WIHART2/WISA2 Wireless Module – Hardware Integration Manual
Document Version: 1.3
Centero
Hardware Part Number: CW-24-200
Image: A close-up image of the Centero CW-24-200 wireless module, showing its compact size and various markings including MAC address, FCC ID, and IC certification numbers.
Introduction
This integration manual provides comprehensive specifications and details for engineers to integrate the WIHART2/WISA2 module into new or existing products. The WIHART2/WISA2 wireless module is a direct replacement for Centero's first-generation WIHART/WISA wireless module. The hardware model and part number is CW-24-200.
The document covers:
- Functional specifications
- Electrical characteristics
- Pinout and connectivity interfaces
- Mechanical drawings
- Wireless module integration instructions for FCC and ISED compliance
- RF specifications
It also provides specifications for connecting the module to an external application processor running ISA100 application layer firmware or HART/WirelessHART application layer firmware.
The WIHART module is pre-loaded with a WirelessHART compliant stack, and the WISA module is pre-loaded with an ISA100 Wireless compliant stack. A dual-boot mode is available, allowing the module to boot into either ISA100 or WirelessHART based on a digital input state.
Audience
This manual is intended for hardware and integration engineers.
Revision History
Rev. | Date | Description |
---|---|---|
1.0 | October 4, 2016 | Initial baseline document. |
1.1 | December 14, 2017 | Updated to include functional details related to connectivity. |
1.2 | March 9, 2017 | Revised pin definitions. Added PCB stack-up, drawings and block diagram. |
1.3 | June 30, 2017 | Revised section 5 – connectivity to external application processor. |
1.4 | July 11, 2017 | Added mechanical drawings. |
1.8 | April 22, 2018 | Added Manufacturing Information section. |
1.81 | May 18, 2018 | Added RoHS compliance statement. |
1.83 | August 24, 2018 | Changed max voltage of any digital I/O to 3.3 V. |
1.85 | March 2, 2019 | Minor revisions. |
1.90 | October 16, 2019 | Cosmetic revisions to the WiHART module connectivity – no impact on functionality. |
1.91 | January 8, 2020 | Extended the supply voltage range to 2.9 V based on additional measurement. |
1.92 | February 27, 2020 | Revised V_LDO_OUT parameter to reflect extended voltage range. |
2.0 | February 26, 2021 | Added reference design schematics for WISA, WIHART and Dual-Boot modules. |
1.0 | July 14, 2024 | Reset revision number and revised entire document for the second generation WIHART2 and WISA2 drop in replacement module. |
1.1 | January 8, 2025 | Editorial revision of some of the JTAG pin names. |
1.2 | February 28, 2025 | Revised pictures to show correct FCC and IC ID numbers. |
1.3 | June 12, 2025 | Revised to comply with FCC/ISED documentation requirements. |
Definitions, Acronyms, and Abbreviations
The following list defines the acronyms and abbreviations used in this document:
- ADC: Analog to Digital Converter
- AES: Advanced Encryption Standard
- CTS: Clear to Send
- DAC: Digital to Analog Converter
- DMA: Direct Memory Access
- FEM: Front End Module
- I2C: Inter-Integrated Circuit is a multi-master serial computer bus
- ISM: Industrial Scientific Medical 2.4 GHz radio frequency band
- JTAG: Joint Test Action Group
- LDO: Low Drop Regulator
- LGA: Land Grid Array
- MAC: Media Access Controller
- MCU: Microcontroller Unit
- MEMS: Micro Electro Mechanical Systems
- MMCX: Micro Miniature Coaxial
- NEXUS: An embedded processor development tool interface that helps design engineers identify software and hardware-level issues.
