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KingDian DDR Memory Molekane ea Tšepahalang
Mabapi le rona
Shen Zhen KingDian Technology Co, Ltd. e thehiloe ka 2010, ke e 'ngoe ea lik'hamphani tsa pele tsa theknoloji e phahameng tse sebetsanang le SSD Solid State Drive, DDR Memories R&D, tlhahiso le papatso China.
Ho tloha ka letsatsi la ho thehoa ha eona, k'hamphani ea rona e 'nile ea inehela temong e matla ea SSD Solid State Drive le DDR Memory indasteri, e fana ka litharollo tse theko e tlaase le tsa boleng ba polokelo bakeng sa mefuta eohle ea bophelo. Ho fihlela joale, re se re thehile liofisi tsa makala Korea Boroa, Latin America, Amerika Leboea, Mexico, Indonesia, Malaysia, Philippines le Vietnam. Fana ka bareki ka lits'ebeletso tse ngata tsa profeshenale, tse nakong, le tse felletseng tsa lehae!
naheng ea China. re na le likanale tsa kabo liprofinseng tse 28! Kamehla re beha boleng ba lihlahisoa sebakeng sa bohlokoa ka ho fetisisa. re lumela ka tieo hore: Boleng ba sehlahisoa ke bophelo ba k'hamphani!
Khamphani ea rona e na le baenjiniere ba bangata ba litsebi, le lisebelisoa tse tsoetseng pele, ho netefatsa hore lihlahisoa tsa rona li ka lekoa ka litekanyetso tse thata le tse sebetsang tsa indasteri ho tsoa letotong la lits'ebetso tse thata joalo ka tlhahlobo ea thepa, taolo ea ts'ebetso ea tlhahiso, tlhahlobo ea lihlahisoa le taolo ea kotsi ea boleng, ka hona, etsa bonnete ba ho fana ka lihlahisoa tse khotsofatsang ka ho fetisisa ho basebelisi ba rona!
Re ikemiselitse ho fa bareki lihlahisoa tsa boleng bo holimo, tse theko e boima ka ho fetisisa. le ho lula re ntlafatsa ts'ebeletso e hlokolosi ea pele ho thekiso, thekiso le kamora ho rekisa, re ikitlaelletsa ho tsoela pele ho etsa boleng ba bareki ba rona.
Pono ea rona:
Ho etsa "KingDian SSD" ho fetoha lets'oao le tsebahalang la polokelo lefatšeng!
Sepheo sa rona:
- Fana ka bareki ka lihlahisoa le litšebeletso tsa boleng bo holimo!
- Fana ka sethala se setle sa kholo ea basebetsi!
- Ho theha phaello e tsitsitseng ea matsete bakeng sa beng ba liabo!
- Ho theha boleng ba toka le botšepehi sechabeng!
Ea rona view ea boleng:
Boleng ke bophelo ba khoebo hobane litlhare li hloka ho lefa ho feta.
Litekanyetso tsa rona:
Pragmatism, boqapi, ho ea holimo, mahlahahlaha!
