QUECTEL FCS851U Wi-Fi and Bluetooth Module
Specifications
- Product Name: FCS851U Hardware Design Wi-Fi&Bluetooth
- Version: 1.0.0
- Date: 2023-07-26
- Status: Preliminary
Product Usage Instructions
- Legal Notices
- Users are required to adhere to the following legal notices:
- Use and Disclosure Restrictions: Keep documents and information confidential unless specific permission is granted.
- License Agreements: Abide by the terms of license agreements provided.
- Copyright: Respect all copyright regulations.
- Trademarks: Usage restrictions on trademarks owned by Quectel or third parties.
- Third-Party Rights: Follow restrictions and obligations related to third-party materials mentioned in the document.
- Privacy Policy: Understand and comply with data processing policies when interacting with Quectel or third-party servers.
- Disclaimer: Acknowledgement of limited liability for any injury, damage, inaccuracies, or omissions in the information provided.
- Users are required to adhere to the following legal notices:
- Safety Information
- Ensure the following safety precautions are observed during product operation:
- Give full attention to driving to reduce accident risks.
- Avoid using mobile devices, even with hands-free kits, while driving.
- Comply with laws restricting wireless device use while driving.
- Ensure the following safety precautions are observed during product operation:
FAQs
- Q: Where can I find technical support for the FCS851U Hardware Design Wi-Fi&Bluetooth Module Series?
- A: Technical support can be accessed at http://www.quectel.com/support/technical.htm or by emailing support@quectel.com.
“`
FCS851U Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.0 Date: 2023-07-26 Status: Preliminary
Wi-Fi&Bluetooth Module Series
At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com
Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com.
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.
Use and Disclosure Restrictions
License Agreements
Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.
Copyright
Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with above mentioned requirements, unauthorized use, or other illegal or malicious use of the material.
FCS851U_Hardware_Design
1 / 53
Wi-Fi&Bluetooth Module Series
Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects .
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non -infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product . We further disclaim any and all warranties arising from the course of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein. c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.
FCS851U_Hardware_Design
2 / 53
Wi-Fi&Bluetooth Module Series
Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
Terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
The terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electrical equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.
FCS851U_Hardware_Design
3 / 53
Wi-Fi&Bluetooth Module Series
About the Document
Revision History
Version Date
Author
Description
–
2023-07-26 Arrow HUANG Creation of the document
1.0.0
2023-07-26 Arrow HUANG Preliminary
FCS851U_Hardware_Design
4 / 53
Wi-Fi&Bluetooth Module Series
FCS851U_Hardware_Design
5 / 53
FCS851U_Hardware_Design
6 / 53
Wi-Fi&Bluetooth Module Series
FCS851U_Hardware_Design
8 / 53
Wi-Fi&Bluetooth Module Series
1 Introduction
This document defines the FCS851U and describes its air interfaces and hardware interfaces which are connected with your applications. The document provides a quick insight into interface specifications, RF performance, electrical and mechanical details, as well as other related information of the module. IC: 10224A-2023FCS851U
1.1. Special Marks
Table 1: Special Marks
Mark * […]
Definition
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. Brackets ([…]) used after a pin enclosing a range of numbers indicating all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.
FCS851U_Hardware_Design
9 / 53
Wi-Fi&Bluetooth Module Series
2 Product Overview
FCS851U is a low-power and high-performance IEEE 802.11 a/b/g/n/ac Wi-Fi 5 and Bluetooth 5.0 module. It supports 2.4 GHz and 5 GHz dual-band and 2T2R with maximum data transmission rate up to 866.6 Mbps. It provides SDIO 3.0 interface for Wi-Fi functions and UART* and PCM* interface for Bluetooth functions.
