ALINX AC7Z020 ZYNQ7000 FPGA Development Board

Product Information

The ZYNQ7000 FPGA Development Board is a development board that features the XC7Z100-1CLG400I chip, which is part of the ZYNQ7000 series. It has an ARM dual-core CortexA9-based application processor with a clock speed of up to 800MHz, 256KB on-chip RAM, and external storage interface that supports 16/32 bit DDR2, DDR3 interface. The board also has two Gigabit NIC support, two USB2.0 OTG interfaces, two CAN2.0B bus interfaces, two SD card, SDIO, MMC compatible controllers, 2 SPIs, 2 UARTs, 2 I2C interfaces, and 4 pairs of 32bit GPIO. The board has a core board (AC7Z010) that uses two Micron’s MT41K128M16TW-107 DDR3 chips with a combined capacity of 256MB and a data bus width of 32-bit. The board also has user LEDs, user keys, expansion header, JTAG debug port, and power supply.

Product Usage Instructions

To use the ZYNQ7000 FPGA Development Board, follow these steps:

1. Connect the power supply to the board.
2. Connect the board to your computer using a USB cable.
3. Install any necessary drivers for the board on your computer.
4. Open your software development environment and create a new project.
5. Configure your project settings to use the ZYNQ7000 FPGA Development Board.
6. Write your code and compile it.
7. Upload the compiled code to the board using the JTAG debug port.
8. Test your code on the board.

Note: Refer to the user manual for more detailed information on the board’s features and usage.

Version Record

Version	Date	Release By	Description
Rev 1.0	2019-12-15	Rachel Zhou	First Release

AC7Z010 core board

AC7Z010 core board Introduction

• AC7Z010 (core board model, the same below) FPGA core board, ZYNQ chip is based on XC7Z010-1CLG400I of XILINX company ZYNQ7000 series. The ZYNQ chip’s PS system integrates two ARM CortexTM-A9 processors, AMBA® interconnects, internal memory, external memory interfaces and peripherals. The FPGA of the ZYNQ chip contains a wealth of programmable logic cells, DSP and internal RAM.
• This core board uses two Micron’s MT41K128M16TW-107 DDR3 chips, each of which has a capacity of 256MB; the two DDR chips combine to form a 32-bit data bus width, and the clock frequency of read and write data between ZYNQ and DDR3 Up to 533Mhz; this configuration can meet the needs of the system’s high-bandwidth data processing
• In order to connect with the carrier board, the two board-to-board connectors of this core board are extended with USB ports on the PS side, Gigabit Ethernet interfaces, SD card slot, and other remaining MIO ports (48). As well as almost all IO ports (100) of BANK13 (only for AC7Z010), BAN34 and BANK35 on the PL side, the IO levels of BANK34 and BANK35 can be provided through the carrier board to meet users’ requirements for different level interfaces. For users who need a lot of IO, this core board will be a good choice. And the IO connection part, the ZYNQ chip to the interface between the equal length and differential processing, and the core board size is only 35 * 42 (mm), which is very suitable for secondary development.

ZYNQ Chip

The FPGA core board AC7Z010 uses Xilinx’s Zynq7000 series chip, module XC7Z010-1CLG400I. The chip’s PS system integrates two ARM Cortex™-A9 processors, AMBA® interconnects, internal memory, external memory interfaces and peripherals. These peripherals mainly include USB bus interface, Ethernet interface, SD/SDIO interface, I2C bus interface, CAN bus interface, UART interface, GPIO etc. The PS can operate independently and start up at power on or reset. Figure 2-2-1 detailed the Overall Block Diagram of the ZYNQ7000 Chip.

The main parameters of the PS system part are as follows:

• ARM dual-core CortexA9-based application processor, ARM-v7 architecture, up to 800MHz
• 32KB level 1 instruction and data cache per CPU, 512KB level 2 cache 2 CPU shares
• On-chip boot ROM and 256KB on-chip RAM
• External storage interface, support 16/32 bit DDR2, DDR3 interface
• Two Gigabit NIC support: divergent-aggregate DMA, GMII, RGMII, SGMII interface
• Two USB2.0 OTG interfaces, each supporting up to 12 nodes
• Two CAN2.0B bus interfaces
• Two SD card, SDIO, MMC compatible controllers
• 2 SPIs, 2 UARTs, 2 I2C interfaces
• 4 pairs of 32bit GPIO, 54 (32 + 22) as PS system IO, 64 connected to PL
• High bandwidth connection within PS and PS to PL

The main parameters of the PL logic part are as follows:

