MegaChips MRF61_FI IEEE 802.11ah Sub-1 GHz Wi-Fi HaLow Module User Guide

Prohibition on copying and disclosure.
These specifications include intellectual property and know-how belonging to MegaChips Corporation (“MCC”) and its partner companies.
Therefore, do not use these specifications for any purpose other than the purpose expressly agreed to by MCC’s customer and MCC.
Also, do not duplicate, copy, or reproduce these specifications, nor reveal these specifications to any third party without MCC’s prior written consent.

No guarantee of rights
MCC does not warrant that it owns or controls any of the information, patents, copyrights or other intellectual property rights contained in these specifications.
MCC grants no license of patents, copyrights or other intellectual property rights contained in these specifications.
MCC disclaims all liability arising from the use of the specifications with regard to infringement of any patents, copyrights or other intellectual property rights.
Safety designs such as redundancy
While MCC has been making continuous effort to enhance the quality and reliability of its devices, the possibility of malfunction cannot be eliminated entirely.
To minimize risk of damage or injury to persons or property arising from a malfunction in a device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
(If the customer intends to use the devices for applications other than those specified between the customer and MCC, please contact MCC sales representative before such use.)

Restriction on use
MCC provides no warranty relating to the use of the devices, where there is risk of serious damage, environmental pollution, loss of life, injury or damage to property, or where reliability or special quality is essential, such as life support, military use, or space exploration.
Radiation-proof design
This device has not been designed to be radiation-resistant.

Export restriction
The export of this device may be regulated by the government under customs, anti-proliferation rules, or other regulations, and export may be prohibited without governmental license.
No prior notice of revision
These specifications are based on materials dated 02/10/2025, and MCC reserves the right to revise these specifications without any prior notice. For mass production planning, please reference the latest version of the specifications.

Product Overview

Introduction
MegaChips provides a complete Wi-Fi HaLow connectivity solution. The MFIM0002 is a fully integrated Wi-Fi HaLow® modules with long-range, low-power consumption and superior RF performance, featuring the MM6108 Wi-Fi HaLow SoC.
The MFIM0002 are designed in compliance with the IEEE 802.11ah standard, supporting data rates up to 32.5 Mbps with programmable operation between 902 MHz and 928 MHz.
MRF61_FI_FL(T/N : MBWM000002) has U.FL connector and output to U.FL connector.
MRF61_FI_TH(T/N : MBWM000024) does not have U.FL connector and output to Plated Half-hole. Primary Function of ANT pin (pin number 44) is different.

Please see “3.3 Pin Diagram”.
This module includes ultra-long-reach PA, high linearity LNA, T/R switch, 32 MHz crystal oscillator and it has been designed for a simplified Wi-Fi HaLow connection to an external host for applications in which a customer wants to merely replace their prior RF technology with a Wi-Fi HaLow connection while leveraging the latest WPA3 security protocol.
Battery-operated applications are supported by a combination of features which are inherently supported by the module. The IEEE 802.11ah standard provides for extended sleep times for battery-operated Stations (STAs or client devices), with longer durations than other prior IEEE 802.11a/b/g/n/ac generations. It also allows longer extended maximum idle times for clients to conserve energy without being removed from the access point’s (AP’s) list of associated devices.

Features

Table 1-1 Features

Ultra-long-range, low-power Wi-Fi HaLow module for IoT Applications:
Frequency Band	920MHz Band(Sub-1GHz Band)
Channel Band Width	1MHz/2MHz/4MHz/8MHz
Maximum Transmission power	20dBm
Modulation method	OFDM
Sub carrier modulation method (It is depended on communication conditions)	BPSK,QPSK,16-QAM,64-QAM
Theoretical maximum transmission rate	32.5Mbps(In case of 8MHz BW,MCS7)

Applications
For Internet of Things (IoT) and Machine-to-Machine (M2M) applications such as:

Surveillance Cameras and Sensors
Cloud Connectivity

Low-power Sensor Networks
Building Automation Systems (BAS)

