NETPRISMA LCUK54-WRD IOT Verified Device

Specifications

• Product Name: LCUK54-WRD Hardware Design
• Series: LTE-A Series
• Version: 1.0.0
• Date: 2024-04-01
• Status: Preliminary

Product Information

The LCUK54-WRD Hardware Design is part of the LTE-A Series aimed at providing timely and comprehensive services to customers. For technical support and documentation errors, contact NetPrisma US INC.

Contact Information
Contact NetPrisma US INC at 100 N HOWARD ST STE R, SPOKANE, WA, 99201 or email: Info@netprisma.us. Visit here for more information.

Technical Support
For technical support or reporting documentation errors, visit here or email: support@netprisma.us.

Legal Notices
Documents and information provided are confidential unless specific permission is granted. Use of trademarks, trade names, or third-party materials shall be governed by applicable restrictions and obligations.

Privacy Policy
Data uploaded to servers for module functionality will be processed as permitted by applicable laws. Be informed of privacy and data security policies before interacting with third parties.

FAQs

Q: How can I get technical support?
A: You can visit https://www.netprisma.us/tech-support/ or email support@netprisma.us for technical assistance.

Q: Are the documents provided confidential?
A: Yes, unless specific permission is granted, the documents and information are to be kept confidential.

Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.

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To implement module functionality, certain device data are uploaded to NetPrisma’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. NetPrisma, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

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LTE-A Series
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein. c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.
Copyright © NetPrisma US 2024. All rights reserved.

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LTE-A Series

Revision History

Version 1.0.0

Date 2024-04-01 2024-04-01

Description Creation of the document Preliminary

The hardware design defines the air and hardware interfaces of LCUK54-WRD which connect to your applications.
This document can help you quickly understand the interface specifications, electrical and mechanical details as well as other related information of the module. Besides, reference designs will be offered to exemplify diverse applications of the modules. With this hardware design coupled with application notes and user guides, you can use the modules to design and set up mobile applications easily.

1.1. Reference Standards
The module complies with the following standards: PCI Express M.2 Specification Revision 4.0, Version 1.1 Universal Serial Bus Specification, Revision 4.0 ISO/IEC 7816-3 MIPI Alliance Specification for RF Front-End Control Interface Version 2.0 3GPP TS 27.007 and 3GPP TS 27.005 3GPP TS 34.121-1 and 3GPP TS 36.521-1

1.2. Special Marks
`
Table 1: Special Marks

Mark * […]

Definition
Unless otherwise specified, an asterisk (*) after a function, feature, interface, pin name, command, argument, and so on indicates that it is under development and currently not supported; and the asterisk (*) after a model indicates that the model sample is currently unavailable. Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.

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LTE-A Series

2 Product Overview

2.1. Frequency Bands and Functions
LCUK54-WRD is an LTE-A/UMTS/HSPA+ wireless communication module with diversity receiver. They provide data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks. It is a standard WWAN M.2 Key-B module. For more details, see PCI Express M.2 Specification Revision 4.0, Version 1.1.
It supports embedded operating systems such as Windows, Linux and Android, and also provides GNSS 1 to meet specific application demands.
The following table shows the frequency bands and GNSS functions of the module. For details about CA combinations, see document [1].

Table 2: Frequency Bands and GNSS Function

Mode
LTE-FDD Rx-diversity) LTE-TDD Rx-diversity) WCDMA Rx-diversity)

Frequency Band

(with (with

B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26 /B28/B29 2/B30/B32 2/B66/B71
B34/B38/B39/B40(CE)/B41

(with B1/B2/B3/B4/B5/B6/B8/B19

2.2. Key Features

Table 3: Key Features

Feature Function Interface Power Supply

Details
PCI Express M.2 Interface Supply voltage: 3.135­4.4 V Typical supply voltage: 3.7 V

1 GNSS function is optional. 2 LTE-FDD B29/B32 support Rx only and is only for secondary component carrier.
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LTE-A Series

(U)SIM Interface eSIM USB Interface Rx-diversity Antenna Interfaces Transmitting Power
LTE Features
UMTS Features GNSS Features 3 AT Commands

Compliant with ISO/IEC 7816-3, ETSI and IMT-2000 Supports (U)SIM card: 1.8/3.0 V Supports Dual SIM Single Standby (one eSIM and one USIM interface)
Supports eSIM function
Compliant with USB 2.0 specifications, with maximum transmission rates up to 480 Mbps
Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA sentence output
Supports USB serial drivers: Windows 10/11 Linux 2.6­6.x Android 4.x­13.x
LTE/WCDMA
Main antenna connector and Rx-diversity/GNSS antenna connector 50 impedance WCDMA: Class 3 (23 dBm ±2 dB) LTE B7/B38/B40(CE)/B41: Class 3 (23 dBm ±1 dB) LTE B30: Class 3 (22 dBm ±1 dB) LTE other bands: Class 3 (23.5 dBm ±1 dB) Supports 3GPP Rel-12 LTE-FDD and LTE-TDD Supports CA category: up to DL CA Cat 6 Supports modulations:
UL: QPSK and 16QAM modulations DL: QPSK, 16QAM and 64QAM modulations Supports 1.4/3/5/10/15/20 MHz RF bandwidths Max. transmission data rates: LTE-FDD: 300 Mbps (DL)/50 Mbps (UL) LTE-TDD: 226 Mbps (DL)/28 Mbps (UL) Supports 3GPP Rel-9 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Supports modulations: DL: BPSK, QPSK, 16QAM and 64QAM UL: BPSK, QPSK Max. transmission data rates: DC-HSDPA: Max. 42 Mbps (DL) HSUPA: Max. 5.76 Mbps (UL) WCDMA: Max. 384 kbps (DL)/384 kbps (UL) Supports GPS, GLONASS, BDS, Galileo and QZSS Data update rate: 1 Hz by default Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 Enhanced AT commands

3 GNSS function is optional.

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LTE-A Series

Internet Protocol Features

QMI/MBIM/NITZ/HTTP/HTTPS Supports PAP and CHAP for PPP connections

Firmware Upgrade Via USB 2.0 or DFOTA

Point-to-point MO and MT

SMS

Text and PDU modes SMS cell broadcast

SMS storage: ME by default

Physical Characteristics

M.2 Key-B Size: 30.0 mm × 42.0 mm × 2.3 mm Weight: approx. 6.2 g

Operating temperature range 4: -25 to +75 °C

Temperature Ranges Extended temperature range 5: -40 to +85 °C

Storage temperature range: -40 to +90 °C

RoHS

All hardware components are fully compliant with EU RoHS directive

2.3. Functional Diagram
The following figure shows a functional diagram of LCUK54-WRD.
Power management Baseband LPDDR2 SDRAM + NAND flash Radio frequency M.2 Key-B interface

4 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers. Within the temperature range of -10 °C to +55 °C, the mentioned RF performance margins higher than 3GPP specifications can be guaranteed. When temperature goes beyond temperature range of -10 °C to 55 °C, a few RF performances of module may be slightly off 3GPP specifications. 5 To meet the extended operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers. Within this range, the module remains the ability to establish and maintain functions such as SMS, without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again.

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EBI1 EBI2
SPMI BB_CLK 19.2 MHz RF_CLK 38.4 MHz
Transceiver Tx/Rx Blocks
APT

LTE-A Series

VCC
GND FULL_CARD_POWER_OFF#
RESET#

PMIC

38.4 MHz XO

PCI Express M.2 Key-B Interface

2Gb 8 bit NAND Flash 2Gb 32 bit LPDDR2 SDRAM
eSIM

(U)SIM I2C
WLAN_PA_EN COEX_URAT DPR
USB 2.0 RFFE
WWAN_LED# WAKE_ON_WAN#
W_DISABLE1# W_DISABLE2#

Baseband

Qlink

Control

Tx PRx DRx GNSS

Figure 1: Functional Diagram

ANT_MAIN ANT_DRX/GNSS

2.4. Pin Assignment
The following figure shows the pin assignment of the module.

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LTE-A Series

No.

