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Product Guide
1111C Series Ultra Compact SMT LED

STANLEY 1111C Series Ultra Compact SMT LED

Features

  • Meets industry standards for 1608 (0603) footprint
  • Provides bright, wide and uniform spatial distribution
  • Excellent for cellular telephone key pads,
  • LCD backlighting and pager display application.

Applications

  • Mobile devices (cellular telephones, PDAs, pagers)
  • Industrial / Medical instrumentation

Outline Dimensions

STANLEY 1111C Series Ultra Compact SMT LED - Outline Dimensions

Electro-Optical Characteristics

(Ta=25°C)

Type No. Material Emitted
Color
Lens
Color
MIN. Luminous Intensity
TYP.
Iv
IF
Peak
4 TYP.
Dominant
ad
TYP.
Wavelength
Spectral Line Halt Width
9, TYP.
IF TYP Forward Voltage
MAX.
vr
IF
Reverse Current
MAX.
IR
VR
Viewing
Angle
(2 0 1/2)
BR1111C GaAIAs Red Milky
White
7.0 11.7 20 660 647 30 20 1.7 2.3 20 100 4 140°
AA1111C GaAsP Orange 2.0 3.4 20 605 606 30 20 2.2 2.8 20 100 4 150°
AY1111C GaAsP Yellow 2.0 3.4 20 580 590 30 20 2.2 2.8 20 100 4
PY1111C GaP Yellow Green 7.0 11.7 20 570 572 30 20 2.1 2.8 20 100 4
PG1111C GaP Green 3.8 6.4 20 560 567 30 20 2.1 2.8 20 100 4
BG1111C GaP Pure Green 1.4 2.4 20 555 558 30 20 2.1 2.8 20 100 4
Units mcd mA nm mA V mA pA V Deg.

Absolute Maximum Ratings

Red Orange Yellow Yellow
Green
Green Pure
Green
Units
Item Symbol BR AA AY PY PG PY
Power Dissipation Pd 58. 70 70 70 70 70 mW
Forward Current IF 25 25 25 25 25 25 mA
Peak Forward Current IRA 60 60 60 60 60 60 mA
Reverse Voltage VR 4 4 4 4 4 4 V
Operating Temperature Topr -30 to +85 °C
Storage Temperature Tstg -40 to +100 °C
Derating* AIF 0.36 (DC) 0.86 (Pulse) mA/°C

* Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.

Operation Current Derating Chart (DC)

Spatial Distribution

STANLEY 1111C Series Ultra Compact SMT LED - Spatial Distribution

Taping Specifications

STANLEY 1111C Series Ultra Compact SMT LED - Taping

Precautions

Please follow these handling precautions to prevent damage to the chip and ensure its reliability.

1. Soldering conditions:

  • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max.
  • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
  • Reflow Soldering:

STANLEY 1111C Series Ultra Compact SMT LED - Soldering conditions

2. Cleaning:

  • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C.
  • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
  • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after  confirming there is no problem.
    Product specifications subject to change without notice. PG1111C-0301

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Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606
•• Tel: 800-LED-LCD1 (533-5231)
•• Fax: 949-222-0555
Website: www.stanley-electric.com

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Documents / Resources

STANLEY 1111C Series Ultra Compact SMT LED [pdf] User Guide
1111C Series Ultra Compact SMT LED, 1111C Series, Ultra Compact SMT LED, Compact SMT LED, SMT LED, LED

References

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