Asset Tracking and Management
Machine Performance Monitors & Sensors

Building Access Control & Security
Drone Video and Navigation Communications

Connected Toys and Games
Rural Internet Access

Agricultural and Farm Networks
Utility Smart Meter and Intelligent Grid

Proximity Sensors
Industrial Automation Controls
Smart Home Automation
EV Car Chargers
Appliances
Construction Site Connectivity
Smart Signs and Kiosks
Retail Point-of-Sale Terminals
IP Sensor Networks
Biometric IDs and Keypads
Warehouse Connectivity
Intelligent Lighting Controls
BT/ZigBee(™)/Z-Wave(™) to Wi-Fi HaLow Gateways
Wi-Fi to Wi-Fi HaLow Bridges
Wi-Fi HaLow Client Adapters/Dongles
Smart City Networks

Product Specifications

Table 2-1 Product Specifications

Product Specifications
Power supply	Voltage	VBAT : +3.0~+3.6V VDD_FEM : +3.0~+3.6V VDDIO : +1.8~+3.6V
Maximum power consumption		T.B.D
Maximum Storage temperature		-40℃~+125℃
Maximum Storage temperature		-40℃~+85℃
RF performance	RF terminal Impedance	50ohms
	Frequency range	902MHz~928MHz
External Dimensions		23mm x 14mm x 2.58mm
Weight		2g

Channel Frequency

Table 2-2 TX/RX Frequency

41Channel spacing 41(MHz)	41Channel center 41frequency index	41Channel center frequency 41(MHz)	41Channel center 41frequency index	41Channel center frequency 41(MHz)
411	413	41903.5	4129	41916.5
	415	41904.5	4131	41917.5
	417	41905.5	4133	41918.5
	419	41906.5	4135	41919.5
	4111	41907.5	4137	41920.5
	4113	41908.5	4139	41921.5
	4115	41909.5	4141	41922.5
	4117	41910.5	4143	41923.5
	4119	41911.5	4145	41924.5
	4121	41912.5	4147	41925.5
	4123	41913.5	4149	41926.5
	4125	41914.5
	4127	41915.5

412	416	41905.0	4134	41919.0
	4110	41907.0	4138	41921.0
	4114	41909.0	4142	41923.0
	4118	41911.0	4146	41925.0
	4122	41913.0
	4126	41915.0
	4130	41917.0
414	418	41906.0	4132	41918.0
	4116	41910.0	4140	41922.0
	4124	41914.0	4148	41926.0
418	4112	41908.0
	4128	41916.0
	4144	41924.0

Functional Description

The following sections describe the functions of the MFIM0002 device.

Exterior View

Picture 3-2 MRF61_FI_TH Top view

Pin Diagram

Table 3-1 Pin Diagram

40Pin	40Name	40Type	40Primary Function	40remarks
401	40GND	40Power	40Ground
402	40GND	40Power	40Ground
403	40GND	40Power	40Ground
404	40GND	40Power	40Ground
405	40GND	40Power	40Ground
406	40GND	40Power	40Ground
407	40Reserved	40I		40implement a 10kΩ pull- down resistor
408	40Reserved	40I		40implement a 10kΩ pull- down resistor
409	40NC	40NC	40Do Not Connect
4010	40Reserved	40I		40implement a 10kΩ pull- down resistor
4011	40Reserved	40I
4012	40Reserved	40O		40implement a 10kΩ pull- down resistor
4013	40NC	40NC	40Do Not Connect
4014	40NC	40NC	40Do Now Connect	40implement a 10kΩ pull- down resistor
4015	40GND	40Power	40Ground
4016	40Reserved	40I/O		40implement a 10kΩ pull- down resistor
4017	40Reserved	40I/O		40implement a 10kΩ pull- down resistor
4018	40Reserved	40I/O		40implement a 10kΩ pull- down resistor
4019	40SD_D1(*1)	40I/O	40SDIO D1 / SPI_INT
4020	40SD_D0(*1)	40I/O	40SDIO D0 / SPI_MISO
4021	40SD_CLK	40I/O	40SDIO Clock / SPI_SCK
4022	40VDDIO	40Power	403.3VPower（MM6108 I/O）
4023	40GND	40Power	40Ground
4024	40SD_CMD(*1)	40I/O	40SDIO Command / SPI_MOSI
4025	40SD_D3(*1)	40I/O	40SDIO D3 / SPI_CS
4026	40SD_D2(*1)	40I/O	40SDIO D2
4027	40Reserved	40I/O		40implement a 10kΩ pull- down resistor
4028	40VBAT	40Power	403.3V Power（MM6108）
4029	40GND	40Power	40Ground
4030	40Reserved	40I/O		40implement a 10kΩ pull- down resistor

