DX SMART DX-WF24 WiFi Module
Product Information
- Product Name: DX-WF24 Wi-Fi/Bluetooth 2-in-1 Module
- Version: 1.2
- Date: 2023-07-10
Product Usage Instructions
- Module Introduction
The DX-WF24 is a versatile Wi-Fi/Bluetooth 2-in-1 module designed to provide wireless connectivity solutions. - Features
The key features of the DX-WF24 module include:- Wi-Fi and Bluetooth dual-mode support
- Application Versatility
- Functional Block Diagram for easy understanding
- Basic parameters for customization
- Application
The DX-WF24 module can be used in various applications requiring wireless communication capabilities. - Functional Block Diagram
The functional block diagram illustrates the internal components and connections of the module, aiding in integration. - Basic Parameters
The basic parameters provide essential technical details for configuring and utilizing the module effectively.
FAQ
Q: How do I connect the DX-WF24 module to a microcontroller?
A: To connect the DX-WF24 module to a microcontroller, follow these steps:
- Identify the module pin definitions as per the technical manual.
- Create a power supply design based on the specified requirements.
- Establish the hardware physical interface connections.
- Refer to the connection circuit for proper integration.
Q: What are the recommended conditions of use for the DX-WF24 module?
A: The recommended conditions of use include:
- Maintain maximum ratings within specified limits.
- Adhere to ESD ratings to prevent damage.
- Ensure proper Digital LDO functioning.
update record
| Version | date | illustrate | author |
| V 1.0 | 2022/12/25 | initial version | LSL |
| V1.1 | 2023/6/12 | Added hardware diagrams | LSL |
| V1.2 | 2023/7/10 | Update hardware parameters | LSL |
Module Introduction
Overview
DX- WF24 It is a Wi-Fi / Bluetooth two-in-one module, which was developed by Shenzhen Daxia Longque Technology Co., Ltd. for intelligent wireless data transmission. It uses the BK7238 chip. It is a highly integrated single-chip Wi-Fi 802.11n and Bluetooth low energy (BLE) 5.2 combination solution, designed for applications that require Wi-Fi / Bluetooth two-in-one and compact size. It integrates a powerful 32-bit MCU and a comprehensive set of peripheral interfaces. This module supports interfaces such as UART, SPI, I, and 2C, supports IO port control, and ADC acquisition, and has the advantages of low power consumption, high performance, and high speed. In addition to having a wealth of peripheral interfaces, the module also has powerful signal processing capabilities and is suitable for a variety of application scenarios such as the IoT field, such as smart lighting, smart home, indoor positioning, and other complex IoT applications.
Features
Wi-Fi:
- Features Wi-Fi compliant with IEEE 802.11 b/g/n 1×1 standard
- Supports 20 MHz channels
- Support working modes STA, AP, AP+STA
- Transmit power up to +19 dBm
- Receive sensitivity -99 dBm
Bluetooth BLE:
- Support 5.2 Bluetooth protocol
- Supports Bluetooth Low Energy (LE), 1 Mbps, 2 Mbps, long-range (125 kbps and 500 kbps)
- Broadcast Extensions
- Bluetooth Direction Finding: Angle of Arrival (AoA) and Angle of Departure (AoD)
- Supports up to 16 antenna arrays for precise indoor positioning Integrated Bluetooth LE/WLAN coexistence (PTA)
Memory:
- 32-bit MCU, up to 160 MHz
- 2 MB SiP Flash
- 288 KB RAM
- UART/JTAG for downloading and debugging
Clock Management :
- External oscillator: 26 MHz crystal oscillator (X26M)
- Internal oscillator: 26 ~ 160 MHz digitally controlled oscillator (DCO), 32 kHz ring oscillator (ROSC)
- 480 MHz DPLL
Power Management:
- Operating voltage: 2.7 V ~3.6 V (reference value: 3.3 V)
- On-chip Power-On Reset (POR) and Brown-Out Detector (BOD)
- Embedded LDO Regulator
- Onboard PCB antenna/external antenna optional
- Operating temperature range: -40 ~ +105℃
application
- Camera video streaming
- Smart Building
- Smart Agriculture
- Health/Medical/Nursing
- Wearable Electronics
- Home Automation
- OTT TV Box/Set-Top Box Devices
- automated industry
- Audio equipment
- Wi-Fi Toys
- Retail & Catering
Functional Block Diagram
The figure below is the functional block diagram of the DX- WF24 WIFI module, which explains its main functions as follows:
- Power supply
- Baseband
- Memory
- RF Part
- Peripheral Interface
Basic parameters
Table 1: Basic parameter table
| parameter name | Details | parameter name | Details |
| Chip model | BK7238 | Module Model | DX- WF24 |
