Ai-Thinker BW20-12F Dual Band Wi-Fi plus BLE SoC Module Owner's Manual

The BW20-12F module is electrostatic sensitive equipment.
Special ESD precautions are required during transportation,
operation, and use. ESD protective devices should be used, and
avoid touching the module by hand or using non-antistatic iron to
prevent damage.

Electrical Characteristics:

The module operates within a voltage supply range of 3.0V to
3.6V. Ensure that input and output voltage levels meet the
specified VIL, VIH, VOL, and VOH values as per Table 2.

Wi-Fi RF Performance:

The module’s RF performance for BLE is detailed in Table 3,
including output power and receiving sensitivity values for
different modes.

BLE RF Performance:

The BLE RF performance information is provided in Table 4,
specifying frequency ranges, output power, and receiving
sensitivity for different rate modes.

Appearance Dimensions:

The front and back appearance diagrams are shown in Figure 3.
Refer to the size diagram in Figure 4 for physical dimensions.

FAQ:

Q: Is the BW20-12F module compatible with Arduino?

A: Yes, the module supports Arduino development.

Q: What precautions should be taken to prevent ESD damage?

A: Use ESD protective devices and avoid touching the module by
hand or using non-antistatic iron.

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BW20-12F Specification V1.0.0

BW20-12F Specification

Page 1 of 20

Document resume

BW20-12F Specification V1.0.0

Version

Date

V1.0.0 2024.06.13

Develop/revise content First Edition

Edition Xihuan Lu

Approve Ning Guang

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BW20-12F Specification V1.0.0
Content
1. Product overview ……………………………………………………………………………………………………….4 1.1. Characteristic …………………………………………………………………………………………………..5
2. Main parameters ……………………………………………………………………………………………………….. 6 2.1. Static electricity requirement ……………………………………………………………………………..6 2.2. Electrical characteristics …………………………………………………………………………………… 7 2.3. Wi-Fi RF performance ………………………………………………………………………………………7 2.4. BLE RF performance ………………………………………………………………………………………. 8
3. Appearance dimensions ……………………………………………………………………………………………… 9 4. Pin definition ………………………………………………………………………………………………………….. 11 5. Schematic diagram ………………………………………………………………………………………………….. 13 6. Design guide ……………………………………………………………………………………………………………14
6.1. Circuit guidance of application ……………………………………………………………………….. 14 6.2. Recommend PCB package size ……………………………………………………………………….. 14 6.3. Antenna layout requirements ……………………………………………………………………………15 6.4. Power supply ………………………………………………………………………………………………… 15 6.5. GPIO …………………………………………………………………………………………………………….16 7. Storage conditions …………………………………………………………………………………………………… 17 8. Reflow welding curve diagram …………………………………………………………………………………. 17 9. Product Packaging Information ………………………………………………………………………………….18 10. Contact us …………………………………………………………………………………………………………….. 18 Disclaimer and copyright notice …………………………………………………………………………………….19 Notice ……………………………………………………………………………………………………………………….. 19 Important statement …………………………………………………………………………………………………….. 20

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BW20-12F Specification V1.0.0
1. Product overview
BW20-12F is a dual-band Wi-Fi + BLE SoC module developed by Ai-Thinker based on RTL8711 series chips, which supports dual-frequency (2.4 GHz or 5 GHz)802.11a/b/g/n WLAN protocol and Bluetooth 5.0 protocol. The BW 20-12F integrates dual-core MCU, a ARM V8.1 (Cortex-M4F compatible) high-performance MCU with a maximum frequency of 330 MHz; a ARM V8M (Cortex-M0 compatible) low-power MCU. The BW20-12F module has rich peripheral interfaces, including UART / GPIO / ADC / PWM / IIC / SPI / SDIO / IR / SWD / USB etc. It can be widely used in the Internet of Things (IoT), mobile devices, wearable electronic devices, smart home and other fields.