It is an SMD module with compact packaging. Related information is listed in the table below:
Table 2: Basic Information
FCS851U Packaging type Pin counts Dimensions Weight
LCC 50 (15.0 ±0.15) mm × (13.0 ±0.15) mm × (2.25 ±0.2) mm Approx. 0.81 g
FCS851U_Hardware_Design
10 / 53
2.1. Key Features
Wi-Fi&Bluetooth Module Series
Table 3: Key Features
Basic Information Protocols and Standard
Power Supplies
Temperature Ranges EVB Kit
Wi-Fi protocols: IEEE 802.11 a/b/g/n/ac Bluetooth protocol: Bluetooth 5.0 All hardware components are fully compliant with EU RoHS directive
VBAT Power Supply: 3.13.4 V Typ.: 3.3 V VDD_IO Power Supply: 1.71. 98 V Typ.: 1.8 V Operating temperature 1: -20 °C to +75 °C Storage temperature: -40 °C to +95°C
FCS851U-M.2
RF Antenna Interface
Wi-Fi Antenna Interfaces
BT Antenna Interface 2
ANT_WIFI0 ANT_WIFI1/BT 50 characteristic impedance ANT_WIFI1/BT or ANT_BT 50 characteristic impedance
Application Interface
Wi-Fi Application Interface Bluetooth Application Interfaces*
SDIO 3.0 UART, PCM
1 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation,
eg, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module’s indicators comply with IEEE and Bluetooth specification requirements. 2 The module is provided with one of the two Bluetooth antenna interface designs: the shared Wi-Fi/Bluetooth antenna interface (ANT_WIFI1/BT) or the dedicated Bluetooth antenna interface (ANT_BT). The ANT_WIFI1/BT is only used as
Wi-Fi 1 antenna interface when the ANT_BT is used. For more details, contact Quectel Technical Support.
FCS851U_Hardware_Design
11 / 53
Wi-Fi&Bluetooth Module Series
3 RF Performance
3.1. Wi-Fi Performances
Table 4: Wi-Fi Performances Operating Frequency 2.4 GHz: 2.4002.4835 GHz 5 GHz: 5.1505.850 GHz Modulation DSSS, CCK, BPSK, QPSK, DBPSK, DQPSK, 16QAM, 64QAM, 256QAM Operating Mode STA Encryption Mode (STA) WPA/WPA2/WPA3-Personal WPA2/WPA3-Enterprise Transmission Data Rate 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 07), HT40 (MCS 07) 802.11ac: VHT20 (MCS 08), VHT40 (MCS 09), VHT80 (MCS 09)
FCS851U_Hardware_Design
12 / 53
Wi-Fi&Bluetooth Module Series
3.2. Bluetooth Performance
Table 5: Bluetooth Performance Operating Frequency 2.4002.4835 GHz Modulation GFSK, /4-DQPSK, 8-DPSK Operating Mode Classic Bluetooth (BR + EDR) Bluetooth Low Energy (BLE) Transmission Data Rate
BR EDR (/4-DQPSK) EDR (8-DPSK) BLE (1 Mbps) BLE (2 Mbps) BLE Long Range (S=2) 500kbps BLE Long Range (S=8) 125kbps
FCS851U_Hardware_Design
13 / 53
Wi-Fi&Bluetooth Module Series
Application Interfaces
4.1. Pin Assignment
36 VBAT 35 RESERVED 34 VDD_IO 33 RESERVED 32 GND 31 GND 30 PCM_CLK 29 PCM_DOUT 28 PCM_DIN 27 PCM_SYNC 26 RESERVED
RESERVED 37 RESET_N 38 GND 39 BT_TXD 40 BT_RXD 41 BT_RTS 42 BT_CTS 43
RESERVED 44 RESERVED 45 RESERVED 46 RESERVED 47
GND 48 HOST_WAKE_BT 49 BT_WAKE_HOST 50
25 RESERVED 24 GPIO1 23 GND 22 SDIO_DATA1 21 SDIO_DATA0 20 SDIO_DATA2 19 SDIO_DATA3 18 SDIO_CLK 17 SDIO_CMD 16 WLAN_WAKE 15 CHIP_EN 14 RESERVED 13 RESERVED 12 ANT_BT
GND 1 ANT_WIFI0 2
GND 3 GND 4 GND 5 GND 6 GND 7 GND 8 ANT_WIFI1/BT 9 GND 10 GND 11
Power
GND
WLAN Bluetooth
RF
RESERVED Other Signals
Figure 1: Pin Assignment (Top View)
NOTE Keep all RESERVED and unused pins unconnected.