| Modulation OFDM, MCS0(GF), Module size 22 (L) × 15.2 (W) × 2.2 (H) mm
MCS7(GF) |
|||
| Operating Voltage | 3.3V | protocol | IEEE 802.11 b/g/n |
| Sensitivity | -99 dBm | Transmit power | +19 dBm |
| RF input impedance
Antenna interface Operating temperature |
50Ω
Onboard antenna/External antenna (optional) MIN : -40℃ – MAX : + 105 ℃ |
Frequency band
Hardware Interface humidity |
2402 ~ 2480MHz
GDMA, SPI, RTC, PWM, UART, ADC, TRNG, I2C 10%-95% non-condensing |
Application Interface
Module pin definition
Pin Definition
Table 2: Pin definition table
|
Pin number |
Pin Name | Pin Function |
illustrate |
| 5/6/7 | NC | NC | null |
| 10/26/28 | GND | GND | Grounding |
| 1 | UART-TX | Serial data output | |
| 2 | UART-RX | Serial data input | |
| 3 | DLTX | Burning port | |
| 4 | DLRX | Burning port | |
| 8 | CEN | Reset | For details, refer to 2.3.3 |
| 9 | VBAT | Power input pin | 3.3V (typical) |
| 10/26/28 | GND | Power Ground | |
| 11 | P28 | I/O | Programmable input/output pins |
| 12 | P20 | I/O | Programmable input/output pins |
| 13 | P21 | I/O | Programmable input/output pins |
| 14 | P22 | I/O | Programmable input/output pins |
| 15 | P23 | I/O | Programmable input/output pins |
| 16 | P24 | I/O | Programmable input/output pins |
| 17 | P14 | I/O | Programmable input/output pins |
| 18 | P16 | I/O | Programmable input/output pins |
| 19 | P15 | I/O | Programmable input/output pins |
| 20
21 |
KEY
WORK-STATUS |
Module working status output pin |
For details, refer to 2.3.4 |
| 22 LINK-STATUS | Bluetooth connection status pin | ||
| 23 | P07 | I/O | Programmable input/output pins |
| 24 | P08 | I/O | Programmable input/output pins |
| 25 | P09 | I/O | Programmable input/output pins |
| 27 | ANT | antenna | Programmable input/output pins |
Power Design
Power interface
Table 3: Power interface pin definition table
Power stability requirements
DX- WF24 is 2.7 ~ 3.6V, and it is necessary to ensure that the input voltage is not lower than 2.7 V. The figure below shows the VBAT voltage drop during RF burst transmission.
To reduce voltage drop, it is recommended to reserve two ( 100 uF, 0.1uF) chip multilayer ceramic capacitors (MLCC) with the best ESR performance for VBAT, and the capacitors should be placed close to the VBAT pin. The reference circuit is as follows:
CEN reset pin description
Table 4: CEN pin definition table
| Pin Name | Pin Number | I/O | describe | Remark |
| CEN | 8 | I | Module reset | Low-level reset |
KEY wake-up pin description
Table 5: KEY Pin definition table
| Pin Name | Pin Number | I/O | describe | Remark |
| KEY | 20 | DI | Module wake-up | Low level |
Hardware physical interface
General digital IO port
7 general digital IO ports are defined in the module. All these IO ports can be configured by software to realize various functions, such as button control, LED drive, or interrupt signal of the main controller. Keep it floating when not in use.
UART
DX-WF24 has a universal asynchronous receive/transmit (UART) interface that provides full-duplex, asynchronous serial communication with baud rates up to 6 Mbps. They support 5/6/7/8-bit data, odd, even, or no parity, and the stop bit can be set to 1 or 2 bits. UART1 supports Flash download.
I2C Interface
DX-WF24 has an I2C interface that requires only two buses, the serial data (SDA) and the serial clock line (SCL). The I2C interface can be used as a master or slave mode. It supports standard (up to 100kbps) and fast (up to 400kbps) modes with 7-bit addressing. If the low level on SCL or the bus idle duration is greater than the programmable threshold, an interrupt will be generated to the MCU.
PWM
DX-WF24 has 6 32-bit PWM channels, labeled PWM0-PWM 5 (supports timer mode). Each PWM channel has three modes: timer mode, PWM mode, and capture mode. The mode of each channel is multiplexed with 32-bit counts, and the PWM operation clock can select a high-speed clock or a low-power clock. Each PWM runs independently and has an independent duty cycle.
SPI interface
The DX-WF24 has an SPI interface that can operate in master or slave mode. The SPI interface allows clock frequencies up to 30 MHz in master mode and up to 20 MHz in slave mode. The SPI interface supports configurable 8-bit or 16-bit data width. The SPI interface supports 4-wire and 3-wire modes (without CSN pin), 64-bit RX FIFO, and 64-bit TX FIFO with DMA function. Receive data can be latched on the rising or falling edge of the clock signal. Transmit data can be set by MSB or LSB.