Figure 1 Chip Block Diagram

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BW20-12F Specification V1.0.0
1.1. Characteristic
Support for the 802.11a/b/g/n protocol Support for dual-frequency 2.4GHz or 5GHz Supports the HT20 / HT40 mode Support for Bluetooth 5.0 Support for BLE Long Range The Bluetooth supports a high-power mode LE data length extension Support for link layer privacy Support for the hardware encryption engine Integrated dual-core MCU, up to 330 MHz Abundant interfaces, with 17 flexible IO ports Wi-Fi and Bluetooth share the same antenna Support secondary development, support programming in Linux and Windows
environments Support for Arduino development

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BW20-12F Specification V1.0.0

2. Main parameters
Table 1 Description of the main parameters

Model Package
Size Antenna Frequency range Operating temperature Storage temperature Power supply Support interface Available IO UART rate Bluetooth SPI flash

BW20-12F SMD-22 24*16*3.2(±0.2)MM on-board PCB antennaIPEX connector1st generation 2400~2483.5MHz and 5180~5825MHz -40 ~85 -40 ~125 <90%RH Voltage supply 3.0V~3.6VCurrent supply>500mA UART/GPIO/ADC/PWM/IIC/SPI/SDIO/IR/SWD/USB Default 17 Default 115200bps BLE 5.0 Default 4MByte

2.1. Static electricity requirement

BW 20-12F module is electrostatic sensitive equipment, which requires special ESD precautions, and usually ESD protective devices should be added in use. Proper ESD handling and packaging must be used during the transportation, operation, and use of the BW 20-12F module. Do not touch the module by hand or use non-antistatic iron to damage the module.

Figure 2 ESD Anti-static diagram

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BW20-12F Specification V1.0.0

2.2. Electrical characteristics
Table 2 Electrical characteristics table

Parameters Condition

Min.

Typical value

Max.

Unit

Voltage supply

3V3

3.0

3.3

3.6

VIL

–

0.3*VDD

I/O

VIH

–

0.65*VDD

–

VOL

–

0.15*VDD

–

VOH

–

0.85*VDD

–

2.3. Wi-Fi RF performance

Table 3 BLE RF performance

Description Frequency range
Mode 11a modePA output power 11b modePA output power 11g modePA output power 11n modePA output power
Mode 11b1Mbps 11b11Mbps 11a/g6Mbps 11a/g54Mbps HT20MCS0 HT20MCS7 HT40MCS0 HT40MCS7

Typical value

2400~2483.5 and 5180~5825

Output power

Min. value Typical value

–

24.083

Max. va-lue

–

23.908

–

23.981

–

23.918

–

Receiving sensitivity

Min.value Typical value

–

-99

Max. va-lue

–

-90

–

-94

–

-76

–

-93

–

-74

–

-91

–

-71

–

Unit MHz
Unit dBm dBm dBm dBm
Unit dBm dBm dBm dBm dBm dBm dBm dBm

Page 7 of 20

BW20-12F Specification V1.0.0

2.4. BLE RF performance

Table 4 BLE RF performance

Description Frequency range
Rate mode 1Mbps 2Mbps
Rate mode 1Mbps @30.8%PER 2Mbps @30.8%PER

Typical value 2400 ~ 2480MHz

Output power

Min.value –

Typical value 8.153 8.139

Max.value –

Receiving sensitivity

Min.value Typical value Max.value

–

-99

–

-97

–

Unit MHz
Unit dBm dBm
Unit dBm dBm

Page 8 of 20

3. Appearance dimensions

BW20-12F Specification V1.0.0

Front

Back

Figure 3 Appearance diagram (Rendering figure is for reference only,subject to physical objects)

Front Figure 4 Size diagram

Back

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O/I

H/N

BW20-12F Specification V1.0.0

FLASH size (MB)
Module temperature version Hhigh temperature Nnormal temperature
FLASH FLASH type
O:Chip external FLASH I :Chip built-in FLASH Figure 5 The screen cover information

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BW20-12F Specification V1.0.0
4. Pin definition
BW20-12F is connected a total of 22 pins, as in the pin schematic diagram, and the definition of the pin function is shown in the following table.

Front

Back

Figure 6 Pin diagram Table 5 Pin function definition table

No.