FCS851U_Hardware_Design
14 / 53
4.2. Pin Description
Wi-Fi&Bluetooth Module Series
Table 6: I/O Parameters Definition
Type AIO DI DO DIO PI
Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input
DC characteristics include power domain and rate current.
Table 7: Pin Description
Power Supply Pin Name VBAT
VDD_IO GND
Pin No. I/O
36
PI
34
PI
Description
Power supply for the module
Power supply for the module’s I/O pins
DC Characteristics Vmin = 3.1 V Vnom = 3.3 V Vmax = 3.4 V Vmin = 1.7 V Vnom = 1.8 V Vmax = 1.98 V
1, 38, 10, 11, 23, 31, 32, 39, 48
Comment
It must be provided with sufficient current of at least 1.5 A. It must be provided with sufficient current of at least 100 mA.
Wi-Fi Application Interfaces
Pin Name
Pin No. I/O
WLAN_WAKE
16
DO
SDIO_CMD
17
DIO
SDIO_CLK
18
DI
SDIO_DATA3
19
DIO
Description
WLAN wakes up the host
DC Characteristics
SDIO command SDIO clock
VDD_IO
SDIO data bit 3
How to
Active high.
Requires differential impedance of 50. SDIO 3.0 compliant.
FCS851U_Hardware_Design
15 / 53
Wi-Fi&Bluetooth Module Series
SDIO_DATA2
20
DIO SDIO data bit 2
SDIO_DATA0
21
DIO SDIO data bit 0
SDIO_DATA1
22
DIO SDIO data bit 1
Bluetooth Application Interfaces*
Pin Name PCM_SYNC PCM_DIN PCM_DOUT
Pin No. I/O
27
DI
28
DI
Description
PCM data frame sync PCM data input
29
DO PCM data output
DC Comment
Characteristics
If unused, keep these pins open.
PCM_CLK BT_TXD BT_RXD
30
DI
40
DO
41
DI
BT_RTS
42
DO
BT_CTS
43
DI
HOST_WAKE_BT 49
DI
BT_WAKE_HOST 50
DO
RF Antenna Interfaces 3
Pin Name
Pin No. I/O
ANT_WIFI0
9
AIO
ANT_WIFI1/BT 2
AIO
ANT_BT
12
AIO
Other Interfaces
PCM clock
Bluetooth UART transmit Bluetooth UART receive Request to send signal from the module Clear to send signal to the module Host wakes up Bluetooth Bluetooth wakes up the host
VDD_IO
Description
Wi-Fi 0 antenna interface Wi-Fi1/Bluetooth antenna interface Bluetooth antenna interface
DC Characteristics
It is recommended to add 0 series resistors.
Active high.
How
3 The module is provided with one of the two Bluetooth antenna interface designs: the shared Wi-Fi/Bluetooth antenna interface (ANT_WIFI1/BT) or the dedicated Bluetooth antenna interface (ANT_BT). The ANT_WIFI1/BT is only used as Wi-Fi 1 antenna interface when the ANT_BT is used. For more details, contact Quectel Technical Support.
FCS851U_Hardware_Design
16 / 53
Wi-Fi&Bluetooth Module Series
Pin Name RESET_N
Pin No. I/O Description
38
DI Reset the module
DC Characteristics
How Active low.
CHIP_EN
15
GPIO1
24
RESERVED Pins
DI Enable the module VDD_IO
General-purpose DO
input/output
Active high.
Active high. Multiplexed as SDIO IRQ.
Pin Name
Pin No.
How
RESERVED
13, 14, 25, 26, 33, 35, 37, 4447
Keep them open.
FCS851U_Hardware_Design
17 / 53
Wi-Fi&Bluetooth Module Series
4.3. Power Supply
The module is powered by VBAT. It is recommended to use a power supply chip with sufficient of at least 1.5 A. For better power supply performance, it is recommended to parallel a 47 F decoupling capacitor, and 1 F and 100 nF filter capacitors near the module’s VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be.
VBAT reference circuit is shown below:
VBAT
R1
0R
VBAT
D1 C1 C2 C3 C4
47 F 1 F 100 nF NM
Module
Figure 2: Reference Circuit of Power Supply
The power-up timing of the module is shown below.