DDR5 UDIMM Series(R51 Series)
| Letoto | DDRS UDIMM Series(RSl Series) | |||
| Brand | KingDian | |||
| Bokhoni | 16GB | 32GB | ||
| Nomoro ea Mohlala | R51-DDR5-PC-16GB | R51-DDR5-PC-32GB | ||
| Lebelo la Memori (/) | 4800MHz | 5600MHz | 4800MHz | 5600MHz |
| Bophahamo ba Memori(GB/s) | 38400 | 44800 | 38400 | 44800 |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8 | 2Rx8 | 2Rx8 |
| Bokamoso ba CAS | 40-40-40-77 | 47-47-47-90 | 40-40-40-77 | 47-47-47-90 |
| Tshebetso Voltage | 1.1V | 1.1V | 1.1V | 1.1V |
| Nomoro ea Memory IC | 8/16 | |||
| Tšebeliso ea Matla | 3W | |||
| Molaoli IC | NO | |||
| Tšehetso ea Overclock (YES/CHE) | NO | |||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | |||
| Net Weight (g) | 44g | |||
| Boima ba 'mele(g) | 80g | |||
| Palo ea Pin | 262 | |||
| OEM / ODM tšehetso | EE | |||
| Sekepe sa Mocheso/ Sephadi sa mocheso | EE | |||
| Mabone a RGB | EE | |||
| Sebopeho sa Foromo | UDIMM | |||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | |||
| Mocheso oa ho sebetsa | 0~70°C | |||
| Mocheso oa polokelo | -40 ~ 85°C | |||
| Tiisetso | Lilemo tse 3 | |||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | (Nngwe/Habedi) | |||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 69x30x4.0mm | |||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | |||
| Memori IC Brand | Micron/Samsung/Sk Hynix | |||
DDR4 RGB Ka Heatsink UDIMM Series(R11 Series)
| Brand | KingDian | ||
| Bokhoni | 8GB | 16GB | 32GB |
| Nomoro ea Mohlala | RII DDR4 – PC – 8GB | RII DDR4 – PC – 16GB | RII DDR4 – PC – 32GB |
| Lebelo la Memori (/) | 2666/3000/3200/3600MHz | 2666/3000/3200/3600MHz | 2666/3000/3200/3600MHz |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8 | 2Rx8 |
| CAS Latency-2666MHz | 9-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3000MHz | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3200MHz | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 |
| CAS Latency-3600MHz | 18-22-22-42 | 18-22-22-42 | 18-22-22-42 |
| Nomoro ea Memory IC | 4 // 8 // 16 | ||
| Tshebetso Voltage | 1.2V | ||
| Tšebeliso ea Matla | 3W | ||
| Net Weight (g) | 44g | ||
| Boima ba 'mele(g) | 80g | ||
| Molaoli IC | NO | ||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | ||
| Tšehetso ea Overclock (YES/CHE) | NO | ||
| Sekepe sa Mocheso/ Sephadi sa mocheso | EE | ||
| Mabone a RGB | EE | ||
| OEM / ODM tšehetso | EE | ||
| Palo ea Pin | 288 | ||
| Sebopeho sa Foromo | UDIMM | ||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | ||
| Mocheso oa ho sebetsa | ~ 70 ° C | ||
| Mocheso oa polokelo | -40 ~ 85°C | ||
| Tiisetso | Lilemo tse 3 | ||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | (Nngwe/Habedi) | ||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 145x46x5.5mm | ||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | ||
| Memori IC Brand | Micron/Samsung/Sk Hynix | ||
DDR4 Ka Heatsink UDIMM SeriesH11 Series)
| Letoto | DDR4 Ka Heatsink UDIMM Series (Hll Series) | |||
| Brand | KingDian | |||
| Bokhoni | 4GB | 8GB | 16GB | 32GB |
| Nomoro ea Mohlala | HII DDR4-PC-4GB | HII DDR4-PC-8GB | HII DDR4-PC-16GB | HII DDR4-PC-32GB |
| Lebelo la Memori (/) | 2400/2666/3200MHz | 2666/3200MHz | 2666/3200MHz | 2666/3200MHz |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8 | 2Rx8 | 2Rx8 |
| CAS Latency-2400MHz | 17-17-17-39 | |||
