HT Micron Semicondutores |
ht32sx/Evaluation Board V2.0 at documents · htmicron/ht32sx · GitHubGitHub - htmicron/ht32sx at master_2
Installation Guide for HT Micron models including: IMCP HTSXMO32L-22 SIP MODULE Evaluation Board, IMCP HTSXMO32L-22, SIP MODULE Evaluation Board, MODULE Evaluation Board, Evaluation Board, Board
HT Micron Semicondutores S.A. HTSXMO32L 2A7ZW-HTSXMO32L 2A7ZWHTSXMO32L htsxmo32l
File Info : application/pdf, 18 Pages, 915.22KB
DocumentDocumentHT MICRON SEMICONDUTORES S.A. Av. Unisinos, 1550 | 93022-750 | São Leopoldo RS | Brasil www.htmicron.com.br IMCP HTSXMO32L-22 SIP MODULE Evaluation Board V2.0 Manual and Hardware Integration Guide Classification: PUBLIC Doc. Type: User Manual Revision: v.06 Date: 27/06/2023 Code: EVB-SXF-02 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 SUMMARY SUMMARY .............................................................................................................................................................................................................................2 DOCUMENT INFO .........................................................................................................................................................................................................3 1. HT32SX - DEVICE OVERVIEW..........................................................................................................................................................................4 1.1. KEY FEATURES ....................................................................................................................................................................................................................... 4 1.2. SUPPORTED FCC RULES ................................................................................................................................................................................................ 4 1.3. BLOCK DIAGRAM................................................................................................................................................................................................................ 5 2. EVALUATION BOARD............................................................................................................................................................................................6 2.1. PIN ASSIGNMENT................................................................................................................................................................................................................ 6 2.2. CONNECTIONS DESCRIPTION .................................................................................................................................................................................... 7 2.3. POWER PINS.......................................................................................................................................................................................................................... 8 2.4. OTHER PINS........................................................................................................................................................................................................................... 9 2.5. STATIC CHARACTERISTICS - GENERAL OPERATING RANGE ..................................................................................................................... 9 2.6. POWER CONSUMPTION .............................................................................................................................................................................................. 10 2.7. EXTERNAL CLOCK RESONATOR ............................................................................................................................................................................. 10 2.8. BOARD SCHEMATICS..................................................................................................................................................................................................... 11 2.9. JUMPERS ................................................................................................................................................................................................................................. 11 2.10. PCB LAYOUT.................................................................................................................................................................................................................. 12 2.11. PCB SPECIFICATION.................................................................................................................................................................................................... 12 2.12. ANTENNA TYPE ............................................................................................................................................................................................................ 12 2.13. ANTENNA CHARACTERISTICS............................................................................................................................................................................... 13 3. RF CIRCUITS AND ANTENNA ...................................................................................................................................................................... 13 3.1. ANTENNA INTERFACE .................................................................................................................................................................................................. 