Pin Name

74

VCC

72

VCC

70

VCC

68

NC

66

USIM_DET

64

COEX_TXD

62

COEX_RXD

60

WLAN_PA_EN

58

RFFE_DATA

56

RFFE_CLK

54

RESERVED

52

RESERVED

50

RESERVED

48

NC

46

NC

44

I2C_IRQ

42

I2C_SDA

40

I2C_SCL

38

NC

36

USIM_VDD

34

USIM_DATA

32

USIM_CLK

30

USIM_RST

28

RESERVED

26

W_DISABLE2#

24

RESERVED

22

RESERVED

20

RESERVED

Notch

Notch

Notch

Notch

10

WWAN_LED#

8

W_DISABLE1#

6 FULL_CARD_POWER_OFF#

4

VCC

2

VCC

PIN74

PIN75

BOT

TOP

PIN10 PIN2

PIN11 PIN1

Figure 2: Pin Assignment

Pin Name

No.

CONFIG_2

75

VIO_CFG

73

GND

71

CONFIG_1

69

RESET#

67

ANTCTL3

65

ANTCTL2

63

ANTCTL1

61

ANTCTL0

59

GND

57

RESERVED

55

RESERVED

53

GND

51

RESERVED

49

RESERVED

47

GND

45

RESERVED

43

RESERVED

41

GND

39

RESERVED

37

RESERVED

35

GND

33

RESERVED

31

RESERVED

29

GND

27

DPR

25

WAKE_ON_WAN#

23

CONFIG_0

21

Notch

Notch

Notch

Notch

GND

11

USB_DM

9

USB_DP

7

GND

5

GND

3

CONFIG_3

1

NOTE
Before the module turns on, ensure the pins DPR and USIM_DET are not pulled high to avoid current sink damaging the module. For more details, contact NetPrisma Technical Support.

2.5. Pin Definitions
Table 4: Parameter Definition

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Parameter AI AO AIO DI DO DIO OD PI PO PU

Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Pull Up

DC characteristics include power domain and rated current.

Table 5: Pin Description

Pin Pin Name
No.

1

CONFIG_3

2

VCC

3

GND

4

VCC

5

GND

FULL_CARD_ 6
POWER_OFF#

7

USB_DP

I/O Description

DC Characteristics Comment

Connected to GND DO
internally

Vmin = 3.135 V

Power supply for the

PI

Vnom = 3.7 V

module

Vmax = 4.4 V

Ground

Power supply for the

PI

Refer to Pin 2

module

Ground

Turn on/off the module VIHmax = 4.4 V

DI, PD High level: turn on

VIHmin = 1.19 V

Low level: turn off

VILmax = 0.2 V

USB differential data AIO
(+)

Internally pulled
down with a
100 k resistor. Require differential impedance of 90 .
A test point

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Airplane mode control

8

W_DISABLE1#

DI

1.8/3.3 V

Active LOW

9

USB_DM

USB differential data AIO
(-)

RF status indication

10

WWAN_LED#

OD LED

VCC

Active LOW

11

GND

Ground

12

Notch

Notch

13

Notch

Notch

14

Notch

Notch

15

Notch

Notch

16

Notch

Notch

17

Notch

Notch

18

Notch

Notch

19

Notch

Notch

20

RESERVED

21

CONFIG_0

22

RESERVED

Reserved Not connected DO internally Reserved

Wake up the host

23

WAKE_ON_WAN# OD

1.8/3.3 V

Active LOW

24

RESERVED

25

DPR

Reserved
DI, Dynamic power PU reduction

1.8 V

LCUK54-WRD_Hardware_Design

must be reserved. Internally pulled up to 1.8 V with a 100 k resistor. Require differential impedance of 90 . A test point must be reserved.
Externally pull up to 1.8 V or 3.3 V. Internally pulled up to 1.8 V.
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Active LOW

GNSS control

26

W_DISABLE2#* DI

Active LOW

1.8/3.3 V

27

GND

28

RESERVED

29

RESERVED

30

USIM_RST

31

RESERVED

32

USIM_CLK

33

GND

Ground Reserved Reserved DO (U)SIM card reset Reserved DO (U)SIM card clock Ground

USIM_VDD USIM_VDD

34

USIM_DATA

DIO (U)SIM card data

USIM_VDD

35

RESERVED

36

USIM_VDD

37

RESERVED

38

NC

39

GND

40

I2C_SCL

41

RESERVED

42

I2C_SDA

Reserved
High-Voltage: Vmin = 3.05 V Vnom = 2.85 V Vmax = 2.7 V (U)SIM card power PO supply Low-Voltage: Vmin = 1.95 V Vnom = 1.8 V Vmax = 1.65 V
Reserved
Not connected
Ground

OD I2C serial clock

1.8 V

Reserved

OD I2C serial data

1.8 V

Internally pulled up to 1.8 V with a 100 k resistor.
Internally pulled up to 1.8 V with a 10 k resistor.
Internally pulled up to 1.8 V. Internally pulled up to 1.8 V.

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43

RESERVED

Reserved

44

I2C_IRQ

DI

I2C interrupt signal 1.8 V

45

GND

Ground

46

NC

Not connected

47

RESERVED

Reserved

48

NC

Not connected

49

RESERVED

Reserved

50

RESERVED

Reserved

51

GND

Ground

52

RESERVED

Reserved

53

RESERVED

Reserved

54

RESERVED

Reserved

55

RESERVED

Reserved

Used for external MIPI

56

RFFE_CLK* 6

DO

1.8 V

IC control

57

GND

Ground

Used for external MIPI

58

RFFE_DATA* 6

DIO

1.8 V

IC control

59

ANTCTL0*

DO Antenna GPIO control 1.8 V

Self-protection of LNA

60

WLAN_PA_EN* DI

1.8 V

control

61

ANTCTL1*

DO Antenna GPIO control 1.8 V

62

COEX_RXD*

LTE/WLAN

DI

1.8 V

coexistence receive

63

ANTCTL2*

DO Antenna GPIO control 1.8 V

64

COEX_TXD*

LTE/WLAN

DO

1.8 V

coexistence transmit

65

ANTCTL3*

DO Antenna GPIO control 1.8 V

6 If RFFE_CLK and RFFE_DATA are required, contact NetPrisma Technical Support for more details.
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LTE-A Series

66

USIM_DET

67

RESET#

68

NC

69

CONFIG_1

70

VCC

71

GND

72

VCC

73

VIO_CFG

74

VCC

75

CONFIG_2

(U)SIM card hot-plug

DI

1.8 V

detect

Reset the module

DI

1.8 V

Active LOW

Internally pulled up to 1.8 V with a 100 k resistor. A test point is recommended to be reserved if unused.

Not connected

Connected to GND DO
internally

Power supply for the

PI

Refer to Pin 2

module

Ground

Power supply for the

PI

Refer to Pin 2

module

Configuration of PCIe sideband signals 7

Power domain

The default

NC: support 1.8/3.3 V; state is NC (Not

GND: support 3.3 V connected).

Power supply for the

PI

Refer to Pin 2

module

Not connected DO
internally

NOTE
Keep all RESERVED and NC and unused pins unconnected. All GND pins should be connected to ground.

7 PCIe sideband signals include PERST#, CLKREQ# and PEWAKE#.
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3LTE-A Series 3 Operating Characteristics

3.1. Operating Modes
The table below summarizes different operating modes of the module.

Table 6: Overview of Operating Modes

Mode
Full Functionality Mode
Minimum Functionality Mode Airplane Mode Sleep Mode Power Down Mode

Details

Software is active. The module has registered on the Idle
network, and it is ready to send and receive data.

Data

Network is connected. In this mode, the power consumption is decided by network setting and data transmission rate.

AT+CFUN=0 sets the module to a minimum functionality mode without removing the power supply. In this mode, both RF function and (U)SIM card are invalid.

AT+CFUN=4 or driving W_DISABLE1# pin low will set the module to airplane mode. In this mode, the RF function is invalid.

The module keeps receiving paging messages, SMS, TCP/UDP data from the network with its power consumption reduced to the minimal level.

In this mode, the power management unit shuts down the power supply. Software is inactive, while all interfaces are inaccessible and the operating

voltage (connected to VCC) remains applied.

NOTE
For more details about the AT command, see document [2].

3.2. Sleep Mode
In sleep mode, DRX (Discontinuous Reception) of the module is able to reduce the power consumption to an ultra-low level, and DRX cycle index values are broadcasted by the wireless network. The figure below shows the relationship between the DRX run time and the power consumption in sleep mode. The longer the DRX cycle is, the lower the power consumption will be.