| CAS Latency-2666MHz | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3200MHz | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 |
| Nomoro ea Memory IC | 4/8/16 | |||
| Tshebetso Voltage | 1.2V | |||
| Tšebeliso ea Matla | 3W | |||
| Net Weight (g) | 36g | |||
| Boima ba 'mele(g) | 72g | |||
| Molaoli IC | NO | |||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | |||
| Tšehetso ea Overclock (YES/CHE) | NO | |||
| Sekepe sa Mocheso/ Sephadi sa mocheso | EE | |||
| OEM / ODM tšehetso | EE | |||
| Palo ea Pin | 288 | |||
| Sebopeho sa Foromo | UDIMM | |||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | |||
| Mocheso oa ho sebetsa | 0~70°C | |||
| Mocheso oa polokelo | -40 ~ 85°C | |||
| Tiisetso | Lilemo tse 3 | |||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | (Nngwe/Habedi) | |||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 145x43x5mm | |||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | |||
| Memori IC Brand | Micron/Samsung/Sk Hynix | |||
DDR4 UDIMM RGB Series(RH41 Series)
| Letoto | DDR4 RGB Ka Heatsink UDIMM Series(RH41 Series) | ||
| Brand | KingDian | ||
| Bokhoni | 8GB | 16GB | 32GB |
| Nomoro ea Mohlala | RH41 DDR4-PC-8GB | RH41 DDR4-PC-16GB | RH41 DDR4-PC-32GB |
| Lebelo la Memori (/) | 2666/3000/3200/3600MHz | 2666/3000/3200/3600MHz | 2666/3000/3200/3600MHz |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8 | 2Rx8 |
| CAS Latency-2666MHz | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3000MHz | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3200MHz | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 |
| CAS Latency-3600MHz | 18-22-22-42 | 18-22-22-42 | 18-22-22-42 |
| Nomoro ea Memory IC | 4/8/16 | ||
| Tshebetso Voltage | 1.2V | ||
| Tšebeliso ea Matla | 3W | ||
| Net Weight (g) | 52g | ||
| Boima ba 'mele(g) | 80g | ||
| Molaoli IC | NO | ||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | ||
| Tšehetso ea Overclock (YES/CHE) | NO | ||
| Sekepe sa Mocheso/ Sephadi sa mocheso | EE | ||
| Mabone a RGB | EE | ||
| OEM / ODM tšehetso | EE | ||
| Palo ea Pin | 288 | ||
| Sebopeho sa Foromo | UDIMM | ||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | ||
| Mocheso oa ho sebetsa | 0~70°C | ||
| Mocheso oa polokelo | -40 ~ 85°C | ||
| Tiisetso | Lilemo tse 3 | ||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | (Nngwe/Habedi) | ||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 138x52x6mm | ||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | ||
| Memori IC Brand | Micron/Samsung/Sk Hynix | ||
DDR4 UDIMM Heat Sink Series(H41 Series)
| Letoto | DDR4 Ka Heatsink UDIMM Series(H41 Series) | |||
| Brand | KingDian | |||
| Bokhoni | 4GB | 8GB | 16GB | 32GB |
| Nomoro ea Mohlala | H41 DDR4-PC-4GB | H41DDR4-PC-8GB | H41 DDR4-PC-16GB | H41DDR4-PC-32GB |
| Lebelo la Memori (/) | 2400/2666/3200MHz | 2666/3200MHz | 2666/3200MHz | 2666/3200MHz |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8 | 2Rx8 | 2Rx8 |
| CAS Latency-2400MHz | 17-17-17-39 | |||
| CAS Latency-2666MHz | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3200MHz | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 |
| Nomoro ea Memory IC | 4/8/16 | |||
| Tshebetso Voltage | 1.2V | |||
| Tšebeliso ea Matla | 3W | |||
| Net Weight (g) | 52g | |||
| Boima ba 'mele(g) | 80g | |||