Name

Function description

PB17 TOUCH2_ADC2/SPI1_CS/SD_D3

PB18 TOUCH1_ADC1/SPI1_CLK/SD_CMD

Chips enable pin and pull up effectively

PB19 TOUCH0_ADC0/SPI1_MOSI/SD_CLK

LOG_RX UART_LOG_RXDFirmware download RX pin

PB20 SPI1_MISO/SWD_CLK/SD_D0

PB21 SPI1_CS/SWD_DAT/SD_D1

3V3

3.3V power supplyVDDthe external power supply output current

is recommended in above 500mA

PA8

PSRAM_DQ5/TIM8_TRIG

PA12 SPI0_CS/SD_D2/TIM9_TRIG

The default is not available and the IO is occupied by Flash inside the

PA13

module. Please contact Ai-Thinker if need to use. SD_D2/external

Flash this pin is NC

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BW20-12F Specification V1.0.0

The default is not available and the IO is occupied by Flash inside the

PA16

module. Please contact Ai-Thinker if need to use.

SPI0_MISO/SD_CLK/external Flash this pin is NC

PA29/SPI1_CLK/SD_CLK/FSDP

PA28/SPI0_MISO/SD_CMD/FSDM

GND Ground

PA26 SPI0_CLK/SD_D2

LOG_TX UART _ LOG _ TXD, TX pin for download firmware, do not external

pull down will enter Flash download mode

PA27 SPI0_MOSI/SD_D3

PA30

SPI1_MOSI/SWD_CLK/SD_D0default function is SWD DATAIC

can be configured as PA31

PA31

SPI1_MISO/SWD_DAT/SD_D1fefault function is SWD DATAIC

can be configured as PA31

PB30/RXD

UART 1 _ RXD, do not external pull down, external pull down will enter Load OTP settings

22 PB31/TXD UART 1 _ TXD, do not external pull down, external pull down will enter the chip test mode

Note: 1. When LOG_TX is low level at the moment of power-on, the module enters the burning mode; when it is high level at the moment of power-on, the module starts normally and defaults is pull-up. 2. PA13 and PA16 are internally occupied in the external Flash version. At this time, these two IOs are unavailable and the pins are left floating. 3. PB30 / RXD Do not external pull down, external pull down will enter the Load OTP settings. 4. PB31 / TXD do not external down, external down will enter the chip test mode.

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5. Schematic diagram

BW20-12F Specification V1.0.0

Figure 7 Schematic diagram

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6. Design guide
6.1. Circuit guidance of application

BW20-12F Specification V1.0.0

Figure 8 Circuit guidance of application Note LOG _ TX is the starting control pin in normal operating mode at high level and burning
firmware mode at low level. Internal chip default high level.
6.2. Recommend PCB package size

Figure 9 Recommend PCB package sizeTOP view

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BW20-12F Specification V1.0.0
6.3. Antenna layout requirements
In the installation position on the motherboard, the following two ways are recommended: Scheme 1: put the module on the edge of the motherboard, and the antenna area extends of the edge of the motherboard. Scheme two: put the module on the edge of the motherboard, which hollowed an area in the antenna position. In order to meet the performance of on-board antenna, metal parts are prohibited around
the antenna, away from high-frequency devices.

Figure 10 Schematic diagram of the antenna layout
6.4. Power supply
Recommended 3.3V voltage, peak current above 500 mA. It is recommended to use LDO; if DC-DC, ripple control within 30 mV. The DC-DC power supply circuit suggests to reserve the position of the dynamic response
capacitor, which can optimize the output ripple when the load change is large. 3.3V power interface, it is recommended to add ESD devices. If the power supply is boosted from 1.5V to 3.0V for more than 15 ms, add the voltage
reset IC or use the wide voltage version Flash. During the repeated up and down process, if the voltage cannot be less than 0.3V, the
voltage reset IC must be increased.