- PA: Power Amplifier
- PCB: Printed circuit board
- SiP: Platform in Package
- PWM: Pulse-width modulation
- RTC: Real Time Clock
- RTS: Request to Send
- SPI: Serial Peripheral Interface
- SSI: Synchronous Serial Interface
- USB: Universal Serial Bus
- VCP: Virtual Com Port
Description and Functional Specifications
General Features
The WIHART2/WISA2 wireless module is based on the Silicon Labs EFR32MG24 chipset, an IEEE 802.15.4 platform. It integrates a low-power 2.4 GHz radio frequency transceiver, operating within the 2400-2483.5 MHz band with +16dBm output power. The module supports industrial wireless applications compliant with ISA100.11a and WirelessHART standards. Its System on Chip (SoC) architecture combines a radio and microcontroller for a cost-effective, compact solution.
- Multi-protocol support for 802.15.4 based ISA100/WirelessHART and Bluetooth Low Energy (BLE).
- Drop-in replacement for Centero's first-generation WIHART/WISA wireless module.
- The CW-24-200 is offered in three models: WISA2 (ISA100 Wireless), WIHART2 (WirelessHART), and Dual-boot (ISA100/WirelessHART).
- Based on Silicon Labs' EFR32MG24 chipset, featuring a 2.4 GHz SoC, 32-bit ARM core MCU, and hardware acceleration for IEEE 802.15.4 MAC and AES security.
- State-of-the-art security with Silicon Labs' Secure Vault™, PSA Level 3 certification.
- On-chip over-the-air (OTA) secure upgrades.
- Market-leading sensitivity of -104 dBm with a maximum link budget of 120 dB (ISA100), 114 dB (WirelessHART), and 113 dB (Bluetooth Low Energy).
- Designed for integration in intrinsically safe (Exi) compliant or certified devices.
- Wireless features: Single-ended output RF port, -105 dBm sensitivity at MMCX port, programmable output power (-5 dBm to +16 dBm), hardware-based dynamic control of external RF elements, external antenna connectivity via MMCX or PCB antennas, and Faraday shield for regulatory compliance.
- Ready for automated assembly in JEDEC compliant trays.
- On-board regulator provides power for external circuitry, reducing product cost and size.
- System clock options support ISA100 and WirelessHART time synchronization requirements.
Form Factor and Markings
The WIHART2/WISA2 module is a surface-mountable, castellated PCB form factor. The user interface exposes serial interfaces, MCU digital/analog I/Os, and power. Firmware development and debugging are supported via the JTAG SWD port.
Figure 1: WIHART2/WISA2 Module Form Factor - A diagram illustrating the physical dimensions and pin layout of the module.
Figure 2: WIHART2/WISA2 Module Markings - Shows the markings on the module, including the hardware part number (CW-24-200), MAC address, FCC and IC IDs, and firmware loaded information (ISA100, WirelessHART, Thread, Dual-boot).
Specifications and Performance Parameters
Electrical Specifications
Parameter | MIN | TYPICAL | MAX | Units | Notes/Conditions |
---|---|---|---|---|---|
Supply Voltage (VCC) | 2.9 V | 3.3 V | 4.2 V | V | Max 6V for 10 seconds |
Supply Voltage Noise | 0 | 0 | 200 | mVPP | 50Hz-15MHz |
Regulated Voltage Output | VCC-200 mV (non-reg if VCC <3.2 V) | 3.00 | 3.02 | V | Supplied to external circuitry via pin V_LDO_OUT (PIN 29). If VCC > 3.2 V, output is 3.0 V. If VCC < 3.2 V, output is VCC-200 mV non-regulated. |
Regulated Voltage Output Noise | 30 | 35 | 40 | mVPP | Supplied to external circuitry via pin V_LDO_OUT (PIN 29) |
