Shenzhen CHF8ML BLE Module Owner’s Manual

CHF8ML BLE Module

Specifications

Protocol and Interface Standards

Bluetooth standard Compliant with Bluetooth V5.0 LE standard
Data interface I/O port UART/HSPI/I2C/I2S/IR Remote Control (not used for lighting
control) GPIO,UART,SPI,I2C,PWM,I2S,LED 17 universal I/O ports, all
of which can be set as interrupts
CPU Main frequency processing speed: 12-48Mhz
Memory capacity 150KB ROM, up to 48KB RAM
FLASH 8M Flash ROM
Bluetooth BLE feature Transmission power: Up to -1.0dBm transmission power
Encryption Type AES/CCM
Bluetooth RF parameters (typical values) Operating Frequency: 2400-2483.5 MHz, Transmission power:
-1.0dBm, Working current (typical value)

Product Usage Instructions

1. Installation

Ensure that no metallic substances are around the module antenna
for optimal BLE connection performance.

2. Intelligent Control System Integration

Developers can achieve Bluetooth control functions by
integrating the CHF8ML BLE Module with mobile phone Bluetooth or
cloud systems and related APP software.

3. Modules & Application Fields

The CHF8ML BLE Module supports various applications such as
Bluetooth voice remote control, intelligent toys, smart home
appliances, and more. It features a range of interfaces and
functionalities including GPIO, UART, SPI, I2C, PWM output, I2S
interface, LED driver, and more.

4. Wireless Connection Setup

Before Bluetooth pairing, install the required APP to establish
a wireless connection between smart devices and mobile phones via
Bluetooth or Bluetooth routers.

FAQ

Q: Can the CHF8ML BLE Module support multiple Bluetooth device
connections?

A: Yes, the module supports up to 14 Bluetooth device
connections and master-slave role operations.

Q: What is the main processor used in the CHF8ML BLE
Module?

A: The module features an ARM CortexM3 32-bit processor with a
main frequency of 12-48MHz.

Q: Does the CHF8ML BLE Module support remote upgrades?

A: Yes, it supports AT remote upgrade and cloud OTA upgrade for
firmware updates.

“`

CHF8ML BLE Module
BLE MODULE DATASHEET – CHF8ML CHF8ML Bluetooth Module Information
File version: V1.0 Production date: 2022-03-07

versi on
V1.0

REVISIO N
Initial version

writer
Wangua nXiong

to exami
ne
Jeff

date 2022/03/07

depart ment
product ion
depart ment

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CHF8ML BLE Module
1 Product Introduction
1.1 product overview
The CHF8ML BLE Module is based on Bluetooth Low Energy technology for the Internet of Things (IoT) The Bluetooth BLE control module developed and designed adopts the module designed by FR801x Bluetooth BLE IC. Featuring high cost-effectiveness and reliability, we provide the best solutions and services for the Internet of Things era. For IoT applications that connect everything, the CHF8ML BLE Module module, together with a series of hardware design reference materials, apps, and firmware, can quickly help developers and manufacturers achieve the development and rapid mass production of Bluetooth smart products. If there is a need for customization and deep design, we will also provide API interfaces, development tool SDKs, and more
1.2 Product images
Figure 0.1 CHF8ML BLE Module module (without IPEX mount)
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1.3Applicationdiagram

CHF8MLBLEModule

Attention:InordertoensuregoodBLEconnectionperformance,thereshouldbenometallicsubstancesaroundthe
module antenna.
1.4IntroductiontoIntelligentControlSystem
ByintegratingtheCHF8MLBLEModulemodule,developerscanachievetheBluetoothcontrolfunctionshownin
thefigurebelow.ThroughtheBluetoothorcloudsystemofthemobilephoneandrelatedinstalledAPPsoftware,
smmaacrhtindeevinicteersacctaionnbmeeccohnatnrioslmledanbdydmevoicbeilteoadpepvsi/coerdinintearrcyonsnweictcthioens,/vboriinceg,inegtcu.sWersethweilblecstreuasteereaxppeerrfieecntceh,umanBeforeBluetoothpairing,itisnecessarytoinstallanAPPtoachievewirelessconnectionbetweensmartdevicesand
mobilephonesviaBluetoothorBluetoothrouters.