• Logic Cells: 28K
• Look-up-tables (LUTs): 17600
• Flip-flops: 35,200
• 18x25MACCs: 80
• Block RAM: 240KB
• Two AD converters for on-chip voltage, temperature sensing and up to 17 external differential input channels, 1MBPS
• XC7Z100-1CLG400I chip speed grade is -1, industrial grade, package is BGA400, pin pitch is 0.8mm the specific chip model definition of ZYNQ7000 series is shown in Figure 2-2-2

DDR3 DRAM

• The FPGA core board AC7Z010 is equipped with two Micron DDR3 SDRAM chips (1GB in total), model MT41K128M16TW-107 (Compatible with Hynix
• H5TQ2G63AFR-PBI). The total bus width of DDR3 SDRAM is 32bit. DDR3 SDRAM operates at a maximum speed of 533MHz (data rate1066Mbps). The DDR3 memory system is directly connected to the memory interface of the BANK 502 of the ZYNQ Processing System (PS). The specific configuration of DDR3 SDRAM is shown in Table 2-3-1 below:

Bit Number	Chip Model	Capacity	Factory
U8,U9	MT41K128M16TW-107	256M x 16bit	Micron

Table 2-3-1: DDR3 SDRAM Configuration

The hardware design of DDR3 requires strict consideration of signal integrity. We have fully considered the matching resistor/terminal resistance, trace impedance control, and trace length control in circuit design and PCB design to ensure high-speed and stable operation of DDR3.

DDR3 DRAM pin assignment:

Signal Name	ZYNQ Pin Name	ZYNQ Pin Number
DDR3_DQS0_P	PS_DDR_DQS_P0_502	C2
DDR3_DQS0_N	PS_DDR_DQS_N0_502	B2
DDR3_DQS1_P	PS_DDR_DQS_P1_502	G2
DDR3_DQS1_N	PS_DDR_DQS_N1_502	F2
DDR3_DQS2_P	PS_DDR_DQS_P2_502	R2
DDR3_DQS2_N	PS_DDR_DQS_N2_502	T2
DDR3_DQS3_P	PS_DDR_DQS_P3_502	W5
DDR3_DQS4_N	PS_DDR_DQS_N3_502	W4
DDR3_D0	PS_DDR_DQ0_502	C3
DDR3_D1	PS_DDR_DQ1_502	B3
DDR3_D2	PS_DDR_DQ2_502	A2
DDR3_D3	PS_DDR_DQ3_502	A4
DDR3_D4	PS_DDR_DQ4_502	D3
DDR3_D5	PS_DDR_DQ5_502	D1
DDR3_D6	PS_DDR_DQ6_502	C1
DDR3_D7	PS_DDR_DQ7_502	E1
DDR3_D8	PS_DDR_DQ8_502	E2
DDR3_D9	PS_DDR_DQ9_502	E3

DDR3_D10	PS_DDR_DQ10_502	G3
DDR3_D11	PS_DDR_DQ11_502	H3
DDR3_D12	PS_DDR_DQ12_502	J3
DDR3_D13	PS_DDR_DQ13_502	H2
DDR3_D14	PS_DDR_DQ14_502	H1
DDR3_D15	PS_DDR_DQ15_502	J1
DDR3_D16	PS_DDR_DQ16_502	P1
DDR3_D17	PS_DDR_DQ17_502	P3
DDR3_D18	PS_DDR_DQ18_502	R3
DDR3_D19	PS_DDR_DQ19_502	R1
DDR3_D20	PS_DDR_DQ20_502	T4
DDR3_D21	PS_DDR_DQ21_502	U4
DDR3_D22	PS_DDR_DQ22_502	U2
DDR3_D23	PS_DDR_DQ23_502	U3
DDR3_D24	PS_DDR_DQ24_502	V1
DDR3_D25	PS_DDR_DQ25_502	Y3
DDR3_D26	PS_DDR_DQ26_502	W1
DDR3_D27	PS_DDR_DQ27_502	Y4
DDR3_D28	PS_DDR_DQ28_502	Y2
DDR3_D29	PS_DDR_DQ29_502	W3
DDR3_D30	PS_DDR_DQ30_502	V2
DDR3_D31	PS_DDR_DQ31_502	V3
DDR3_DM0	PS_DDR_DM0_502	A1
DDR3_DM1	PS_DDR_DM1_502	F1
DDR3_DM2	PS_DDR_DM2_502	T1
DDR3_DM3	PS_DDR_DM3_502	Y1
DDR3_A0	PS_DDR_A0_502	N2
DDR3_A1	PS_DDR_A1_502	K2
DDR3_A2	PS_DDR_A2_502	M3
DDR3_A3	PS_DDR_A3_502	K3
DDR3_A4	PS_DDR_A4_502	M4
DDR3_A5	PS_DDR_A5_502	L1
DDR3_A6	PS_DDR_A6_502	L4
DDR3_A7	PS_DDR_A7_502	K4
DDR3_A8	PS_DDR_A8_502	K1
DDR3_A9	PS_DDR_A9_502	J4

