EARDATEK EWN-EP2T23F1CA BLE Soc Module Owner's Manual

ModuleEWN-EP2T23F1CA
Contents
1 General Specifications———————————————————————————- 3 2 Features ————————————————————————————————— 3 3 System Block Diagram ——————————————————————————— 4 4 PHY Specification ————————————————————————————— 4 5 Other Specifications ———————————————————————————— 6 6 DC Specifications—————————————————————————————- 6 7 Module configurations ——————————————————————————— 7 8 Pin Definition ——————————————————————————————– 8 9 Module Photos ——————————————————————————————- 9 10 Key material list ————————————————————————————– 9 11 Reference design ———————————————————————————– – 10 –
11.1 RF ————————————————————————————————————- – 10 11.2 Power supply requirement ——————————————————————————— – 11 11.3 Motherboard interference avoidance ——————————————————————— – 12 –
11.3.1 Interface interference ——————————————————————————————- – 12 11.3.2 The main chip interferes with DDR————————————————————————— – 13 –
12 Revision History ———————————————————————————– – 15 –

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ModuleEWN-EP2T23F1CA
1 General Specifications
EWN-EP2T23F1CA is Bluetooth LE SoC solution with internal Flash, which combines the features and functions needed for all 2.4 GHz IoT standards into a single SoC.
2 Features
RF features include: BLE/2.4 GHz RF transceiver embedded, working in worldwide 2.4 GHz ISM band. Bluetooth 5.1 compliant, 1 Mbps, 2 Mbps, Long Range 125 kbps and 500 kbps. 2.4 GHz proprietary 1 Mbps/2 Mbps/250 kbps/500 kbps mode. Support Adaptive Frequency Hopping feature. Support flexible GFSK/FSK modulation index configuration. Support 1-N receiver capability.
Embedded 32-bit proprietary microcontroller. Program memory: Internal 512 KB flash. Data memory: 64 KB on-chip SRAM:
Up to 32 KB SRAM with retention in deep sleep One 32 KB SRAM without retention in deep sleep

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3 System Block Diagram

ModuleEWN-EP2T23F1CA

Fig 3-1 EWN-EP2T23F1CA System Block Diagram

4 PHY Specification

Protocol Interface Frequency
Data rate

Table 4-1 EWN-EP2T23F1CA Bluetooth RF Parameters BLE5.1
UARTPWMGPIO
2400 MHz ~ 2483.5MHz BLE/2.4G Proprietary 1Mbps, ±250kHz deviation BLE/2.4G Proprietary 2Mbps, ±500kHz deviation BLE 125kbps, ±250kHz deviation BLE 500kbps, ±250kHz deviation 2.4G Proprietary 500kbps, ±125kHz deviation 2.4G Proprietary 250kbps, ±62.5kHz deviation

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ModuleEWN-EP2T23F1CA

Item

Sym.

Table 4-2 RX Performance

Min.

Typ.

Max.

Unit

Condition

BLE 1Mbps RF_Rx performance (±250KHz deviation)

Sensitivity

1Mbps

–

-96

–

dBm

–

Frequency Offset Tolerance

-250

–

+300

KHz

–

Co-channel rejection

–

+1/-1 MHz

–

-4/-2

–

In-band blocking

offset

rejection

+2/-2 MHz

–

-41/-32

–

(Equal Modulation

offset

Interference)

>=3 MHz

–

-42

–

offset

Image rejection

–

-32

–

Wanted signal at -67dBm

Wanted signal at -67 dBm

Item
Output power, maximum setting
Output power, minimum setting
(resolution) Programmable output
power range Modulation 20dB
bandwidth

Sym. –

Table 4-3 TX Performance

Min.

Typ.

Max.

Unit

BLE 1Mbps RF_TX performance

–

dBm

–

-45

–

dBm

–

1.4

–

MHz

Condition
–

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5 Other Specifications

Operating Temperature Storage Temperature Operating Humidity Storage Humidity Humidity level

Table 5-1 other Specifications -40~+105 Module: -40~+105 Package: -20~+70 RH 95%(Non-Condensing)
RH 95%(Non-Condensing)
Level 3

ModuleEWN-EP2T23F1CA

6 DC Specifications

Item
VDD_3.3V
RX current
TX current
TX current Deep sleep without SRAM retention Deep sleep with 32kB SRAM retention Deep sleep with 32kB SRAM retention

Sym. VBAT IRX ITX ITX IDeep1
IDeep2
IDeep3

Min.

Table 6-1 DC Specifications

Typ.

Max.