3 / 18

1.5 Modules&Application Fields

CHF8ML BLE Module

Module characteristics
Supports 2.4GHz Bluetooth Low Energy 5.0 Compliant with Bluetooth specification V5.0 LE, supporting 2M, 1M, 500K, and 125K data rates Supports up to 14 Bluetooth device connections and master-slave role operations ARM CortexM3 32-bit processor, with a main frequency of 12-48MHz Built in 150KB ROM and up to 48KB SRAM Built in 4Mbits flash memory as user program and data storage space Interface: General GPIO, UART interface, SPI interface, I2C interface, PWM output, I2S interface, LED
driver Built in charging management unit Independent watchdog circuit Support 240 * 240 pixel LCD color screen Supports MIC microphone input and AUDIO speaker output Support AT remote upgrade and cloud OTA upgrade Support Bluetooth BLUETOTH SIG MESH self-organizing network function Supports PCB board mounted antennas (if needed, external antennas can also be supported)

application area
Bluetooth voice remote control intelligent toy Intelligent lighting fixtures Intelligent sports and fitness equipment Smart toothbrushes, smart weight scales, and smart personal care devices Smart home appliances, smart home devices Intelligent medical devices: health thermometers, heart rate, blood pressure, blood sugar, etc

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CHF8ML BLE Module

1.6 Product specifications

Table 1-6-1 Product Specifications:

Protocol and Interface Standards

Bluetooth standard

Compliant with Bluetooth V5.0 LE standard

data interface I/O port

UART/HSPI/I2C/I2S/IR Remote Control (not used for lighting control) GPIO,UART,SPI,I2C,PWM,I2S,LED 17 universal I/O ports, all of which can be set as interrupts

CPU

Main frequency processing speed
Memory capacity

12-48Mhz

SRAM

150KB ROM, up to 48KB RAM

FLASH

8M Flash ROM

Bluetooth BLE feature

Transmission power

Up to -1.0dBm transmission power

Encryption Type

AES/CCM

Bluetooth RF parameters (typical values)

Operating Frequency
Transmission power

2400-2483.5 mhz -1.0dBm

Working current (typical value)

Power input VCC

1.8~4.3V

Working current
working conditions
operation temperature storage temperature

8 mA -40ºC to +85ºC -55ºC to +125ºC

Working humidity

5% to 95% (non condensing)

Physical parameters Antenna type

PCB built-in antenna, optional IPEX mount (connected to external antenna)

Product size

17.95 * 10.60 * 2.60 (height) mm

Wireless transmission distance

Wireless transmission distance

Indoor: 20m, outdoor: 30m (depending on the environment)

1.7 Interface Definition

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CHF8ML BLE Module

Figure 1-7-1 Pin Identification
Table 1-7-1 Definition of Pin Functions for CHF8ML BLE Module BLE Module

Serial Number
1

Pin identification
OUT-P

2

OUT-N

3

RTSP

4

VCHG

5

LDO-OUT

6

PD7

7

PD6

8

PD5

9

PD4

pin type Function Description

AI PWR

Global reset (high active) Charger supply input

DIO DIO DIO DIO

SDA1/I2SDIN/PWM1/SSPDIN/UTXD0/UTXD1/ANT CTL1/PDMDAT/PWM0/ADC3
SCL1/I2SDOUT/PWM0/SSPDOUT/URXD0/URXD1/ CLKOUT/PDMCLK/PWM1/ADC2
SDA0/I2SFRM/PWM5/SSPCSN/UTXD0/UTXD1/ANT CTL0/PDMDAT/PWM4/ADC1
SDA0/I2SFRM/PWM5/SSPCSN/UTXD0/UTXD1/ANT CTL0/PDMDAT/PWM4/ADC4

