Ligne d'accès haute performance STMicroelectronics STM32F413VG
Caractéristiques
- Numéro d'article du fabricant : STM32F413VGH6
- Nom de l'article du fabricant : 51MJ*463XXXA
- Quantité : 80 mg
- Version : A
- Unité de mesure : mg
- Site de fabrication : 9996
- Type d'unité : Chaque
- Cote MSL : 3
- Désignateur de package : BGA
- Température de classification : 260°C
- Nombre de cycles de refusion : 3
- Taille du paquet : 7×7
- Package Description: A0C2 UFBGA 7x7x0.60 100L R12sq P0.5 8219030
Instructions d'utilisation du produit
Manutention et stockage
Manipulez le produit avec précaution pour éviter tout dommage. Conservez-le dans un endroit frais et sec.
endroit frais et sec, à l'abri de la lumière directe du soleil et de l'humidité.
Installation
Follow the manufacturer’s guidelines for installing the product in your device. Ensure proper alignment and connection.
Mode d'emploi
Refer to the device’s user manual for specific operating instructions related to this product. Ensure proper power supply and compatibility.
Description
- The STM32F413xG/H devices are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a floating-point unit (FPU) single precision, which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU), which enhances application security.
- The STM32F413xG/H devices belong to the STM32F4 access product lines (with products combining power efficiency, performance, and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM), allowing to save even more power consumption during data batching.
- The STM32F413xG/H devices incorporate high-speed embedded memories (up to 1.5 Mbytes of flash memory, 320 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses, and a 32-bit multi-AHB bus matrix.
- All devices offer a 12-bit ADC, two 12-bit DACs, a low-power RTC, twelve general-purpose 16-bit timers, including two PWM timers for motor control, two general-purpose 32-bit timers, and a low-power timer.
Schéma de circuit
They also feature standard and advanced communication interfaces.
Caractéristiques
- Inclut la technologie brevetée de pointe ST
- Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode)
- Alimentation 1.7 V à 3.6 V
- -40 °C to 85/105/125 °C temperature range
- Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
- Souvenirs
- Up to 1.5 Mbytes of flash memory
- 320 Ko de SRAM
- Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
- Dual-mode Quad-SPI interface
- 512 bytes of OTP memory
- Interface parallèle LCD, modes 8080/6800
- Clock, reset, and supply management
- Alimentation d'application et E/S de 1.7 à 3.6 V
- POR, PDR, PVD and BOR
- Oscillateur à cristal de 4 à 26 MHz
- RC interne 16 MHz ajusté en usine
- Oscillateur 32 kHz pour RTC avec étalonnage
- RC interne 32 kHz avec étalonnage
- Consommation d'énergie
- Run: 112 µA/MHz (peripheral off)
- Stop (Flash in Stop mode, fast wakeup time): 42 µA Typ.; 80 µA max @25 °C
- Stop (Flash in Deep power down mode, slow wakeup time): 15 µA Typ.; 46 µA max @25 °C
- Standby without RTC: 1.1 µA Typ.; 14.7 µA max at @85 °C
- VBATTE supply for RTC: 1 µA @25 °C
- 2×12-bit D/A converters
- 1×12-bit, 2.4 MSPS ADC: up to 16 channels
- 6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support
- General-purpose DMA: 16-stream DMA
- Up to 18 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each, with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer, and a low-power timer
- Mode débogage
- Débogage de fil série (SWD) & JTAG
- Cortex®-M4 Embedded Trace Macrocell™
- Up to 114 I/O ports with interrupt capability
- Up to 109 fast I/Os up to 50 MHz
- Up to 114 five V-tolerant I/Os
- Up to 24 communication interfaces
- Up to 4x I2C interfaces (SMBus/PMBus)
- Up to 10 UARTS: 4 USARTs / 6 UARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
- Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces
- SDIO interface (SD/MMC/eMMC)
- Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY
- 3x CAN (2.0B Active), 1xSAI
- Véritable générateur de nombres aléatoires
- Unité de calcul CRC, ID unique 96 bits
- RTC: subsecond accuracy, hardware calendar packages are ECOPACK®2
FAQ
What is the package size of the product?
The package size is 7x7.
Does the product meet EU RoHS requirements?
Yes, the product meets EU RoHS requirements without any exemptions.
How many reflow cycles can the product undergo?
The product can undergo up to 3 reflow cycles.
Documents / Ressources
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Ligne d'accès haute performance STMicroelectronics STM32F413VG [pdf] Guide de l'utilisateur Ligne d'accès haute performance STM32F413VG, STM32F413VG, Ligne d'accès haute performance, Ligne d'accès, Ligne |