DDR3_A10	PS_DDR_A10_502	F5
DDR3_A11	PS_DDR_A11_502	G4
DDR3_A12	PS_DDR_A12_502	E4
DDR3_A13	PS_DDR_A13_502	D4
DDR3_A14	PS_DDR_A14_502	F4
DDR3_BA0	PS_DDR_BA0_502	L5
DDR3_BA1	PS_DDR_BA1_502	R4
DDR3_BA2	PS_DDR_BA2_502	J5
DDR3_S0	PS_DDR_CS_B_502	N1
DDR3_RAS	PS_DDR_RAS_B_502	P4
DDR3_CAS	PS_DDR_CAS_B_502	P5
DDR3_WE	PS_DDR_WE_B_502	M5
DDR3_ODT	PS_DDR_ODT_502	N5
DDR3_RESET	PS_DDR_DRST_B_502	B4
DDR3_CLK0_P	PS_DDR_CKP_502	L2
DDR3_CLK0_N	PS_DDR_CKN_502	M2
DDR3_CKE	PS_DDR_CKE_502	N3

QSPI Flash

The FPGA core board AC7Z010 is equipped with one 256MBit Quad-SPI FLASH chip, the flash model is W25Q256FVEI, which uses the 3.3V CMOS voltage standard. Due to the non-volatile nature of QSPI FLASH, it can be used as a boot device for the system to store the boot image of the system. These images mainly include FPGA bit files, ARM application code, and other user data files. The specific models and related parameters of QSPI FLASH are shown in Table 2-4-1.

Position	Model	Capacity	Factory
U15	W25Q256FVEI	32M Byte	Winbond

Table 2-4-1: QSPI FLASH Specification
QSPI FLASH is connected to the GPIO port of the BANK500 in the PS section of the ZYNQ chip. In the system design, the GPIO port functions of these PS ports need to be configured as the QSPI FLASH interface. Figure 2-4-1 shows the QSPI Flash in the schematic.

Configure chip pin assignments:

Signal Name	ZYNQ Pin Name	ZYNQ Pin Number
QSPI_SCK	PS_MIO6_500	A5
QSPI_CS	PS_MIO1_500	A7
QSPI_D0	PS_MIO2_500	B8
QSPI_D1	PS_MIO3_500	D6
QSPI_D2	PS_MIO4_500	B7
QSPI_D3	PS_MIO5_500	A6

Clock configuration

The AC7Z010 core board provides an active clock for the PS system, so that the PS system can work independently.
PS system clock source
The ZYNQ chip provides 33.333333MHz clock input for the PS part through the X1 crystal on the core board. The clock input is connected to the PS_CLK_500 pin of the ZYNQ chip BANK500. Its schematic diagram is shown in Figure 2-5-1:

Clock pin assignment:

Signal name	ZYNQ Pin
PS_CLK_500	E7

Power Supply
The power supply voltage of the AC7Z010 core board is DC5V, which is supplied by connecting the carrier board. In addition, the power of BANK34 and BANK35 is also provided through the carrier board. The schematic diagram of the power supply design on the core board is shown in Figure 2-6-1:

The FPGA development board is powered by + 5V, and is converted into + 1.0V, + 1.8V, + 1.5V, + 3.3V four power supplies through four DC / DC power chips. The output current of + 1.0V can reach 6A, + 1.8V and + 1.5V power output current is 3A, + 3.3V output current is 500mA. J29 also has 4 pins each to supply power to FPGA BANK34 and BANK35. The default is 3.3V. Users can change the power of BANK34 and BANK35 by changing VCCIO34 and VCCIO35 on the backplane. 1.5V generates the VTT and VREF voltages required by DDR3 through TI’s TPS51206. The functions of each power distribution are shown in the following table:

Power Supply	Function
+1.0V	ZYNQ PS and PL section Core Voltage
+1.8V	ZYNQ PS and PL partial auxiliary voltage BANK501 IO voltage
+3.3V	ZYNQ Bank0,Bank500,QSIP FLASH Clock Crystal

+1.5V	DDR3, ZYNQ Bank501
VREF,VTT(+0.75V)	DDR3
VCCIO34/35	Bank34, Bank35

Because the power supply of the ZYNQ FPGA has the power-on sequence requirements, in the circuit design, we have designed according to the power requirements of the chip. The power-on sequence is+1.0V->+1.8V->(+1.5 V, +3.3V, VCCIO) circuit design to ensure the normal operation of the chip. Because the level standards of BANK34 and BANK35 are determined by the power supply provided by the carrier board, the highest is 3.3V. When you design the carrier board to provide the VCCIO34 and VCCIO35 power for the core board, the power-on sequence is slower than + 5V.