LDO Output Max Current | 0 | 0 | 25 | mA | Maximum current supplied by V_LDO_OUT (PIN 29) |
Voltage on any digital I/O | 0 | 3.0 | 3.3 | V | CMOS compatible |
Voltage on any analog I/O | 0 | 3.0 | VREF | V | Internal VREF is 3.0 V |
Idle mode current | 3.0 | 4.5 | 6 | mA | At 25° C |
Transmit Current - 802.15.4 and BLE at 0 dBm | 22 | 23 | 27 | mA | At 25° C |
Transmit Current - 802.15.4 and BLE at 10 dBm | 56 | 59 | 61 | mA | At 25° C |
Transmit Current - 802.15.4 and BLE at 16 dBm | 116 | 119 | 124 | mA | At 25° C |
Receive Current 802.15.4 | 11 | 11.5 | 12 | mA | At 25° C |
Receive Current BLE - 1 MBPS PHY | 7 | 7.5 | 8 | mA | At 25° C |
Receive Current BLE – 2 MBPS PHY | 8 | 8.5 | 9 | mA | At 25° C |
Sleep Current | 1.8 | 2 | 5 | μΑ | At 25° C |
RF Specifications
Parameter | MIN | TYPICAL | MAX | Units | Notes/Conditions |
---|---|---|---|---|---|
802.15.4 Frequency range | 2400 | N/A | 2475 | MHz | <5% PER for 20-byte packets (using +2 dBi antenna isotropic antenna) |
Range (outdoor line-of-sight) | 0.75 miles (1200 meters) | Miles/Meters | <5% PER for 20-byte packets (using +2 dBi antenna isotropic antenna) | ||
Range (indoor/industrial/urban) | 1000 ft (300 m) | Feet/Meters | 5% PER for 20-byte packets (using +2 dBi antenna isotropic antenna) | ||
Number of Frequency Channels | 15 | IEEE 802.15.4 frequency channels. Channel 26 is not used due to FCC regulatory. | |||
Occupied Channel BW | 2.65 MHz | Per IEEE 802.15.4 standard specification. | |||
Channel Separation | 5 MHz | Per IEEE 802.15.4 standard specification. | |||
Modulation | Q-PSK | Per IEEE 802.15.4 standard specification. | |||
Raw Data Rate | 250 kbps | Per IEEE 802.15.4 standard specification. | |||
Frequency Accuracy | -10 | Frequency | +10 | ppm | ±4 ppm at +25 °C |
RF Transmitter | |||||
RF Output Power | -5 | 0 | +16 | dBm | Programmable. Note: When transmitting on channel 26, output power should not exceed -4 dBm to meet FCC Part 15. |
RF Receiver | |||||
RF Sensitivity – 802.15.4 | -103 | -104 | -105 | dBm | <1% PER for 20-byte packets per 802.15.4-2003 standards specification. |
Bluetooth Low Energy - 1 Mbps GFSK | -96 | -97 | -98 | dBm | <1% PER for 20-byte packets per 802.15.4-2003 standards specification. |
Bluetooth Low Energy - 2 Mbps GFSK | -93 | -94 | -94 | dBm | <1% PER for 20-byte packets per 802.15.4-2003 standards specification. |
Antenna Port
Parameter | MIN | TYPICAL | MAX | Units | Notes/Conditions |
---|---|---|---|---|---|
Connector - antenna port | MMCX | ||||
Impedance | 50 | Ω |
Mechanical and Board Specifications
Parameter | MIN | TYP | MAX | Units | Notes/Conditions |
---|---|---|---|---|---|
Size - Module with Shield Mounted | 0.8" x 1" x 0.2" | inches | 20.5 x 25.5 x 5.25 mm | ||
Form Factor | Surface Mount | ||||
Layer build (PCB) width | 1.6 | mm | 1.57mm option 4-Layer board | ||
Dielectric material (PCB) | FR4 | FR4 |
Environmental Specifications
Parameter | MIN | TYP | MAX | Units | Notes/Conditions |
---|---|---|---|---|---|
Operating temperature (see note) | -40 | +25 | +85 | °C | |
Storage temperature | -40 | +25 | +85 | °C | |
Operating Relative Humidity | 10 | 90 | % | Non-condensing humidity |
User Interfaces
- UART Ports: Two (2) for data interface with WirelessHART communication stack.
- SPI Ports: See table detailing WISA2/WIHART2 module pin definition.
- I2C port: One (1) - Need external pull-up resistors. See table detailing WISA2/WIHART2 module pin definition.