3.3

3.6

–

9.1

–

9.5

–

0.4

–

1.5

–

2.0

–

Unit

Condition

3.3V Supply Voltage

Whole Chip

whole chip @ 0dBm with LDO

mA whole chip @ 10dBm with LDO

Without 32K RC

With 32K RC

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ModuleEWN-EP2T23F1CA
7 Module configurations
Module(Hole-Hole) Dimension (unit : mm)20.0(±0.2) *14.7(±0.2)*2.6±0.2 Module Size (Unit: mm): 20.0(±0.2) *15.0(±0.3)*2.6±0.2

Fig 7-1 EWN-EP2T23F1CA Module Size (TOP VIEW)

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8 Pin Definition

Table 8-1 the hardware Pin definition of the module

Table 8-1 EWN-EP2T23F1CA Pin definition

Definition

Description

VBAT

Supply power 2V-3.6V

GND

Module power reference

PD2

PWM3SPI_CNGPIO

PD5

PWM0PWM0_NGPIO

PA4

PWM2UART_RTSCK/SCLGPIO

PB4

PWM4lc_comp_ain<4>/sar_aio<4>GPIO

PB5

PWM5lc_comp_ain<5>/sar_aio<5>GPIO

PC3

PWM1UART_RXxtl_32k_inGPIO

RST

Power on reset, active low

SWS/PA7

SWSUART_RTSGPIO

PA0

UART_RXPWM0_NPS_PE<0>GPIO

PD7

UART_TXSPI_CK/SCLPS_PE<3>GPIO

Notes:

1. Download Interface use SWS test point.

2. Only SWS interface can be used for debugging firmware.

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9 Module Photos

ModuleEWN-EP2T23F1CA

Fig 9-1 TOP View

Fig 9-2 Bottom View

10 Key material list

Type Crystal
IC

Table 10-1 EWN-EP2T23F1CA Key material list Model
24MHz 12pF 20ppm EP2T23F40

Footprint 3225
QFN20

QTY. 1PCS 1PCS

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11 Reference design

ModuleEWN-EP2T23F1CA

11.1 RF
a) Under the antenna and in the two directions indicated by the arrow, avoid covering the ground, routing and placing metal components. It is better to directly hollow out the PCB in this area.

Fig 11-1 Antenna
b) It is recommended not to use any components within 30mm of the module antenna area, and the module baseboard should also avoid wiring and covering the ground as much as possible.
c) It is strongly recommended that the user place the antenna of the Bluetooth module close to the edge of the backplane as far as possible when laying out the PCB, as shown in the figure below, so as to ensure the good performance of the antenna.

Fig 11-2 Recommended PCB layout

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11.2 Power supply requirement

ModuleEWN-EP2T23F1CA

The module power supply voltage is DC+3.3V. The power supply design needs to consider the output current and power interference. The power supply current design needs to reserve 60mA. To avoid the +3.3V power supply from interfering with other circuits on the motherboard, it is recommended to supply to the module using the regulator circuit alone. the recommended DC-DC circuit structure shown in the figure below. A 4.7uF~10uF capacitor is connected in parallel at 3_3VD output to filter out the interference. A bead is connected in series at 3_3VD output. The bead and capacitor must be placed as close to the module as possible. If you need to share +3.3V with other circuits, consider whether the current of the shared power supply is sufficient.

Fig 11-3 Power supply Circuit schematic

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ModuleEWN-EP2T23F1CA
11.3 Motherboard interference avoidance
Motherboard interference comes from: high-speed data interface (HDMI), the Operating frequency of main chip, DDR, DC-DC power supply. The method of avoiding interference according to the characteristics of various signals is also different. The main methods of interference avoidance include:
1. keeping away from the source of interference;
2. Adding shields to avoid interference leakage;
3. Reasonable layout to eliminate interference. 11.3.1 Interface interference
When HDMI uses the 74.2MHz frequency, its 33x frequency is in the 2.4G band of BT, which will seriously interfere with the BT signal. If the HDMI frequency is 148.5MHz, although the 16x frequency is not in the BT band, the isolation of the frequency is not good, and the BT signal will be interfered to some extent. If the distance between the HDMI interface and the BT module on the PCB is less than 5cm, the HDMI output display will interfere with the BT signal, resulting in problems such as BT connection failure and throughput drop. Therefore, keep the location of the BT module away from the HDMI port on the hardware layout to avoid interference.
At the same time, if the BT antenna is built-in the motherboard, its placement must also be carefully considered to be far from the interface interference. If the antenna is placed in an incorrect position, even if the module is shielded, the interference signal is coupled through the antenna, which will eventually result in a lower BT throughput. (Note: In addition to interference, the placement of the internal antenna should also evaluate the effect of the metal interface, motherboard, and housing material on the antenna impedance.)

