Iridium 9704
User Guide
IRDM-5202-UDOC-005 | v2.0 | r22F0B8FEA3 | 2024-NOV-21
LEGAL DISCLAIMER AND CONDITIONS OF USE
Reasonable effort has been made to make the information in this Document reliable and consistent with other specifications, test measurements and other information. However, Iridium Satellite LLC and its affiliated companies, directors, officers, employees, agents, trustees or consultants (“Iridium”) assume no responsibility for any typographical, technical, content or other inaccuracies in this document. Iridium reserves the right in its sole discretion and without notice to you to change this Document and materials and/or revise this Document or withdraw it at any time. You assume any and all risks of using the Product and any information provided in this Document.
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Revision History
| Version | Date | Description |
| 1.0 | October 2024 | Initial Release |
| 2.0 | November 2024 | Updated design guidelines for RF routing |
Introduction
The Iridium 9704 is a transceiver designed to be used inside an integrator’s product, providing satellite messaging using the Iridium® satellite constellation. Iridium’s satellite services using the Iridium 9704 typically are provided by Iridium Service Providers and Value Added Resellers to end users.
This document describes hardware specifications and integration information for the Iridium 9704 transceiver including:
- Digital interfaces for communication between the transceiver and the host product
- RF interfaces to:
◦ provide the transceiver with access to the Iridium network via the host PCB and antenna
◦ provide GNSS passthrough to an integrator’s GNSS receiver - Mechanical specifications for integrating the transceiver into a host product
- Environmental specifications for transceiver storage and operation
1.1. Intended Audience
This document is intended to be used by hardware developers building products incorporating the Iridium 9704 transceiver. This document focuses on hardware aspects relating to the integration of the Iridium 9704 transceiver into a host product.
1.2. Abbreviations
| Term | Description |
| DEQPSK | Differentially Encoded Quadrature Phase Shift Key |
| EIRP | Equivalent Isotropic Radiated Power |
| EMC | Electromagnetic Compatibility |
| ETSI | European Telecommunications Standards Institute |
| EU | European Union |
| FCC | Federal Communications Commission |
| FDMA | Frequency Division Multiple-Access |
| GNSS | Global Navigation Satellite System |
| IC | Industry Canada |
| IEC | International Electrotechnical Commission |
| IFP | Iridium for Partners |
| ISEDC | Innovation, Science and Economic Development Canada |
| LGA | Land Grid Array |
| MSL | Moisture Sensitivity Level |
| PCB | Printed Circuit Board |
| QPSK | Quadrature Phase Shift Key |
| RED | Radio Equipment Directive |
| RF | Radio Frequency |
| RH | Relative Humidity |
| RSS | Radio Standard Specification |
| SP | Service Provider |
| TDD | Time-Division Duplexing |
| TDMA | Time-Division Multiple-Access |
Electrical Specification
2.1. Absolute Maximum Ratings
| Parameter | MIN | MAX | UNIT |
| RF | |||
| XCVR_RF Average Output Power | 32.0 | ||
| XCVR_RF Peak Output Power | 37.0 | ||
| XCVR_RF Peak input Power | 0.0 | ||
2.2. Recommended Operating Conditions
2.2.1. Transceiver Power Supplies
| Parameter | Conditions | MIN | TYP | MAX | UNIT | |
| Supply Voltages | ||||||
| V_BAT_MAIN | 3.5 | 3.7 | 4.5 | |||
| V_BAT_PA | ||||||
| V_IO | 1.62 | 1.8, 3.3 | 3.6 | |||
2.2.2. Antenna RF Connection – XCVR_RF
| Parameter | Conditions | MIN | TYP | MAX | UNIT |
| Iridium Transmit Frequency Range | 1616.0 | 1626.0 | |||
| Iridium Receive Frequency Range | 1616.0 | 1626.5 | |||
| Average RF Transmit Power (conducted) | 26 | 32 | |||
| Input/Output Impedance | 50 | ||||
| Iridium RF Burst Duration | 8.27 | ||||
| Iridium RF Burst Interval | 90.0 | ||||
| Duplexing Method | TDD | ||||
| Multiplexing Method | TDMA / FDMA | ||||
| Modulation | QPSK, DEQPSK | ||||
RF
3.1. RF Routing
Both the transceiver connection to the antenna (XCVR_RF) and the GNSS passthrough connection to the GNSS receiver (GNSS_RF_OUT) need to be routed on the host PCB as an impedance controlled track. For the XCVR_RF signal it is recommended to use a microstrip track topology on the host PCB routing to a through-hole SMA connector, following the design guidelines and layout requirements below.