13 3.2. MATCHING NETWORK................................................................................................................................................................................................ 13 4. REGULATORY INFORMATION.....................................................................................................................................................................14 4.1. RF - FREQUENCY BANDS ............................................................................................................................................................................................ 14 4.2. FCC REGULATORY NOTICES................................................................................................................................................................................... 14 4.3. PROFESSIONAL INSTALLATION INSTRUCTIONS............................................................................................................................................. 15 4.3.1. Installation personal.................................................................................................................................................................................15 4.3.2. Installation location ..................................................................................................................................................................................15 4.3.3. Installation procedure..............................................................................................................................................................................15 5. DIMMENSIONS .......................................................................................................................................................................................................... 16 6. ORDERING INFORMATION............................................................................................................................................................................16 LIST OF FIGURES............................................................................................................................................................................................................17 LIST OF TABLES..............................................................................................................................................................................................................17 REVISION HISTORY.....................................................................................................................................................................................................18 CONTACT ......................................................................................................................................................................................................................... 18 DOCUMENT INFORMATION..............................................................................................................................................................................18 DISCLAIMER ...................................................................................................................................................................................................................... 18 HT MICRON Semicondutores S.A. PUBLIC 2/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 DOCUMENT INFO This document provides the hardware integration guidelines for devices based on iMCP HTSXMO32L-22 SiP Module and technical information about the EVB-SXF-02, its Evaluation Board. This is a reference for the customers of HT Micron Semicondutores, especially device manufacturers and hardware engineers. HT MICRON Semicondutores S.A. PUBLIC 3/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 1. HT32SX - DEVICE OVERVIEW The iMCP HTSXMO32L-22 SiP Module is a Multicomponent Integrated Circuit (MCO) designed to provide a general ready-to-use connectivity solution for Internet of Things (IoT) applications. Its small dimensions, high performance and low power consumption targets the best experience for IoT developers. Detailed information about this device can be found on its datasheet. 1.1. EVALUATION BOARD KEY FEATURES · Frequency bands: o 413-479 MHz o 452-527 MHz o 826-958 MHz o 904-1055 MHz · Modulation schemes: o DBPSK, 2(G)FSK, OOK, ASK 64kB of flash memory 8kB of RAM 32.768kHz external crystal for RTC applications Voltage regulator ranging from 2.7 to 6V USB to Serial converter External LiPoly Battery connector Compatibility with Adafruit Feather Wings SWD interface MCU bootloader 20 GPIOs 12-bit ADC 12-bit 1 channel DAC 2 USART, LPUART, USB 2.0, I2C 1.2. OPERATIONAL DESCRIPTION The HT32SX's evaluation board contains a voltage regulator with a voltage range of 2.7 to 6V, ensuring stable power supply to the system, it features a built-in USB to Serial converter, enabling easy communication with external devices and computers terminals. A LiPoly Battery Connector allow portable and wireless operation. Regarding to the radio, HTSXMO32L integrates an ultra-low power RF transceiver, intended for RF wireless applications in the sub-1 GHz band. It supports different modulation schemes, but due to the MCO main target application (Sigfox Network), only DBPSK (for TX) and GFSK (for RX) schemes are enabled in the provided software. 