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Rabbit-S User Guide

Project: Rabbit/Bluetooth 5 BLE module
Module name: Rabbit-S
Designed: Suzhou Pair link Network Technology Ltd.

Version Note Date
V1.0 Create 2021/06/30
V2.0 Modify Confidential Information 9/1/2021

This document contains information that is proprietary to the Pair link. This document is commercially confidential and must NOT be disclosed to third parties without prior consent. The information provided herein is believed to be reliable. But production testing may not include testing of all parameters. Pair link reserves the right to change information at any time without notification.

Main Application Domain

  1. MCU data pass-through.
  2. Bluetooth Printer / Scanner / Digital price tag etc.
  3. Remote control / Keyboard and Mouse / Toys / Smart phone self timer etc.
  4. Industrial remote control / Industrial telemetry / Industrial data collection.
  5. Smart home / Intelligent lighting / Intelligent access control system.

Electrical Specifications

Absolute Ratings

Parameter

Specification

Unit

Min.

Max.

Power Supply(V) -0.3V +3.6V Burn the module permanently  if it exceeds +3.6V
Storage temperature(℃) -55 +125
Working temperature (℃) -40 +85
ESD HBM -3.5KV +3.5KV Human Body Model
ESD CDM -500V +500V Charged-Device Model

Recommended Operating Conditions

Parameter

Specification

Note

Min.

Typical

Max

Power Supply(V) 3.3 3.6
Communication level(V) 3.3 Can’t communicate with 5V TTL level directly
Working temperature(℃) 20 +85 Industry Standard
Consume TX Current (mA) 10.2 TX Power=+4dBm
12.7 TX Power=+8dBm
RX Current (mA) 6.8 VBAT=3V3,1Mbps
Sleep Current (a) 3.8 Deep-sleep,Supports GPIO wake-up and timer wake-up
TX Power(dBm) +8
Receive Sensitivity(dBm) -97 1Mbps

Digital I/O Characteristic

Characteristics Condition Symbol Specification Unit
Min. Typical Max.
Input Low Voltage VBAT=3V3 VIL 0 0.9 V
Input High Voltage VIA 2.0 3.3 3.6 V
Output Low Voltage VOL 0 0.33 V
Output High Voltage VEOH 2.97 3.3 V

Physical Parameters

Parameter Performance Note
CommunicationDistance 50M Data Transfer (BLE) Environment: Sunny and open Airspeed: 1Mbps
 Crystal 40MHz Industry Standard
Protocol BLE 5 Supported data rates: 1Mbps,2Mbps
Package Patch Refer to section 3.3
IC RTL8762CMF Packaging: QFN-40
Core ARM Cortex-M4
RAM 160KByte
Flash 4Mbits Embedded SOC memory
Dimensions 17.8mm*12.0mm*1.9mm L*W*H
RF Interface PCB Antenna

Hardware Design and PCB layout

The pin assignment and Pin description

Rabbit-S Pin definition can refer to Figure 1.

Table 1: Module Pin Description

Pin Number Pin Name I/O Alternate Function Description
10 VBA P Power Supply(DC1.8V~3.6V).
1,2,16,22,25 GND P Connect to Ground.
11 RESET DI Reset signal (active high).
13 LOG_OUT DIO Log_out, not intended for customer use.
18 P3_1 DIO GPIO/UART_RX
19 P3_0 DIO GPIO/UART_TX
23 32K_XI A
24 32K_XO A
3 P0_4 DIO INPUT/OUTPUT with selectable pulls up/down resistor.

General-purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down.

4 P0_2 DIO
5 P0_1 DIO
6 P4_0 DIO
7 P4_1 DIO
8 P4_2 DIO
9 P4_3 DIO
12 P5_0 DIO
14 P1_0 DIO
15 P1_1 DIO
17 P2_3 DIO/AIN GPIO/ADCIN3
20 P2_4 DIO/AIN GPIO/ADCIN4
21 P2_5 DIO/AIN GPIO/ADCIN5

Note: GPIO has integrated pull-up and pull-down resistors.
Support GPIO super multiplexing function, WAKE_UP / UART / SPI / IIC / PWM / and other functions can be arbitrarily configured on GPIO.

For more GPIO function configuration questions, contact to Pair link.