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BW20-12F Specification V1.0.0

Figure 11 The DC-DC step-down circuit diagram
6.5. GPIO
There are some IO ports on the periphery of the module. If you need to use it, it is recommended to connect a 10-100 ohm resistor in series with the IO port.
This inhibits overshoot and makes both sides level more stable. It is helpful for EMI and ESD. For special I/O ports to be pulled up and down, refer to the usage instructions in the specifications, which may affect the module startup configuration. The IO port of the module is 3.3V. If the IO level of the main control and the module do not match, a level conversion circuit needs to be added. If the I/O port is directly connected to a peripheral port or terminals, for example, a pin row, reserve an ESD device near the terminal of the I/O cable.

Figure 12 The level conversion circuit

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BW20-12F Specification V1.0.0
7. Storage conditions
Products sealed in moisture-proof bags should be stored in a non-condensing atmosphere of <40 ° C /90%RH. The module has a moisture sensitivity rating of MSL 3. After the vacuum bag is opened, it must be used within 168 hours at 25±5/60%RH, otherwise it needs to be baked before it can be put on line again.
8. Reflow welding curve diagram

Figure 13 Reflow welding diagram

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BW20-12F Specification V1.0.0
9. Product Packaging Information
BW20-12F module module was packaged in a tape, 800pcs/reel.As shown in the below image:

Figure 14 Package and packing diagram

10.Contact us

Ai-Thinker official website

Office forum

Develop DOCS

Tmall shop

Taobao shop

Alibaba shop

Technical support emailsupport@aithinker.com

Domestic business cooperationsales@aithinker.com

Overseas business cooperationoverseas@aithinker.com

Company AddressRoom 403-405,408-410, Block C, Huafeng Smart Innovation Port, Gushu 2nd Road, Xixiang, Baoan District, Shenzhen.

Tel+86-0755-29162996

WeChat mini program

WeChat official account

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BW20-12F Specification V1.0.0
Disclaimer and copyright notice
The information in this article,including the URL address for reference,is subject to change without notice. The document is provided”as is”without any guarantee responsibility,including any guarantee for merchantability,suitability for a specific purpose,or non-infringement,and any guarantee mentioned elsewhere in any proposal,specification or sample.This document does not bear any responsibility,including the responsibility for infringement of any patent rights arising from the use of the information in this document.This document does not grant any license for the use of intellectual property rights in estoppel or other ways,whether express or implied. The test data obtained in the article are all obtained from Ai-Thinker’s laboratory tests,and the actual results may vary slightly. All brand names,trademarks and registered trademarks mentioned in this article are the property of their respective owners,and it is hereby declared. The final interpretation right belongs to Shenzhen Ai-Thinker Technology Co.,Ltd.
Notice
Due to product version upgrades or other reasons,the contents of this manual may be changed. Shenzhen Ai-Thinker Technology Co.,Ltd.reserves the right to modify the contents of this manual without any notice or prompt. This manual is only used as a guide.Shenzhen Ai-Thinker Technology Co.,Ltd. makes every effort to provide accurate information in this manual.However, Shenzhen Ai-Thinker Technology Co.,Ltd. does not guarantee that the contents of the manual are completely free of errors.All statements and information in this manual And the suggestion does not constitute any express or implied guarantee.

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BW20-12F Specification V1.0.0
Important statement
Ai-Thinker may provide technical and reliability data “as is” (including data sheets), design resources (including design for reference purposes), application or other design recommendations, network tools, security information and other resources (the “these resources”) and without warranty without express or implied warranty, including without limitation, adaptability for a particular purpose or infringement of intellectual property rights of any third party. And specifically declares that it is not liable for any inevitable or incidental losses arising from the application or the use of any company products and circuits.
Ai-Thinker reserves the right to the information released in this document (including but not limited to the indicators and product description) and any changes to the Company without notice to automatically replace and replace all the information provided in the previous version of the same document number document.
These resources are available to skilled developers who design Ai-Thinker products. You will assume all responsibilities for the following: (1) select the appropriate optional products for your application; (2) design, verify, and run your application and products during the full life cycle; and (3) ensure that your application meets all corresponding standards, norms and laws, and any other functional security, information security, regulatory or other requirements.
Ai-Thinker authorizes you to use these resources only for the application of the Essence products described in this resource. Without the permission of Ai-Thinker, no unit or individual shall copy or copy part or all of these resources without authorization, and shall not spread them in any form. You are not entitled to use any other Principal or any third party intellectual property. You shall fully indemnify you for any claims, damages, costs, losses and debts incurred by the result of the use of these resources.
The products available by Ai-Thinker are subject to the terms of sales or other applicable terms attached to the products. Ai-Thinker may provide these resources does not extend or otherwise change the applicable warranty or warranty disclaimer for the product release.