1.3. SUPPORTED FCC RULES The iMCP HTSXMO32L-22 SiP Module has been certified to comply with the following FCC rules, when operating according to Sigfox RC2 requirements: · 47 CFR Part 15.247 · 47 CFR Part 15B · 47 CFR part 2.1091 These certifications can be applied to the host device if the device manufacturer implements the integration and test instructions of this document into the host device, except for FCC Part 15 Subpart B which needs to be retested. The host manufacturer can use iMCP HTSXMO32L-22 SiP Module FCC ID if the device meets the conditions of the FCC certificate. Commonly required conditions can be: HT MICRON Semicondutores S.A. PUBLIC 4/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 · A minimum of 20 cm distance from the human body. · No collocation with other transmitters (this condition generally needs to be reviewed by an FCC lab). · Antenna gain below the requirements. It is mandatory for the host device manufacturer to assure the final device's compliance with FCC Part 15 Subpart B, even if certification has been granted to iMCP HTSXMO32L-22 SiP Module. The host device manufacturer is also responsible for compliance with any other FCC rules that apply to the host device not covered by the iMCP HTSXMO32L-22 SiP Module grant of certification. 1.4. BLOCK DIAGRAM The following block diagram illustrates the iMCP HTSXMO32L-22 SiP Module. It features an ARM Cortex M0+ 32bit (STM32L052x8) and the S2-LP low-power transceiver from ST Microelectronics combined with the SKY66420 from Skyworks Solutions which provide all the performance advantages, integration, and convenience of advanced semiconductor packaging technology into a single chip. Figure 1: Block Diagram HT MICRON Semicondutores S.A. PUBLIC 5/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 2. EVALUATION BOARD The EVB-SXF-02 Evaluation Board was designed to be a development platform, facilitating new users first contact and providing to advanced users limitless possibilities of developing your own products. All the iMCP HTSXMO32L-22 SiP features are available on the evaluation board. Two supply options can be used: a USB connection or an external battery. The evaluation board will automatically switch to USB power when it is available. The external battery makes the evaluation board portable, so it becomes easy to test the Sigfox connectivity anywhere you go. 2.1. PIN ASSIGNMENT Figure 2: Pin Assignment HT MICRON Semicondutores S.A. PUBLIC 6/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 2.2. CONNECTIONS DESCRIPTION User Manual v.06 Connector Number CN1 - CN2 - CN3 - 1 2 3 Name Antenna Micro USB Battery VBAT ENABLE VUSB 4 PB10 5 PA5 6 PA8 7 PB5 CN4 8 PB0 9 PB11 10 PA11 11 PB6 12 PB7 1 NRESET 2 3V3 3 NC CN5 4 GND 5 PA4 Table 1: Detailed pin functions. Alt. Functions Type - RF I/O - - LPUART1_TX TIM2_CH3 ADC_IN5 TIM2_CH1 TIM2_ETR COMP1_INM5 USART1_CK USB_CSR_SYNC EVENT_OUT I2C1_SMBA LPTIM1_IN1 TIM22_CH2 ADC_IN0 VREF_OUT LPUART1_RX TIM2_CH4 EVENTOUT USART1_CTS USB_DM COMP1_OUT EVENT_OUT I2C1_SCL USART1_TX LPTIM1_ETR I2C1_SDA USART1_RX LPTIM1_IN2 Power Power Input Power Digital I/O Digital I/O Analog I Digital I/O Digital I/O Analog I Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Analog I Analog I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Analog O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O - I/O DAC_OUT ADC_IN4 USART2_CK Power - Ground Analog O Analog I Digital I/O Description RF input and output signal USB connection for power and communication Input power from external battery Battery output power Voltage regulator Enable Output power from USB Bus USART interface General-purpose timer ADC external input 5 General-purpose timer General-purpose timer Comparator input USART interface USB I2C interface Low-power timer General-purpose timer ADC external input 0 Output reference voltage Low-power USART interface General-purpose timer USART interface USB Comparator output I2C interface USART interface Low-power timer I2C interface USART interface Low-power timer Bidirectional reset pin with embedded weak pull-up resistor DAC analog output ADC external input 4 USART interface HT MICRON Semicondutores S.A. PUBLIC 7/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 6 7 8 9 10 11 12 13 14 15 16 2.3. POWER PINS PA3 PA1 PA6 PA2 PA0 PA14 PA13 PA12 PA9 PA10 BOOT0 TIM22_ETR COMP1_INM4 ADC_IN3 USART2_RX TIM2_CH4 TIM21_CH2 ADC_IN1 USART2_RTS_DE COMP1_INP TIM21_ETR EVENT_OUT ADC_IN6 LPUART1_CTS TIM22_CH1 COMP1_OUT EVENT_OUT ADC_IN2 USART2_TX TIM21_CH1 TIM2_CH3 ADC_IN0 WKUP1 USART2_CTS TIM2_CH1 SWCLK USART2_TX SWDIO USB_NOE USART1_RTS_DE USB_DP EVENT_OUT USART1_TX USART1_RX - Digital I/O Analog I Analog I Digital I/O Digital I/O Digital I/O Analog I Digital I/O Analog I Digital I/O Digital I/O Analog I Digital I/O Digital I/O Analog O Digital I/O Analog I Digital I/O Digital I/O Digital I/O Analog I Digital I Digital I/O Digital I/O Digital O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I General-purpose timer Comparator input ADC external input 3 USART interface General-purpose timer General-purpose timer ADC external input 1 USART interface Comparator input General-purpose timer ADC external input 6 USART interface General-purpose timer Comparator output ADC external input 2 USART interface General-purpose timer General-purpose timer ADC external input 0 MCU external wakeup input USART interface General-purpose timer Serial wire clock output USART interface Serial wire USB USART interface USB Serial wire Serial wire Boot selection Pins VBAT VUSB EN CN3 3V3 GND Table 2: Power pins