IMCP HTSXMO32L-22 SIP MODULE
Evaluation Board V2.0 Manual and
Hardware Integration Guide
DOCUMENT INFO
This document provides the hardware integration guidelines for devices based on iMCP HTSXMO32L-22 SiP Module and technical information about the EVB-SXF-02, its Evaluation Board. This is a reference for the customers of HT Micron Semicondutores, especially device manufacturers and hardware engineers.
HT32SX – DEVICE OVERVIEW
The iMCP HTSXMO32L-22 SiP Module is a Multicomponent Integrated Circuit (MCO) designed to provide a general ready-to-use connectivity solution for Internet of Things (IoT) applications. Its small dimensions, high performance and low power consumption targets the best experience for IoT developers. Detailed information about this device can be found on its datasheet.
1.1. EVALUATION BOARD KEY FEATURES
- Frequency bands:
- 413-479 MHz
- 452-527 MHz
- 826-958 MHz
- 904-1055 MHz
- Modulation schemes:
- DBPSK, 2(G)FSK, OOK, ASK
- 64kB of flash memory
- 8kB of RAM
- 32.768kHz external crystal for RTC applications
- Voltage regulator ranging from 2.7 to 6V
- USB to Serial converter
- External LiPoly Battery connector
- Compatibility with Adafruit Feather Wings
- SWD interface
- MCU bootloader
- 20 GPIOs
- 12-bit ADC
- 12-bit 1 channel DAC
- 2 USART, LPUART, USB 2.0, I2C
1.2. OPERATIONAL DESCRIPTION
The HT32SX’s evaluation board contains a voltage regulator with a voltage range of 2.7 to 6V, ensuring stable power supply to the system, it features a built-in USB to Serial converter, enabling easy communication with external devices and computers terminals. A LiPoly Battery Connector allow portable and wireless operation.
Regarding to the radio, HTSXMO32L integrates an ultra-low power RF transceiver, intended for RF wireless applications in the sub-1 GHz band. It supports different modulation schemes, but due to the MCO main target application (Sigfox Network), only DBPSK (for TX) and GFSK (for RX) schemes are enabled in the provided software.
1.3. SUPPORTED FCC RULES
The iMCP HTSXMO32L-22 SiP Module has been certified to comply with the following FCC rules, when operating according to Sigfox RC2 requirements:
- 47 CFR Part 15.247
- 47 CFR Part 15B
- 47 CFR part 2.1091
These certifications can be applied to the host device if the device manufacturer implements the integration and test instructions of this document into the host device, except for FCC Part 15 Subpart B which needs to be retested. The host manufacturer can use iMCP HTSXMO32L-22 SiP Module FCC ID if the device meets the conditions of the FCC certificate. Commonly required conditions can be:
- A minimum of 20 cm distance from the human body.
- No collocation with other transmitters (this condition generally needs to be reviewed by an FCC lab).
- Antenna gain below the requirements.
It is mandatory for the host device manufacturer to assure the final device’s compliance with FCC Part 15 Subpart B, even if certification has been granted to iMCP HTSXMO32L-22 SiP Module. The host device manufacturer is also responsible for compliance with any other FCC rules that apply to the host device not covered by the iMCP HTSXMO32L-22 SiP Module grant of certification.
1.4. BLOCK DIAGRAM
The following block diagram illustrates the iMCP HTSXMO32L-22 SiP Module. It features an ARM Cortex M0+ 32bit (STM32L052x8) and the S2-LP low-power transceiver from ST Microelectronics combined with the SKY66420 from Skyworks Solutions which provide all the performance advantages, integration, and convenience of advanced semiconductor packaging technology into a single chip.
EVALUATION BOARD
The EVB-SXF-02 Evaluation Board was designed to be a development platform, facilitating new users first contact and providing to advanced users limitless possibilities of developing your own products. All the iMCP HTSXMO32L-22 SiP features are available on the evaluation board. Two supply options can be used: a USB connection or an external battery. The evaluation board will automatically switch to USB power when it is available.
The external battery makes the evaluation board portable, so it becomes easy to test the Sigfox connectivity anywhere you go.