Page 20 of 20

FCC WARNING FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: –Reorient or relocate the receiving antenna. –Increase the separation between the equipment and receiver. –Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. –Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other

antenna or transmitter. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labelled in a visible area with the following: “Contains Transmitter Module “FCC ID: 2ATPO-BW20”
Requirement per KDB996369 D03
2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power,spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3
Explanation: This module meets the requirements of FCC part 15C (15.247).it Specifically identified AC Power Line Conducted Emission, Radiated Spurious emissions, Band edge and RF Conducted Spurious Emissions, Conducted Peak Output Power, Bandwidth, Power Spectral Density, Antenna Requirement.
2.3 Summarize the specific operational use conditions
Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-topoint antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer’s instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands.
Explanation: The product antenna uses an irreplaceable antenna with a gain of 2.4GWIFI:2.33dBi, BT : 2.33dBi, WiFi (5.2G) : 2.91dBi, WiFi (5.3G) : 3dBi, WiFi (5.6G) : 3.79dBi WiFi, (5.8G) : 5.33dBi
2.4 Single Modular
If a modular transmitter is approved as a “Single Modular,” then the module manufacturer is responsible for approving the host environment that the Single Modular is used with. The manufacturer of a Single Modular must describe, both in the filing and in the installation instructions, the alternative means that the Single Modular manufacturer uses to verify that the host

meets the necessary requirements to satisfy the module limiting conditions. A Single Modular manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited
module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This Single Modular procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. Explanation: The module is a single module. 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.
a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna); b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered); c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout; d) Appropriate parts by manufacturer and specifications; e) Test procedures for design verification; and f) Production test procedures for ensuring compliance
The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the

module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a person’s body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application).
Explanation: The module complies with FCC radiofrequency radiation exposure limits for uncontrolled environments. The device is installed and operated with a distance of more than 20 cm between the radiator and your body.” This module follows FCC statement design, FCC ID: 2ATPO-BW20 2.7 Antennas
A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an “omni-directional antenna” is not considered to be a specific “antenna type”). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product.

The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The product antenna uses an irreplaceable antenna with a gain of
2.4GWIFI:2.33dBi, BT : 2.33dBi, WiFi (5.2G) : 2.91dBi, WiFi (5.3G) : 3dBi, WiFi (5.6G) : 3.79dBi WiFi, (5.8G) : 5.33dBi
2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID” with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. Explanation: The host system using this module, should have label in a visible area indicated the following texts: “Contains FCC ID: 2ATPO-BW20 2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturer’s determination that a module as installed in a host complies with FCC requirements. Explanation: Shenzhen Ai-Thinker Technology Co., Ltd can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter. 2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product

as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.

Documents / Resources

Ai-Thinker BW20-12F Dual Band Wi-Fi plus BLE SoC Module [pdf] Owner's Manual
2ATPO-BW20, 2ATPOBW20, bw20, BW20-12F Dual Band Wi-Fi plus BLE SoC Module, BW20-12F, Dual Band Wi-Fi plus BLE SoC Module, Wi-Fi plus BLE SoC Module, BLE SoC Module, SoC Module, Module

References

User Manual

BW20-12F Dual Band Wi-Fi plus BLE SoC Module

Specifications:

Product Overview:

Main Parameters:

Product Usage Instructions:

Static Electricity Requirement:

Electrical Characteristics:

Wi-Fi RF Performance:

BLE RF Performance:

Appearance Dimensions:

FAQ:

Q: Is the BW20-12F module compatible with Arduino?

Q: What precautions should be taken to prevent ESD damage?

Documents / Resources

References

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