description. Description Positive voltage is available from external battery or an external power supply can be used Positive 5V from USB is available when the USB cable is connected This pin is pulled up to enable voltage regulator. If connected to the ground the voltage regulator is turned off JST-PH connector for external Lipoly battery Output voltage from voltage regulator. A peak of 500mA can be supplied Common ground for the board and components. HT MICRON Semicondutores S.A. PUBLIC 8/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 2.4. OTHER PINS Figure 3: Power pins Pins I2C SWD TX/RX Boot0 Table 3: Other pins description. Description Serial interface. Alternative functions are also available on these pins. These pins can also be used as GPIO Serial Wire Debug interface to programming and debug the iMCP HTSXMO32L-22 SiP Module. These pins can also be used as GPIO These pins can be used to communicate with iMCP HTSXMO32L-22 SiP Module through Serial 1. Alternative functions are also available on these pins. These pins can also be used as GPIO This pin is pulled down. When connected to VDD during iMCP HTSXMO32L-22 SiP Module powering up allow access to programming its flash memory through the serial interface. Figure 4: Other pins. 2.5. STATIC CHARACTERISTICS - GENERAL OPERATING RANGE Table 4: General operating conditions. Parameter Conditions Min Typ. Max Unit Supply Voltage - 2.7 3.3 6.0 V Supply Current - - - 500 mA Operating Temperature - -20 - 70 °C HT MICRON Semicondutores S.A. PUBLIC 9/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 External XTAL Frequency - - - 32.768 kHz Remark: the voltage regulator can handle an input ranging from 1.5 to 6.0V. However, the iMCP HTSXMO32L22 SiP Module operation voltages range is from 2.7 to 3.6V. The evaluation board is provided with a resistor pair that sets the voltage regulator output to 3.3V, therefore, consider the supply voltage informed above to get a proper operation from the iMCP HTSXMO32L-22. 2.6. POWER CONSUMPTION Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to 25 °C temperature, output regulator voltage 3.3 V. Parameter Supply current Table 5: Power Consumption. Conditions Min Typ. Max Unit JP2 Open (iMCP HTSXMO32L-22 SiP Module turned off) - 1.4 - mA The iMCP HTSXMO32L-22 SiP Module current consumption depends on the operation mode, to get complete information about it, please refer to datasheet. 2.7. EXTERNAL CLOCK RESONATOR The external clock resonator can be of high speed (1-25MHz) or low speed (32.768kHz), which can be connected to pins 25 and 26 of the iMCP HTSXMO32L-22 SiP Module. On the Evaluation Board, it is provided a 32.768kHz clock resonator, which can be changed by a high speed one, according to the application necessity. The connection diagram is shown below. For CL10 and CL11, it is recommended to use high-quality ceramic capacitors in the 5pF to 25 pF range (typ.), designed for high-frequency applications, and selected to match the requirements of the crystal or resonator. CL1 and CL2 include PCB and the MCU pin capacitances. Figure 5: Oscillator position. HT MICRON Semicondutores S.A. PUBLIC 10/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 Figure 6: Oscillator circuit diagram. 2.8. BOARD SCHEMATICS Is highly recommended to use the iMCP HTSXMO32L-22 SiP Module's evaluation board schematic diagram as a reference circuitry when designing PCBs. The PCB layout, list of materials and all the documentation are provided at HT Micron's git hub page. In this context this reference circuitry (i.e. EVB-SXF-02) is applicable for the iMCP HTSXMO32L-22 SiP Module granted the FCC certifications . The given reference circuity is a valid generic example of an iMCP HTSXMO32L-22 based final device but does not limit it uses in any way. 2.9. JUMPERS Jumper JP1 JP2 JP3 JP4 Identification USB/Serial Converter Reset iMCP HTSXMO32L- 22 SiP Module Supply / Current Measurement User LED User Button Table 6: Jumpers' identification. Description This jumper provides the reset function for the USB to Serial converter when short-circuited. This jumper provides the supply to the iMCP HTSXMO32L-22 SiP Module and can be used to open the circuit and measure the current consumption drained only by it in different operation conditions. This jumper allows the disconnection of User LED from PA5 to avoid disturbances when using this Pin as GPIO for other purposes. This jumper allows the disconnection of User Button from PA6 to avoid disturbances when using this Pin as GPIO for other purposes. Figure 7: Jumpers' positioning. HT MICRON Semicondutores S.A. PUBLIC 11/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 2.10. PCB LAYOUT The PCB layout shown in Figure 6 are part of the iMCP HTSXMO32L-22 SiP Module Evaluation Board (EVBSXF-02) reference layout, it shows the details of the area where the antenna connector is located. Figure 8: HT32SX reference layout on top and bottom layer 2.11. PCB SPECIFICATION The Evaluation Board EVB-SXF-02 PCB stack-up and layer materials are shown in Figure 7. The reference PCB material is a two-layer FR4, 1.5mm core thickness and 1 Oz copper. Figure 9: HT32SX reference PCB stack up. 2.12. ANTENNA TYPE The external hinged antenna used in EVB-SXF-02 is Ethertronics X9000984-4GDSMB, as shown in the Figure 8. For further details on the antenna, see the antenna supplier datasheet. HT MICRON Semicondutores S.A. PUBLIC 12/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 UFL RP-SMA CABLE ANTENNA Figure 10: HT32SX Evaluation Board antenna. 