6 / 18

CHF8ML BLE Module

10

PC7

DIO

SDA0/I2SFRM/PWM5/SSPCSN/UTXD0/UTXD1/SW V/PDMDAT/PWM

11

PC6

SDA0/I2SFRM/PWM5/SSPCSN/UTXD0/UTXD1/SW

DIO

V/PDMDAT/PWM

12

PC5

DIO

SDA0/I2SFRM/PWM5/SSPCSN/UTXD0/UTXD1/SW V/PDMDAT/PWM4

13

PC3

SDA0/I2SFRM/PWM5/SSPCSN/UTXD0/UTXD1/SW

DIO

V/PDMDAT/PWM

14

PC2

DIO

SDA0/I2SFRM/PWM5/SSPCSN/UTXD0/UTXD1/SW V/PDMDAT/PWM

15

PC1

SDA0/I2SFRM/PWM5/SSPCSN/UTXD0/UTXD1/SW

DIO

V/PDMDAT/PWM

16

PC0

DIO

SDA0/I2SFRM/PWM5/SSPCSN/UTXD0/UTXD1/SW V/PDMDAT/PWM

17

VBAT

PWR Battery positive supply input

18

GND

GND Ground

19

PD3

DIO

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD IO/PDMDAT/PWM

20

PD2

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD

DIO

IO/PDMDAT/PWM

21

PD1

DIO

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD IO/PDMDAT/PWM

22

PD0

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD

DIO

IO/PDMDAT/PWM

23

PB4

DIO

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD IO/PDMDAT/PWM

24

PB6

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD

DIO

IO/PDMDAT/PWM

25

PB7

DIO

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD IO/PDMDAT/PWM

26

PB1

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD

DIO

IO/PDMDAT/PWM

27

PB2

DIO

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD IO/PDMDAT/PWM

28

PB3

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD

DIO

IO/PDMDAT/PWM

29

PB5

DIO

SDA1/I2SDIN/PWM5/SSPDIN/UTXD0/UTXD1/SWD IO/PDMDAT/PWM

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30

PA3-TX

31

PA2-RX

32

PA1

33

PA0

34

PA7

35

PA6

36

PA4

CHF8ML BLE Module

DIO

SDA1/I2SDIN/PWM3/SSPDIN/UTXD0/UTXD1/ANT CTL1/PDMDAT/PWM2

SCL1/I2SDOUT/PWM2/SSPDOUT/URXD0/URXD1/

DIO

ANTCTL0/PDMCLK/PWM3

DIO

SDA0/I2SFRM/PWM1/SSPCSN/UTXD0/UTXD1/ANT CTL0/PDMDAT/PWM0

SCL0/I2SCLK/PWM0/SSPCLK/URXD0/URXD1/CLK

DIO

OUT/PDMCLK/PWM1

DIO

SDA1/I2SDIN/PWM1/SSPDIN/UTXD0/UTXD1/ANT TL0/PDMDAT/PWM0

SCL1/I2SDOUT/PWM0/SSPDOUT/URXD0/URXD1/CLKOUT/

DIO

PDMCLK/PW1M1

DIO

SCL0/I2SCLK/PWM4/SSPCLK/URXD0/URXD1/CLK OUT/PDMCLK/PWM5

Table 1-7-2 Description of Pin Types for CHF8ML BLE Module BLE Module

sign
I O AI AO IO OD PWR GND

Description and Explanation
Digital Input Digital Output Analog Input Analog Output Bidirectional(digital) Open Drain Power Ground

2 Electrical characteristics

Table 2-1 Recommended Electrical Parameters

parameter
operation temperature
Nuclear voltage I/O voltage
Supply Voltage

describe

minimum

Typical Maximum

unit

value

values value

Working temperature 2 hours after startup

-20

20

105

ºC

N/A

0.9

1.2

1.3

V

VDDIO VBAT

1.65

2.5

3.5

V

1.8

3.3

4.3

V

8 / 18

Charger voltage

VCHG

Table 2-2 DC Electrical Parameters Table

category

name

Input logic low level Input logic high level Output logic low level Output logic high level