2.1. PIN ASSIGNMENT 
| Connector | Number | Name | Alt. Functions | Type | Description |
| CN1 | – | Antenna | – | RF I/O | RF input and output signal |
| CN2 | – | Micro USB | – | – | USB connection for power and communication |
| CN3 | – | Battery | – | Power | Input power from external battery |
| CN4 | 1 | VBAT | – | Power | Battery output power |
| 2 | ENABLE | – | Input | Voltage regulator Enable | |
| 3 | VUSB | – | Power | Output power from USB Bus | |
| 4 | PB10 | LPUART1_TX | Digital I/O | USART interface | |
| TIM2_CH3 | Digital I/O | General-purpose timer | |||
| 5 | PA5 | ADC_IN5 | Analog I | ADC external input 5 | |
| TIM2_CH1 | Digital I/O | General-purpose timer | |||
| TIM2_ETR | Digital I/O | General-purpose timer | |||
| COMP1_INM5 | Analog I | Comparator input | |||
| 6 | PA8 | USART1_CK | Digital I/O | USART interface | |
| USB_CSR_SYNC | Digital I/O | USB | |||
| EVENT_OUT | Digital I/O | ||||
| 7 | PB5 | I2C1_SMBA | Digital I/O | I2C interface | |
| LPTIM1_IN1 | Digital I/O | Low-power timer | |||
| TIM22_CH2 | Digital I/O | General-purpose timer | |||
| 8 | PB0 | ADC_IN0 | Analog I | ADC external input 0 | |
| VREF_OUT | Analog I/O | Output reference voltage | |||
| 9 | PB11 | LPUART1_RX | Digital I/O | Low-power USART interface | |
| TIM2_CH4 | Digital I/O | General-purpose timer | |||
| EVENTOUT | Digital I/O | ||||
| 10 | PA11 | USART1_CTS | Digital I/O | USART interface | |
| USB_DM | Digital I/O | USB | |||
| COMP1_OUT | Analog O | Comparator output | |||
| EVENT_OUT | Digital I/O | ||||
| 11 | PB6 | I2C1_SCL | Digital I/O | I2C interface | |
| USART1_TX | Digital I/O | USART interface | |||
| LPTIM1_ETR | Digital I/O | Low-power timer | |||
| 12 | PB7 | I2C1_SDA | Digital I/O | I2C interface | |
| USART1_RX | Digital I/O | USART interface | |||
| LPTIM1_IN2 | Digital I/O | Low-power timer | |||
| CN5 | 1 | NRESET | – | I/O | Bidirectional reset pin with embedded weak pull-up resistor |
| 2 | 3V3 | – | Power | – | |
| 3 | NC | – | – | – | |
| 4 | GND | – | Ground | – | |
| 5 | PA4 | DAC_OUT | Analog O | DAC analog output | |
| ADC_IN4 | Analog I | ADC external input 4 | |||
| USART2_CK | Digital I/O | USART interface |
| TIM22_ETR | Digital I/O | General-purpose timer | |||
| COMP1_INM4 | Analog I | Comparator input | |||
| 6 | PA3 | ADC_IN3 | Analog I | ADC external input 3 | |
| USART2_RX | Digital I/O | USART interface | |||
| TIM2_CH4 | Digital I/O | General-purpose timer | |||
| TIM21_CH2 | Digital I/O | General-purpose timer | |||
| 7 | PA1 | ADC_IN1 | Analog I | ADC external input 1 | |
| USART2_RTS_DE | Digital I/O | USART interface | |||
| COMP1_INP | Analog I | Comparator input | |||
| TIM21_ETR | Digital I/O | General-purpose timer | |||
| EVENT_OUT | Digital I/O | ||||
| 8 | PA6 | ADC_IN6 | Analog I | ADC external input 6 | |
| LPUART1_CTS | Digital I/O | USART interface | |||
| TIM22_CH1 | Digital I/O | General-purpose timer | |||
| COMP1_OUT | Analog O | Comparator output | |||
| EVENT_OUT | Digital I/O | ||||
| 9 | PA2 | ADC_IN2 | Analog I | ADC external input 2 | |
| USART2_TX | Digital I/O | USART interface | |||
| TIM21_CH1 | Digital I/O | General-purpose timer | |||
| TIM2_CH3 | Digital I/O | General-purpose timer | |||
| 10 | PA0 | ADC_IN0 | Analog I | ADC external input 0 | |
| WKUP1 | Digital I | MCU external wakeup input | |||
| USART2_CTS | Digital I/O | USART interface | |||
| TIM2_CH1 | Digital I/O | General-purpose timer | |||
