R	11.5 max	10.0 ± 0.3	3.8 ± 0.2	2.0 ± 0.5	3.0 ± 0.5

Part Marking: XRX = inductance value in uH, R = decimal point. If no R is present, then the last character equals the number of zeros.

General Notes:

All soldering surfaces to be coplanar within 0.1 millimeters.
Tolerances are ±0.2 millimeters unless stated otherwise.
Pad layout tolerance is ±0.1 millimeters unless stated otherwise.
Traces or vias underneath the inductor are not recommended.

Recommended Pad Layout

Diagram: A recommended pad layout for surface mounting the inductor, showing top and side views with dimensions.

Schematic

Diagram: A schematic representation of the inductor's internal circuitry.

Packaging Information

Supplied in tape and reel packaging, 500 parts per 13" diameter reel.

Diagram: Shows the tape and reel packaging with dimensions and user direction of unreeling.

Eaton Family:

Eaton Family	W ± 0.30	F ± 0.10	E1 ± 0.10	E2 Min	P0 ± 0.10	P1 ± 0.10	P2 ± 0.10	D0+0.10/-0	D1+0.10/-0	A0 ± 0.10	B0 ± 0.10	K0 ± 0.10	T ± 0.05
HPAL1V1040	24mm	24.00	11.50	1.75	22.25	4.00	16.00	2.0 ± 0.10	1.50	1.50	10.40	11.60	4.30	0.40

Inductance and Impedance vs Frequency

Diagrams: Multiple graphs plotting Inductance (μH) and Impedance (Ω) against Frequency (MHz) for various HPAL1V1040 models (e.g., HPAL1V1040-R22-R, HPAL1V1040-R30-R, HPAL1V1040-R36-R, HPAL1V1040-R47-R, HPAL1V1040-R56-R, HPAL1V1040-R68-R, HPAL1V1040-R80-R, HPAL1V1040-1R0-R, HPAL1V1040-1R5-R, HPAL1V1040-2R2-R, HPAL1V1040-3R3-R, HPAL1V1040-4R7-R, HPAL1V1040-6R8-R, HPAL1V1040-8R2-R, HPAL1V1040-100-R, HPAL1V1040-150-R, HPAL1V1040-220-R, HPAL1V1040-330-R, HPAL1V1040-470-R).

Inductance and Temperature Rise vs Idc

Diagrams: Multiple graphs plotting Inductance (μH) and Temperature Rise (°C) against Idc (A) for various HPAL1V1040 models (e.g., HPAL1V1040-R22-R, HPAL1V1040-R30-R, HPAL1V1040-R36-R, HPAL1V1040-R47-R, HPAL1V1040-R56-R, HPAL1V1040-R68-R, HPAL1V1040-R80-R, HPAL1V1040-1R0-R, HPAL1V1040-1R5-R, HPAL1V1040-2R2-R, HPAL1V1040-3R3-R, HPAL1V1040-4R7-R, HPAL1V1040-6R8-R, HPAL1V1040-8R2-R, HPAL1V1040-100-R, HPAL1V1040-150-R, HPAL1V1040-220-R, HPAL1V1040-330-R, HPAL1V1040-470-R).

Core Loss vs Bp-p

Diagrams: Multiple graphs plotting Core Loss (mW) against Bp-p (Gauss) for various frequencies (50kHz, 100kHz, 300kHz, 500kHz, 700kHz) for different HPAL1V1040 models (e.g., HPAL1V1040-R22-R, HPAL1V1040-R30-R, HPAL1V1040-R36-R, HPAL1V1040-R47-R, HPAL1V1040-R56-R, HPAL1V1040-R68-R, HPAL1V1040-R80-R, HPAL1V1040-1R0-R, HPAL1V1040-1R5-R, HPAL1V1040-2R2-R, HPAL1V1040-3R3-R, HPAL1V1040-4R7-R, HPAL1V1040-6R8-R, HPAL1V1040-8R2-R, HPAL1V1040-100-R, HPAL1V1040-150-R, HPAL1V1040-220-R, HPAL1V1040-330-R, HPAL1V1040-470-R).

Solder Reflow Profile

Diagram: A graph illustrating the solder reflow profile with key temperature points (Tsmin, Tsmax, TL, Tp) and time durations (ts, tL, tp).

Reference: J-STD-020

Profile Feature Comparison:

Profile feature	Standard SnPb solder	Lead (Pb) free solder
Preheat and soak
• Temperature min. (Tsmin)	100 °C	150 °C
• Temperature max. (Tsmax)	150 °C	200 °C
• Time (Tsmin to Tsmax) (ts)	60-120 seconds	60-120 seconds
Ramp up rate TL to Tp	3 °C/ second max.	3 °C/ second max.
Liquidous temperature (TL)	183 °C	217 °C
Time (tL) maintained above TL	60-150 seconds	60-150 seconds
Peak package body temperature (Tp)*	Table 1	Table 2
Time (tp)* within 5 °C of the specified classification temperature (Tc)	20 seconds*	30 seconds*
Ramp-down rate (Tp to TL)	6 °C/ second max.	6 °C/ second max.
Time 25 °C to peak temperature	6 minutes max.	8 minutes max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

Eaton Support and Legal Information

Eaton's Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton

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Cleveland, OH 44122
United States
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