| Molaoli IC | NO | |||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | |||
| Tšehetso ea Overclock (YES/CHE) | NO | |||
| Sekepe sa Mocheso/ Sephadi sa mocheso | EE | |||
| OEM / ODM tšehetso | EE | |||
| Palo ea Pin | 288 | |||
| Sebopeho sa Foromo | UDIMM | |||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | |||
| Mocheso oa ho sebetsa | 0~10°c | |||
| Mocheso oa polokelo | -40 ~ 85°C | |||
| Tiisetso | Lilemo tse 3 | |||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | (Nngwe/Habedi) | |||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 138x52x6mm | |||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | |||
| Memori IC Brand | Micron/Samsung/Sk Hynix | |||
DDR4 UDIMM RGB Series(RH42 Series)
| Letoto | DDR4 RGB Ka Heatsink Letoto la UDIMM(RH42 Letoto) | ||
| Brand | KingDian | ||
| Bokhoni | 8GB | 16GB | 32GB |
| Nomoro ea Mohlala | RH42 DDR4-PC-8GB | RH42 DDR4-PC-16GB | RH42 DDR4-PC-32GB |
| Lebelo la Memori (/) | 2666/3000/3200/3600MHz | 2666/3000/3200/3600MHz | 2666/3000/3200/3600MHz |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8 | 2Rx8 |
| CAS Latency-2666MHz | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3000MHz | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3200MHz | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 |
| CAS Latency-3600MHz | 18-22-22-42 | 18-22-22-42 | 18-22-22-42 |
| Nomoro ea Memory IC | 4 // 8 // 16 | ||
| Tshebetso Voltage | 1.2V | ||
| Tšebeliso ea Matla | 3W | ||
| Net Weight (g) | 48g | ||
| Boima ba 'mele(g) | 80g | ||
| Molaoli IC | NO | ||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | ||
| Tšehetso ea Overclock (YES/CHE) | NO | ||
| Sekepe sa Mocheso/ Sephadi sa mocheso | EE | ||
| Mabone a RGB | EE | ||
| OEM / ODM tšehetso | EE | ||
| Palo ea Pin | 288 | ||
| Sebopeho sa Foromo | UDIMM | ||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | ||
| Mocheso oa ho sebetsa | 0~70°C | ||
| Mocheso oa polokelo | -40 ~ 85°C | ||
| Tiisetso | Lilemo tse 3 | ||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | (Nngwe/Habedi) | ||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 135x45x6mm | ||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | ||
| Memori IC Brand | Micron/Samsung/Sk Hynix | ||
DDR4 UDIMM Heat Sink Series(H42 Series)
| Letoto | DDR4 Ka Heatsink UDIMM Series{H42 Series) | |||
| Brand | KingDian | |||
| Bokhoni | 4GB | 8GB | 16GB | 32GB |
| Nomoro ea Mohlala | H42 DDR4-PC-4GB | H42 DDR4-PC-8GB | H42 DDR4-PC-16GB | H42 DDR4-PC-32GB |
| Lebelo la Memori (/) | 2400/2666/3200MHz | 2666/3200MHz | 2666/3200MHz | 2666/3200MHz |
| Rank(1Rx8/2Rx8/8Rx4} | 1Rx8 | 1Rx8 | 2Rx8 | 2Rx8 |
| CAS Latency-2400MHz | 17-17-17-39 | |||
| CAS Latency-2666MHz | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3200MHz | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 |
| Nomoro ea Memory IC | 4/8/16 | |||
| Tshebetso Voltage | 1.2V | |||
| Tšebeliso ea Matla | 3W | |||
| Net Weight (g) | 52g | |||
| Boima ba 'mele(g) | 80g | |||
| Molaoli IC | NO | |||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | |||
| Tšehetso ea Overclock (YES/CHE} | NO | |||
| Sekepe sa Mocheso/ Sephadi sa mocheso | EE | |||
| OEM / ODM tšehetso | EE | |||
| Palo ea Pin | 288 | |||
| Sebopeho sa Foromo | UDIMM | |||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM} | DRAM | |||
| Mocheso oa ho sebetsa | 0~70°C | |||