AC7Z010 Core Board Size Dimension

Board to Board Connectors pin assignment
The core board has a total of two high-speed expansion ports. It uses two 120-pin inter-board connectors (J29/J30) to connect to the carrier board. The PIN spacing of the board to board connector is 0.5mm, among them, J29 is connected to 5V power, VCCIO power input, some IO signals and JTAG signals, and J30 is connected to the remaining IO signals and MIO. The IO level of BANK34 and BANK35 can be changed by adjusting the VCCIO input on the connector, the highest level does not exceed 3.3V. The AX7Z010 carrier board we designed is 3.3V by default. Note that the IO of BANK13 is not

Pin assignment of board to board connector J29

J29 Pin	Signal  Name	ZYNQ Pin Number	J29 Pin	Signal Name	ZYNQ Pin Number
1	VCC5V	–	2	VCC5V	–
3	VCC5V	–	4	VCC5V	–
5	VCC5V	–	6	VCC5V	–
7	VCC5V	–	8	VCC5V	–
9	GND	–	10	GND	–
11	VCCIO_34	–	12	VCCIO_35	–
13	VCCIO_34	–	14	VCCIO_35	–
15	VCCIO_34	–	16	VCCIO_35	–
17	VCCIO_34	–	18	VCCIO_35	–
19	GND	–	20	GND	–
21	IO34_L10P	V15	22	IO34_L7P	Y16
23	IO34_L10N	W15	24	IO34_L7N	Y17
25	IO34_L15N	U20	26	IO34_L17P	Y18
27	IO34_L15P	T20	28	IO34_L17N	Y19
29	GND	–	30	GND	–
31	IO34_L9N	U17	32	IO34_L8P	W14
33	IO34_L9P	T16	34	IO34_L8N	Y14
35	IO34_L12N	U19	36	IO34_L3P	U13
37	IO34_L12P	U18	38	IO34_L3N	V13
39	GND	–	40	GND	–
41	IO34_L14N	P20	42	IO34_L21N	V18
43	IO34_L14P	N20	44	IO34_L21P	V17
45	IO34_L16N	W20	46	IO34_L18P	V16
47	IO34_L16P	V20	48	IO34_L18N	W16
49	GND	–	50	GND	–
51	IO34_L22N	W19	52	IO34_L23P	N17
53	IO34_L22P	W18	54	IO34_L23N	P18
55	IO34_L20N	R18	56	IO34_L13N	P19
57	IO34_L20P	T17	58	IO34_L13P	N18
59	GND	–	60	GND	–

61	IO34_L19N	R17	62	IO34_L11N	U15
63	IO34_L19P	R16	64	IO34_L11P	U14
65	IO34_L24P	P15	66	IO34_L5N	T15
67	IO34_L24N	P16	68	IO34_L5P	T14
69	GND	–	70	GND	–
71	IO34_L4P	V12	72	IO34_L2N	U12
73	IO34_L4N	W13	74	IO34_L2P	T12
75	IO34_L1P	T11	76	IO34_L6N	R14
77	IO34_L1N	T10	78	IO34_L6P	P14
79	GND	–	80	GND	–
81	IO13_L13P	Y7	82	IO13_L21P	V11
83	IO13_L13N	Y6	84	IO13_L21N	V10
85	IO13_L11N	V7	86	IO13_L14N	Y8
87	IO13_L11P	U7	88	IO13_L14P	Y9
89	GND	–	90	GND	–
91	IO13_L19N	U5	92	IO13_L22N	W6
93	IO13_L19P	T5	94	IO13_L22P	V6
95	IO13_L16P	W10	96	IO13_L15P	V8
97	IO13_L16N	W9	98	IO13_L15N	W8
99	GND	–	100	GND	–
101	IO13_L17P	U9	102	IO13_L20P	Y12
103	IO13_L17N	U8	104	IO13_L20N	Y13
105	IO13_L18P	W11	106	IO13_L12N	U10
107	IO13_L18N	Y11	108	IO13_L12P	T9
109	GND	–	110	GND	–
111	FPGA_TCK	F9	112	VP	K9
113	FPGA_TMS	J6	114	VN	L10
115	FPGA_TDO	F6	116	PS_POR_B	C7
117	FPGA_TDI	G6	118	FPGA_DONE	R11

