LG JLR EBA31 Wireless CSC and WGM
Product Usage Instructions
CSC Usage
- Ensure the operating temperature is within -40°C to +85°C.
- Connect the CSC to a HV Battery within the power range of 12.5V to 49.5V.
- Place the CSC inside the Vehicle Battery Pack as per the specified location.
WGM Usage
- Operate the WGM within the temperature range of -40°C to +85°C.
- Connect the WGM to a LV INPUT power supply of 5V+/-0.125.
- Insert the WGM into the opening provided on the battery lid.
Introduction
- The CSC and its WGM are an integral part of the JLR scalable Battery Management System (BMS), which enables rapid and efficient re-application of proven High Voltage (HV) systems to support our future electrification strategy.
- The CSC measures voltage across every series-connected cell and measures temperature at different locations within the cell stack. The CSC is also responsible to perform charge balancing to maximize the battery’s energy storage and mitigate the effects of cell self-discharge.
- All CSC’s communicate with the WGM using a dedicated wireless network.
- The WGM in turn communicates with the BMCM via 2 (two) twisted-pair isolated SPI channels.
- The CSC has an on-board temperature sensor to monitor CSC temperatures generated by balancing resistor heat dissipation.
- Temperature and voltage measurements are taken by the CSC and measures are taken across every bank of parallel cells and temperature sensors.
- Voltage sense wires are also used for the balancing currents.
Specification
CSC Operating Environment
| Entry | Customer Requirements (Specifications) | Design Specification | Remarks (measurement conditions, expected problems, implementation plans, etc.) |
| 1)Operating temperature range | -40 ~ +85℃ Ambient | -40 ~ +105℃ Ambient | AEC – Q Component Usage, Accelerated Test Confirmation |
| 2) Storage temperature range | -40 ~ +85℃ | -40 ~ +105℃ Ambient | AEC – Q Component Usage |
| 3)Standard use | -40 ~ +85℃ | -40 ~ +105℃ Ambient | AEC – Q Component Usage |
| 7)Use power range | HV Battery : 12.5V ~ 49.5V | HV Battery : 11V ~ 80V | |
| 8)Maximum applied power supply | HV Battery : 0~ 66V | HV Battery : 0V ~ 85V | |
| 9)Other Terms of Use | 2 BMIC with dedicated connection Wireless communication | Isolated 2 Bank Circuits
RF module with PCB antenna |
Securing the separation distance between banks in the PCB (5mm at minimum)
RF Battery Simulation for MLA, EMA, JEA Pack |
| 10)Product lifespan | 10 years (87600 hours) | 10 years (87600 hours) | AEC_Q Verification through component use and reliability testing (long term) |
| 11) Location / Place of use | Inside the Vehicle Battery Pack | Inside the Vehicle Battery Pack | Customer Requirement: IP30 |
WGM Operating Environment
| Entry | Customer Requirements (Specifications) | Design Specification | Remarks (measurement conditions, expected problems,
implementation plans, etc.) |
| 1)Operating temperature range | -40 ~ +85℃ Ambient | -40 ~ +105℃ Ambient | AEC – Q Component Usage, Accelerated Test Confirmation |
| 2) Storage temperature range | -40 ~ +85℃ | -40 ~ +105℃ Ambient | AEC – Q Component Usage |
| 3)Standard use | -40 ~ +85℃ | -40 ~ +105℃ Ambient | AEC – Q Component Usage |
| 7)Use power range | LV INPUT : 5V+/-0.125 | LV INPUT : 5V+/-0.125 | |
| 8)Maximum applied
power supply |
LV INPUT : 5V+/-0.125 | HV Battery : 4.21 ~ 8V | |
| 9)Other Terms of Use | Dual Manager
Wireless communication |
2 X RF module application RF module with PCB antenna | RF Battery Simulation for MLA, EMA, JEA Pack |
| 10)Product lifespan | 10 years (87600 hours) | 10 years (87600 hours) | AEC_Q Verification through component use and reliability testing (long term) |
| 11) Location / Place of use | Inserted into an opening provided on the battery lid | Inserted into an opening provided on the battery lid | Customer Requirement: IP30 and IP69K support |
SPECIFICATIONS FOR APPROVAL
- PRODUCT NAME : Slave RF Communication Module for wBMS
- MODEL NAME : APBR000L02.KM00
- CUSTOMER P/N : 8MDW00004A
- FIRMWARE Ver. :
- TITLE : Specifications for approval (Doc No.)
- REV 0.2 ( 2 / 32 )
- ( CUSTOMER P/NO: 8MDW00004A )
Change History of Revision
Revision Date Contents of Revision Change Remark
- 2023.08.23 Establishment
- 2024.04.24Updated Packing Label
REV
- 2023.08.23 Revision 0.1 released LG Innotek Co., Ltd
- 2024.04.24 Revision 0.2 released DSGD CHKD APPD Doc No. DOCUMENT NO. Doc No.