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LTE-A Series

Power Consumption

DRX OFF ON OFF

ON OFF ON OFF ON OFF

Run Time

Figure 3: DRX Run Time and Power Consumption in Sleep Mode

NOTE
DRX cycle values are transmitted over the wireless network.

The following part of this chapter describes the power saving procedure and sleep mode of the module.
If the host supports USB Suspend/Resume and remote wakeup function, the following two conditions must be met simultaneously to bring the module into sleep mode.
Execute AT+QSCLK=1. The host’s USB bus, which is connected to the module’s USB interface, enters suspend state.
The following figure shows the connection between the module and the host.

Host

Module

USB Interface GND

USB Interface GND

Figure 4: Sleep Mode Application with USB Remote Wakeup Function

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LTE-A Series
The module will wake up when the host sends data to the module through USB interface.
3.3. Airplane Mode
Execute AT+CFUN=4 or driving W_DISABLE1# pin low will set the module to airplane mode. For more details, see Chapter 4.3.1.
3.4. Communication Interface with Host
The module supports communication with the host through USB interface. USB 2.0 should be reserved for firmware upgrade. See the USB mode features as below: USB Mode: Supports all USB 2.0 features. Supports MBIM/QMI/AT.

3.5. Power Supply

3.5.1. Power Supply Pins
Table 7: Definition of VCC and GND Pins

Pin No. 2, 4, 70, 72, 74 3, 5, 11, 27, 33, 39, 45, 51, 57, 71

Pin Name I/O Description Comment

VCC

Vmin = 3.135 V

Power supply

PI

Vnom = 3.7 V

for the module

Vmax = 4.4 V

GND

Ground

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3.5.2. Reference Design for Power Supply
The performance of the module largely depends on the power supply design. The continuous current of the power supply should be 2 A at least and the peak current should be 3 A at least.
The following figure shows a reference design for +5 V input power supply based on a DC-DC converter. The typical output of the power supply is about 3.7 V.

L1

VIN

SW

DC_IN

D1

R3

C1

C2

C3

DC-DC VOS

R5

FB EN

GND

R6

EN

Q1

R1

R2

DC_OUT

C4

C5

Figure 5: Reference Circuit for Power Supply

NOTE
To avoid corrupting the data in the internal flash, do not cut off the power supply before the module is completely turned off by pulling down FULL_CARD_POWER_OFF# pin for more than 1 s, and do not cut off power supply directly when the module is working.

3.5.3. Voltage Stability Requirements
The power supply of the module ranges from 3.135 V to 4.4 V. Please ensure that the input voltage never drops below 3.135 V, otherwise the module will be powered off automatically. The following figure shows the maximum voltage drop during burst transmission in 3G/4G networks.

Load (A)

Burst Transmission

VCC (V)
Voltage Drop 3.135 V

Burst Transmission

Voltage Ripple < 100 mV

Figure 6: Power Supply Limits During Burst Transmission

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LTE-A Series
To decrease the voltage drop, two bypass capacitors of about 220 µF with low ESR (ESR = 0.7 ) should be used, and two multi-layer ceramic chip capacitor (MLCC) arrays also should be used due to their ultra-low ESR. It is recommended to use eight ceramic capacitors (1 µF, 100 nF, 33 pF, 10 pF) to compose the MLCC arrays, and to place these capacitors close to VCC pins. The width of VCC trace should be not less than 2.5 mm. In principle, the longer the VCC trace is, the wider it should be.
In addition, to guarantee the stability of the power supply, it is recommended to use a TVS component with a reverse TVS voltage of 5.1 V and a dissipation power higher than 0.5 W. The following figure shows a reference circuit of the VCC.

VCC(3.3 V Typ.)

Module
VCC 2, 4

+

C2

C4

C6 C8 C10

220 F 1 F 100 nF 33 pF 10 pF

APT

GND 3, 5, 11

VCC 70, 72, 74

+

D1

C1

C3

5.1 V 220 F 1 F

C5 C7 100 nF 33 pF

C9 10 pF

PMU

GND 27, 33, 39, 45, 51, 57, 71

Figure 7: Reference Circuit for VCC Pins
3.5.4. Power Supply Voltage Monitoring
You can use AT+CBC to monitor the voltage value of VCC. For more details, see document [2].

3.6. Turn On
FULL_CARD_POWER_OFF# serves to turn on/off the module. This input signal is 3.3 V tolerant and can be driven by either 1.8 V or 3.3 V GPIO. Also, it has been internally pulled down with a 100 k resistor.
When FULL_CARD_POWER_OFF# is driven high ( 1.19 V), the module will be turned on.

Table 8: Pin Definition of FULL_CARD_POWER_OFF#

Pin No. Pin Name FULL_CARD_
6 POWER_OFF#

I/O

Description

Turn on/off the module DI, PD
High level: turn on

Comment
Internally pulled down with a 100 k resistor.

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LTE-A Series

Low level: turn off

It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure.

Host
GPIO

1.8 V or 3.3 V FULL_CARD_POWER_OFF#

Module

D 6 GS
R1 100K

PMU

NOTE: The voltage of pin 6 should be not less than 1.19 V when it is at high level. Figure 8: Turn On the Module Using a Host GPIO
The turn-on timing is illustrated in the following figure.

T1 VCC

RESET#

1.19 V VIH 4.4 V

FULL_ CARD_ POWER_ OFF#

VIL 0.2 V

Module State

OFF

T2
Boot ing

Figure 9: Turn-On Timing

Table 9: Turn-On Timing of the Module

Symbol Min.

Typ. Max. Comment

Act ive

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T1

100 ms –

–

T2

–

13.7 s –

The turn-on timing of the module (T1 is from RESET# high to FULL_CARD_POWER_OFF# high).
The system booting timing of the module.

NOTE
1. RESET# is automatically pulled up as soon as the module is turned on. RESET# is not allowed to be pulled down by host during the power-up process. 2. When the FULL_CARD_POWER_OFF# signal is low, please avoid any leakage current entering the module’s DPR pin from the host.

3.7. Turn Off

If the module is turned off with a host GPIO, when VCC is supplied with power, driving FULL_CARD_POWER_OFF# low ( 0.2 V) will turn off the module normally. The turn-off timing is illustrated in the following figure.
VCC

RESET#

FULL_ CARD_ POWER_ OFF#

Module Status

Act ive

Power- down procedure

OFF

T1

Figure 10: Turn-Off Timing

Table 10: Turn-Off Timing of the Module

Symbol Min.

T1

1 s

Typ. –

Max. –

Comment The turn-off timing of the module.

3.8. Reset
The RESET# pin serves to reset the module. Triggering the RESET# signal will lead to loss of all data

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from the modem and removal of system drivers. It will also lead to disconnection of the modem from the network.

Table 11: Pin Definition of RESET#

Pin No. Pin Name

67

RESET#

I/O DI, PU

Description
Reset the module Active LOW

Comment
Internally pulled up to 1.8 V with a 100 k resistor. A test point is recommended to be reserved if unused.

The module can be reset by pulling down the RESET# pin for at least 200 ms.

Host

Reset pulse

GPIO

Q1

R4

1K

R3

100K

Module

RESET#

1.8 V

R1

67

100K

R2 1K

PMU

T2

Figure 11: Reference Circuit for RESET# with Open Collector Driving Circuit The reset timing is illustrated in the following figure.

VCC T2

FULL_ CARD_ POWER_ OFF#

T1

RESET#

Module Status

Running

Reset ing

T3
Off

Figure 12: Reset Timing

Rest art

Table 12: Reset Timing of the Module

Symbol Min. Typ.

Max.

Comment

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T1

0 ms 100 ms –

T2

200 ms –

–

T3

–

50 ms –

It is recommended to pull down RESET# for about 100 ms before driving FULL_CARD_POWER_OFF# low. Driving RESET# low for at least 200 ms can reset the module.
Set up by the host, 50 ms by default.

NOTE
When the FULL_CARD_POWER_OFF# signal is low, please avoid any leakage current entering the module’s DPR pin from the host.