Pin assignment of board to board connector J30

J30 Pin	Signal Name	ZYNQ Pin Number	J30 Pin	Signal Name	ZYNQ Pin Number
1	IO35_L1P	C20	2	IO35_L15N	F20

3	IO35_L1N	B20	4	IO35_L15P	F19
5	IO35_L18N	G20	6	IO35_L5P	E18
7	IO35_L18P	G19	8	IO35_L5N	E19
9	GND	T13	10	GND	T13
11	IO35_L10N	J19	12	IO35_L3N	D18
13	IO35_L10P	K19	14	IO35_L3P	E17
15	IO35_L2N	A20	16	IO35_L4P	D19
17	IO35_L2P	B19	18	IO35_L4N	D20
19	GND	T13	20	GND	T13
21	IO35_L8P	M17	22	IO35_L9N	L20
23	IO35_L8N	M18	24	IO35_L9P	L19
25	IO35_L7P	M19	26	IO35_L6P	F16
27	IO35_L7N	M20	28	IO35_L6N	F17
29	GND	T13	30	GND	T13
31	IO35_L17N	H20	32	IO35_L16N	G18
33	IO35_L17P	J20	34	IO35_L16P	G17
35	IO35_L19N	G15	36	IO35_L13N	H17
37	IO35_L19P	H15	38	IO35_L13P	H16
39	GND	T13	40	GND	T13
41	IO35_L12N	K18	42	IO35_L14N	H18
43	IO35_L12P	K17	44	IO35_L14P	J18
45	IO35_L24N	J16	46	IO35_L20P	K14
47	IO35_L24P	K16	48	IO35_L20N	J14
49	GND	T13	50	GND	T13
51	IO35_L21N	N16	52	IO35_L11P	L16
53	IO35_L21P	N15	54	IO35_L11N	L17
55	IO35_L22N	L15	56	IO35_L23P	M14
57	IO35_L22P	L14	58	IO35_L23N	M15
59	GND	T13	60	GND	T13
61	PS_MIO22	B17	62	PS_MIO50	B13
63	PS_MIO27	D13	64	PS_MIO45	B15
65	PS_MIO23	D11	66	PS_MIO46	D16
67	PS_MIO24	A16	68	PS_MIO41	C17
69	GND	T13	70	GND	T13
71	PS_MIO25	F15	72	PS_MIO7	D8
73	PS_MIO26	A15	74	PS_MIO12	D9

75	PS_MIO21	F14	76	PS_MIO10	E9
77	PS_MIO16	A19	78	PS_MIO11	C6
79	GND	T13	80	GND	T13
81	PS_MIO20	A17	82	PS_MIO9	B5
83	PS_MIO19	D10	84	PS_MIO14	C5
85	PS_MIO18	B18	86	PS_MIO8	D5
87	PS_MIO17	E14	88	PS_MIO0	E6
89	GND	T13	90	GND	T13
91	PS_MIO39	C18	92	PS_MIO13	E8
93	PS_MIO38	E13	94	PS_MIO47	B14
95	PS_MIO37	A10	96	PS_MIO48	B12
97	PS_MIO28	C16	98	PS_MIO49	C12
99	GND	T13	100	GND	T13
101	PS_MIO35	F12	102	PS_MIO52	C10
103	PS_MIO34	A12	104	PS_MIO51	B9
105	PS_MIO33	D15	106	PS_MIO40	D14
107	PS_MIO32	A14	108	PS_MIO44	F13
109	GND	T13	110	GND	T13
111	PS_MIO31	E16	112	PS_MIO15	C8
113	PS_MIO36	A11	114	PS_MIO42	E12
115	PS_MIO29	C13	116	PS_MIO43	A9
117	PS_MIO30	C15	118	PS_MIO53	C11
119	QSPI_D3_PS_MIO5	A6	120	QSPI_D2_PS_MIO4	B7

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Documents / Resources

ALINX AC7Z020 ZYNQ7000 FPGA Development Board [pdf] User Manual AC7Z020, AC7Z020 ZYNQ7000 FPGA Development Board, ZYNQ7000 FPGA Development Board, FPGA Development Board, Development Board, Board

References

• User Manual