| 11 | PA14 | SWCLK | Digital O | Serial wire clock output | |
| USART2_TX | Digital I/O | USART interface | |||
| 12 | PA13 | SWDIO | Digital I/O | Serial wire | |
| USB_NOE | Digital I/O | USB | |||
| 13 | PA12 | USART1_RTS_DE | Digital I/O | USART interface | |
| USB_DP | Digital I/O | USB | |||
| EVENT_OUT | Digital I/O | ||||
| 14 | PA9 | USART1_TX | Digital I/O | Serial wire | |
| 15 | PA10 | USART1_RX | Digital I/O | Serial wire | |
| 16 | BOOT0 | – | Digital I | Boot selection |
2.3. POWER PINS
Table 2: Power pins description.
| Pins | Description |
| VBAT | Positive voltage is available from external battery or an external power supply can be used |
| VUSB | Positive 5V from USB is available when the USB cable is connected |
| EN | This pin is pulled up to enable voltage regulator. If connected to the ground the voltage regulator is turned off |
| CN3 | JST-PH connector for external Lipoly battery |
| 3V3 | Output voltage from voltage regulator. A peak of 500mA can be supplied |
| GND | Common ground for the board and components. |
| Pins | Description |
| VBAT | Positive voltage is available from external battery or an external power supply can be used |
| VUSB | Positive 5V from USB is available when the USB cable is connected |
| EN | This pin is pulled up to enable voltage regulator. If connected to the ground the voltage regulator is turned off |
| CN3 | JST-PH connector for external Lipoly battery |
| 3V3 | Output voltage from voltage regulator. A peak of 500mA can be supplied |
| GND | Common ground for the board and components. |
2.4. OTHER PINS
| Pins | Description |
| I2C | Serial interface. Alternative functions are also available on these pins. These pins can also be used as GPIO |
| SWD | Serial Wire Debug interface to programming and debug the iMCP HTSXMO32L-22 SiP Module. These pins can also be used as GPIO |
| TX/RX | These pins can be used to communicate with iMCP HTSXMO32L-22 SiP Module through Serial 1. Alternative functions are also available on these pins. These pins can also be used as GPIO |
| Boot0 | This pin is pulled down. When connected to VDD during iMCP HTSXMO32L-22 SiP Module powering up allow access to programming its flash memory through the serial interface. |
2.5. STATIC CHARACTERISTICS – GENERAL OPERATING RANGE
Table 4: General operating conditions.
| Parameter | Conditions | Min | Typ. | Max | Unit |
| Supply Voltage | – | 2.7 | 3.3 | 6.0 | V |
| Supply Current | – | – | – | 500 | mA |
| Operating Temperature | – | -20 | – | 70 | °C |
| External XTAL Frequency | – | – | – | 32.768 | kHz |
Remark: the voltage regulator can handle an input ranging from 1.5 to 6.0V. However, the iMCP HTSXMO32L22 SiP Module operation voltages range is from 2.7 to 3.6V. The evaluation board is provided with a resistor pair that sets the voltage regulator output to 3.3V, therefore, consider the supply voltage informed above to get a proper operation from the iMCP HTSXMO32L-22.
2.6. POWER CONSUMPTION
Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to 25 °C temperature, output regulator voltage 3.3 V.
Table 5: Power Consumption.
| Parameter | Conditions | Min | Typ. | Max | Unit |
| Supply current | JP2 Open (iMCP HTSXMO32L-22 SiP Module turned off) | – | 1.4 | – | mA |
The iMCP HTSXMO32L-22 SiP Module current consumption depends on the operation mode, to get complete information about it, please refer to datasheet.