- JTAG debug port: One (1) - See table detailing WISA2/WIHART2 module pin definition.
- GPIOS: 5 (dedicated)
- ADC Inputs: 3 inputs - One dedicated ADC input. Two inputs can also be used as GPIOs. Two additional pins provided for connectivity to external voltage reference.
Regulatory Compliance
Compliance Type | Status | Notes |
---|---|---|
EMI/RF Compliance – USA | Certified | FCC Section 15, Part 247 – modular certification – see antenna list |
EMI/RF Compliance – Canada | Certified | IC RSS 210 - modular certification. Canada: IC RSS-247/RSS-GEN – modular certification (see antenna list) |
EMI/RF – EU/UKCA | Certified | CE-Approval –R&TTE Directive. Modular certification see antenna list. Compliant to RED & EMCD 2014/53/EU, 2014/30/EU. EN 300-328 V2.2.2 (includes receiver blocking and intentional spurious emissions). |
RoHS | Compliant | Directive 2015/863 commonly referred to as RoHS 3. |
HAZLOC and Intrinsic Safety | Compliant | Designed to pass intrinsic safety compliance tests. This includes design considerations: Minimizing overall lump capacitance, Minimizing overall lump inductance, Minimizing the passive component energy storage capacity of the WISA2/WIHART2 module in order to prevent sparking. |
Interface and Pinout
User Interface
The user interface is exposed through a standard castellated 1.27 mm pitch PCB pinout.
Figure 3: Interface Locations and Pinout - Diagrams showing the top and side views of the module, indicating pin locations and dimensions.
The interface provides access to selected micro-controller GPIOs and serial interface ports. Power is also provided through this interface.
Figure 4: WIHART2/WISA2 Module - Interface and Pinout - A detailed diagram showing the pinout of the WIHART2/WISA2 module with pin numbers and corresponding signals.
WIHART2/WISA2 Module- Pin Definition and Functionality
No. | Name | Description | Type | Direction | Functionality |
---|---|---|---|---|---|
1 | RF-GND | Ground | Power | NAPP | Ground to be used for RF IO signal. |
2 | RF-IO | RF Signal | RF | I/O | RF port signal routed to an external board when C26 is populated and C22 is not populated. For PCB antennas or external matching circuitry. |
3 | RF-GND | Ground | Power | NAPP | Ground to be used for RF IO signal. |
4 | SPI-CS | SPI Chip Select | DIG | OUT | Standard SPI communication chip select signal. |
5 | SPI-SCK | SPI Clock | DIG | OUT | Standard SPI communication clock signal. |
6 | SPI-SOUT | SPI Data Out | DIG | OUT | Standard SPI communication data out signal (MOSI – Master Output Slave Input). |
7 | SPI-SIN | SPI Data In | DIG | IN | Standard SPI communication data in signal (MISO – Master Input Slave Output). |
8 | GPIO5 | General Purpose I/O | DIG | I/O | General purpose digital I/O. |
9 | I2C-SCL | I2C Clock | DIG | OUT | I2C clock output – pull-up resistors need to be provided externally. |
10 | I2C-SDA | I2C Serial Data Line | DIG | I/O | I2C serial data – pull-up resistors need to be provided externally. |
11 | VCC-IN | Supply Voltage | POWER | NAPP | Supply voltage – provide external 3.3 VDC. |
12 | WKU-RADIO | Wake-up signal for external application processor | DIG | IN | Digital line used by the application processor to wake up WIHART2/WISA2 module from sleep mode. Signal is active high and notifies the module that the application processor intends to communicate. When active, the module will not enter low-power sleep mode. |
13 | RDY-RADIO | Ready signal for external application processor | DIG | OUT | Digital line used by WIHART2/WISA2 module to wake up the external application processor. Connect to external application processor GPIO. |