Consult Iridium before adopting a different track topology or antenna connector from microstrip and through-hole SMA. This will confirm current design guidelines, layout requirements and regulatory advice.
The reference plane for the RF routing on the host PCB should connect to the GND signal on the Iridium 9704 transceiver using the LGA pads adjacent to the RF pad. The RF signals from the transceiver are referenced to this common GND ground plane within the transceiver.
To achieve a microstrip track the copper and substrate dimensions shown in Figure 1 should be considered, along with the dielectric constant, , of the substrate used. An online calculator tool can be used to find the exact dimensions appropriate for the host board’s stackup, with the table below giving some example values. The impedance control requirements should also be explicitly stated in the design documents provided to the bare PCB fabricator to ensure the dimensions are adjusted to align with the final fabrication processes.
| Track Impedance [Ω] | T | W [mm] | H [mm] | S [mm] | |
| 50 | 1.0 oz/sq-ft Foil + Plating | 0.11 | 0.076 | ≥ 0.22 | 4.2 |
| 0.34 | 0.2 | ≥ 0.68 | |||
| 0.5 | 0.3 | ≥ 1.0 | |||
| 0.9 | 0.5 | ≥ 1.8 | |||
| 2.0 | 1.0 | ≥ 4.0 |
The examples given show a simplified PCB with ony two copper layers. If a PCB with a higher layer count is to be used, either:
- The reference plane for the RF should be on the adjacent layer to the signal. With H being the substrate thickness between the two layers.
- If the reference plane is not on the adjacent layer, then all the copper on the intermediary layers must be removed (including all tracks, vias and planes) out to beyond the separation distance S. The distance H is then the separation distance between the bottom of the copper track and the top of the reference plane, accounting for all substrate and copper thickness on the intermediary layers.
As well as the microstrip dimensional requirements, the following should also be met:
- The RF track should be routed directly from the 9704 transceiver to the antenna connection
- The RF track length should be kept as short as possible to minimize transmission line loss
- No discrete components should be placed in the RF route (series or shunt)
- Avoid the use of any right-angle bends in the RF track. If a large direction change is required, this should be achieved using multiple smaller-angled transitions.
3.2. FCC and ISEDC Modular Grant Re-use
For operation in the US and Canada, the 9704 transceiver has obtained regulatory certification against the technical radio requirements standards in Table 1 in the form of Modular Grants. It is possible for the integrator to use the Modular Grants as evidence of the host product’s compliance with these technical requirements without the need for formal testing or application to the FCC and ISEDC via a TCB or FCB. This is contingent on the adherence to the routing and layout guidelines detailed in Section 3.1, “RF Routing”.
Table 1. US and Canada Technical Radio Requirements
| Governing Standard | Technical Radio Requirements |
| FCC | FCC CFR 47 Part 2: 2021 FCC CFR 47 Part 25: 2025 |
| ISEDC | RSS-170 Issue 4 (2022-09) ISEDC RSS-GEN Issue 5 + A2 (2021-02) |
It is strongly recommended, by both the FCC and ISEDC, that investigative testing against the technical requirements in Table 2 is performed by the integrator. This is to confirm the 9704 transceiver is still compliant to the requirements when integrated into the host product.
It is the responsibility of the integrator to ensure that the Modular Grant is still applicable, this includes the identification and resolution of any test failures of the host product.
Table 2. Advised Technical Radio Requirement Retest By Integrator
| Test Description | Governing Standard | Technical Radio Requirements | Specification Clause |
| Radiated Spurious Emissions | FCC | FCC CFR 47 Part 2: 2021 | 2.1053 |
| FCC CFR 47 Part 25: 2025 | 25.202(f) | ||
| ISEDC | RSS-170 Issue 4 (2022-09) | 5.8 | |
| ISEDC RSS-GEN Issue 5 + A2 (2021-02) | 6.13 | ||
| Equivalent Isotropic Radiated Power | FCC | FCC CFR 47 Part 2: 2021 | 2.1046 |
| FCC CFR 47 Part 25: 2025 | 25.204 | ||
| ISEDC | RSS-170 Issue 4 (2022-09) | 5.5 | |
| ISEDC RSS-GEN Issue 5 + A2 (2021-02) | 6.12 |
For the testing outlined in Table 2, a maximum power C2 burst at top, middle and bottom of the Iridium band should be used. For details of the required test commands see [IR5187-AN-009].
3.3. Antenna Compatibility
The Iridium 9704 transceiver requires the integrator to provide a matched antenna capable of supporting the RF frequency range and RF powers specified in this document and further detailed in [IR5187-TRD-005].