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4 Application Interfaces
The physical connections and signal levels of the module comply with the PCI Express M.2 specification. This chapter mainly describes the definition and application of the following interfaces/pins of the module:
(U)SIM interfaces USB interface Control and indication interfaces Antenna Tuner Control Interface* Configuration pins

4.1. (U)SIM Interfaces
The (U)SIM interfaces circuitry meet ETSI and IMT-2000 requirements and ISO/IEC 7816-3. Both Class B (3.0 V) and Class C (1.8 V) (U)SIM cards are supported, and dual SIM single standby function is supported. The module supports eSIM inside the module.

4.1.1. Pin definition of (U)SIM
Table 13: Pin Definition of (U)SIM Interfaces

Pin No. Pin Name

I/O

36

USIM_VDD

PO

Description (U)SIM card power supply

34

USIM_DATA

DIO

(U)SIM card data

32

USIM_CLK

DO

30

USIM_RST

DO

66

USIM_DET

DI

(U)SIM card clock (U)SIM card reset (U)SIM card hot-plug detect

Comment
Internally pulled up to 1.8 V with a 10 k resistor.

4.1.2. Normally Closed (U)SIM Card Connector
With a normally closed (U)SIM card connector, USIM_DET pin is normally shorted to ground when there is no (U)SIM card inserted. (U)SIM card detection by high level is applicable to this type of connector. Once (U)SIM hot-plug is enabled by executing AT+QSIMDET=1,1, insertion of a (U)SIM card will drive USIM_DET from low to high level, and the removal of it will drive USIM_DET from high to low level.

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When the (U)SIM card is absent, CD is shorted to ground and USIM_DET is at low level. When the (U)SIM card is present, CD is open from ground and USIM_DET is at high level.
The following figure shows a reference design of (U)SIM interface with a normally closed (U)SIM card connector.

Module

USIM_VDD USIM_VDD USIM_ RST

10K

USIM_ CLK

USIM_ DET

USIM_ DATA

GND

20K 22R 22R
22R

100 nF

(U)SIM Card Connect or

VCC

VPP

RST

CLK

CD

IO

GND

33 pF 33 pF 33 pF

TVS array

NOTE: All these resistors, capacitors and TVSarray should be close to (U)SIM card connector in PCB layout. The external pull- up resistor of USIM_DATA is optional.

Figure 13: Reference Circuit for Normally Closed (U)SIM Card Connector

4.1.3. Normally Open (U)SIM Card Connector
With a normally open (U)SIM card connector, CD1 and CD2 of the connector are disconnected when there is no (U)SIM card inserted. (U)SIM card detection by low level is applicable to this type of connector. Once (U)SIM hot-plug is enabled by executing AT+QSIMDET=1,0, a (U)SIM card insertion will drive USIM_DET from high to low level, and the removal of it will drive USIM_DET from low to high level.
When the (U)SIM card is absent, CD1 is open from CD2 and USIM_DET is at high level. When the (U)SIM card is present, CD1 is pull down to ground and USIM_DET is at low level. The following figure shows a reference design for (U)SIM interface with a normally open (U)SIM card connector.

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Module

USIM_VDD USIM_VDD USIM_ RST

10K

USIM_ CLK

USIM_ DET

USIM_ DATA GND

20K 22R 22R
22R

100 nF

(U)SIM Card Connector

VCC

VPP

RST

CLK CD2
CD1

IO

0R

GND

33 pF 33 pF 33 pF

TVS array
NOTE: All these resistors, capacitors and TVSarray should be close to (U)SIM card connector in PCB layout. The external pull-up resistor of USIM_DATA is optional.

Figure 14: Reference Circuit of Normally Open (U)SIM Card Connector

NOTE
1. If the (U)SIM card detection function is not needed, please keep USIM_DET unconnected. 2. If the (U)SIM card detection function is required, note that a pull-up resistor should not be added to the USIM_DET signal.
4.1.4. (U)SIM Design Notices
To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design.
Place the (U)SIM card connector as close to the module as possible. Keep the trace length less than 200 mm.
Keep (U)SIM card signals away from RF and VCC traces. Ensure the ground between the module and the (U)SIM card connector is short and wide. Keep the
trace width of ground and USIM_VDD not less than 0.2 mm to maintain the same electric potential. Keep the trace width of USIM_DATA, USIM_CLK, USIM_RST and USIM_DET not less than 0.1 mm. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. To offer better ESD protection, add a TVS array of which the parasitic capacitance should be not higher than 20 pF. Add 22 resistors in series between the module and the (U)SIM card connector to suppress EMI such as spurious transmission. The 33 pF capacitors are used to filter out RF interference. Additionally, keep the (U)SIM peripheral circuit close to the (U)SIM card connector. For USIM_DATA, a 20 k pull-up resistor is optional to be added near the (U)SIM card connector. The (U)SIM card connector should be placed near the M.2 socket, because a long trace may lead to waveform distortion, which affects the signal quality.

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4.2. USB Interface
The module provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specifications and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA sentence output.

Table 14: Pin Definition of USB Interface

Pin No. Pin Name

7

USB_DP

I/O

Description

AIO USB differential data (+)

9

USB_DM

AIO USB differential data (-)

Comment
Require differential impedance of 90 . Test points must be reserved.

For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. The following figure presents a reference circuit for the USB interface.

Host

Module

USB_ DM USB_ DP

BB

R1 0 R2 0

USB_DM 9 USB_DP 7

Test Points

R3 NM- 0 R4 NM- 0

TVS array
Minimize these stubs in PCB layout.

Figure 15: Reference Circuit for USB Interface

To ensure the signal integrity of USB 2.0 data traces, R1, R2, R3 and R4 must be placed close to the module, and the stubs must be minimized in PCB layout. Please follow the principles below when designing the USB interface to meet 2.0 specifications:
Route the USB signal traces as differential pairs with ground surrounded. The impedance of differential trace of USB 2.0 is 90 .
For USB 2.0, the trace length should be less than 120 mm, and the differential data pair matching should be less than 2 mm.

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Do not route signal traces under crystals, oscillators, magnetic devices, PCIe, other high-speed and RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below.
Junction capacitance of the ESD protection components might cause influences on USB data traces, so you should pay attention to the selection of the components. Typically, the stray capacitance should be less than 2.0 pF for USB 2.0.
Keep the ESD protection components as close to the USB connector as possible. If possible, reserve 0 resistor on USB_DP and USB_DM traces respectively.

4.3. Control and Indication Interfaces

Table 15: Pin Definition of Control and Indication Interfaces

Pin No. Pin Name

8

W_DISABLE1#

10

WWAN_LED#

23

WAKE_ON_WAN#

25

DPR

26

W_DISABLE2#*

60

WLAN_PA_EN*

I/O DI OD OD DI, PU DI DI

Description
Airplane mode control Active LOW
RF status indication LED Active LOW Wake up the host Active LOW Dynamic power reduction Active LOW
GNSS control Active LOW
Self-protection of LNA control

Comment Internally pulled up to 1.8 V with a 100 k resistor.
High level by default. Internally pulled up to 1.8 V with a 100 k resistor.

4.3.1. W_DISABLE1#
The module provides a W_DISABLE1# pin to disable or enable airplane mode through hardware operation. W_DISABLE1# is pulled up by default. Driving it low will configure the module into airplane mode. In airplane mode, the RF function will be disabled.
The RF function can also be enabled or disabled through AT commands. The following table shows the AT command and corresponding RF function status of the module.

Table 16: RF Function Status W_DISABLE1# Logic AT Command

RF Function Status Operating Mode

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Level High Low

AT+CFUN=1
AT+CFUN=0
AT+CFUN=4 AT+CFUN=0 AT+CFUN=1 AT+CFUN=4

Enable Disable Disable
Disable

Full functionality mode Minimum functionality mode Airplane mode
Airplane mode

4.3.2. W_DISABLE2#
The module provides a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2# pin is pulled up by default. Driving it low will disable the GNSS function.
The GNSS function can also be controlled through AT commands. The combination of W_DISABLE2# pin and AT commands controls the GNSS function.

Table 17: GNSS Function Status W_DISABLE2# Logic Level High
Low

AT Command AT+QGPS=1 AT+QGPSEND AT+QGPS=1 AT+QGPSEND

GNSS Function Status Enable Disable
Disable

For details about AT commands mentioned above, see document [3].
A simple voltage-level translator based on diodes is used on W_DISABLE1# pin and W_DISABLE2# pin which are pulled up to a 1.8 V voltage in the module. The control signals (GPIO) of the host device could be at 1.8 V or 3.3 V voltage level. W_DISABLE1# and W_DISABLE2# are active low signals. A reference circuit of the two pins is shown below.