TITLE : Specifications for approval (Doc No.)
REV 0.2 ( 3 / 32 )
( CUSTOMER P/NO: 8MDW00004A )
Change History of Firmware version
- Firmware version Date Remark
- Version check 2023.08.23 Update Firmware Version
Application
This specification is applied to Wireless communication between the Battery cell monitoring Module and the Battery management system controller
Quality
Quality should meet each condition which mentioned on this specification. However, the items which are not mentioned on this specification follow the inspection agreements and standards which are agree with both companies.
Appearance and Characteristics
- Appearance
Appearance should not contaminated by harmful materials and should not have cracks etc. Mechanical dimensions should meet the contents of clause 8. - Characteristics
Electrical characteristics should meet the contents of clause 10.
Application of Bluetooth Low Power module
Wireless battery management systems
Maximum Rating
| TITLE : Specifications for approval (Doc No.) | REV 0.2 ( 6 / 32 ) | ||||||||||||||||||
| ( CUSTOMER P/NO: 8MDW00004A ) | |||||||||||||||||||
Mechanical Dimension1) Module Dimension <Top Through View> |
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| Mark | Dimension | Mark | Dimension | Mark | Dimension | Mark | Dimension | Mark | Dimension | ||||||||||
| a1 | 0.60±0.05 | a2 | 1.20±0.1 | a3 | 1.20±0.1 | b1 | 3.25±0.1 | b2 | 0.20±0.05 | ||||||||||
| C1 | 2.20±0.1 | c2 | 6.22±0.1 | L1 | 15.5 – 0.15/+0.3 | L2 | 14.7±0.1 | W | 23.9 – 0.15/+0.3 | ||||||||||
| W1 | 19.2±0.1 | W2 | 4.30±0.1 | T1 | 2.10±0.1 | T2 | 1.0±0.1 | ||||||||||||
| Unit : mm | |||||||||||||||||||
| Module package is LGA (Land Grid Array) type .
Notice) If the module attached to the set board is flipped during the reflow process, shield case of the module may detach or fall apart. Notice) Bur on the router bride surface is allowed up to -0.15(Without copper foil)+0.6 |
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|
R E V |
0.1 | 2023.08.23 | Revision 0.1 released | LG Innotek Co., Ltd | |||||||||||||||
| 0.2 | 2024.04.24 | Revision 0.2 released | DSGD | CHKD | APPD | Doc No. | |||||||||||||
| DOCUMENT NO.
Doc No. |
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Recommended Land Pattern -.Top View
- The larger copper cut area is better.
- Stencil: 90% of PCB LAND
Recommended module position
Must has no copper at red-dashed circle area for all layers.
<Key design guide>
- Distance of module edge is minimum 6mm * from ground area in main board.
- Must has no copper plate around antenna position for all layers.
- Do not routing any of power and clock signal under Module digital path
* The minimum distance may vary depending on the set environmental conditions. The larger open area is better.
General Features
RF Module for wBMS
- ADRF Chipet Features
- Low Power 2.4GHz radio
- RF frequency range : 2400MHz to 2483.5 MHz ISM band
- 1Mbps data rate options
- Transmit output power : +8dBm
- On-chip temperature sensor
- On-chip LDO power
- Integrated RF match
- Integrated transmit and receive switch
- Microcontroller with a memory protection unit (MPU)
- Secure JTAG port supporting code download
- Security
- Hardware root of trust
- Secure boot
- Secure update with roll-back protection
- Hardware accelerator supporting AES-128, AES-256, ECC-256, and SHA-256
- True random number generator (TRNG)
- Memory
- SRAM with SECDED ECC
- Flash with SECDED ECC
- ROM with SECDED ECC
- Anti-fuse OTP
- SPI x 2
- GPIO ports
- UART x 2
- On-chip POR
| TITLE : Specifications for approval (Doc No.) | REV 0.2 ( 10 / 32 ) | ||||||||||||
| ( CUSTOMER P/NO: 8MDW00004A ) | |||||||||||||
Pin Configuration
|
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| No. | Pin Name | I/O | Description | ||||||||||
| 1 | GND | Ground | |||||||||||
| 2 | SPI2_MISO | I | SPI2_MISO for BMIC | ||||||||||
| 3 | SPI2_SCK | I | SPI2_SCK for BMIC | ||||||||||
