SEMIKRON 32R Technical Explanation Board
Specifications
- Model: SKYPER IGBT Driver Adapter Board
- Revision: 32 R
- Issue Date: 2016-03-16
- Prepared by: H.Flohrer
- Approved by: J.Krapp
- Application and Handling Instructions
For detailed application and handling instructions, refer to the SEMIKRON Application Manual Power Modules available at http://www.semikron.com. - General Description
The SKYPER IGBT Driver Adapter Board is designed to provide efficient switching signal inputs and drive power supply for IGBT modules. - PIN Array
Product information of suitable female connectors and distributor contact information is available at http://www.harting.com (part.nr.09 18 514 6813). - Setting Dynamic Short Circuit Protection
To set the dynamic short circuit protection, refer to Table 3 for RCE & CCE Designation. - Collector Series Resistance
Refer to Table 4 for RVCE Designation for collector series resistance values based on IGBT operation voltage. - Further Application Support
For the latest information and design support, visit http://www.semikron.com.
Please note:
All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating parameters should be validated by the user’s technical experts for each application.
Application and Handling Instructions
- Please provide static discharge protection during handling. As long as the hybrid driver is not completely assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT modules.
- Any parasitic inductances within the DC-link have to be minimized. Over-voltages may be absorbed by C- or RCD-snubber networks between main terminals for PLUS and MINUS of the power module.
- When first operating a newly developed circuit, SEMIKRON recommends applying low collector voltage and load current in the beginning and increasing these values gradually, observing the turn-off behavior of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works correctly under rated operating conditions, short-circuit testing may be done, starting again with low collector voltage.
- It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
- The inputs of the hybrid driver are sensitive to over-voltage. Currents higher than VS +0,3V or below -0,3V may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.
- The connecting leads between the hybrid driver and the power module should be as short as possible (max. 20cm), and the driver leads should be twisted.
Further application support
The latest information is available at http://www.semikron.com . For design support please read the SEMIKRON Application Manual Power Modules available at http://www.semikron.com .
General Information
The Board 3s SKYPER® 32PRO R is an adapter board for the IGBT module SEMiX® 3s (spring contact version). The board can be customized allowing adaptation and optimization to the used SEMiX® Module. The switching characteristic of the IGBT can be influenced through user settings, eg changing turn-on and turn-off speed by variation of RGon and RGoff. Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP (see Technical Explanations SKYPER® 32PRO R).
Please note:
This technical explanation is based on the Technical Explanations for SKYPER® 32PRO R. Please read the Technical Explanations for SKYPER® 32 PRO R before using the Adaptor Board.
Quality
| Table 1: Quality | |||
| End of the exam | test category | exam details | level |
| AOI | Automated Optical Inspection | Control of accurate placement of components/solder joints | SEMIKRON |
| ICT | In-Circuit Test | Test of the populated PCB, checking the correct fabrication | SEMIKRON |
| Test type | test category | conditional test | level |
| EP | Electrical Parameters | Jamb = -40°C / +85°C | SEMIKRON |
| SP | STEP Test, Interrupted PS | 20x 10µs to 2s | EN61000-4-29 |
| Yes | Isolation Test | Maximum voltage test 4kV, 60s | EN 61800-5-1 |
| TC | Thermal cycling | 200 cycles, Tstgmax – Tstgmin | IEC60068-2-14 |
| PD | Partial discharge test | >1.1 kV; suitable for 900V DC Link | VDE 0110-20 |
| TH | Warm humidity | 85°C, 85% RH, 96h | IEC 60068-2-67 |
| VB | Vibration | Sine 20/2000Hz Random 10/2000Hz, 5g, 26 per x,y,z | IEC 60068-2-6 |
| SH | Shock | Half-sinus pulse, 30g, 6000 shocks, 6ms, ±x, ±y, ±z | IEC 60068-2-29 |
Dimensions
Component Placement Layout
Figure 3: Adapter Board
PIN Array
Figure 4: Connector X20 (Assmann AWHW 20G SMD)
Product information of suitable female connectors and distributor contact information is available at eg http://www.harting.com (part number 09 18 520 6 813).