VIL VIH VOL VOH

Table 2-3 Power Consumption Parameters
Working mode
TX peak current (0dB) RX peak current Deep sleep current (48K RAM hold) ShutDown Current

Table 2-4 Environmental Parameters
Working mode
operation temperature storage temperature Working humidity (non condensing) Storage humidity (non condensing)

CHF8ML BLE Module

4.75

5

5.25

V

minimum

Maximum

unit

value

value

-0.3

0.3*VDDIO

V

0.7*VDDIO

VDDIO+0.3

V

0.1*VDDIO

V

0.8*VDDIO

V

average value N/A
N/A
6.1
2.7

Maximum

unit

value

8

mA

9.7

mA

N/A

A

N/A

A

minimum

Maximum

unit

value

value

-45

+85

ºC

-55

+125

ºC

5%

95%

5%

95%

3 RF parameters
3.1 General wireless characteristic parameters

Table 3-1 General Wireless Characteristics Parameters

name

condition

Frequency Range(MHz)

minimum value
2402

typical –

Maximum value
2480

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CHF8ML BLE Module

3.2 Bluetooth Rx characteristic parameters

Table 3-2 Bluetooth Reception Characteristics Parameter Table

name

condition

Sensitivity (dBm) Maximum Input Level (dBm)
C/I
Blocker Power (dBm) Max PER Report Integrity
Max Intermodulation level(dBm)

PER 30.8%
PER 30.8%
C/I co-channel (dB)
C/I +1MHz (dB)
C/I -1MHz (dB)
C/I +2MHz (dB)
C/I -2MHz (dB)
C/I +3MHz (dB)
C/I -3MHz (dB)
C/I Image+1MHz (dB)
C/I Image-1MHz (dB) 70~2000MHz, Wanted signal level =-67dBm 2003~2399MHz, Wanted signal level =-67dBm 2484~2997MHz, Wanted signal level =-67dBm 3000MHz~6000MHz, Wanted signal level =-67dBm Wanted signal: -30dBm Wanted signal (f0): -64dBm Worst intermodulation level @2f1-f2=f0, |f1-f2|=n MHz,n=3, 4, 5… –

minimum value
-95
21 15 15 -15 -17 -9 -27 -15 -15

typical Maximum value

1

-30

-35

-35

-30

50%

-50

3.3 Bluetooth Tx characteristic parameters

Table 3-3 Bluetooth Transmission Characteristics Parameter Table

name

condition

Maximum Output Power (dBm)

N/A +2MHz -2MHz
10 / 18

minimu m
value
-30

typical 0

Maxim um value -1.0
-41
-41

Adjacent Channel Power Ratio (dBm)
Modulation Characteristics
Carrier Frequency Offset and Drift Output power of second harmonic(dBm)
Output power of third harmonic(dBm)

+3MHz -3MHz f1 avg (kHz) f2max (kHz) f2 max Pass Rate (%) f2 avg /f1 avg Average Fn (kHz) Drift Rate (kHz/50µs) Avg Drift (kHz/50µs) Max Drift (kHz/50µs)
N/A
N/A

CHF8ML BLE Module

-42

-42

240

185

100

0.9

12.5

10

10

10

-50

-50

4 operating environment
4.1 Static discharge parameter parameters

Table 4-1 Static Discharge Parameters Table

nam

symbol

refer

e

to

Static discharge voltage
(Human body model)

VESD (HBM)

Temperature: 16 ~35 in accordance with ANSI/ESDA/JEDEC
JS-001-2014

4.2 Recommended Operating Conditions

grad Maxim unit

e

um

value

2

2000

V

Table 4-2 Recommended Operating Conditions Table

symbo l

parameter

VDD3 TA TS

3.3V Supply Voltage Ambient operating
temperature Storage temperature

minimu m
value 1.8
-40
-40

median

Maxim

unit

um

value

3

4.3

V

25

105

ºC

25

125

ºC

5 Reflow soldering conditions
1 Heating method: Conventional convection or IR convection 2 Allowable reflow soldering frequency: 2 times, based on the following tilted heating conditions
11 / 18