4031	40Reserved	40I/O		40implement a 10kΩ pull- down resistor
4032	40Reserved	40I/O		40implement a 10kΩ pull- down resistor
4033	40VDD_FEM	40Power	403.3V Power (for PA)
4034	40GND	40Power	40Ground
4035	40Reserved	40I/O		40implement a 10kΩ pull- down resistor
4036	40Reserved	40I/O		40implement a 10kΩ pull- down resistor
4037	40GND	40Power	40Ground
4038	40BUSY	40O	40BUSY output	40implement a 10kΩ pull- down resistor
4039	40RESET_N	40I	40RESET input
4040	40WAKE	40I	40WAKE input
4041	40GND	40Power	40Ground
4042	40GND	40Power	40Ground
4043	40GND	40Power	40Ground
4044	40ANT	40Analog	40RF in/out pin. Connects to antenna. 40MRF61_FI_FL : N.C 40MRF61_FI_TH: ANT

Certification

FCC
The host manufacturer should reference KDB Publication 996369 D04 Module Integration Guide.

Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the use is encouraged to try to correct the interference by one of the following measures:

Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

This device may not cause harmful interference.
This device must accept any interference received, including interference that may cause undesired operation.

IMPORTANT NOTE
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance 20cm between the radiator and your body.

IMPORTANT NOTE
This module is intended for OEM integrators. This module is only FCC authorized for the specific rule parts listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
Additional testing and certification may be necessary when multiple modules are used.

USERS MANUAL OF THE END PRODUCT:
In the user’s manual of the end product, the end user must be informed to keep at least 20cm of separation with the antenna while this end product is installed and operated. The end user must be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied.
The end user must also be informed that any changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate this equipment.
This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area.
This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

This module has been tested and found to comply with the following requirements for Modular Approval.

Part 15.247 – Operation within the bands 902-928 MHz, 2400-2483.5 MHz, and 5725-5850MHz.

RF exposure considerations
In the end product, the antenna(s) used with this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operation in conjunction with any other antenna or transmitter except in accordance with multi-transmitter product procedures. User and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying the RF exposure compliance.

Antennas
This radio transmitter has been approved by the FCC and ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Antenna Type	Supplier	Antenna Part No.	Freq. (MHz)	Peak Antenna Gain (dBi)
Chip	KYOCERA AVX	P822603	902-928	0.7
Chip	Johanson Technology	0915AT43A0026001E		-1.0
Dipole	Pulse Electronics	W1063		1.0
Monopole	TE Connectivity Linx	ANT-916-CW-RCS		4.8
	molex	1052620002		1.5
	molex	2111400100		1.0
	molex	1052620001		1.6

Required End Product Labeling
Any device incorporating this module must display an external, visible, permanently affixed label with the FCC ID and the ISED certification number preceded by the term as follows.
“ Contains FCC ID: 2AGYI-WM0021”
“ Contains IC: 29836-WM0021”

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in User manual.

Test Modes
This device uses various test mode programs for test set up which operate separate from production firmware. Host integrators should contact the grantee for assistance with test modes needed for module/host compliance test requirements.