|
Table 2: PIN Range |
|||
|
PIN |
Waves | Work |
Measurements |
| X20:01 | IF_PWR_15P | Drive power supply | Stabilized +15V ±4% |
| X20:02 | IF_PWR_GND | GND for power supply | |
| X20:03 | IF_PWR_15P | Drive power supply | Stabilized +15V ±4% |
| X20:04 | IF_PWR_GND | GND for power supply | |
| X20:05 | IF_PWR_15P | Drive power supply | Stabilized +15V ±4% |
| X20:06 | IF_PWR_GND | GND for power supply | |
| X20:07 | reserved | ||
| X20:08 | IF_PWR_GND | GND for power supply | |
| X20:09 | IF_CMN_nHALT | Driver core status signal (bidirectional signal with dominant recessive behavior) | Digital 15V logic;LOW (dominant) = driver disabled; HIGH (recessive) = ready to operate |
| X20:10 | reserved | ||
| X20:11 | reserved | ||
| X20:12 | IF_CMN_GND | GND for signal IF_CMN_nHALT | |
| X20:13 | reserved | ||
| X20:14 | reserved | ||
| X20:15 | IF_HB_TOP | Switching signal input (TOP switch) | Digital 15 V logic; 10 kOhm impedance;LOW = TOP switch off; HIGH = TOP switch on |
| X20:16 | IF_HB_BOT | Switching signal input (BOTTOM switch) | Digital 15 V logic; 10 kOhm impedance;LOW = BOT switch off; HIGH = BOT switch on |
| X20:17 | reserved | ||
| X20:18 | IF_HB_GND | GND for signals IF_HB_TOP & F_HB_BOT | |
| X20:19 | reserved | ||
| X20:20 | reserved | ||
Please note:
The feature PRIM_ERROR_IN of the driver core is not available at the interface X20.
Setting Dynamic Short Circuit Protection
| Table 3: RCE & CCE | |||
| Designation | Pattern Name | Setting | |
| R160 | 1206 | RCE
Factory setting: not equipped |
TOP |
| C150 | 1206 | CCE
Factory setting: not equipped |
TOP |
| R260 | 1206 | RCE
Factory setting: not equipped |
BOT |
| C250 | 1206 | CCE
Factory setting: not equipped |
BOT |
Collector Series Resistance
| Table 4: RVCE | |||
| Designation | Pattern Name | Setting | |
| R150 | MiniMELF | RVCE *
Factory setting: not equipped |
TOP |
| R250 | MiniMELF | RVCE *
Factory setting: not equipped |
BOT |
- 1200V IGBT operation: 0Ω
- 1700V IGBT operation: 1kΩ / 0,4W
Adaptation Gate Resistors
| Table 5: RGon & RGoff | |||
| Designation | Pattern Name | Setting | |
| R151, R152, R153
(parallel connected) |
MiniMELF | RGon
Factory setting: not equipped |
TOP |
| R155, R156, R157
(parallel connected) |
MiniMELF | RGoff
Factory setting: not equipped |
TOP |
| R251, R252, R253
(parallel connected) |
MiniMELF | RGon
Factory setting: not equipped |
BOT |
| R255, R256, R257
(parallel connected) |
MiniMELF | RGoff
Factory setting: not equipped |
BOT |
Adaptation Decoupling Gate Resistors
For details to the decoupling gate resistors and recommended values, see Modules Explanations and Data Sheets SEMiX®.
| Table 6: RG1, RG2 | |||
| Designation | Pattern Name | Setting | |
| R101 | MELF | RG1
Factory setting: not equipped |
TOP |
| R102 | MELF | RG2
Factory setting: not equipped |
TOP |
| R201 | MELF | RG1
Factory setting: not equipped |
BOT |
| R202 | MELF | RG2
Factory setting: not equipped |
BOT |
Boost Capacitors
| Table 7: Cboost15P & Cboost8N | |||
| Designation | Pattern Name | Setting | |
| C151 | 1210 | Cboost8N
Factory setting: 4,7µF/16V * |
TOP |
| C152 | 1210 | Cboost15P
Factory setting: 2,2µF/25V * |
TOP |
| C251 | 1210 | Cboost8N
Factory setting: 4,7µF/16V * |
BOT |
| C252 | 1210 | Cboost15P
Factory setting: 2,2µF/25V * |
BOT |
* output charge pulse: 5μC
Temperature Signal
The temperature sensor inside the SEMiX® module is directly connected to contacting points T1 and T2. For details to the temperature sensor, see Modules Explanations SEMiX®.