3 Peak temperature:<250 ° C

CHF8ML BLE Module

Table 5-1 Reflow Soldering Condition
Diagram
12 / 18

6 Application Circuit
Table 6-1 Application Circuit Diagram

CHF8ML BLE Module

7 AT instruction
7.1 AT command configuration
The AT+instruction refers to the instruction set used by users to transmit commands to modules through UART in command mode. The usage format of the AT+instruction will be explained in detail later.
After successful power on startup, the module can be configured through UART. The default UART port parameters for the module are: baud rate 9600, no checksum, 8-bit data bits, and 1-bit
stop bit.
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CHF8ML BLE Module
7.2 Overview of AT Instructions
The AT+instruction can be directly input through serial debugging programs such as CRT. The AT+instruction uses an ASCII based command line, and the instruction format is as follows: 1 format description
<>: indicates mandatory parts []: indicates optional parts 2 Command Message AT+[op][para-1,para-2,para-3,para-4…] <CR> <LF> AT+: Command message prefix; [op]: Instruction operator, specifying whether it is a parameter setting or a query; =”: represents parameter setting”? “: represents query [para-n]: Input for parameter settings, not required for queries; <CR>: End symbol, car, ASCII code 0X0D; <LF>: End character, line break, ASCII code 0X0A; [SPACE]: Space symbol, space, ASCII code 0X20
7.3 response message
<CR><LF>+<RSP>[op][para-1,para-2,para-3,para-4…]<CR><LF> +Response message prefix; RSP: Response string, including: “OK”: indicates success ERR “: indicates failure [para-n]: Return parameters when querying or error code when encountering errors <CR>: ASCII code 0x0d; <LF>: ASCII code 0x0a; [SPACE]: Space symbol, space, ASCII code 0X20
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CHF8ML BLE Module
8 Packaging method
Shipping packaging method A: Using anti-static vacuum formed tray boxes, each tray box is 100 PCS, and the tray box size is shown in the following figure.
Figure 8-1 Dimensions of vacuum formed tray box Shipping packaging method B: The tape method is adopted, with 2000 PCS per roll, and the tape size is shown in the following figure.
Figure 8-2 Packaging Tape Diagram
15 / 18

CHF8ML BLE Module

9 Ordering Information

Due to the fact that the CHF8ML BLE Module module is available in two types: shielded and unshielded, as well
as in two types of packaging: disk mounted and tape wrapped, please carefully read the detailed information in the table below before placing an order. If the module needs to be burned with a special program during shipment, please specify. If there are special
requirements for the MAC code required by the module during shipment, please specify

Table 9-1 Order Information

PRODUCT MODEL
CHF8ML BLE Module

Shielding cover
have

Pre burning program
not have

MAC code No requirements

Minimum order quantity per batch
1K

10 Certification and safety regulations

authentication FCC CE RoHS BQB SRRC

describe Verified, PASS Verified, PASS Verified, PASS Verified, PASS Verified, PASS