2.7. EXTERNAL CLOCK RESONATOR
The external clock resonator can be of high speed (1-25MHz) or low speed (32.768kHz), which can be connected to pins 25 and 26 of the iMCP HTSXMO32L-22 SiP Module. On the Evaluation Board, it is provided a 32.768kHz clock resonator, which can be changed by a high speed one, according to the application necessity. The connection diagram is shown below. For CL10 and CL11, it is recommended to use high-quality ceramic capacitors in the 5pF to 25 pF range (typ.), designed for high-frequency applications, and selected to match the requirements of the crystal or resonator. CL1 and CL2 include PCB and the MCU pin capacitances.
2.8. BOARD SCHEMATICS
Is highly recommended to use the iMCP HTSXMO32L-22 SiP Module’s evaluation board schematic diagram as a reference circuitry when designing PCBs. The PCB layout, list of materials and all the documentation are provided at HT Micron’s git hub page. In this context this reference circuitry (i.e. EVB-SXF-02) is applicable for the iMCP HTSXMO32L-22 SiP Module granted the FCC certifications . The given reference circuity is a valid generic example of an iMCP HTSXMO32L-22 based final device but does not limit it uses in any way.
2.9. JUMPERS
Table 6: Jumpers’ identification.
| Jumper | Identification | Description |
| JP1 | USB/Serial Converter Reset | This jumper provides the reset function for the USB to Serial converter when short-circuited. |
| JP2 | iMCP HTSXMO32L- 22 SiP Module Supply / Current Measurement | This jumper provides the supply to the iMCP HTSXMO32L-22 SiP Module and can be used to open the circuit and measure the current consumption drained only by it in different operation conditions. |
| JP3 | User LED | This jumper allows the disconnection of User LED from PA5 to avoid disturbances when using this Pin as GPIO for other purposes. |
| JP4 | User Button | This jumper allows the disconnection of User Button from PA6 to avoid disturbances when using this Pin as GPIO for other purposes. |
2.10. PCB LAYOUT
The PCB layout shown in Figure 6 are part of the iMCP HTSXMO32L-22 SiP Module Evaluation Board (EVBSXF-02) reference layout, it shows the details of the area where the antenna connector is located.
2.11. PCB SPECIFICATION
The Evaluation Board EVB-SXF-02 PCB stack-up and layer materials are shown in Figure 7. The reference PCB material is a two-layer FR4, 1.5mm core thickness and 1 Oz copper.
2.12. ANTENNA TYPE
The external hinged antenna used in EVB-SXF-02 is Ethertronics X9000984-4GDSMB, as shown in the Figure 8.
For further details on the antenna, see the antenna supplier datasheet. 
2.13. ANTENNA CHARACTERISTICS
The Ethertronics X9000984-4GDSMB antenna has 196 mm height and 6 mm diameter, a peak gain of 2.2dBi andan efficiency greater than 40% over the 790-960MHz frequency band. The radiation pattern plots can be foundat the antenna datasheet.
RF CIRCUITS AND ANTENNA
The iMCP HTSXMO32L-22 SiP Module support all the Sigfox radio configurations frequency bands. It has beencertified only with the antenna solution presented in previous section. It is possible to use other antennas withiMCP HTSXMO32L-22 SiP Module but testing and certification will always be required from the end device,regardless of antenna selection.
3.1. ANTENNA INTERFACE
The Evaluation Board EVB-SXF-02 has a single-ended 50 Ω uFL antenna connector, where the antenna solutionshall be connected. The antenna impedance and the characteristic impedance of the transmission line (planar andcable) connecting to the antenna must be 50Ω. It is recommended to reserve space for a matching network (asin the EVB-SXF-02) because antennas are typically tuned on a supplier reference board and some differences mayimpact the antenna impedance, matching components can be used to compensate a possible mismatch to theantenna impedance and avoid performance degradation. The recommended minimum return loss is 10 dB but6.0 dB can still be accepted in the end device. The length of the transmission line from the antenna connector tothe matching network should be kept as short as possible to minimize losses.