0 µs VDD_IO
VBAT CHIP_EN RESET_N
0 µs 0 µs
Module Status
Power-up
Running
0 µs 0 µs
Power-down
Figure 3: Power-up Timing
FCS851U_Hardware_Design
18 / 53
Wi-Fi&Bluetooth Module Series
4.4. Wi-Fi Application Interface
The following figure shows the Wi-Fi application interface connection between the module and the host.
SDIO
SDIO
WLAN_WAKE
WLAN_WAKE
Module
Host
Figure 4: Wi-Fi Application Interface Connection
4.4.1. SDIO Interface
SDIO interface connection between the module and the host is illustrated in the following figure.
VDD_IO
NM_10K NM_10K NM_10K NM_10K NM_10K NM_10K
NM
SDIO_CLK SDIO_CMD SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 SDIO_DATA3
Module
NM NM NM NM NM
SDIO_CLK SDIO_CMD SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 SDIO_DATA3
Host
Figure 5: SDIO Interface Connection
To ensure compliance of interface design with the SDIO 3.0 specification, it is recommended to adopt the following principles:
FCS851U_Hardware_Design
19 / 53
Wi-Fi&Bluetooth Module Series
To avoid jitter of bus, pull up SDIO_CMD and SDIO_DATA_[0:3]/SDIO_CMD to VDD_IO with resistors respectively. Value range of these resistors should be 10100 k and the recommended value is 10 k.
The impedance of SDIO signal trace is 50 ±10%. Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. And the SDIO_CLK signal trace should be routed with ground surrounded separately.
Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals.
The distance between SDIO signals and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF.
Route the SDIO traces on the same floor as much as possible and surround them with ground without crossing with each other.
According to the transmission rate, here are some requirements for trace length: 1) For SDR104 mode, the recommended signal trace length is less than 50 mm. 2) For other modes, such as DDR50, SDR50, etc., the recommended signal trace length is less than 150 mm.
SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be equal in length (less than 1 mm distance between the traces), and pay attention to the SDIO signal trace length during design. The length of signal trace inside the module is as follows:
Table 8: SDIO Interface Trace Length Inside the Module (Unit: mm)
Pin No. 17 18 19 20 21 22
Pin Name SDIO_CMD SDIO_CLK SDIO_DATA3 SDIO_DATA2 SDIO_DATA0 SDIO_DATA1
Length 15.08 14.27 14.67 14.81 14.34 14.65
FCS851U_Hardware_Design
20 / 53
Wi-Fi&Bluetooth Module Series
4.5. Bluetooth Application Interfaces*
Bluetooth application interface connection between the module and the host is illustrated in the figure below.
UART PCM BT_WAKE_HOST HOST_WAKE_BT
Module
UART PCM Interruptable GPIO1 GPIO
Host
Figure 6: Bluetooth Application Connection
4.5.1. PCM Interface
The module provides a PCM interface for Bluetooth audio applications. It supports the following features:
Master and slave modes Programmable long/short frame sync 8-bit A-law/u-law, and 13/16-bit linear PCM formats Sign-extension PCM master clock output: 64 kHz, 128 kHz, 256 kHz, or 512 kHz SCO/eSCO link
PCM interface timing as below:
FCS851U_Hardware_Design
21 / 53
PCM_SYNC PCM_CLK
PCM_DOUT PCM_DIN
TPCM_SYNC_DELAY
FPCM_CLK TT PCM_CLKH PCM_CLKL
TPCM_CLK_DELAY
MSB (LSB)
TT SETUPIN
HOLDIN
MSB (LSB)
Wi-Fi&Bluetooth Module Series
Figure 7: PCM Interface (Long Frame Sync)
TPCM_SYNC_DELAY PCM_SYNC PCM_CLK PCM_DOUT PCM_DIN
FPCM_CLK
TT PCM_CLKH
PCM_CLKL
TPCM_CLK_DELAY
MSB (LSB)
TT SETUPIN
HOLDIN
MSB (LSB)
Figure 8: PCM Interface (Short Frame Sync)
Table 9: PCM Interface Clock Specifications
Parameter FPCM_CLK FPCM_SYNC FPCM_CLK
Description
Min.