Safety Warnings: The contacting points T1 and T2 are not electrical isolated. Due to high voltage that may be present at the contacting points T1 and T2, some care must be taken in order to avoid accident. There is no cover or potential isolation that protect the high voltage sections / wires from accidental human contact.
Mounting Notes
The electrical connections between adaptor board and SEMiX® are realised via spring contacts integrated in SEMiX® power modules and via landing pads on the bottom side of the adaptor board.
Figure 5: Adaptor Board & Driver Core Mounting
- Soldering of components (e.g. RGon, RGoff, etc.) on adapter board.
- Adaptor Board has to be fixed to the SEMiX® module (see “Mounting Instruction and Application Notes for SEMiX® IGBT modules” on SEMiX® product overview page at http://www.semikron.com).
- Insert driver core into the box connector on adaptor board.
- The connection between driver core and adaptor board should be mechanical reinforced by using support posts. The posts have to be spaced between driver core and adaptor board.
- Product information of suitable support posts and distributor contact information is available at e.g. http://www.richco-inc.com (e.g. part number DLMSPM-8-01, LCBST-8-01).
Schematics
Parts List
| Count | Ref. Designator | Value | Pattern Name | Description |
|---|---|---|---|---|
| 2 | C151, C251 | 4.7uF | 1210 (SMD) | Capacitor X7R |
| 2 | C152, C252 | 2.2uF | 1210 (SMD) | Capacitor X7R |
| 4 | C20, C21, C22, C23 | 1nF | 0805 (SMD) | Capacitor X7R |
| 1 | C27 | 220uF/35V | SMD | Longlife-Elko |
| 1 | R10 | 0.000Ohm | MiniMelf (SMD) | 1% |
| 3 | R11, R161, R261 | 10.0KOhm | MiniMelf (SMD) | 2% |
| 4 | R111, R112, R201, R212 | 0.51Ohm | Melf (SMD) | |
| 2 | V150, V250 | BY203/20S | DO215AA (SMD) | High Voltage Diode |
| 1 | V20 | SMBJ15A | DO214AA (SMD) | Suppressor Diode |
| 4 | V111, V112, V211, V212 | 10BQ100N | SMD | Diode Schottky |
| 3 | X10, X100, X200 | RM2.54 10p. | SMD | Box Connector |
| 1 | X20 | 14p. | Box Connector: SUYIN 254100FA010G200ZU |
- TP: Test Review
- Box Connector: SUYIN 254100FA010G200ZU
References
- www.SEMIKRON.com
- A. Wintrich, U. Nicolai, W. Tursky, T. Reimann, “Application Manual Power Semiconductors”, ISLE Verlag 2011, ISBN 978-3-938843-666
HISTORIA
SEMIKRON reserves the right to make changes without further notice herein
DISCLAIMER
SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function, or design. Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed concerning the accuracy or use of such information, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance, or suitability. This document supersedes and replaces all information previously supplied and may be superseded by updates without further notice.
SEMIKRON products are not authorized for use in life support appliances and systems without express written approval by SEMIKRON.
SEMIKRON INTERNATIONAL GmbH
- PO Box 820251 • 90253 Nuremberg • Germany
- Phone: +49 911-65 59-234
- Fax: +49 911-65 59-262
- sales.skd@semikron.com
- www.semikron.com .
FAQ
Q: Are the values provided in the technical explanation specific to my application?
A: No, the values provided are typical values and may vary in different applications. It is recommended to validate all operating parameters with technical experts for each specific application.
Documents / Resources
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SEMIKRON 32R Technical Explanation Board [pdf] Instruction Manual 32R Technical Explanation Board, 32R, Technical Explanation Board, Explanation Board, Board |