3.2. MATCHING NETWORK
An external LC matching network (series inductor and shunt capacitor) was applied on the EVB-SXF-02 toimprove the output power level of the antenna pin in the iMCP HTSXMO32L-22 SiP Module. For detailedinformation about iMCP HTSXMO32L-22 SiP Module RF characteristics, please refers to datasheet. Therecommended values and specifications are given below:
- SMD ceramic inductor L1: 5.6nH +-0.3nH 0402 size
- SMD ceramic capacitor C13: 4.7pF +-0.1pF 0402 size
REGULATORY INFORMATION
This section contains information on certified bands and FCC/ISED regulatory notices for iMCP HTSXMO32L-22 SiP Module.
4.1. RF – FREQUENCY BANDS
Frequency bands based on Sigfox radio configurations:
- RC1: Europe, Middle East and Africa 868.034 ~ 868.226 MHz
- RC2: North America and Brazil 902.104 ~ 902.296 MHz
- RC3: Japan 923.104 ~ 923.296 MHz
- RC4: Latin America and Asia Pacific 920.704 ~ 920.896 MHz
- RC5: South Korea 923.204 ~ 923.396 MHz
- RC6: India 865.104 ~ 865.296 MHz
- RC7: Russia 868.704 ~ 868.896 MHz
4.2. FCC REGULATORY NOTICES
FCC regulatory notices cover modification and interference statements, wireless and FCC Class B digital device notices, permitted antennas and labeling requirements.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna
- Increase the separation between the equipment and receiver
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
- Consult the dealer or an experienced radio/TV technician for help
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
Labeling requirements for the host device
The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be always clearly visible when installed in the host device, otherwise the host device must be labelled to display the FCC ID of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: Contains FCC ID: 2A7ZW-HTSXMO32L.
Interference statement
This device complies with Part 15 of the FCC. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Wireless notice
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body.
This transmitter must not be collocated or operating in conjunction with any other antenna or transmitter.
Permitted antenna
This radio transmitter has been approved by FCC to operate with the antenna type described in this document, below the maximum permissible gain. The antenna peak gain is 2.2 dBi along the RC2 band cited in section 4.1.
Antenna types not included in this list, having a gain greater than the maximum gain indicated, are strictly prohibited for use with this device.
Information on Test Modes
All the test modes information, codes and requirements can be found at HT Micron’s github page.
DIMMENSIONS
ORDERING INFORMATION
Table 7: Detailed pin functions.
| Type number | Package | ||
| Name | Description | Version | |
| EVB-SXF-02 | Sigfox HT32SX-22 EVB | iMCP HTSXMO32L-22 Evaluation Board | 2.0 |
REVISION HISTORY
| Version | Date | Changes | Authors |
| 00 | 03/12/2020 | – Initial draft | MC |
| 01 | 18/12/2020 | – Review and updates | WH |
| 02 | 12/01/2020 | – Corrections and template update. | MC |
| 03 | 26/01/2020 | – Classification changed to Public | MC |
| 04 | 07/06/2021 | – Table 5 and Table 6 descriptions fixed. | MC |
| 05 | 09/03/2022 | – Regulatory Information and integration guide instructions | FK |
| 06 | 27/06/2023 | – Regulatory FCC ID and modulation schemes description update |
CONTACT
HT MICRON SEMICONDUTORES S.A.
Av. Unisinos, 1550 | 93022-750 | São Leopoldo | RS | Brasil
www.htmicron.com.br
DOCUMENT INFORMATION
Document Title: iMCP HTSXMO32L-22 SIP MODULE
Document Subtitle: Evaluation Board V2.0 Manual and Hardware Integration Guide
Classification: PUBLIC
Doc. Type: User Manual
Revision: v.06
Date: 27/06/2023
Code: EVB-SXF-02
DISCLAIMER
This document is a property of HT Micron and cannot be reproduced without its consent.
HT Micron does not assume any responsibility for use what is described.
This document is subject to change without notice.
HT MICRON Semicondutores S.A.
PUBLIC
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