The Iridium 9704 transceiver must be used with an Iridium compliant antenna with a gain that does not exceed +5.0 dBi.
Mechanical
4.1. Transceiver Dimensions
| Description | VALUE | UNIT |
| Transceiver Length | 42.0 | |
| Transceiver Width | 31.5 | |
| Transceiver Thickness | 3.9 | |
| Transceiver Weight | 9.7 | |
| Transceiver Flatness (LGA Pad Surface) | better than 0.1 |
Environmental
5.1. Operating Conditions
| Parameter | MIN | MAX | UNIT |
| Environmental | |||
| Storage Temperature | -40 | 125 | |
| Storage Humidity | 93 | ||
| MSL | Level 3 | ||
| Operational Temperature | -40 | 85 | |
| Operating Humidity | 95 | ||
| Maximum Operational Vibration | from to , to dropping per octave from to , to dropping per octave | ||
| Maximum Operational Shock | peak shock over a period of , 3 shocks in 3 perpendicular orientations | ||
The operating temperature is defined as the temperature as measured at the transceiver electronics within any host enclosure.
Prolonged storage at high temperature prior to reflow can result in poor solderability of parts due to effects such as oxidation. Consult standard JEDEC practices for storage and handling of SMT parts prior to host product assembly.
5.2. Thermal Management
5.2.1. Transceiver Self-Heating and Thermal Integration
When operating, the Iridium 9704 transceiver will dissipate power internally as heat. It is the responsibility of the host product to conduct this heat away from the transceiver to maintain the transceiver within its operating temperature range.
The primary thermal path for conducting this heat from the transceiver is through the LGA GND pads on the underside of the transceiver – i.e. directly into the host PCB. The screening can of the Iridium 9704 transceiver is only weakly thermally coupled to the internal circuitry, and is not recommended as a thermal path.
The extent of self-heating of the transceiver will depend on the dissipative design of the host product.
When transmitting or in high ambient temperatures, the Iridium 9704 can be hot to the touch. Avoid direct contact with the transceiver in order to avoid burns.
Regulatory Approvals
The Iridium 9704 transceiver is a regulatory approved component that can be fitted within an integrator’s product or host device. The integrator is responsible for providing the appropriate external connections to ensure that the host device meets all pertinent regulatory requirements such as CE, FCC, and IC. It is the responsibility of the integrator to ensure that the host product meets all regulatory requirements.
The Iridium 9704 has been tested to the regulatory and technical certifications shown below.
| Regulatory Approvals | Tests | Regulatory and Technical Certifications |
| FCC | Radio Tests | FCC 47 CFR Part 2: 2021 |
| FCC 47 CFR Part 25: 2023 | ||
| Industry Canada | Radio Tests | RSS170 Issue 4 (2022-09) |
| ISEDC RSS-GEN Issue 5 + A2 (2021-02) | ||
| EU (RED) | Radio Tests | ETSI EN 301 441 V2.1.1 (2016-06) |
| Electrical / Mechanical / Operational Safety Tests | IEC 62368-1:2024 + A11:2024 | |
| EN 50665: 2017 | ||
| EMC Tests | ETSI EN 301 489-1 V2.2.3 (2019-11) | |
| ETSI EN 301 489-20 V2.1.1 (2019-04) |
6.1. Unauthorized Changes
Iridium has not approved any changes or modifications to the Iridium 9704 transceiver by the user. Any changes or modifications could void the user’s authority to operate the equipment.
6.2. Radio Interference
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropic radiated power (EIRP) is not more than that necessary for successful communication.
6.3. RF Exposure
This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 30 cm between the radiator and your body. Antenna gain must be below: +5.0 dBi. This transmitter must not be colocated or operated in conjunction with any other antenna or transmitter.
6.4. Labeling Requirements for Host Device
The host device shall be properly labeled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the FCC ID and IC of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows:
| Contains FCC ID: Q639704 Contains IC: 4629A-9704 |
or | Contains transmitter module FCC ID: Q639704 Contains transmitter module IC: 4629A-9704 |
6.5. EU Declaration of Conformity
The EU Declaration of Conformity is available on the Iridium for Partners website, https://www.iridium.com/ifp.
Iridium Proprietary Business Information
Documents / Resources
 |
Iridium 9704 Satellite IoT Developer Kit [pdf] User Guide 9704, Q639704, 9704 Satellite IoT Developer Kit, 9704, Satellite IoT Developer Kit, IoT Developer Kit, Developer Kit, Kit |