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ModuleEWN-EP2T23F1CA
Fig 11-4 HDIM and USB interference
11.3.2 The main chip interferes with DDR Because the main chips operate at about 800MHz or DDR2 operate at 667MHz, 3x frequency of 800MHz and 4x frequency of 667MHz are near 2.4GHz band. It must to place BT modules and antennas far away from the main chip and DDR. It is strongly recommended that the main chip be isolated from the DDR by a shield. As shown in the figure below.

Fig 11-5 Main chip and DDR interference

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11.4 Recommended secondary reflux temperature curve
T he number of reflux shall not exceed 2 times, and the tin feeding height of the half hole of the module shall be no less than 1/4.
The lead-free reflux curve requirements of BT module products are shown in figure

Fig 11-6 Furnace temperature curve
Note: 1. The maximum furnace temperature of the module is 260, don’t exceed this temperature. 2. The gold plating thickness of the module pad is 2u”.

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ModuleEWN-EP2T23F1CA

12 Revision History

Vision V1.0 V1.1

Release Date 2024-7-10 2025-2-13

Summary First release Updated Module configurationsAdd Module Photos

Revised By Lizzie
Huazhi Li

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FCC Warning
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
NOTE 1: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: – Reorient or relocate the receiving antenna. – Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help.
NOTE 2: Any changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.
“This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions:
(1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.”
« Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : (1) l’appareil ne doit pas produire de brouillage, et (2) l’utilisateur de l’appareil doit accepter tout brouillage radioelectrique subi, meme sile brouillage est susceptible d’en compromettre le fonctionnement. »
The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.
L’appareil a été évalué pour répondre aux exigences générales en matière d’exposition aux RF. L’appareil peut être utilisé en condition d’exposition portable sans restriction.

Integration instructions for host product manufacturers according to KDB 996369 D03OEM Manual v01
2.2 List of applicable FCC rules FCC Part 15 Subpart C 15.247 &15.209 &15.207.
2.3 Specific operational use conditions The module can be used for mobile applications with a maximum -1.6dBi antenna. The host manufacturer installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation. The host manufacturer has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
2.4 Limited module procedures The device is a Single module and complies with the requirement of FCC Part 15.212.
2.5 Trace antenna designs Not applicable, The module has its own antenna, and doesn’t need a host sprinted board micro strip trace antenna etc
2.6 RF exposure considerations The module must be installed in the host equipment, can be used in portable exposure condition without restriction.; and if RF exposure statement or module layout is changed, then the host product manufacturer required to take responsibility of the module through a change in FCC ID or new application The FCC ID of the module cannot be used on the final product In these circumstances, the host manufacturer will be responsible for re-evaluating the end product (including the transmitter)and obtaining a separate FCC authorization
2.7 Antennas Antenna Specification are as follows: Type of antenna: PCB Antenna Gain of antenna: -1.6dBi Max. This device is intended only for host manufacturers under the following conditions: The transmitter module may not be co-located with any other transmitter or antenna; The module shall be only used with the internal antenna(s) that has been originally tested and certified with this module. The antenna must be either permanently attached or employ a “unique” antenna coupler As long as the conditions above are met, further transmitter test will not be required However, the host manufacturer is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc)
2.8 Label and compliance information Host product manufacturers need to provide a physical or e-label stating ” Contains FCC ID: 2AKGT-EP2T23F1CA”with their finished product
2.9 Information on test modes and additional testing requirements Host manufacturer must perform test of radiated & conducted emission and spurious emission, e.t.c according to the actual test modes for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. Only when all the test results of test modes comply with FCC requirements, then the end product can be sold legally.
2.10 Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for FCC Part 15 Subpart C 15.247 &15209 &15.207 and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuit), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed

Documents / Resources

EARDATEK EWN-EP2T23F1CA BLE Soc Module [pdf] Owner's Manual
EP2T23F1CA, EWN-EP2T23F1CA BLE Soc Module, EWN-EP2T23F1CA, BLE Soc Module, Soc Module, Module

References

User Manual

EARDATEK EWN-EP2T23F1CA BLE Soc Module Owner’s Manual

EWN-EP2T23F1CA BLE Soc Module

Specifications

Product Usage Instructions

1. Installation

2. Power Supply

3. Interference Avoidance

Frequently Asked Questions (FAQ)

Q: What is the maximum output power of the EWN-EP2T23F1CA BLE
Soc Module?

Q: What Bluetooth versions are supported by the module?

Documents / Resources

References

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