The communication protocol of the SPI slave interface uses 4-byte or 8-byte control signals. Between the two available communication protocols, the CPU selects one before starting control.
The 8-byte control type uses a 4-byte address, a 1-byte control, and a 3-byte length. The 4-byte address shows the address of the register that is accessed internally. The 1-byte control is used for communication control, and the 3-byte length shows the length of the data that is accessed continuously in bytes. Therefore, when the 8-byte control type is applied, the maximum length of the data that can be accessed continuously is 16 MB. The 4-byte control type uses a 2-byte address, a 1-byte control, and a 1-byte length. The 2-byte address shows the address of the register that is accessed internally. The 1-byte control is used for communication control, and the 1-byte length shows the length of the data that is accessed continuously in bytes. Since a 32-bit address map is used internally, a 2-byte address is not enough to express everything. Therefore, specify the upper 2-byte base address first, and then use the lower 2-byte address.
Reference connection circuit
Electrical characteristics, RF characteristics, and reliability
Maximum Ratings
Stresses exceeding the absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 7: Absolute Maximum Ratings
ESD Rating
Table 8: ESD Ratings
| parameter | describe | Typical Value | unit |
| ESD HBM | Human Model | ±2000 | V |
| VDD_DIO2 | Charged Device Model | ±500 | V |
Recommended conditions of use
Table 9: Recommended operating conditions
| VCCIF | IF supply voltage | 2.7 | – | 3.6 | V |
| VCCRXFE | RX supply voltage | 2.7 | – | 3.6 | V |
| VCCPA | PA supply voltage | 2.7 | – | 3.6 | V |
| VCCTX | TX supply voltage | 2.7 | – | 3.6 | V |
| VDDAON Digital LDO output 0.5 | 0.9 | 1.0 | V | ||
| VDD_FLASH External flash supply voltage 2.7 | – | 3.6 | V | ||
Digital LDO
Table 10: Digital LDO
Static Protection
In module applications, static electricity generated by human static electricity, charged friction between microelectronics, etc., is discharged to the module through various channels, which may cause certain damage to the module. Therefore, ESD protection should be taken seriously. ESD protection measures should be taken during the R&D, production assembly, and testing processes, especially in product design. For example, anti-static protection should be added at the interfaces of circuit design and points that are susceptible to damage or impact from electrostatic discharge, and anti-static gloves should be worn during production.
Table 11: ESD withstand voltage of module pins
| Test interface | Contact discharge | Air discharge | unit |
| VBAT and GND | +4 | +8 | kV |
| Main antenna interface | +2.5 | +4 | kV |
Mechanical dimensions and layout recommendations
This section describes the mechanical dimensions of the module. All dimensions are in millimeters. All dimensions without tolerances are ±0.3 mm.
Module mechanical ruler
Recommended package
Module top view/bottom view
Remark
The above picture is for reference only. For the actual product appearance and label information, please refer to the actual module.
Hardware Design Layout Recommendations
DX-WF20 Bluetooth module works in the 2.4G wireless frequency band and uses an onboard antenna. The VSWR and efficiency of the antenna depend on the patch position. Various factors affecting the wireless transceiver signal should be avoided as much as possible. Note the following points:
- Avoid using metal for the product shell surrounding Bluetooth. When using a partial metal shell, keep the module antenna away from the metal part as much as possible. The metal connecting wires or metal screws inside the product should be kept away from the module antenna as much as possible.
- The module antenna should be placed against the edge of the PCB or directly exposed to the PCB. It is not allowed to be placed in the middle of the board. There should be at least 5mm of free space in the direction of the antenna, and the PCB under the antenna should be milled out. Copper laying and routing are not allowed in the direction parallel to the antenna.
- It is recommended to use insulating materials to isolate the module mounting position on the substrate, such as placing a whole piece of silk screen (TopOverLay) at this position.
Storage, production, and packaging
Storage conditions
The module is shipped in a vacuum-sealed bag. The module has a moisture sensitivity level of 3 (MSL 3) and its storage must comply with the following conditions:
- Recommended storage conditions: temperature 23±5°C and relative humidity 35~60%.
- Under recommended storage conditions, modules can be stored in vacuum-sealed bags for 12 months.
- Under workshop conditions of 23±5°C and relative humidity below 60%, the workshop life of the module after unpacking is 168 hours. Under this condition, the module can be directly subjected to reflow production or other high-temperature operations. Otherwise, the module needs to be stored in an environment with a relative humidity of less than 10% (for example, a moisture-proof cabinet) to keep the module dry.
