1. Introduction
This manual provides essential information for the proper handling, installation, and operation of the Qualcomm PM7150 102 Power Supply IC. This high-technology component is designed for use in mobile phone applications, specifically compatible with models such as Redmi Note 8 and K20. Due to the delicate nature and precision required for BGA (Ball Grid Array) chips, it is imperative to follow all instructions carefully to ensure successful integration and functionality.
2. Product Overview
The PM7150 102 is a power supply integrated circuit (IC) manufactured by Qualcomm. It is supplied as a surface-mount device (SMD) module, designed for integration into mobile phone circuit boards. This IC is a new condition component, originating from Mainland China, and is free from high-concerned chemicals.
3. Specifications
| Feature | Specification |
|---|---|
| Model Number | PM7150 102 |
| Type | Module |
| Package | SMD (Surface Mount Device) |
| Application | Mobile Phone (e.g., Redmi Note 8, K20) |
| Condition | New |
| High-concerned chemical | None |
| Unit Weight | 0.012 kg |
| Package Dimensions (L x W x H) | 10 cm x 10 cm x 2 cm |
4. Setup and Installation
The installation of BGA chips like the PM7150 102 requires specialized skills and equipment. It is strongly recommended that only proficient engineers perform the soldering and replacement procedures.
4.1 Pre-Installation Handling
- Humidity Control: BGA chips, especially in small quantities, can absorb humidity when exposed to air after being removed from their packaging. To prevent quality issues, place the chips in a baking chamber for at least 24 hours at a temperature of 100°C - 110°C before installation.
4.2 Soldering Process
- BGA Reballing: When soldering, BGA reballing is necessary. It is recommended to use medium or low-temperature solder paste for this process.
- Professional Operation: The soldering process is complex. Any slight faulty positioning, careless temperature control, or incomplete cleaning of the PCB (Printed Circuit Board) can lead to insufficient or missing solder connections, resulting in chip failure.
- Fragility: BGA chips are fragile and can be easily damaged by improper soldering techniques.
4.3 Important Considerations Before Installation
Before attempting to install the chip, please ensure the following:
- You have verified that you have purchased the correct PM7150 102 chip for your device.
- You possess the proper equipment required for BGA soldering and reballing.
- You are sufficiently skilled and experienced in soldering BGA components.
5. Operating Instructions
Once the PM7150 102 Power Supply IC is correctly installed and integrated into the mobile phone's circuit board, it will operate automatically as designed to manage power distribution within the device. There are no user-adjustable settings or operational controls for this component.
6. Maintenance
The PM7150 102 Power Supply IC contains no user-serviceable parts. Any maintenance or repair work on the IC or the device it is installed in should be performed by qualified technicians with appropriate tools and expertise in micro-soldering and electronics repair.
7. Troubleshooting
If the device experiences power-related issues after the installation of the PM7150 102 IC, consider the following potential causes, which are common with BGA chip installations:
- Insufficient Soldering: Check for cold joints or incomplete solder connections on the BGA pads.
- Missing Soldering: Verify that all solder balls have made proper contact with the PCB pads.
- Faulty Positioning: Ensure the chip was aligned correctly during the soldering process.
- Temperature Control Issues: Improper temperature profiles during reflow can lead to soldering defects.
- Incomplete PCB Cleaning: Residues on the PCB can interfere with proper solder adhesion.
- Physical Damage: Inspect the chip for any physical damage that might have occurred during handling or installation.
Due to the complexity, professional diagnosis and repair are highly recommended for any troubleshooting beyond visual inspection.
8. User Tips
No specific user tips are available from reviews or Q&A for this product at this time. However, based on the nature of BGA chips, always prioritize a clean workspace and precise temperature control during installation.
9. Warranty and Support
9.1 Warranty Policy
- If the item is found to be defective upon receipt, it must be reported within 7 days from the date of receipt for an exchange.
- The buyer is responsible for returning all original and undamaged items in re-saleable condition.
- Returns for parts that have been used in machines will not be accepted.
- Once returned items are received, replacements will be sent out as soon as possible.
- The warranty does not cover products that are physically damaged or operating under abnormal conditions due to misuse or improper installation of the parts.
9.2 Technical Support
For any technical inquiries or support regarding the PM7150 102 Power Supply IC, please contact the seller, Transcend Electrons Store, directly through the platform where the purchase was made.