2.13. ANTENNA CHARACTERISTICS The Ethertronics X9000984-4GDSMB antenna has 196 mm height and 6 mm diameter, a peak gain of 2.2dBi and an efficiency greater than 40% over the 790-960MHz frequency band. The radiation pattern plots can be found at the antenna datasheet. 3. RF CIRCUITS AND ANTENNA The iMCP HTSXMO32L-22 SiP Module support all the Sigfox radio configurations frequency bands. It has been certified only with the antenna solution presented in previous section. It is possible to use other antennas with iMCP HTSXMO32L-22 SiP Module but testing and certification will always be required from the end device, regardless of antenna selection. 3.1. ANTENNA INTERFACE The Evaluation Board EVB-SXF-02 has a single-ended 50 uFL antenna connector, where the antenna solution shall be connected. The antenna impedance and the characteristic impedance of the transmission line (planar and cable) connecting to the antenna must be 50. It is recommended to reserve space for a matching network (as in the EVB-SXF-02) because antennas are typically tuned on a supplier reference board and some differences may impact the antenna impedance, matching components can be used to compensate a possible mismatch to the antenna impedance and avoid performance degradation. The recommended minimum return loss is 10 dB but 6.0 dB can still be accepted in the end device. The length of the transmission line from the antenna connector to the matching network should be kept as short as possible to minimize losses. 3.2. MATCHING NETWORK An external LC matching network (series inductor and shunt capacitor) was applied on the EVB-SXF-02 to improve the output power level of the antenna pin in the iMCP HTSXMO32L-22 SiP Module. For detailed information about iMCP HTSXMO32L-22 SiP Module RF characteristics, please refers to datasheet. The recommended values and specifications are given below: · SMD ceramic inductor L1: 5.6nH +-0.3nH 0402 size · SMD ceramic capacitor C13: 4.7pF +-0.1pF 0402 size HT MICRON Semicondutores S.A. PUBLIC 13/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 Figure 11: uFL connector positioning. 4. REGULATORY INFORMATION This section contains information on certified bands and FCC/ISED regulatory notices for iMCP HTSXMO32L-22 SiP Module. 4.1. RF - FREQUENCY BANDS Frequency bands based on Sigfox radio configurations: RC1: RC2: RC3: RC4: RC5: RC6: RC7: Europe, Middle East and Africa North America and Brazil Japan Latin America and Asia Pacific South Korea India Russia 868.034 ~ 868.226 MHz 902.104 ~ 902.296 MHz 923.104 ~ 923.296 MHz 920.704 ~ 920.896 MHz 923.204 ~ 923.396 MHz 865.104 ~ 865.296 MHz 868.704 ~ 868.896 MHz 4.2. FCC REGULATORY NOTICES FCC regulatory notices cover modification and interference statements, wireless and FCC Class B digital device notices, permitted antennas and labeling requirements. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: · Reorient or relocate the receiving antenna · Increase the separation between the equipment and receiver · Connect the equipment into an outlet on a circuit different from that to which the receiver is connected · Consult the dealer or an experienced radio/TV technician for help FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. HT MICRON Semicondutores S.A. PUBLIC 14/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 User Manual v.06 Labeling requirements for the host device The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be always clearly visible when installed in the host device, otherwise the host device must be labelled to display the FCC ID of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: Contains FCC ID: 2A7ZW-HTSXMO32L. Interference statement This device complies with Part 15 of the FCC. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Wireless notice This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. This transmitter must not be collocated or operating in conjunction with any other antenna or transmitter. Permitted antenna This radio transmitter has been approved by FCC to operate with the antenna type described in this document, below the maximum permissible gain. The antenna peak gain is 2.2 dBi along the RC2 band cited in section 4.1. Antenna types not included in this list, having a gain greater than the maximum gain indicated, are strictly prohibited for use with this device. Information on Test Modes All the test modes information, codes and requirements can be found at HT Micron's github page. 4.3. PROFESSIONAL INSTALLATION INSTRUCTIONS Due to the unique function provided by the iMCP HTSXMO32L-22 SiP Module, this device must use our software and licensed third-party only. The product will be distributed through controlled distribution channels, installed by trained professional and will not be sold directly to the public through retail stores. 4.3.1. Installation personal This product is designed for specific application and needs to be installed by a qualified personal who has RF and related CFR rules knowledge. The general user shall not attempt to install or change the setting. 4.3.2. Installation location The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 4.3.3. Installation procedure The installation procedures are described along the chapters 2, 3 and 4 of this document, where all the information about the PCB layout and circuitry references can be found. HT MICRON Semicondutores S.A. PUBLIC 15/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 5. DIMMENSIONS User Manual v.06 Figure 12: Board dimensions. 