14 | UARTO-RX | UARTO Receive Data | DIG | IN | UART used for bootloader, wired firmware upgrades, and serial debug interface (when module is running Hardware Test Firmware). |
15 | UARTO-TX | UARTO Transmit Data | DIG | OUT | UART used for bootloader, wired firmware upgrades, and serial debug interface (when module is running Hardware Test Firmware). |
16 | UART1-TX/API | UART1 Transmit Data | DIG | OUT | UART TX signal used for communication with the external application processor. Connect to RX signal of the application processor UART. |
17 | UART1-RX/API | UART1 Receive Data | DIG | IN | UART RX signal used for communication with the external application processor. Connect to TX signal of the application processor UART. |
18 | EXTRTS | UART1 Clear to Send | DIG | IN | UART CTS signal used for communication with external application processor. Connect to RTS (OUTPUT) signal of the application processor UART. |
19 | EXTCTS | UART1 Request to Send | DIG | OUT | UART RTS signal used for communication with external application processor. Connect to CTS (INPUT) signal of the application processor UART. |
20 | WISA STATUS/GPIO2 | General Purpose I/O | DIG | I/O | ISA100 Wireless wakeup/status/provisioning signal, typically connected to a push-button. Holding this signal low for > 30 seconds will cause the WISA module ISA100 stack to erase its provisioning information to the factory default state and unjoin the ISA100 network. No WiHART functionality associated to this pin. |
21 | ADC-BATT | Analog Input for Battery | ANALOG | IN | Analog input used to read battery voltage level. |
22 | GPIO/ADC1 | General Purpose I/O | DIG | I/O | General purpose digital I/O. Alternate functionality: Analog input to ADC. |
23 | GPIO/ADC2 | General Purpose I/O | DIG | I/O | General purpose digital I/O. Alternate functionality: Analog input to ADC. |
24 | GPIO1 | General Purpose I/O | DIG | I/O | General purpose digital I/O. |
25 | VREFH | ADC Voltage Reference | POWER | IN | External high voltage reference for the ADC. Connect to external 3.0 VDC reference. If not connected to an external 3.0 VDC reference, connect to WIHART2/WISA2 pin 29, V-LDO-OUT. |
26 | TAMPER/RTC-WAKEUP | Tamper detect. | DIG | IN | Tamper detect digital line. Alternate functionality: Real-time clock wake-up. |
27 | GND | Ground | POWER | NAPP | Ground. |
28 | VREFL | ADC Voltage Reference | POWER | NAPP | Voltage reference for the ADC. Connect to GND. |
29 | V-LDO-OUT | Power output. | POWER | NAPP | Voltage output of the internal LDO at 3.0 VDC – can be used to power external sensing/control circuitry. Limit current draw on this pin to <25 mA. |
30 | JTAG-TCLK/SWD-CLK | JTAG | DIG | I/O | JTAG clock signal – SWD-CLK. |
31 | JTAG-TDI | JTAG | DIG | I/O | JTAG TDI signal. |
32 | GPIO5/NMI OR BOOT-SWITCH | General Purpose I/O or BOOT-SWITCH | DIG | I/O | BOOT-SWITCH signal read by the bootloader at start-up. The status of this pin dictates the firmware image that will be loaded (HIGH -> ISA100, LOW ->WirelessHART). General purpose digital I/O with non-masking interrupt. |
33 | JTAG-TDO/TRACE-SWO | JTAG | DIG | I/O | JTAG SWO signal. Traditional serial JTAG Trace signal. |
34 | JTAG-TMS/SWD-DIO | JTAG | DIG | I/O | Serial JTAG SWD-DIO signal. JTAG TMS signal. |
35 | GPIO3/CLK-OUT | General Purpose I/O | DIG | I/O | General purpose digital I/O. |
36 | GPIO4 | General Purpose I/O | DIG | I/O | General purpose digital I/O. |
37 | nReset | Reset | DIG | IN | Reset signal of the KW21 chipset. |
38 | GND | Ground | POWER | NAPP | Ground. |
Reference Design Schematics
WISA2 Reference Design Schematic
Figure: Shows the schematic for a reference hardware integration of the WISA2 (ISA100 Wireless) module.