| Mocheso oa polokelo | -40 ~ 85°C | |||
| Tiisetso | Lilemo tse 3 | |||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | {Lesoha/Habeli) | |||
| Boemo ba Sehlahisoa {W x Dx H}ka limilimithara | 135x45x6mm | |||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | |||
| Memori IC Brand | Micron/Samsung/Sk Hynix | |||
Letoto la DDR5 UDIMM
| Letoto | DDRS UDIMM Series | |||
| Brand | KingDian | |||
| Bokhoni | 16GB | 32GB | ||
| Nomoro ea Mohlala | DDRS-PC-16GB | DDRS-PC-32GB | ||
| Lebelo la Memori (/) | 4800MHz | 5600MHz | 4800MHz | 5600MHz |
| Bophahamo ba Memori(GB/s) | 38400 | 44800 | 38400 | 44800 |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8 | 2Rx8 | 2Rx8 |
| Bokamoso ba CAS | 40-40-40-77 | 47-47-47-90 | 40-40-40-77 | 47-47-47-90 |
| Tshebetso Voltage | l.lV | 1.25V | l.lV | 1.25V |
| Nomoro ea Memory IC | 8/16 | |||
| Tšebeliso ea Matla | 3W | |||
| Molaoli IC | NO | |||
| Tšehetso ea Overclock (YES/CHE) | NO | |||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | |||
| Net Weight (g) | 20g | |||
| Boima ba 'mele(g) | 45g | |||
| Palo ea Pin | 288 | |||
| OEM / ODM tšehetso | EE | |||
| Sekepe sa Mocheso/ Sephadi sa mocheso | NO | |||
| Sebopeho sa Foromo | UDIMM | |||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | |||
| Mocheso oa ho sebetsa | 0~70°C | |||
| Mocheso oa polokelo | -40 ~ 85°C | |||
| Tiisetso | Lilemo tse 3 | |||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | (Nngwe/Habedi) | |||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 133X30X4.0mm | |||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | |||
| Memori IC Brand | Micron/Samsung/Sk Hynix | |||
Letoto la DDR5 SODIMM
| Letoto | DDRS SODIMM Letoto | |||
| Brand | KingDian | |||
| Bokhoni | 16GB | 32GB | ||
| Nomoro ea Mohlala | DDR5-NB-16GB | DDR5-NB-32GB | ||
| Lebelo la Memori (/) | 4800MHz | 5600MHz | 4800MHz | 5600MHz |
| Bophahamo ba Memori(GB/s) | 38400 | 44800 | 38400 | 44800 |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8 | 2Rx8 | 2Rx8 |
| Bokamoso ba CAS | 40-40-40-77 | 47-47-47-90 | 40-40-40-77 | 47-47-47-90 |
| Tshebetso Voltage | l.lV | l.lV | l.lV | l.lV |
| Nomoro ea Memory IC | 8/16 | |||
| Tšebeliso ea Matla | 3W | |||
| Molaoli IC | NO | |||
| Tšehetso ea Overclock (YES/CHE) | NO | |||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | |||
| Net Weight (g) | 10g | |||
| Boima ba 'mele(g) | 45g | |||
| Palo ea Pin | 262 | |||
| OEM / ODM tšehetso | EE | |||
| Sekepe sa Mocheso/ Sephadi sa mocheso | NO | |||
| Sebopeho sa Foromo | SODIMM | |||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | |||
| Mocheso oa ho sebetsa | 0~70°C | |||
| Mocheso oa polokelo | -40 ~ 85°C | |||
| Tiisetso | Lilemo tse 3 | |||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | (Nngwe/Habedi) | |||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 69x30x4.0mm | |||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | |||
| Memori IC Brand | Micron/Samsung/Sk Hynix | |||
Letoto la DDR4 UDIMM
| Letoto | Letoto la DDR4 UDIMM | |||
| Brand | KingDian | |||
| Bokhoni | 4GB | 8GB | 16GB | 32GB |
| Nomoro ea Mohlala | DDR4-PC-4GB | DDR4-PC-8GB | DDR4-PC-16GB | DDR4-PC-32GB |
| Lebelo la Memori (/) | 2400/2666MHz | 2400/2666/3200MHz | 2666/3200MHz | 2666/3200MHz |
| Bophahamo ba Memori(GB/s) | 19200 | 21300 | 21300 | 21300 |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8 | 2Rx8 | 2Rx8 |