- If the module is in the following conditions, it is necessary to pre-bake the module to prevent the module from absorbing moisture and then causing PCB blistering, cracks and delamination after high-temperature soldering:
- The storage temperature and humidity do not meet the recommended storage conditions;
- The module fails to be manufactured or stored under the above clause 3 after being unpacked;
- Vacuum packaging leaks, materials are in bulk;
- Before module repair;
Module baking process
- It needs to be baked at 120±5°C for 8 hours;
- 24 hours after baking, otherwise, they still need to be stored in a drying oven;
Remark
- In order to prevent and reduce the occurrence of poor weldings such as blistering and delamination of the module due to moisture, strict control should be exercised. It is not recommended to expose the module to the air for a long time after opening the vacuum packaging.
- Before baking, the module needs to be taken out of the package and placed on a high-temperature resistant device to prevent high temperature from damaging the plastic tray or reel; the module for secondary baking must be soldered within 24 hours after baking, otherwise,e it needs to be stored in a drying oven. Please pay attention to ESD protection when unpacking and placing the module, for example, wear anti-static gloves.
Reflow
- Use a printing scraper to print solder paste on the stencil so that the solder paste leaks through the stencil opening onto the PCB. The strength of the printing scraper needs to be adjusted appropriately. To ensure the quality of the module printing paste, the recommended steel mesh thickness corresponding to the module pad part is 0.1~0.15mm.
- The recommended reflow temperature is 235~250 ºC, and the maximum temperature should not exceed 250 ºC. To avoid damage to the module due to repeated heating, it is strongly recommended that customers mount the module after completing the reflow soldering of the first side of the PCB board. The recommended furnace temperature curve (lead-free SMT reflow soldering) and related parameters are shown in the following chart:
Table 20: Recommended reflow temperature
Packing Specifications
DX- WF20 modules are packaged in tape and reel and sealed in vacuum-sealed bags with desiccant and humidity cards. Each carrier is 20 meters long and contains 1000 modules. The reel diameter is 330 mm. The specific specifications are as follows:
FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
- This device may not cause harmful interference, and
- This device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, under part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used by the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and the receiver.
- Connect the equipment to an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v0101
List of applicable FCC rules
CFR 47 FCC Part 15 Subpart C and Subpart F have been investigated. It applies to the modular transmitter
Specific Operational Use Conditions – Antenna Placement Within the Host Platform
The module is tested for standalone mobile RF exposure use conditions.
- The antenna must be installed such that 20cm is maintained between the antenna and users,
- The transmitter module may not be co-located with any other transmitter or antenna.
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
Limited Module Procedures
Not applicable
Trace Antenna Designs
Not applicable
RF Exposure Considerations
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body.
Antenna Type and Gain
The following antennas have been certified for use with this module.
- Only antennas of the same type with equal or lower gain may also be used with this module.
- Other types of antennas and/or higher gain antennas may require additional authorization for operation.
Antenna Specification list below:
End Product Labelling Compliance Information
When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door, or cover is easily removed. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: 2BLPG-DX-WF24”. The FCC ID can be used only when all FCC compliance requirements are met.
Information on Test Modes and Additional Testing Requirements
- This transmitter is tested in a standalone mobile RF exposure condition and any co-located or simultaneous transmission with other transmitters) class Il permissive change re-evaluation or new FCC authorization.
- The host manufacturer installed this modular with single modular approval should perform the test of radiated emission and spurious emission according to FCC part 15C, 15.209, 15.207 requirements, only if the test result complies with FCC part 15C, 15.209, 15.207 requirements, then the host can be sold legally.
Additional testing, Part 15 Subpart B Disclaimer
- This transmitter modular is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B rules requirement applicable to the final host. The final host will still need to be reassessed for compliance with this portion of rules requirements if applicable.
- As long as all conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this modular installation.
Manual Information to The End User
- The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module.
- The host integrator must follow the integration instructions provided in this document and ensure that the composite system end product complies with the requirements by a technical assessment or evaluation of the rules and to KDB Publication 996369.
- The host integrator installing this module into their product must ensure that the final composite product complies with the requirements by a technical assessment or evaluation of the rules, including the transmitter operation, and should refer to the guidance in KDB Publication 996369.
OEM/Host Manufacturer Responsibilities
OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and RF Exposure essential requirements of the FCC rules.
How to Make Changes – Important Note
If these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
Contact Us
- Shenzhen Daxia Longque Technology Co., Ltd.
- Email: waimao@szdx-smart.com
- Tel: 0 7 5 5 – 2 9 9 7 8 1 2 5
- Website: en.szdx-smart.com
- Address: Room 601, Block A1, Huafeng Zhigu, Hangkong Road, Hangcheng Street, Baoan District, Shenzhen.
Documents / Resources
 |
DX SMART DX-WF24 WiFi Module [pdf] User Guide DX-WF24 WiFi Module, DX-WF24, WiFi Module, Module |