Frequency of PCM_CLK (Master) 64
Frequency of PCM_SYNC (Master) –
Frequency of PCM_CLK (Slave)
64
Type 8 –
Max.
Unit
512
kHz
–
kHz
512
kHz
FCS851U_Hardware_Design
22 / 53
FPCM_SYNC DN
Frequency of PCM_SYNC (Slave) –
Data Size
8
Number of Slots Per Frame
1
Wi-Fi&Bluetooth Module Series
8
–
kHz
8
16
bits
1
1
slots
Table 10: PCM Interface Timing
Parameter
Description
Min.
TPCM_CLKH
High period of PCM_CLK
980
TPCM_CLKL
Low period of PCM_CLK
970
Delay time from PCM_CLK high to
TPCM_SYNC_DELAY PCM_SYNC high
–
Delay time from PCM_CLK high to valid
TPCM_CLK_DELAY
PCM_DOUT
–
Set-up time for PCM_DIN valid to
TSETUPIN
PCM_CLK low
10
THOLDIN
Hold time for PCM_CLK low to PCM_DIN 125
invalid
Type –
Max. Unit
–
ns
–
ns
75
ns
125
ns
–
ns
–
ns
4.5.2. UART
The module provides a Bluetooth HCI (Host Controller Interface) UART supporting hardware flow control (RTS/CTS). It can be used for data transmission with the host with default baud rate of 115200 bps, which can support up to 2 Mbps baud rate.
Table 11: UART Timing Parameters
Parameter Data Bits Per Frame Parity Number of Stop Bit Hardware Flow Control
Description 8 bits None 1 bit RTS/CTS
FCS851U_Hardware_Design
23 / 53
Wi-Fi&Bluetooth Module Series
4.6. RF Antenna Interfaces
The module supports two Wi-Fi antenna interfaces (ANT_WIFI0 and ANT_WIFI1/BT and) and one Bluetooth antenna interface (ANT_WIFI1/BT or ANT_BT).
Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.
4.6.1. Antenna Design Requirements
Table 12: Antenna Design Requirements
Parameter Frequency Ranges (GHz) Cable Insertion Loss (dB) VSWR Gain (dBi) Max Input Power (W) Input Impedance () Polarization Type
Requirement 4 2.4002.4835 5.1505.850 < 1
2 (Typ.) 1 (Typ.)
50
50
Vertical
4.6.2.Reference Design
The module provides three antenna interfaces among which the ANT_WIFI1/BT is only used as Wi-Fi 1 antenna interface. It is recommended to reserve a -type matching circuit and add ESD protection components for better RF performance. Reserved matching components (R1, C1, C2, and D1) shall be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0.
The following reference design is based on ANT_WIFI0 as an example, the reference design of other RF antenna interfaces is the same.
4 For more details about the RF performance, see Chapter 3.
FCS851U_Hardware_Design
24 / 53
Wi-Fi&Bluetooth Module Series
ANT_WIFI0
Module
R1 0R
C1
C2
D1
NM NM
NM
Figure 9: Reference Circuit for RF Antenna Interface
4.6.3.RF Routing Guidelines
For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures.
Figure 10: Microstrip Design on a 2-layer PCB
Figure 11: Coplanar Waveguide Design on a 2-layer PCB
FCS851U_Hardware_Design
25 / 53
Wi-Fi&Bluetooth Module Series
Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
To ensure RF performance and reliability, follow the principles below in RF layout design:
Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50.
The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 × W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.
FCS851U_Hardware_Design
26 / 53
Wi-Fi&Bluetooth Module Series
4.6.4. RF Connector Recommendation
If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose.
Figure 14: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.
Figure 15: Specifications of Mated Plugs
FCS851U_Hardware_Design
27 / 53
Wi-Fi&Bluetooth Module Series The following figure describes the space factor of mated connectors.
Figure 16: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com.
FCS851U_Hardware_Design
28 / 53
Wi-Fi&Bluetooth Module Series
5 Electrical Characteristics & Reliability
5.1. Absolute Maximum Ratings
Table 13: Absolute Maximum Ratings (Unit: V)
Parameter VBAT VDD_IO Voltage at Digital Pins
Min. -0.3 -0.3 -0.3
Max. 3.6 1.98 1.98
5.2. Power Supply Ratings
Table 14: Module Power Supply Ratings (Unit: V)
VBAT VDD_IO parameter
Description
Condition
Min.