| CAS Latency-2400MHz | 17-17-17-39 | 17-17-17-39 | ||
| CAS Latency-2666MHz | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3200MHz | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 | |
| Nomoro ea Memory IC | 4/8/16 | |||
| Tšebeliso ea Matla | 3W | |||
| Molaoli IC | NO | |||
| Tšehetso ea Overclock (YES/CHE) | NO | |||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | |||
| Net Weight (g) | 20g | |||
| Boima ba 'mele(g) | 45g | |||
| Palo ea Pin | 288 | |||
| Tshebetso Voltage | 1.2V | |||
| OEM / ODM tšehetso | EE | |||
| Sekepe sa Mocheso/ Sephadi sa mocheso | NO | |||
| Sebopeho sa Foromo | UDIMM | |||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | |||
| Mocheso oa ho sebetsa | 0~70°C | |||
| Mocheso oa polokelo | -40 ~ 85°c | |||
| Tiisetso | Lilemo tse 3 | |||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | (Nngwe/Habedi) | |||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 133x30x4.0mm | |||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | |||
| Memori IC Brand | Micron/Samsung/Sk Hynix | |||
Letoto la DDR4 SODIMM
| Letoto | Letoto la DDR4 SODIMM | |||
| Brand | KingDian | |||
| Bokhoni | 4GB | 8GB | 16GB | 32GB |
| Nomoro ea Mohlala | DDR4-NB-4GB | DDR4-NB-8GB | DDR4-NB-16GB | DDR4-NB-32GB |
| Lebelo la Memori (/) | 2400/2666MHz | 2400/2666/3200MHz | 2666/3200MHz | 2666/3200MHz |
| Bophahamo ba Memori(GB/s) | 19200 | 21300 | 21300 | 21300 |
| Rank(1Rx8/2Rx8/8Rx4} | 1Rx8 | 1Rx8 | 2Rx8 | 2Rx8 |
| CAS Latency-2400MHz | 17-17-17-39 | 17-17-17-39 | ||
| CAS Latency-2666MHz | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 | 19-19-19-43 |
| CAS Latency-3200MHz | 22-22-22-52 | 22-22-22-52 | 22-22-22-52 | |
| Nomoro ea Memory IC | 4/8/16 | |||
| Tshebetso Voltage | 1.2V | |||
| Tšebeliso ea Matla | 3W | |||
| Net Weight (g) | 15g | |||
| Boima ba 'mele(g) | 40g | |||
| Molaoli IC | NO | |||
| Tšehetso ea Overclock (YES/CHE} | NO | |||
| Sekepe sa Mocheso/ Sephadi sa mocheso | NO | |||
| ECC(Khouto ya Phoso ya Phoso)(YES/NO} | NO | |||
| Palo ea Pin | 260 | |||
| OEM / ODM tšehetso | EE | |||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM} | DRAM | |||
| Mocheso oa ho sebetsa | 0~70°C | |||
| Mocheso oa polokelo | -40 ~ 85°C | |||
| Tiisetso | Lilemo tse 3 | |||
| Sebopeho sa Foromo | SODIMM | |||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | (Nngwe/Habedi) | |||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 70x30x3.5mm | |||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | |||
| Memori IC Brand | Micron/Samsung/Sk Hynix | |||
DDR3 UDIMM Seires
| Letoto | Letoto la DDR3 UDIMM | ||
| Brand | KingDian | ||
| Bokhoni | 2GB | 4GB | 8GB |
| Nomoro ea Mohlala | DDR3-PC-2GB | DDR3-PC-4GB | DDR3-PC-8GB |
| Lebelo la Memori (/) | 1333MHz | 1333/1600MHz | 1333/1600MHz |
| Bophahamo ba Memori (GB/s) | 10700 | 12800 | 12800 |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8/2Rx8 | 2Rx8 |
| CAS Latency-1333MHz | 9-9-9-24 | 9-9-9-24 | 9-9-9-24 |
| CAS Latency-1600MHz | 11-11-11-28 | 11-11-11-28 | |
| Nomoro ea Memory IC | 8 | 8/16 | 8/16 |
| Palo ea Pin | 240 | ||
| Net Weight (g) | 17g | ||
| Boima ba 'mele(g) | 42g | ||
| ECC(Khouto ea Phoso ea Phoso)(YES/NO) | NO | ||
| Tšehetso ea Overclock (YES/CHE) | NO | ||
| Sekepe sa Mocheso/ Sephadi sa mocheso | NO | ||