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Host

VCC_ IO_ HOST

GPIO GPIO

R1 R2 10K 10K

Module
VDD 1.8 V

W_DISABLE2# 26 W_DISABLE1# 8

R3 R4 100K 100K
BB

NOTE: The voltage level of VCC_IO_HOST could be 1.8 V or 3.3 V typically.
Figure 16: Reference Circuit of W_DISABLE1# and W_DISABLE2#

4.3.3. WWAN_LED#
The WWAN_LED# signal is used to indicate RF status of the module, and its sink current is up to 10 mA.
To reduce power consumption of the LED, a current-limited resistor must be placed in series with the LED, as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at low level.

VCC(Typ. 3.3 V)
R1 330

Module

VCC

2, 4 70, 72, 74

LED1

WWAN_LED# 10

PMIC

Figure 17: WWAN_LED# Reference Circuit

Table 18: Network Status Indications of WWAN_LED#

WWAN_LED# Logic Level Low (LED On)
High (LED off)

Description
RF function is turned on
RF function is turned off if any of the following occurs: The (U)SIM card is not powered. W_DISABLE1# is at low level (airplane mode enabled). AT+CFUN=4 and AT+CFUN=0 (RF function disabled).

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4.3.4. WAKE_ON_WAN#
The WAKE_ON_WAN# is an open drain pin, which requires a pull-up resistor on the host. When a URC returns, a one-second low level pulse signal will be outputted to wake up the host.

Table 19: State of the WAKE_ON_WAN#

WAKE_ON_WAN# State

Module Operation Status

Outputs a one-second pulse signal at low SMS/Data is incoming (to wake up the host)
level

Always at high level

Idle/Sleep

Host

Module

VCC_IO_HOST

R1 10K

GPIO

WAKE_ON_WAN# 23

BB

H

1 s

L

Wake up the host

NOTE: The voltage level on VCC_IO_HOST depends on the host side due to the open drain in pin 23.

Figure 18: Reference Circuit of WAKE_ON_WAN#

4.3.5. DPR
The module provides a DPR (Dynamic Power Reduction) pin for body SAR (Specific Absorption Rate) detection. The signal is sent from a host system proximity sensor to the module to provide an input trigger, which will reduce the output power in burst transmission.

Table 20: Pin definition of DPR

Pin No. 25

Pin Name I/O

DPR

DI

Description
Dynamic power reduction Active low

Comment High level by default.

Table 21: Function of the DPR Signal

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Logic Level High/Floating Low

Function
No backoff of max transmitting power occurred Backoff of max transmitting power occurred according to configuration in SAR efs file

Host
GPIO

Module
VDD 1.8V

DPR 25

R1 100K
BB

Figure 19: DPR Signal Reference Circuit Design

NOTE
See document [4] for more details about AT+QCFG=”SAR_DSI”.

4.3.6. WLAN_PA_EN
In LTE mode, WLAN_PA_EN is set to 0 (low level) by default. When WLAN_PA_EN is set to 1 (high level), the LNA will be in self-protection mode.

Table 22: Pin definition of WLAN_PA_EN

Pin No.

Pin Name

I/O

60

WLAN_PA_EN

DI

Description Self-protection of LNA control

4.4. Antenna Tuner Control Interface*
ANTCTL[0:3] and RFFE interfaces are used for antenna tuner control and should be routed to an appropriate antenna control circuit.
4.4.1. Antenna Tuner Control Interface through GPIOs
Table 23: Pin Definition of Antenna Tuner Control Interface through GPIOs

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Pin No. Pin Name

I/O

59

ANTCTL0

DO

61

ANTCTL1

DO

63

ANTCTL2

DO

65

ANTCTL3

DO

Description Antenna GPIO control

4.4.2. Antenna Tuner Control Interface through RFFE
Table 24: Pin Definition of Antenna Tuner Control Interface through RFFE

Pin No. Pin Name

I/O

56

RFFE_CLK

DO

58

RFFE_DATA

DIO

Description Used for external MIPI IC control Used for external MIPI IC control

NOTE
If RFFE_CLK and RFFE_DATA are required, contact NetPrisma Technical Support for more details.

4.5. Cellular/WLAN COEX Interface*
The module provides the cellular/WLAN COEX interface. The following table shows the pin definition of this interface.

Table 25: Pin Definition of Cellular/WLAN COEX Interface

Pin No.

Pin Name

I/O

62

COEX_RXD

DI

64

COEX_TXD

DO

Description LTE/WLAN coexistence receive LTE/WLAN coexistence transmit

NOTE
Please note that COEX_RXD and COEX_TXD cannot be used as general UART.

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4.6. Configuration Pins

Table 26: List of Configuration Pins

Config_0 (Pin 21)
NC

Config_1 (Pin 69)
GND

Config_2 (Pin 75)
NC

Config_3 (Pin 1)
GND

Module Type and Port Main Host Interface Configuration

WWAN – SSIC

2

Table 27: Pin Definition of Configuration Pins

Pin No. Pin Name

I/O

21

CONFIG_0

DO

69

CONFIG_1

DO

75

CONFIG_2

DO

1

CONFIG_3

DO

Description Not connected internally Connected to GND internally Not connected internally Connected to GND internally

The following figure shows a reference circuit for these four pins.

Host

VCC_ IO_ HOST

Module

GPIO GPIO GPIO GPIO

R1 R2 R3 R4 100K 100K 100K 100K

CONFIG_0 21 NM- 0

CONFIG_1 69 0

CONFIG_2 75 NM- 0

CONFIG_3 1

0

NOTE: The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level.
Figure 20: Recommended Circuit of Configuration Pins

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5 RF Specifications
Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.

5.1. Cellular Network
5.1.1. Antenna Interfaces & Frequency Bands
The module provides a main antenna connector and a Rx-diversity/GNSS antenna connector, which are used to resist the fall of signals caused by high-speed movement and multipath effect. The impedance of antenna ports is 50 .

Table 28: Antenna Connector Definition

Antenna Connector

I/O

ANT_MAIN

AIO

ANT_DRX/GNSS

AI

Description
Main antenna interface: LTE: TRX WCDMA: TRX
RX-Diversity/GNSS antenna interface: LTE: DRX WCDMA: DRX GNSS: L1

Comment 50 impedance

Table 29: Frequency Bands

3GPP Band WCDMA B1 WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5

Transmit 1920­1980 1850­1910 1710­1785 1710­1755 824­849

Receive 2110­2170 1930­1990 1805­1880 2110­2155 869­894

Unit MHz MHz MHz MHz MHz

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WCDMA B6 WCDMA B8 WCDAM B19 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B29 8 LTE-FDD B30 LTE-FDD B32 8 LTE-FDD B66

830­840 880­915 830­845 1920­1980 1850­1910 1710­1785 1710­1755 824­849 2500­2570 880­915 699­716 777­787 788­798 704­716 815­830 830­845 832­862 1850­1915 814­849 703­748 2305­2315 1710­1780

875­885 925­960 875­890 2110­2170 1930­1990 1805­1880 2110­2155 869­894 2620­2690 925­960 729­746 746­756 758­768 734­746 860­875 875­890 791­821 1930­1995 859­894 758­803 717­728 2350­2360 1452­1496 2110­2200

8 LTE-FDD B29/B32 supports Rx only and is only for secondary component carrier.
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LTE-FDD B71 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40(CE) LTE-TDD B41

663­698 2010-2025 2570­2620 1880­1920 2300­2400 2496­2690

617­652 2010­2025 2570­2620 1880­1920 2300­2400 2496­2690

MHZ MHZ MHz MHz MHz MHz

5.1.2. Tx Power
Table 30: Conducted RF Output Power

Frequency Band WCDMA B1 WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13

Modulation BPSK BPSK BPSK BPSK BPSK BPSK BPSK BPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK

Max. 23 dBm ±2 dB 23 dBm ±2 dB 23 dBm ±2 dB 23 dBm ±2 dB 23 dBm ±2 dB 23 dBm ±2 dB 23 dBm ±2 dB 23 dBm ±2 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB

Min. < -50 dBm < -50 dBm < -50 dBm < -50 dBm < -50 dBm < -50 dBm < -50 dBm < -50 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm

Comment 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB

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LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B30 LTE-FDD B66 LTE-FDD B71 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40(CE) LTE-TDD B41

QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK

23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 22 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23.5 dBm ±1 dB 23 dBm ±1 dB 23.5 dBm ±1 dB 23 dBm ±1 dB 23 dBm ±1 dB

< -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm < -40 dBm

10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB 10 MHz, 1RB

5.1.3. Rx Sensitivity
Table 31: Rx Sensitivity
Frequency Band WCDMA B1 WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8

SIMO 9 (dBm) -111.5 -111 -111 -111 -113 -113 -113.5

3GPP (SIMO) (dBm) -106.7 -104.7 -103.7 -106.7 -104.7 -106.7 -103.7

Comment 10

9 SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the
receiver side, which can improve Rx performance. 10 The RB configuration follows 3GPP specification.