WiHART2 Reference Design Schematic
Figure: Shows the schematic for a reference hardware integration of the WiHART2 (WirelessHART) module.
Dual-Boot WISA2 – WiHART2 Reference Design Schematic
Figure: Shows the schematic for a reference hardware integration of the Dual-Boot ISA100 Wireless (WISA2) and WirelessHART (WiHART2) module.
ISA100/WirelessHART™ Communication Stack - External Application Processor Interface
NOTE: For additional information on the external application processor interface (pins, timing, sequence), consult the API Integration document.
The WIHART2/WISA2 wireless module communicates with external application processors via a serial UART interface. The figure below depicts the minimal recommended connectivity between the WIHART2/WISA2 wireless module and an external application processor, including flow control signals for reliable UART serial connection.
Most WirelessHART and ISA100 Wireless compliant field instruments spend most of their time in deep sleep mode to conserve battery power. The interface includes wake-up signals to allow entities to wake each other during sleep mode.
Figure 5: Connectivity for UART Communication between WIHART2/WISA2 Module and External Application Processor - A block diagram illustrating the UART communication interface between the module and an external processor, showing pin mappings.
Antenna List
The WIHART2/WISA2 wireless module (hardware part number CW-24-200) has obtained wireless modular certifications and can be used with the following antennas:
Antenna | Description - Type | Manufacturer | Model | Gain |
---|---|---|---|---|
1 | Direct mount, 2 dBi, omni-directional whip antenna, SMA male connector. | Nearson | S181AH-2450S | 2.0 dBi |
2 | Remote mount, 4 dBi, omni-directional antenna for ATEX Zone 1 and 2 area classifications, SMA-male connector, with L-mount bracket for wall or pipe installations. | Comrod/Mimes | UHF2458G | 4 dBi |
3 | Remote mount, 8 dBi, omni-directional antenna for, N-male connector, with L-mount bracket for wall or pipe installations. | Data Alliance | A208Nm-MTL16N | 8 dBi |
Trace Antennas: The CW-24-200 modular transmitter and device is not designed to be used with trace antennas.
RF Exposure: This equipment complies with FCC Radiation Exposure limits and should be installed and operated with a minimum distance of 20 cm between the radiator and any part of the human body. The host product manufacturer must provide RF Exposure information to end users.
Wireless Compliance - Canada
Labelling: Host integrators must place a label showing “Contains IC: 23069-CW24200” on the host device.
IC RSS Compliance: The CW-24-200 complies with IC RSS rules RSS-247 for DTSs, FHSS, and LE-LAN Devices. Operation is subject to two conditions: (1) no harmful interference, and (2) acceptance of any received interference.
Note 1: The CW-24-200 is authorized for RSS-247 rules. Host product manufacturer requires Part 15 Subpart B compliance testing.
Additional Testing: Contact Centero for information on enabling “Hardware Test Firmware” and RF test modes.
Note 2: Limited modular procedures are not applicable.
Warning: Changes or modifications not approved by the responsible party void the user's authority to operate the product.
French Compliance Statement: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Antenna Approval: This radio transmitter has been approved by Industry Canada to operate with the antenna types listed below with maximum permissible gain and required antenna impedance. Antenna types not included, or with gain greater than the maximum indicated, are prohibited.
French Antenna Approval: Le présent émetteur radio, IC: 23069-CW24200 a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
RF Exposure (Canada): Cet équipement est conforme aux limites d'exposition aux radiations ICES définies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé à une distance minimale de 20 cm entre le radiateur et une partie de votre corps. L'émetteur modulaire CW-24-200 ne peut être utilisé dans un hôte que dans les conditions pour lesquelles il a été autorisé. Le fabricant du produit hôte est tenu de fournir les informations sur l'exposition aux RF aux utilisateurs finaux dans leurs manuels de produits finaux. Toute utilisation autre que celles autorisées, par exemple dans un appareil mobile ou portable, ou avec un autre émetteur fonctionnant simultanément, nécessite une évaluation, des tests supplémentaires ou une modification de l'autorisation de classe 2.
