VISHAY IRFPC60LC Power MOSFET
Product Usage Instructions
- The IRFPC60LC Power MOSFET by Vishay Siliconix is designed for high-power applications with a maximum drain-source voltage of 600V and low on-state resistance.
Installation
- Ensure proper grounding and safety precautions are taken before installation.
- Mount the TO-247AC package securely using a 6-32 or M3 screw with the recommended mounting torque.
- Follow soldering recommendations for peak temperature exposure of 10 seconds.
Operation
- Apply a gate-source voltage (VGS) of 10V for optimal performance.
- Avoid exceeding the maximum drain current and pulse drain current ratings.
- Maintain the operating junction temperature within the specified range (-55°C to +150°C).
Maintenance
- Regularly inspect the Power MOSFET for any signs of damage or overheating during operation. Replace if necessary.
FAQ
- Q: What is the recommended gate-source voltage for this MOSFET?
- A: The recommended gate-source voltage is 10V for optimal performance.
- Q: What is the maximum drain-source voltage of the IRFPC60LC?
- A: The maximum drain-source voltage is 600V.
- Q: How should I mount the TO-247AC package?
- A: Use a 6-32 or M3 screw with the specified mounting torque to securely mount the package.
FEATURES
- Ultra low gate charge
- Reduced gate drive requirement
- Enhanced 30 V VGS rating
- Reduced Ciss, Coss, Crss
- Isolated central mounting hole
- Dynamic dV/dt rated
- Repetitive avalanche-rated
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
Note
This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information/tables in this datasheet for details.
| PRODUCT SUMMARY | ||
| VDS (V) | 600 | |
| RDS(on) (W) | VGS = 10 V | 0.40 |
| Qg (max.) (nC) | 120 | |
| Qgs (nC) | 29 | |
| Qgd (nC) | 48 | |
| Configuration | Single | |
DESCRIPTION
- This new series of low-charge Power MOSFETs achieve significantly lower gate charges over conventional MOSFETs.
- Utilizing advanced Power MOSFETs technology the device improvements allow for reduced gate drive requirements, faster switching speeds and increased total system savings.
- These device improvements combined with the proven ruggedness and reliability of Power MOSFETs offer the designer a new standart in power transistors for switching applications.
- The TO-247AC package is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220AB devices. The TO-247AC is similar but superior to the earlier TO-218 package because of its isolated mounting hole.
| ORDERING INFORMATION | |
| Package | TO-247AC |
| Lead (Pb)-free | IRFPC60LCPbF |
| ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) | |||||
| PARAMETER | SYMBOL | LIMIT | UNIT | ||
| Drain-source voltage | VDS | 600 | V | ||
| Gate-source voltage | VGS | ± 30 | |||
| Continuous drain current | VGS at 10 V | TC = 25 °C | ID | 16 |
A |
| TC = 100 °C | 10 | ||||
| Pulsed drain current a | IDM | 64 | |||
| Linear derating factor | 2.2 | W/°C | |||
| Single pulse avalanche energy b | EAS | 1000 | mJ | ||
| Repetitive avalanche current a | IAR | 16 | A | ||
| Repetitive avalanche energy a | EAR | 28 | mJ | ||
| Maximum power dissipation | TC = 25 °C | PD | 280 | W | |
| Peak diode recovery dV/dt c | dV/dt | 3.0 | V/ns | ||
| Operating junction and storage temperature range | TJ, Tstg | -55 to +150 | °C | ||
| Soldering recommendations (peak temperature) | for 10 s | 300 d | |||
| Mounting torque | 6-32 or M3 screw | 10 | lbf · in | ||
| 1.1 | N · m | ||||
Notes
- Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- VDD = 25 V, starting TJ = 25 °C, L = 7.2 mH, Rg = 25 Ω, IAS = 16 A (see fig. 12)
- ISD ≤ 16 A, dI/dt ≤ 140 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
- 1.6 mm from the case