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WCDMA B19 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B29 11 LTE-FDD B30 LTE-FDD B32 11 LTE-FDD B66 LTE-FDD B71 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40(CE) LTE-TDD B41

-113 -100 -100 -100 -99 -101 -98.5 -101 -101 -101 -101 -101 -101 -101 -100.5 -99.5 -100.5 -100.5 -101 -98 -99.5 -99 -100.5 -100 -99.5 -99.5 -98.5 -98.5

-106.7 -96.3 -94.3 -93.3 -96.3 -94.3 -94.3 -93.3 -93.3 -93.3 -93.3 -93.3 -96.3 -96.3 -93.3 -92.8 -93.8 -94.8 -93.3 -95.3 -96.3 -95.8 -94.3 -96.3 -96.3 -96.3 -96.3 -94.3

10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz

11 The test results are based on CA_2A-29A, and CA_20A-32A. LTE-FDD B29/B32 supports Rx only and is only for secondary component carrier.

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5.2. GNSS 12
5.2.1. Antenna Interface & Frequency Bands
The module includes a fully integrated global navigation satellite system solution.
The module supports standard NMEA 0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default.
By default, the module GNSS engine is switched off. It is to be switched on via AT command. For more details, see document [3].

Table 32: GNSS Frequency
Type GPS/Galileo GLONASS BDS QZSS

Frequency 1575.42 ±1.023 1601.65 ±4.15 1561.098 ±2.046 1575.42 ±1.023

Unit MHz MHz MHz MHz

5.2.2. GNSS Performance
Table 33: GNSS Performance

Parameter Sensitivity

Description Acquisition Reacquisition Tracking

Cold start @ open sky

TTFF

Warm start @ open sky

Hot start @ open sky

12 GNSS function is optional.

LCUK54-WRD_Hardware_Design

Condition Autonomous Autonomous Autonomous Autonomous XTRA start Autonomous XTRA start Autonomous XTRA start

Typ. -146 -158 -157 32 12 27.5 3 2 2

Unit dBm dBm dBm s s s s s s

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Accuracy

CEP-50

Autonomous @ open sky

2

m

NOTE
1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously).
2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock.
3. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command.

5.3. Antenna Design Requirements
Table 34: Antenna Requirements

Type
Main Antenna (WCDMA/LTE Tx/Rx)
Diversity/GNSS Antenna (WCDMA/LTE/GNSS Rx)

Requirements
VSWR: 2 Efficiency: > 30 % Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB: LB (<1 GHz) < 1.5 dB: MB (1­2.3 GHz) < 2 dB: LB (> 2.3 GHz)

NOTE
It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance.
5.4. Antenna Connectors
5.4.1. Antenna Connector Location
The antenna connector locations are shown below.

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Figure 21: Antenna Connectors on LCUK54-WRD
5.4.2. Antenna Connector Specifications
The module is mounted with standard 2 mm × 2 mm receptacle antenna connectors for convenient antenna connection. The antenna connector’s PN is IPEX 20449-001E, and the connector dimensions are illustrated as below:

Figure 22: Dimensions of the Receptacle (Unit: mm) LCUK54-WRD_Hardware_Design

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Table 35: Major Specifications of the RF Connectors

Item Nominal Frequency Range Nominal Impedance Temperature Rating
Voltage Standing Wave Ratio (VSWR)

Specification
DC to 6 GHz
50
-40 to +85 °C Meet the requirements of: Max. 1.3 (DC­3 GHz) Max. 1.45 (3­6 GHz)

5.4.3. Antenna Connector Installation
The receptacle RF connector used in conjunction with the modules will accept two types of mated plugs that will meet a maximum height of 1.2 mm using a Ø 0.81 mm coaxial cable or a maximum height of 1.45 mm utilizing a Ø 1.13 mm coaxial cable.
The following figure shows the dimensions of mated plugs using Ø 0.81 mm/Ø 1.13 mm coaxial cables:

Figure 23: Dimensions of Mated Plugs (Ø0.81/Ø1.13 mm Coaxial Cables)
The following figure illustrates the connection between the receptacle RF connector on the module and the mated plugs using a Ø 0.81 mm coaxial cable.

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Figure 24: Space Factor of Mated Connectors (Ø0.81 mm Coaxial Cables) (Unit: mm) The following figure illustrates the connection between the receptacle RF connector on the module and the mated plugs using a Ø 1.13 mm coaxial cable.
Figure 25: Space Factor of Mated Connectors (Ø 1.13 mm Coaxial Cables) (Unit: mm)
5.4.4. Recommended RF Connector Installation
5.4.4.1. Assemble Coaxial Plug Manually The illustration for plugging in a coaxial cable plug is shown below, = 90° is acceptable, while 90° is not.

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Figure 27: Plug in a Coaxial Cable Plug
The illustration of pulling out the coaxial cable plug is shown below, = 90° is acceptable, while 90° is not.

Figure 26: Pull out a Coaxial Cable Plug
5.4.4.2. Assemble Coaxial Plug with jig The pictures of installing the coaxial cable plug with a jig is shown below, = 90° is acceptable, while 90° is not.

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Figure 29: Install the Coaxial Cable Plug with Jig
5.4.5. Recommended Manufacturers of RF Connector and Cable
RF connectors and cables by I-PEX are recommended. For more details, visit https://www.i-pex.com.

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6 Electrical Characteristics and
Reliability

6.1. Absolute Maximum Ratings
Absolute maximum ratings for power supply of the module are listed in the following table.

Table 36: Absolute Maximum Ratings

Parameter VCC

Min. -0.3

Typ.

Max.

Unit

3.7

4.7

V

6.2. Power Supply Ratings
The typical input voltage of the module is 3.7 V.

Table 37: Power Supply Requirements

Parameter
VCC Voltage Ripple

Description

Condition

Min.

Power supply for the module

The actual input voltages must be kept between the minimum and maximum values.

3.135

Typ. Max. Unit 3.7 4.4 V

–

–

30 100 mV

6.3. Power Consumption
Table 38: Averaged Power Consumption LCUK54-WRD_Hardware_Design

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Description

Condition

OFF State

Power off

AT+CFUN=0 (USB 2.0 suspend)

AT+CFUN=4 (USB 2.0 suspend)

Sleep State

WCDMA PF = 64 (USB 2.0 suspend)

LTE-FDD PF = 64 (USB 2.0 suspend)

LTE-TDD PF = 64 (USB 2.0 suspend)

WCDMA PF = 64

WCDMA PF = 256

ldle State

LTE-FDD PF = 64 LTE-FDD PF = 256

LTE-TDD PF = 64

LTE-TDD PF = 256

WCDMA B1 HSDPA CH10700 @ 22.34 dBm

WCDMA B1 HSUPA CH10700 @ 21.83 dBm

WCDMA B2 HSDPA CH9800 @ 22.37 dBm

WCDMA B2 HSUPA CH9800 @ 21.74 dBm

WCDMA B3 HSDPA CH1338 @ 22.39 dBm

WCDMA

Data WCDMA B3 HSUPA CH1338 @ 20.44 dBm

Transmission

(GNSS Off)

WCDMA B4 HSDPA CH1638 @ 22.45 dBm

WCDMA B4 HSUPA CH1638 @ 20.32 dBm

WCDMA B5 HSDPA CH4407 @ 22.39 dBm

WCDMA B5 HSUPA CH4407 @ 21.51 dBm

WCDMA B6 HSDPA CH4400 @ 22.51 dBm

WCDMA B6 HSUPA CH4400 @ 21.79 dBm

LCUK54-WRD_Hardware_Design

Typ.