RoHS Compliance
This equipment is manufactured in compliance with the European Union RoHS (Restriction on Use of Hazardous Substance in Electronic Equipment) directives:
- 2002/95/EU - commonly referred to as RoHS
- Revision 2011/65/EU - commonly referred to as RoHS 2
- Revision 2015/863 - commonly referred to as RoHS 3
Detailed Mechanical Specifications
Mechanical Drawings
NOTE: For additional, more detailed information, please consult the WISA2/WIHART2 Hardware Engineering Package. The WISA2/WIHART2 Hardware Engineering includes schematic symbols, footprints, and mechanical drawings.
Figure 6: WIHART2/WISA2 Module Installation Outline Drawing - A detailed mechanical drawing of the module, showing dimensions, pin locations, and mounting details.
Recommended PCB Footprint Specifications
NOTE: For additional, more detailed information, please consult the WISA2/WIHART2 Hardware Engineering Package. The WISA2/WIHART2 Hardware Engineering includes schematic symbols, footprints, and mechanical drawings.
Figure 7: WIHART2/WISA2 Module Recommended Footprint - A diagram showing the recommended PCB footprint for the module, including component keepout areas and via tenting recommendations.
Manufacturing Information
The WIHART2/WISA2 wireless module is designed for surface-mount on OEM PCBs with castellated pads for easy soldering and inspection.
Moisture Proofing
The WIHART2/WISA2 wireless module has a Moisture Sensitivity Level (MSL) of 3. Refer to IPC/JEDEC J-STD-020 and JEDEC J-STD-033A for additional handling instructions.
Packaging information for baking | Yes |
---|---|
Baking Temperature | 100° - 125° C |
Baking Humidity | Ambient |
Minimum/Maximum Baking Duration | 4 – 24 hours |
Number of Times for Baking | 2 Max |
Moisture Proofing condition remarks | Re-seal in original packaging |
Recommended Solder Cycle and Instructions
The following table lists the recommended solder reflow cycle and temperature settings:
Time (seconds) | Temperature (°C) |
---|---|
30 | 65 |
60 | 100 |
90 | 135 |
120 | 160 |
150 | 195 |
180 | 240 |
210 | 260 |
Additional recommended soldering instructions:
- Ability/Inability for flow soldering: Yes
- Flow soldering temperature: 500 to 510 degrees F
- Flow soldering time: 3 to 7 seconds dwell in solder
- Capable number of re-flow soldering: 2
- Re-flow soldering peak temperature: 260 degrees C
- Re-flow soldering time: 5 to 15 seconds at maximum temperature
- Manual Soldering possible/not possible: Yes
- Manual soldering temperature: 600 to 750 degrees F tip temperature
- Manual soldering time: 3 to 10 seconds
- Lead-free soldering (Sn-3Ag-0.5Cu) possible/not possible: Yes
- Eutectic lead soldering (Sn-Pb) possible/ not possible: Yes
- Plated or ball composition of outmost external layer: ENIG
- Soldering Condition Remarks: Soldering time and temperatures based on thermal mass.
Flux and Cleaning Instructions
Centero recommends using a “no clean” solder paste to eliminate the cleaning step and prevent residual flux under the device.
Caution: Cleaning can result in residual liquid under the device, potentially causing shorting between pads. Residual moisture and flux are not easily seen during inspection.
Type of Cleaner | Kyzen 4241 aqueous chemistry |
---|---|
Ability of ultrasonic cleaning | No |
Ability of nozzle type cleaning | Yes, Aqueous Tech Batch Cleaner |
Cleaning Temperature | 150 degrees F |
Cleaning Time | 20 minutes |
Cleaning Condition Remarks | Removes flux residue, light oils and dirt |
Rework Instructions
CAUTION! Any modifications to the wireless module void the warranty coverage and certifications.
Rework on the module itself should not be performed. However, for guidance on maximizing rework success, the following information is provided. The wireless module may be removed using a hot air rework station or hot plate. Care should be taken not to overheat the module, as this could dislodge internal components.