| OEM / ODM tšehetso | EE | ||
| Tshebetso Voltage | 1.SV | ||
| Molaoli IC | Ha ho letho | ||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | ||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | Motho a le mong | ||
| Mocheso oa ho sebetsa | 0~70°C | ||
| Mocheso oa polokelo | -40 ~ 85°C | ||
| Sebopeho sa Foromo | UDIMM | ||
| Tiisetso | Lilemo tse 3 | ||
| Tšebeliso ea Matla | 6W Boholo | ||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 133x30x4.0mm | ||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | ||
| Memori IC Brand | Micron/Samsung/Sk Hynix | ||
Letoto la DDR3 SODIMM
| Letoto | Letoto la DDR3 SODIMM | ||
| Brand | KingDian | ||
| Bokhoni | 2GB | 4GB | 8GB |
| Nomoro ea Mohlala | DDR3-NB-2GB | DDR3-NB-4GB | DDR3-NB-8GB |
| Lebelo la Memori (/) | 1333MHz | 1333/1600MHz | 1333/1600MHz |
| Bophahamo ba Memori (GB/s) | 10700 | 12800 | 12800 |
| Rank(1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8/2Rx8 | 2Rx8 |
| CAS Latency-1333MHz | 9-9-9-24 | 9-9-9-24 | 9-9-9-24 |
| CAS Latency-1600MHz | 11-11-11-28 | 11-11-11-28 | |
| Nomoro ea Memory IC | 8 | 8/16 | 8/16 |
| Palo ea Pin | 204 | ||
| Tšehetso ea Overclock (YES/CHE} | NO | ||
| Sekepe sa Mocheso/ Sephadi sa mocheso | NO | ||
| ECC(Khouto ya Phoso ya Phoso)(YES/NO} | NO | ||
| OEM / ODM tšehetso | EE | ||
| Net Weight (g) | 13g | ||
| Boima ba 'mele(g) | 38g | ||
| Tshebetso Voltage | 1.35V | ||
| Molaoli IC | Ha ho letho | ||
| Mofuta oa Memori ea Khomphutha(DRAM/SDRAM) | DRAM | ||
| Mocheso oa ho sebetsa | 0~70°C | ||
| Mocheso oa polokelo | -40~8s0c | ||
| Nomoro ea Mehala ea Memori (E le 'ngoe/Habeli) | Motho a le mong | ||
| Tiisetso | Lilemo tse 3 | ||
| Tšebeliso ea Matla | 6W Boholo | ||
| Sebopeho sa Foromo | SODIMM | ||
| Boemo ba Sehlahisoa (W x Dx H) ka limilimithara | 68x30x3.2mm | ||
| Memori (se-buffered) /Un-buffered Memory | Memori e sa buffered | ||
| Memori IC Brand | Micron/Samsung/Sk Hynix | ||
Mokhoa oa puisano
- Makala a Machaba
- HQ: Shenzhen KingDian Technology Co., Ltd. Aterese: 6th Floor, Block B2, Fuxinlin Industrial Park, Hangcheng Industrial Zone, Xixiang Street, Baoan District, Shenzhen, Guangdong, China (518102)
- Tšebeletso ea bareki: +860755-85281822
- Fax: +860755-85281822-608
- www.kingdianssd.com
- Ofisi ea Lekala ea Latin America
Aterese: Rua marquesa de santos, 27 apt 410 - Rio De aneiro-Brazil - Ofisi ea Lekala ea Amerika Leboea
Aterese:2651 S Course Dr #205 Pompano Beach-Miami-FL F33069 - Ofisi ea Lekala ea Indonesia/Malaysia
Aterese: JI.Suryo No. 137,Jagalan, Kecamatan Jebres, Kota Surakarta,Jawa Tengah, Indonesia - Ofisi ea Lekala ea Vietnam
Aterese:220 Xo Viet Nghe Tinh Street, Ward 21, Setereke sa Binh Thanh, Motse oa Ho Chi Minh, Vietnam - Ofisi ea Lekala ea Korea
Aterese: 934 Dong, Gwanak-ro Gwanak-gu Seoul, Korea - Ofisi ea Lekala ea Philippines
Aterese: 169 P. Parada St., Brgy. Sta Lucia, Motse oa San Juan 1500 Philippines - Ofisi ea Lekala Mexico
Aterese: Calle Jacarsndas Mz 156 LT 29 Hacienda Ojo de Agua, Tecamac -Estado de Mexico 55770
Litokomane / Lisebelisoa
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KingDian DDR Memory Molekane ea Tšepahalang [pdf] Buka ea Taelo DDR Memory Molekane ea Tšepahalang, DDR, Memory Molekane ea Tšepahalang, Molekane ea Tšepahalang, Molekane ea Tšepahalang, Molekane |