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CHF8ML BLE Module
11 precautions
The CHF8ML BLE Module module adopts a dual row pin mounting method. In order to achieve optimal RF performance for the terminal product, the following principles must be followed:
1 Power supply: Use an independent LDO to supply power to the module. It is recommended to choose an LDO with a low ripple factor, and the module needs to be reliably grounded. Please note that the positive and negative poles of the power supply are connected correctly. Reverse connection may cause permanent damage to the module.
2 Layout: It is recommended to place the module as far as possible in an open area along the edge of the base plate, with the antenna facing outward.
3 Wiring: The power wiring for the module on the base plate should be as thick as possible (0.5A current). The PCB boards (double-sided and multi-layer boards) under the antenna in the module on the base plate need clearance and cannot be copper plated, that is, all layout layers below the antenna should not have grounding or signal traces.
4 It is best not to have metal components near the antenna, otherwise the communication distance of the module will be reduced to varying degrees in different environments.
12 Static electricity and other precautions
Modules may be damaged due to electrostatic discharge, and it is recommended that all modules be handled under the following preventive measures: 1 Anti static measures must be followed and modules cannot be held naked. 2 The module must be placed in an area that can prevent static electricity. 3 Anti static circuits at high voltage or high frequency inputs should be considered in product design. 4 The result of static electricity may be a slight decrease in performance to the failure of the entire device. Due to
the fact that even very small parameter changes can cause the device to fail to meet its certification requirements, the module is more susceptible to damage
Humidity sensitivity: According to the standard IPC/JEDEC J-STD-020, the module is a level 3 humidity sensitive device. Please comply with all relevant requirements for using such components. In addition, customers must pay attention to the following conditions: a) The calculated shelf life of sealed bags is 12 months at<40 º C and<90% relative humidity (RH). b) Environmental conditions during production: According to IPC/JEDEC J-STD-033A paragraph 5, 30 º C/60% relative humidity. c) If conditions permit, the maximum time between opening the sealed bag and the reflux process must be 168 hours. d) Comply with paragraph 5.2 of IPC/JEDEC J-STD-033A. e) If conditions b) or c) are not followed, baking is required. f) If the humidity indicator inside the bag indicates 10% or more, baking is required.
17 / 18

FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursua nt to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful inte rference in a residential installation. This equipment generates uses and can radiate radio frequency energy a nd, if not installed and used in accordance with the instructions, may cause harmful interference to radio com munications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turn ing the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: – Reorient or relocate the receivingantenna. – Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help important announcement Important Note: Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Country Code selection feature to be disabled for products marketed to the US/Canada. This device is intended only for OEM integrators under the following conditions: 1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2. The transmitter module may not be co-located with any other transmitter or antenna, As long as the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Important Note: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling The final end product must be labeled in a visible area with the following” Contains FCC ID: 2BQJM-CHF8ML ”
Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01r01 2.2 List of applicable FCC rules

CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter
2.3 Specific operational use conditions
This module is stand-alone modular. If the end product will involve the Multiple simultaneously transmitting condition or different operational conditions for a stand-alone modular transmitter in a host, host manufacturer have to consult with module manufacturer for the installation method in end system.
2.4 Limited module procedures
Not applicable
2.5 Trace antenna designs
Not applicable
2.6 RF exposure considerations

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
2.7 Antennas This radio transmitter FCC ID:2BQJM-CHF8ML has been approved by Federal Communications Commission to
operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device.

Antenna No. Bluetooth

Model No. of antenna:
/

Type of antenna: PCB Antenna

Gain of the antenna

(Max.)

Antenna 1 Antenna 2

-4.26

N/A

Frequency range:
2402-2480MHz

2.8 Label and compliance information
The final end product must be labeled in a visible area with the following” Contains FCC ID:2BQJM-CHF8ML”.
2.9 Information on test modes and additional testing requirements
Host manufacturer is strongly recommended to confirm compliance with FCC requirements for the transmitter when
the module is installed in the host.
2.10 Additional testing, Part 15 Subpart B disclaimer
Host manufacturer is responsible for compliance of the host system with module installed with all other applicable requirements for the system such as Part 15 B.
2.11 Note EMI Considerations
Host manufacture is recommended to use D04 Module Integration Guide recommending as “best practice” RF
design engineering testing and evaluation in case non-linear interactions generate additional non-compliant limits due to module placement to host components or properties.
2.12 How to make changes
This module is stand-alone modular. If the end product will involve the Multiple simultaneously transmitting condition or different operational conditions for a stand-alone modular transmitter in a host, host manufacturer have to consult with module manufacturer for the installation method in end system. According to the KDB 996369 D02 Q&A Q12, that a host manufacture only needs to do an evaluation (i.e., no C2PC required when no emission exceeds the limit of any individual device (including unintentional radiators) as a composite. The host manufacturer must fix any failure.

Documents / Resources

Shenzhen CHF8ML BLE Module [pdf] Owner's Manual
2BQJM-CHF8ML, 2BQJMCHF8ML, CHF8ML BLE Module, CHF8ML, BLE Module, Module

References

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