| 4 | SPI2_CS | I | SPI2_CS for BMIC | ||||||||||
| 5 | SPI2_MOSI | O | SPI2_MOSI for BMIC | ||||||||||
| 6 | GND | GND | |||||||||||
| 7 | SPI1_MISO | I | SPI1_MISO for Master MCU | ||||||||||
| 8 | SPI1_SCK | I | SPI1_SCK for Master MCU | ||||||||||
| 9 | SPI1_CS | I | SPI1_CS for Master MCU | ||||||||||
| 10 | SPI1_MOSI | O | SPI1_MOSI for Master MCU | ||||||||||
| 11 | GND | Ground | |||||||||||
| 12 | SPI0_MOSI | O | Serial DATA OUT | ||||||||||
| 13 | SPI0_MISO | I | Serial DATA IN | ||||||||||
| 14 | GND | GND | |||||||||||
| 15 | SPI0_SCK | I | Pull-up during Reset to enter Secure debug area | ||||||||||
| 16 | SPI0_CS | I | Chip Select | ||||||||||
| 17 | GND | GND | |||||||||||
| 18 | UART1_RX | I/O | UART Rx Interface to Manufacturing Test Firmware | ||||||||||
| 19 | UART1_TX | I/O | UART Tx Interface to Manufacturing Test Firmware | ||||||||||
| 20 | GPIO9 | I/O | Gneneral-Purpose Input and Output | ||||||||||
|
R E V |
0.1 | 2023.08.23 | Revision 0.1 released | LG Innotek Co., Ltd | |||||||||
| 0.2 | 2024.04.24 | Revision 0.2 released | DSGD | CHKD | APPD | Doc No. | |||||||
| DOCUMENT NO.
Doc No. |
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| TITLE : Specifications for approval (Doc No.) | REV 0.2 ( 11 / 32 ) | ||||||||||||
| ( CUSTOMER P/NO: 8MDW00004A ) | |||||||||||||
| Pin Configuration | |||||||||||||
| No. | Pin Name | I/O | Description | ||||||||||
| 21 | ADC1_IO | I | Analog Input | ||||||||||
| 22 | ADC2_IO | I | Analog Input | ||||||||||
| 23 | GND | Ground | |||||||||||
| 24 | VDD | I | 3.3 Supply input | ||||||||||
| 25 | VDD | I | 3.3 Supply input | ||||||||||
| 26 | GND | GND | |||||||||||
| 27 | /RESET | I | Hardware Reset | ||||||||||
| 28 | JTAG_TDI | I | JTAG Data In. | ||||||||||
| 29 | JTAG_TCK | I | JTAG Clock | ||||||||||
| 30 | JTAG_TMS | I/O | JTAG Mode Selection | ||||||||||
| 31 | JTAG_TDO | O | JTAG Trace Data Output | ||||||||||
| 32 | GPIO0 | I/O | General-Purpose Input and Output | ||||||||||
| 33 | UART0_TX | I/O | Wired Manager to Manager Interface | ||||||||||
| 34 | UART0_RX | I/O | Wired Manager to Manager Interface | ||||||||||
| 35 | GPIO1 | I/O | General-Purpose Input and Output | ||||||||||
| 36 | GND | GND | |||||||||||
| 37 | GND | GND | |||||||||||
| 38 | GND | GND | |||||||||||
| 39 | GND | GND | |||||||||||
| 40 | GND | GND | |||||||||||
|
R E V |
0.1 | 2023.08.23 | Revision 0.1 released | LG Innotek Co., Ltd | |||||||||
| 0.2 | 2024.04.24 | Revision 0.2 released | DSGD | CHKD | APPD | Doc No. | |||||||
| DOCUMENT NO.
Doc No. |
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Block Diagram
Reference Circuit (Slave)
FCC/IC Compliance Statement
This device complies with Part 15 of the FCC Rules and Industry Canada license-exempt RSS standard(s) .
Operation is subject to the following two conditions:
- This device may not cause harmful interference, and
- This device must accept any interference received, including interference that may cause undesired operation.
CAUTION : Any Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
A minimum separation distance of 20 cm must be maintained between the antenna and the person for this appliance to satisfy the RF exposure requirements.
FAQ
- Q: What should I do if the product is exposed to temperatures outside the specified range?
- A: To ensure proper functioning, avoid using the product outside the recommended temperature range.
- Q: Can I connect the product to a power supply outside the specified limits?
- A: It is recommended to only connect the product to power supplies within the specified ranges to prevent damage.
- Q: How do I clean the product?
- A: Use a soft, dry cloth to clean the product. Avoid using any liquid cleaners or solvents.
Documents / Resources
 |
LG JLR EBA31 Wireless CSC and WGM [pdf] Instructions JLR EBA31, JLR EBA31 Wireless CSC and WGM, Wireless CSC and WGM, CSC and WGM |