Power supply for the module
The actual input voltages must be kept between the minimum and maximum 3.1 values.
Power supply for the
–
1.7
module’s I/O pins
Type 3.3 1.8
Max. 3.6 1.98
FCS851U_Hardware_Design
29 / 53
Wi-Fi&Bluetooth Module Series
5.3. Power Consumption
5.3.1. Wi-Fi Power Consumption
Table 15: Wi-Fi Power Consumption in Signaling Mode (Unit: mA)
Condition 802.11b
2.4 GHz
802.11g
802.11n
802.11a
802.11n 5 GHz
802.11ac
Tx @ 1 Mbps Tx @ 11 Mbps Tx @ 6 Mbps Tx @ 54 Mbps Tx HT20 @ MCS 0 Tx HT20 @ MCS 7 Tx HT40 @ MCS 0 Tx HT40 @ MCS 7 Tx @ 6 Mbps Tx @ 54 Mbps Tx HT20 @ MCS 0 Tx HT20 @ MCS 7 Tx HT40 @ MCS 0 Tx HT40 @ MCS 7 Tx VHT20 @ MCS 0 Tx VHT20 @ MCS 8 Tx VHT40 @ MCS 0 Tx VHT40 @ MCS 9 Tx VHT80 @ MCS 0 Tx VHT80 @ MCS 9
IVBAT 78.73 41.63 42.63 38.46 41.03 38.54 40.91 39.77 55.45 49.29 53.52 49.15 53.53 50.28 55.68 49.09 53.39 50.27 55.58 52.95
IVDD_IO 3.38 3.36 3.36 3.35 3.35 3.35 3.35 3.35 3.36 3.37 3.37 3.36 3.37 3.37 3.37 3.36 3.37 3.37 3.37 3.37
FCS851U_Hardware_Design
30 / 53
5.3.2. Bluetooth Power Consumption
Table 16: Bluetooth Power Consumption (Unit: mA)
Condition
Tx Power
BR
7.92 dBm
Signaling Mode
EDR (/4-DQPSK) 5.65 dBm
EDR (8-DPSK)
5.64 dBm
Non-signaling Mode
BLE (1 Mbps) BLE (2 Mbps)
4.30 dBm 4.32 dBm
Wi-Fi&Bluetooth Module Series
IVBAT 31.67 32.15 32.14 22.21 23.99
IVDD_IO 2.77 2.77 2.76 2.75 2.75
5.4. Digital I/O Characteristics
Table 17: VDD_IO I/O Characteristics (Unit: V)
Parameter HIV VIL VOH VOL
Description High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage
Min. 1.7 -0.3 1.62 0
Max. 1.98 0.8 1.8 0.18
5.5. ESD Protection
Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.
FCS851U_Hardware_Design
31 / 53
Wi-Fi&Bluetooth Module Series
Table 18: Electrostatics Discharge Characteristics (Unit: kV)
Model
Test Result
Human Body Model (HBM)
±2
Charged Device Model (CDM) ±0.35
Standard ESDA/JEDEC JS-001-2017 ESDA/JEDEC JS-002-2018
5.6. Thermal Dissipation
The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range.
The following principles for thermal consideration are provided for reference:
Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply.
Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:
- Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
– Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
– Choose the heatsink with adequate purposes to dissipate heat; – Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and
good wettability and place it between the heatsink and the module; – Fasten the heatsink with four screws to ensure that it is in close contact with the module to
prevent the heatsink from falling off during the drop, vibration test, or transportation.
FCS851U_Hardware_Design
32 / 53
Wi-Fi&Bluetooth Module Series
PCB Heatsink TIM Module
PCB
Screw Heatsink
TIM Module
Figure 17: Placement and Fixing of the Heatsink
FCS851U_Hardware_Design
33 / 53
Wi-Fi&Bluetooth Module Series
6 Mechanical Information
This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.