| THERMAL RESISTANCE RATINGS | ||||
| PARAMETER | SYMBOL | TYP. | MAX. | UNIT |
| Maximum junction-to-ambient | RthJA | – | 40 | °C/W |
| Case-to-sink, flat, greased surface | RthCS | 0.24 | – | |
| Maximum junction-to-case (drain) | RthJC | – | 0.45 | |
SPECIFICATIONS
Notes
- Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- Pulse width ≤ 300 μs; duty cycle ≤ 2 %
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Package Information
TO-247AC (High Voltage)
VERSION 1: FACILITY CODE = 9
| MILLIMETERS | ||||
| DIM. | MIN. | NOM. | MAX. | NOTES |
| A | 4.83 | 5.02 | 5.21 | |
| A1 | 2.29 | 2.41 | 2.55 | |
| A2 | 1.17 | 1.27 | 1.37 | |
| b | 1.12 | 1.20 | 1.33 | |
| b1 | 1.12 | 1.20 | 1.28 | |
| b2 | 1.91 | 2.00 | 2.39 | 6 |
| b3 | 1.91 | 2.00 | 2.34 | |
| b4 | 2.87 | 3.00 | 3.22 | 6, 8 |
| b5 | 2.87 | 3.00 | 3.18 | |
| c | 0.40 | 0.50 | 0.60 | 6 |
| c1 | 0.40 | 0.50 | 0.56 | |
| D | 20.40 | 20.55 | 20.70 | 4 |
| MILLIMETERS | ||||
| DIM. | MIN. | NOM. | MAX. | NOTES |
| D1 | 16.46 | 16.76 | 17.06 | 5 |
| D2 | 0.56 | 0.66 | 0.76 | |
| E | 15.50 | 15.70 | 15.87 | 4 |
| E1 | 13.46 | 14.02 | 14.16 | 5 |
| E2 | 4.52 | 4.91 | 5.49 | 3 |
| e | 5.46 BSC | |||
| L | 14.90 | 15.15 | 15.40 | |
| L1 | 3.96 | 4.06 | 4.16 | 6 |
| Ø P | 3.56 | 3.61 | 3.65 | 7 |
| Ø P1 | 7.19 ref. | |||
| Q | 5.31 | 5.50 | 5.69 | |
| S | 5.51 BSC | |||
Notes
- Package reference: JEDEC® TO247, variation AC
- All dimensions are in mm
- Slot required, notch may be rounded
- Dimensions D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm
- Dimensions b2 and b4 do not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total over b2 and b4 dimension at maximum material condition
VERSION 2: FACILITY CODE = Y
| MILLIMETERS | |||
| DIM. | MIN. | MAX. | NOTES |
| A | 4.58 | 5.31 | |
| A1 | 2.21 | 2.59 | |
| A2 | 1.17 | 2.49 | |
| b | 0.99 | 1.40 | |
| b1 | 0.99 | 1.35 | |
| b2 | 1.53 | 2.39 | |
| b3 | 1.65 | 2.37 | |
| b4 | 2.42 | 3.43 | |
| b5 | 2.59 | 3.38 | |
| c | 0.38 | 0.86 | |
| c1 | 0.38 | 0.76 | |
| D | 19.71 | 20.82 | |
| D1 | 13.08 | – | |
| MILLIMETERS | |||
| DIM. | MIN. | MAX. | NOTES |
| D2 | 0.51 | 1.30 | |
| E | 15.29 | 15.87 | |
| E1 | 13.72 | – | |
| e | 5.46 BSC | ||
| Ø k | 0.254 | ||
| L | 14.20 | 16.25 | |
| L1 | 3.71 | 4.29 | |
| Ø P | 3.51 | 3.66 | |
| Ø P1 | – | 7.39 | |
| Q | 5.31 | 5.69 | |
| R | 4.52 | 5.49 | |
| S | 5.51 BSC | ||
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994
- Contour of the slot optional
- Dimensions D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
- Outline conforms to JEDEC outline TO-247 with the exception of dimension c
VERSION 3: FACILITY CODE = N
| MILLIMETERS | MILLIMETERS | |||||
| DIM. | MIN. | MAX. | DIM. | MIN. | MAX. | |
| A | 4.65 | 5.31 | D2 | 0.51 | 1.35 | |
| A1 | 2.21 | 2.59 | E | 15.29 | 15.87 | |
| A2 | 1.17 | 1.37 | E1 | 13.46 | – | |
| b | 0.99 | 1.40 | e | 5.46 BSC | ||
| b1 | 0.99 | 1.35 | k | 0.254 | ||
| b2 | 1.65 | 2.39 | L | 14.20 | 16.10 | |
| b3 | 1.65 | 2.34 | L1 | 3.71 | 4.29 | |
| b4 | 2.59 | 3.43 | N | 7.62 BSC | ||
| b5 | 2.59 | 3.38 | P | 3.56 | 3.66 | |
| c | 0.38 | 0.89 | P1 | – | 7.39 | |
| c1 | 0.38 | 0.84 | Q | 5.31 | 5.69 | |
| D | 19.71 | 20.70 | R | 4.52 | 5.49 | |
| D1 | 13.08 | – | S | 5.51 BSC | ||
| ECN: E22-0452-Rev. G, 31-Oct-2022 DWG: 5971 | ||||||
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994
- Contour of the slot optional
- Dimensions D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
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CONTACT
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Documents / Resources
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VISHAY IRFPC60LC Power MOSFET [pdf] Owner's Manual IRFPC60LC, IRFPC60LC Power MOSFET, Power MOSFET, MOSFET |