6. ORDERING INFORMATION Type number EVB-SXF-02 Table 7: Detailed pin functions. Package Name Description Sigfox HT32SX-22 EVB iMCP HTSXMO32L-22 Evaluation Board Version 2.0 HT MICRON Semicondutores S.A. PUBLIC 16/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 LIST OF FIGURES User Manual v.06 Figure 1: Block Diagram............................................................................................................................................................................................................... 5 Figure 2: Pin Assignment ............................................................................................................................................................................................................. 6 Figure 3: Power pins....................................................................................................................................................................................................................... 9 Figure 4: Other pins........................................................................................................................................................................................................................ 9 Figure 5: Oscillator position. .................................................................................................................................................................................................. 10 Figure 6: Oscillator circuit diagram. .................................................................................................................................................................................. 11 Figure 7: Jumpers' positioning............................................................................................................................................................................................... 11 Figure 8: HT32SX reference layout on top and bottom layer .................................................................................................................... 12 Figure 9: HT32SX reference PCB stack up. ............................................................................................................................................................... 12 Figure 10: HT32SX Evaluation Board antenna......................................................................................................................................................... 13 Figure 11: uFL connector positioning.............................................................................................................................................................................. 14 Figure 12: Board dimensions. ................................................................................................................................................................................................ 16 LIST OF TABLES Table 1: Detailed pin functions............................................................................................................................................................................................... 7 Table 2: Power pins description. ........................................................................................................................................................................................... 8 Table 3: Other pins description. ............................................................................................................................................................................................ 9 Table 4: General operating conditions.............................................................................................................................................................................. 9 Table 5: Power Consumption.............................................................................................................................................................................................. 10 Table 6: Jumpers' identification............................................................................................................................................................................................ 11 Table 7: Detailed pin functions............................................................................................................................................................................................ 16 HT MICRON Semicondutores S.A. PUBLIC 17/18 iMCP HTSXMO32L-22 SIP MODULE EVB-SXF-02 REVISION HISTORY User Manual v.06 Version 00 01 02 03 04 05 06 Date 03/12/2020 18/12/2020 12/01/2020 26/01/2020 07/06/2021 09/03/2022 27/06/2023 Changes - Initial draft - Review and updates - Corrections and template update. - Classification changed to Public - Table 5 and Table 6 descriptions fixed. - Regulatory Information and integration guide instructions - Regulatory FCC ID and modulation schemes description update CONTACT HT MICRON SEMICONDUTORES S.A. Av. Unisinos, 1550 | 93022-750 | São Leopoldo | RS | Brasil www.htmicron.com.br DOCUMENT INFORMATION Document Title: Document Subtitle: Classification: Doc. Type: Revision: Date: Code: iMCP HTSXMO32L-22 SIP MODULE Evaluation Board V2.0 Manual and Hardware Integration Guide PUBLIC User Manual v.06 27/06/2023 EVB-SXF-02 Authors MC WH MC MC MC FK DISCLAIMER This document is a property of HT Micron and cannot be reproduced without its consent. HT Micron does not assume any responsibility for use what is described. This document is subject to change without notice. HT MICRON Semicondutores S.A. PUBLIC 18/18