6.1. Mechanical Dimensions
Figure 18: Top and Side Dimensions
FCS851U_Hardware_Design
34 / 53
Wi-Fi&Bluetooth Module Series
Figure 19: Bottom Dimensions (Bottom View)
NOTE The package warpage level of the module conforms to JEITA ED-7306 standard.
FCS851U_Hardware_Design
35 / 53
6.2. Recommended Footprint
Wi-Fi&Bluetooth Module Series
Figure 20: Recommended Footprint
NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.
FCS851U_Hardware_Design
36 / 53
6.3. Top and Bottom Views
Wi-Fi&Bluetooth Module Series
Figure 21: Top and Bottom Views
NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.
FCS851U_Hardware_Design
37 / 53
Wi-Fi&Bluetooth Module Series
7 Storage, Manufacturing & Packaging
7.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.
1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 3560%.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours 5 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60%. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10% (eg, a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition; Violation of the third requirement mentioned above; Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours; Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 ±5 °C; The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put
in a dry environment such as in a dry cabinet.
5 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering.
FCS851U_Hardware_Design
38 / 53
Wi-Fi&Bluetooth Module Series
NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to
the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking.
If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
7.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm.
The recommended peak reflow temperature should be 235246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.
Temp. (°C)
246 235 217 200
Soak Zone
150
HAS
Reflow Zone
Ramp-up slope: Cool-down slope:
03 °C/s C -30 °C/s
B
D
100
Ramp-to-soak slope: 03 °C/s
Figure 22: Recommended Reflow Soldering Thermal Profile FCS851U_Hardware_Design
39 / 53
Wi-Fi&Bluetooth Module Series
Table 19: Recommended Thermal Profile Parameters
Factor Soak Zone Ramp-to-soak slope Soak time (between A and B: 150 °C and 200 °C) Reflow Zone Ramp-up slope Reflow time (D: over 217 °C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle
Recommended Value
03 °C/s 70120 s 03
°C/s 4070 s 235246 °C -30 °C/s
1
NOTE
1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for
any situation that you are not sure about, or any process (eg selective soldering,
FCS851U_Hardware_Design
40 / 53
Wi-Fi&Bluetooth Module Series
7.3. Packaging Specification
This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follows:
7.3.1. Carrier Tape
Dimension details are as follows:
Figure 23: Carrier Tape Dimension Drawing
Table 20: Carrier Tape Dimension Table (Unit: mm)
W
P
T
A0
B0
K0
K1
F
E
32
24
0.4
15.4
13.4
2.7
3.2
14.2
1.75
FCS851U_Hardware_Design
41 / 53
7.3.2.Plastic Reel
Wi-Fi&Bluetooth Module Series
Figure 24: Plastic Reel Dimension Drawing
Table 21: Plastic Reel Dimension Table (Unit: mm)
øD1
øD2
W
380
100
32.5
7.3.3.Mounting Direction
Figure 25: Mounting Direction FCS851U_Hardware_Design
42 / 53
7.3.4.Packaging Process
Wi-Fi&Bluetooth Module Series
Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 1000 modules.
Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.
Place the vacuum-packed plastic reel into the pizza box.
Put 4 packaged pizza boxes into 1 carton box and seal it. 1 cardboard box can pack 4000 modules.