Contact information:
Company Name: MegaChips Corporation
Address: 1-1-1,Miyahara, Yodogawa-ku, Osaka, Japan 532-0003
Contact Email: nishigami.kazuaki@megachips.co.jp

Contact Phone: +81663992884

Additional testing, Part 15 Subpart B disclaimer
The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification.
The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

Note EMI Considerations
Note that a host manufacture is recommended to use KDB996369 D04 Module Integration Guide recommending as “best practice” RF design engineering testing and evaluation in case non-linear interactions generate additional non-compliant limits due to module placement to host components or properties.
For standalone mode, reference the guidance in KDB996369 D04 Module Integration Guide and for simultaneous mode; see KDB996369 D02 Module Q&A Question 12, which permits the host manufacturer to confirm compliance.

How to make changes
Only Grantees are permitted to make permissive changes, if the module will be used differently than granted conditions, please contact us to ensure modifications will not affect compliance.

ISED
This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:

This device may not cause interference.
This device must accept any interference, including interference that may cause undesired operation of the device.

This device and its antenna(s) must not be co-located with any other transmitters except in accordance with IC multi-transmitter product procedures.
Referring to the multi-transmitter policy, multiple-transmitter(s) and module(s) can be operated simultaneously without reassessment permissive change.

This radio transmitter has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device.

IMPORTANT NOTE

IC Radiation Exposure Statement:
This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Any changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate this equipment.

USERS MANUAL OF THE END PRODUCT
In the user’s manual of the end product, the end user must be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user must be informed that the IC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied.
The end user must also be informed that any changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate this equipment. Operation is subject to the following two conditions: (1) this device may not cause harmful interference (2) this device must accept any interference received, including interference that may cause undesired operation.

LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area.
The Host Model Number (HMN) must be indicated at any location on the exterior of the end product or product packaging or product literature which shall be available with the end product or online.

Handling and Storage

The MM610x-MF08251 class of modules are a moisture sensitive device rated at Moisture Sensitive Level 3 (MSL3) per IPC/JEDEC J-STD-20.
After opening the moisture sealed storage bag, modules that will be subjected to reflow solder or other high temperature processes must be:

Mounted to a circuit board within 168 hours at factory conditions (≤30°C and <60% RH) OR
Continuously stored per IPC/JEDEC J-STD-033

Modules that have been exposed to moisture and environmental conditions exceeding packaging and storage conditions MUST be baked before mounting according to IPC/JEDEC J-STD-033. Failure to meet packaging and storage conditions will result in irreparable damage to modules during solder reflow.

Revision History

Date:	22/07/2024	Version:	1.0	Detail:
Date:	14/01/2025	Version:	1.1	Detail:	Revised Product Name, Model Name and T/N. Removed W1063M and ANT- 916-CW-RCS-SMA from antenna list.

Frequently Asked Questions

Q: Can I use this module for military applications?
A: No, MegaChips Corporation advises against using the module for military applications due to potential risks and lack of warranty for such high-risk scenarios.
Q: Is the module radiation-resistant?
A: No, the module is not designed to be radiation-resistant, and users should consider this limitation in their applications.

Documents / Resources

	MegaChips MRF61_FI IEEE 802.11ah Sub-1 GHz Wi-Fi HaLow Module [pdf] User Guide MFIM0002, MBWM000002, MBWM000024, MRF61_FI IEEE 802.11ah Sub-1 GHz Wi-Fi HaLow Module, MRF61_FI, IEEE 802.11ah Sub-1 GHz Wi-Fi HaLow Module, 802.11ah Sub-1 GHz Wi-Fi HaLow Module, Sub-1 GHz Wi-Fi HaLow Module, Wi-Fi HaLow Module, HaLow Module, Module
	MegaChips MRF61_FI IEEE 802.11ah Sub-1 GHz Wi-Fi HaLow Module [pdf] User Guide MFIM0002, MBWM000002, MBWM000024, MRF61_FI IEEE 802.11ah Sub-1 GHz Wi-Fi HaLow Module, MRF61_FI, IEEE 802.11ah Sub-1 GHz Wi-Fi HaLow Module, 802.11ah Sub-1 GHz Wi-Fi HaLow Module, Sub-1 GHz Wi-Fi HaLow Module, Wi-Fi HaLow Module, HaLow Module, Module

References

User Manual

MegaChips MRF61_FI IEEE 802.11ah Sub-1 GHz Wi-Fi HaLow Module