Unit

70

A

1.68

mA

1.75

mA

3.05

mA

3.28

mA

3.55

mA

20.25

mA

19.48

mA

20.58

mA

19.61

mA

20.90

mA

19.67

mA

718

mA

650

mA

675

mA

633

mA

722

mA

596

mA

756

mA

627

mA

649

mA

590

mA

632

mA

593

mA

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LTE Data Transmission (GNSS Off)

WCDMA B8 HSDPA CH3012 @ 22.51 dBm WCDMA B8 HSUPA CH3012 @ 21.12 dBm WCDMA B19 HSDPA CH738 @ 22.52 dBm WCDMA B19 HSUPA CH738 @ 21.79 dBm LTE-FDD B1 CH300 @ 23.93 dBm LTE-FDD B2 CH900 @ 23.8 dBm LTE-FDD B3 CH1575 @ 23.64 dBm LTE-FDD B4 CH2175 @ 23.63 dBm LTE-FDD B5 CH2525 @ 23.75 dBm LTE-FDD B7 CH3100 @ 23.26 dBm LTE-FDD B8 CH3625 @ 23.65 dBm LTE-FDD B12 CH5095 @ 23.63 dBm LTE-FDD B13 CH5230 @ 23.62 dBm LTE-FDD B14 CH5330 @ 23.78 dBm LTE-FDD B17 CH5790 @ 23.57 dBm LTE-FDD B18 CH5925 @ 23.59 dBm LTE-FDD B19 CH6075 @ 23.59 dBm LTE-FDD B20 CH6300 @ 23.6 dBm LTE-FDD B25 CH8365 @ 23.91 dBm LTE-FDD B26 CH8865@ 23.64 dBm LTE-FDD B28 CH9360 @ 23.47 dBm LTE-FDD B30 CH9820 @ 22.47 dBm LTE-FDD B66 CH66886 @ 23.56 dBm LTE-FDD B71 CH68786 @ 23.56 dBm LTE-TDD B34 CH36275@ 23.73 dBm

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665

mA

592

mA

632

mA

593

mA

828

mA

829

mA

812

mA

880

mA

762

mA

1070

mA

796

mA

752

mA

686

mA

668

mA

745

mA

774

mA

763

mA

703

mA

840

mA

784

mA

720

mA

1100

mA

875

mA

768

mA

410

mA

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LTE-TDD B38 CH38000 @ 23.29 dBm LTE-TDD B39 CH38450 @ 23.76 dBm LTE-TDD B40(CE) CH39150 @ 23.12 dBm LTE-TDD B41 CH40740 @ 23.35 dBm WCDMA B1 CH10700 @ 23.47 dBm WCDMA B2 CH9800 @ 23.43 dBm WCDMA B3 CH1338 @ 23.46 dBm WCDMA B4 CH1638 @ 23.47 dBm WCDMA B5 CH4407 @ 23.47 dBm WCDMA B6 CH4400 @ 23.52 dBm WCDMA B8 CH3012 @ 23.49 dBm WCDMA B19 CH738 @ 23.52 dBm

500

mA

411

mA

540

mA

462

mA

773

mA

729

mA

778

mA

819

mA

699

mA

684

mA

717

mA

683

mA

NOTE
1. Power consumption test is carried out under 3.7 V, 25 °C with 5G-M2 EVB, and with thermal dissipation measures. 2. For more details about power consumption, please contact NetPrisma Technical Support to obtain the power consumption test report of the module.

6.4. Digital I/O Characteristics

Table 39: (U)SIM High/Low-voltage I/O Requirements

Parameter

Description

Min.

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Max.

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VIH

High-level input voltage 0.7 × USIM_VDD USIM_VDD + 0.3 V

VIL

Low-level input voltage -0.3

0.2 × USIM_VDD V

VOH

High-level output voltage 0.8 × USIM_VDD USIM_VDD

V

VOL

Low-level output voltage 0

0.4

V

Table 40: 1.8 V Digital I/O Requirements

Parameter VIH VIL VOH VOL

Description

Min.

High-level input voltage 1.65

Low-level input voltage -0.3

High-level output voltage 1.3

Low-level output voltage 0

Max.

Unit

2.1

V

0.54

V

1.8

V

0.4

V

Table 41: 3.3 V Digital I/O Requirements

Parameter 3.3 V VIH VIL

Description

Min.

Power domain

3.135

High-level input voltage 2.0

Low-level input voltage -0.5

Max.

Unit

3.464

V

3.6

V

0.8

V

6.5. ESD Protection
Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

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Table 42: Electrostatic Discharge Characteristics (Temperature: 25­30 ºC, Humidity: 40 ±5 %)

Tested Interface VCC, GND Antenna Interfaces Other Interfaces

Contact Discharge

Air Discharge

Unit

±5

±10

kV

±4

±8

kV

±0.5

±1

kV

6.6. Operating and Storage Temperatures

Table 43: Operating and Storage Temperatures

Parameter

Min.

Operating Temperature Range 13 -25

Extended Temperature Range 14 -40

Storage temperature Range

-40

Typ.

Max.

Unit

+25

+75

ºC

–

+85

ºC

–

+90

ºC

13 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers. Within the temperature range of -10 °C to +55 °C
the mentioned RF performance margins higher than 3GPP specifications can be guaranteed. When temperature goes beyond temperature range of -10 °C to 55 °C, a few RF performances of module may be slightly off 3GPP specifications. 14 To meet the extended operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heat sinks, heat pipes, vapor chambers. Within this range, the module remains the ability to establish and maintain functions such as SMS, without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again.

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6.7. Thermal Dissipation

WTR

PA

PMU

BB

MCP

Figure 27: Distribution of Heat Source Chips Inside the Module
The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range.
The following principles for thermal consideration are provided for reference:
Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply.
Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Expose the copper in the PCB area where module is mounted. Apply a soft thermal pad with appropriate thickness and high thermal conductivity between the
module and the PCB to conduct heat. Follow the principles below when the heatsink is necessary:
Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
Choose the heatsink with adequate fins to dissipate heat;

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Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;
Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

Heatsink PCB TIM Thermal pad Module

Screw Heatsink TIM Module

PCB

Thermal pad

Figure 28: Placement and Fixing of the Heatsink

Table 44: Maximum Operating Temperature for Main Chips (Unit: °C)

BASEBAND 85

MCP 85

PMU 85

WTR 85

MMPA 100

APT 85

6.8. Notification
Please follow the principles below in the module application.
6.8.1. Coating
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
6.8.2. Cleaning
Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6.8.3. Installing
It is recommended to fix the module firmly when the module is inserted into a socket.
Fix the module firmly to avoid poor contact caused by shaking. It is recommended to install the module on the socket with a screw as shown below.

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LTE-A Series Figure 29: Installation Schematic

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7 Mechanical Information and
Packaging
This chapter mainly describes mechanical dimensions and packaging specifications of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.15 mm unless otherwise specified.
7.1. Mechanical Dimensions

Figure 30: Mechanical Dimensions
7.2. Top and Bottom Views
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Figure 31: Top and Bottom Views of the Module
NOTE
Images above are for illustration purpose only and may differ from the actual modules. For authentic appearance and label, please refer to the module received from NetPrisma.
7.3. M.2 Connector
The module adopts a standard PCI Express M.2 connector which compiles with the directives and standards listed in PCI Express M.2 Specification.
7.4. Storage Conditions
The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity
should be 35­60 %. 2. Shelf life: 12 months in Recommended Storage Condition.
NOTE

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Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
7.5. Packaging Specifications
This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The modules adopt blister tray packaging and details are as follow:
7.5.1. Blister Tray
Dimension details are as follow:

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Figure 32: Blister Tray Dimension Drawing

7.5.2. Packaging Process

Each blister tray packs 10 modules. Stack 10 blister Packing 11 blister trays together and then put

trays with modules together, and put 1 empty blister blister trays into a conductive bag, seal and pack

tray on the top.

the conductive bag.

Put seal-packed blister trays into a mini box. One Put 4 mini boxes into 1 carton and then seal it.

mini box can pack 100 modules.