Figure 26: Packaging Process
FCS851U_Hardware_Design
43 / 53
Wi-Fi&Bluetooth Module Series
8 Appendix References
Table 22: Related Documents Document Name [1] Quectel_RF_Layout_Application_Note [2] Quectel_Module_SMT_Application_Note
Table 23: Terms and Abbreviations
Abbreviation 2T2R AP BLE BPSK BR CCK CDM CTS DBPSK DPSK DQPSK DSSS EDR eSCO
Description Two Transmit Two Receive Access Point Bluetooth Low Energy Binary Phase Shift Keying Basic Rate Complementary Code Keying Charged Device Model Clear To Send Differential Binary Phase Shift Keying Differential Phase Shift Keying Differential Quadrature Phase Shift Keying Direct Sequence Spread Spectrum Enhanced Data Rate Extended Synchronous Connection- Oriented
FCS851U_Hardware_Design
44 / 53
ESD EVM GFSK GND HBM HCI HT IEEE I/O IRQ LCC LSB Mbps MCS MSB PCB PCM QAM QPSK RF RoHS RTS Rx SCO SDIO
Wi-Fi&Bluetooth Module Series
Electrostatic Discharge Error Vector Magnitude Gaussian Frequency Shift Keying Ground Human Body Model Host Controller Interface High Throughput Institute of Electrical and Electronics Engineers Input/Output Interrupt Request Leadless Chip Carrier (package) Least Significant Bit Million Bits Per Second Modulation and Coding Scheme Most Significant Bit Printed Circuit Board Pulse Code Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Request to Send Receive Synchronous Connection-Oriented Secure Digital Input/Output
FCS851U_Hardware_Design
45 / 53
SMD SMT STA TBD TVS Tx UART VHTHIV VIL Vmax Vmin Vnom VOH VOL VSWR Wi-Fi WPA
Wi-Fi&Bluetooth Module Series
Surface Mount Device Surface Mount Technology Station To Be Determined Transient Voltage Suppressor Transmit Universal Asynchronous Receiver/Transmitter Very High Throughput High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage Nominal Voltage High-level Output Voltage Low- level Output Voltage Voltage Standing Wave Ratio Wireless Fidelity Wi-Fi Protected Access
FCS851U_Hardware_Design
46 / 53
Wi-Fi&Bluetooth Module Series
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (ie fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
Important Note
notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (XMR2023FCS851U) procedure followed by a Class II permissive change application.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: /IC compliance requirements are met.
Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) Only antennas of the same type and with equal or less gains as shown below may be used with this
module. Other types of antennas and/or higher gain antennas may require additional authorization for
operation.
Antenna type 2.4GHz band 5.2GHz band 5.3GHz band 5.5GHz band 5.8GHz band
Peak Gain Peak Gain Peak Gain Peak Gain Peak Gain
(dBi)
(dBi)
(dBi)
(dBi)
(dBi)
Dipole
0.73
1.14
1.00
0.60
0.95
FCS851U_Hardware_Design
47 / 53
Wi-Fi&Bluetooth Module Series
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: – Reorient or relocate the receiving antenna. – Increase the separation between the equipment and receiver. – Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. – Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
List of applicable FCC rules
This module has been tested and found to comply with 15.247 and 15.407 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (ie, FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also
FCS851U_Hardware_Design
48 / 53
Wi-Fi&Bluetooth Module Series
contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
This device is intended only for OEM integrators under the following
conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.
FCS851U_Hardware_Design
49 / 53
Wi-Fi&Bluetooth Module Series
IC
Industry Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.
Radiation Exposure Statement
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator & your body.
Radiation Exposure Statement:
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiation source & your body.
by technology.
This device is intended only for OEM integrators under the following
conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
This device is designed for OEM integrators only under the
following conditions: (For module device use)
FCS851U_Hardware_Design
50 / 53
Wi-Fi&Bluetooth Module Series
1) The antenna must be installed such that a distance of 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as the above 2 conditions are met, additional testing on the transmitter will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required for this installed module.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
IMPORTANT NOTE:
In the event that these conditions cannot be met (e.g. for certain laptop configurations or certain co-location with another transmitter), the Canadian authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the final product (including the transmitter) and obtaining a separate authorization in Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC:10224A-2023FCS851U”.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that a distance of 20cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 10224A-2023FCS851U”.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in this
FCS851U_Hardware_Design
51 / 53
Wi-Fi&Bluetooth Module Series
manual.
End User Information Manual
The OEM integrator should be aware that they do not provide information to the end user on how to install or remove this RF module in the user manual of the end product that incorporates this module. The end user manual should include all required regulatory information and warnings as stated in this manual.
FCS851U_Hardware_Design
52 / 53
trace design
Wi-Fi&Bluetooth Module Series
s
FCS851U_Hardware_Design
53 / 53
Documents / Resources
 |
QUECTEL FCS851U Wi-Fi and Bluetooth Module [pdf] Owner's Manual 2023FCS851U, XMR2023FCS851U, FCS851U Wi-Fi and Bluetooth Module, FCS851U, Wi-Fi and Bluetooth Module, Bluetooth Module, Module |