One carton can pack 400 modules. Figure 33: Packaging Process

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8 Appendix References

Table 45: Related Documents
Document Name [1] NetPrisma_LCUK54-WRD_CA_Feature [2] NetPrisma_LCUK54-WRD_AT_Commands_Manual [3] NetPrisma_LCUK54-WRD_GNSS_Application_Note [4] NetPrisma_LCUK54-WRD_RF_Application_Note

Table 46: Terms and Abbreviations

Abbreviation APT AT BB BDS BIOS bps BPSK CBRS CPE COEX DC-HSDPA DFOTA DL

Description Average Power Tracking ATtention Baseband BeiDou Navigation Satellite System Basic Input/Output System Bit(s) per second Binary Phase Shift Keying Citizen Broadband Radio Service Customer-Premise Equipment Coexistence Dual-carrier High Speed Downlink Package Access Delta Firmware Upgrade Over-The-Air Downlink

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DPR DRX DRx EBI EIRP ESD ESR FDD GLONASS GNSS GPS GSM HSDPA HSPA HSUPA IC kbps LAA LDO LED LPDDR2 LSB LTE MBIM Mbps

Dynamic Power Reduction Discontinuous Reception Diversity Receive External Bus Interface Equipment Isotropic Radiated Power Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplex Global Navigation Satellite System (Russia) Global Navigation Satellite System Global Positioning System Global System for Mobile Communications High Speed Downlink Packet Access High Speed Packet Access High Speed Uplink Packet Access Integrated Circuit Kilobits per second License Assisted Access Low-dropout Regulator Light Emitting Diode Low Power Double Data Rate 2 Least Significant Bit Long Term Evolution Mobile Broadband Interface Model Megabits per second

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MCP ME MFBI MIPI MIMO MLCC MMPA MO MSB MT NAND NC NPN OS PA PAP PC PCB PCIe PDU PME PMIC PMU POS PPP

Multiple Chip Package Mobile Equipment Multi-Frequency Band Indicator Mobile Industry Processor Interface Multiple-Input Multiple-Output Multi-layer Ceramic Capacitor Multimode Multiband Power Amplifier Mobile Originated Most Significant Bit Mobile Terminated NON-AND Not Connected Negative-Positive-Negative Operating System Power Amplifier Password Authentication Protocol Personal Computer Printed Circuit Board Peripheral Component Interconnect Express Protocol Data Unit Power Management Event Power Management IC Power Management Unit Point of Sale Point-to-Point Protocol

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PRx QMI QPSK QZSS RB RF RFFE RH Rx SAR SDRAM SMS SPMI TCP TDD TRx Tx UART UDP UL URC USB (U)SIM VFB VIH

Primary Receive Qualcomm MSM (Mobile Station Modems) Interface Quadrature Phase Shift Keying Quasi-Zenith Satellite System Resource Block Radio Frequency RF Front-End Relative Humility Receive Specific Absorption Rate Synchronous Dynamic Random-Access Memory Short Message Service System Power Management Interface Transmission Control Protocol Time Division Duplex Transmit & Receive Transmit Universal Asynchronous Receiver/Transmitter User Datagram Protocol Uplink Unsolicited Result Code Universal Serial Bus (Universal) Subscriber Identity Module Voltage Feedback High-level Input Voltage

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VIL VOH VOL WCDMA WTR XO

Low-level Input Voltage High-level Output Voltage Low-level Output Voltage Wideband Code Division Multiple Access Wafer-scale RF transceiver Crystal Oscillator

9.1 FCC
9.1.1. Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations. 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
9.1.2. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to XXXX that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application.
9.1.3. End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: 2BEY3LCUK54WRDA” “Contains IC: 32052-LCUK54WRDA ” The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
9.1.4. Antenna Installation
(1)The antenna must be installed such that 20 cm is maintained between the antenna and users,

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(2)The transmitter module may not be co-located with any other transmitter or antenna.

(3)Only antennas of the same type and with equal or less gains as shown below may be used with this

module. Other types of antennas and/or higher gain antennas may require additional authorization for

operation.

Band

MAX Gain (dBi)

WCDMA B2

8.00

WCDMA B4

5.00

WCDMA B5

9.42

LTE B2

8.50

LTE B4

5.50

LTE B5

9.91

LTE B7

9.00

LTE B12

9.20

LTE B13

9.66

LTE B14

9.73

LTE B17

9.24

LTE B25

8.50

LTE B26(814-824)

9.86

LTE B26(824-849)

9.91

LTE B30

0.98

LTE B38

9.00

LTE B41

9.00

LTE B66

5.50

LTE B71

8.98

In the event that these conditions cannot be met (for example certain laptop configurations or co-location

with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC

ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for

re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

9.1.5. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

9.1.6. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can

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be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: – Reorient or relocate the receiving antenna. – Increase the separation between the equipment and receiver. – Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. – Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
9.1.7. List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27 and part 90 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
9.1.8. This device is intended only for OEM integrators under the following conditions:(For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
9.1.9. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.
9.2. IC
9.2.1. Industry Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts

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LTE-A Series
de licence. L’exploitation est autorisée aux deux conditions suivantes: (1) l’appareil ne doit pas produire de brouillage, et (2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d’en compromettre le fonctionnement.”
9.2.2. Radiation Exposure Statement This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.
9.2.3. Déclaration d’exposition aux radiations: Cet équipement est conforme aux limites d’exposition aux rayonnements ISED établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.
9.2.4. This device is intended only for OEM integrators under the following conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
9.2.5. Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module)
1)L’antenne doit être installée de telle sorte qu’une distance de 20 cm est respectée entre l’antenne et les utilisateurs, et 2)Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l’émetteur ne seront pas nécessaires. Toutefois, l’intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.
9.2.6. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
9.2.7. NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d’ordinateur portable ou de certaines co-localisation avec un autre émetteur), l’autorisation du Canada n’est plus considéré comme valide et l’ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l’intégrateur OEM sera chargé de réévaluer le produit final (y compris l’émetteur) et l’obtention d’une autorisation distincte au Canada

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LTE-A Series

9.2.8. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 32052-LCUK54WRDA”.

9.2.9.Plaque signalétique du produit final Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l’antenne peut être installée de telle sorte qu’une distance de 20cm peut être maintenue entre l’antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l’inscription suivante: “Contient des IC: 32052-LCUK54WRDA”.

9.2.10.Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

9.2.11.Manuel d’information à l’utilisateur final L’intégrateur OEM doit être conscient de ne pas fournir des informations à l’utilisateur final quant à la façon d’installer ou de supprimer ce module RF dans le manuel de l’utilisateur du produit final qui intègre ce module. Le manuel de l’utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel.

9.2.12 Antenna Requirements The following antennae were approved with the prototype: This radio transmitter [32052-LCUK54WRDA] has been approved by innovation, Science and development Economic Canada to operate with the types of antennas listed below, with the maximum allowable gain indicated. The types of antennas not included in this list that have a gain of any type lis ted are strictly prohibited for use with this device.

Les antennes suivantes ont été approuvées avec le prototype:

Cet émetteur radio [32052-LCUK54WRDA] a été approuvé par innovation, Science et développement économique Canada pour fonctionner avec les types d’antennes énumérés ci-dessous, avec le gain

maximal autorisé indiqué. Les types d’antennes non inclus dans cette liste qui ont un gain tout type lis ted

sont strictement interdits pour une utilisation avec cet appareil.

Band

Description

MAX Gain (dBi)

WCDMA B2

3.87

WCDMA B4

3.91

WCDMA B5

3.32

LTE B2

3.87

LTE B4

3.91

LTE B5

3.32

LTE B7

3.16

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LTE-A Series

LTE B12

3.19

LTE B13

PIFA Antenna

3.28

LTE B14

3.25

LTE B17

3.19

LTE B25

3.87

LTE B26(824-849)

3.32

LTE B30

0.98

LTE B38

3.07

LTE B41

3.16

LTE B66

3.91

LTE B71

3.07

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Documents / Resources

NETPRISMA LCUK54-WRD IOT Verified Device [pdf] Owner's Manual 2BEY3, lcuk54wrda, LCUK54-WRD IOT Verified Device, LCUK54-WRD, IOT Verified Device, Verified Device, Device

References

• User Manual