As shown in the following table: GPIO Pin detailed Information.

Rabbit-B
Rabbit-C
Rabbit-S
GPIO Index ADC Hardware Default Pull
setting(100K) Reset state
Rom Code Setting Pull resistor Boot code
Default
Wakeup
Function
Dreier
current
P0 -0 GPIO _0 Pull Down Pull Down 10K/1O0K Yes 8mA
P0 -1 GPIO _1 Pull Down Pull Down 10/1000K Yes 8mA
P0_2 GPIO _2 Pull Down Pull Down 10K/1OOK Yes 8mA
P0_3 GPIO_3 Pull Up Output High 10K/1OOK LOG_UART_TX Yes 8mA
P0_4 GPIO _4 Pull Down Pull Down 10K/100K Yes 8mA
P0_5 GPIO_5 Pull Down Pull Down 10K/100K Yes 8mA
P0_6 GPIO _6 Pull Down Pull Down 101K/100K Yes 8mA
P1_0 GPIO_8 Pull Up Pull Up 101K/1OOK STUDIO Yes 8mA
P1_1 GPIO_9 Pull Up Pull Up 10K/1OOK SWDCLK Yes 8mA
P5-0 GPIO 25 Pull Down Pull Down 51K/50K Yes 8mA
32k- XI GPIO 26 Pull Down Pull Down 10K/1100K Yes 8mA
32k- X0 GPIO 27 Pull Down Output Low 10K/1OOK Yes 8mA
P2- 2 GPIO 18 ADCILPC(channel 2) Differential 1+ Pull Down Pull Down 51K/5OK Yes 8mA
P2 -3 GPIO 19 ADCIPC(channel 3)
Differential 2-
Pull Down Pull Down 51K/5OK Yes 8mA
P2- 4 GPIO 20 AD CILPC(channel 4) Differetiat2+ Pull Down Pull Down 5K/50K Yes 8mA
P2- 5 GPIO 21 ADCILPC(ctiarrel 5)
D ifferetiat2-
Pull Down Pull Down 5K/5OK Yes 8mA
P-26 GPIO 22 AD C(channel 6)
D differential 3+
Pull Down Pull Down 5 1/5OK Yes 8mA
P2_7 GPIO 23 ADC(chanm1 7)
Differential 3-
Pull Down Pull Down 5K/50K Yes 8mA
P3_0 GPIO 24 Pull Up Pull Up 10K/1OOK UART TX Yes 8mA
P3_1 GPIO_25 Pull Up Pull Up 10K/1OOK UART_RX Yes 8mA
P3_2 GPIO 26 Pull Down Pull Down 10K/100K Yes 8mA
P3- 3 GPIO 27 Pull Down Pull Down 101/100K Yes 8mA
P4_0 GPIO 28 Pull Down Pull Down 10K/1OOK Yes 8mA
P4_1 GPIO 29 Pull Down Pull Down 10K/1OOK Yes 8mA
P4_2 GPIO_30 Pull Down Pull Down 101/100K Yes 8mA
P4_3 GPIO 31 Pull Up Pull Up 10K/100K Yes 8mA
Appearance and Dimensions

Figure 1 shows the size of the module. The components and prominent structure are not allowed put in this size range(17.8mm*12.0mm*1.9mm).

The following land pattern size is recommended for user board design. However, users can modify it according to PCB soldering conditions. Sufficient examination is necessary if using the modified land pattern.

Figure 1: Mechanical Information

Pairlink Rabbit S Bluetooth 5 BLE Module - fig 1

Module Layout Guideline

The layout on the user PCB should be designed according to the following guideline.
When the module is placed on the PCB, it must be ensured that the RF antenna area (2 times the width of the module) is hollow or suspended, and there must be no traces, vias, or copper.

Figure 2: Module Placement

Pairlink Rabbit S Bluetooth 5 BLE Module - Figure 2

Welding Declaration

The Rabbit-S module only supports one reflow soldering. Our company is not responsible for the module failure caused by multiple reflow soldering.

Figure 3: Reflow Soldering Temperature

Profile Feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min      i Tasmin ) 100°C 150°C
Preheat temperature max (Tmax) 150°C 200°C
Preheat Time (Tasmin to Tsmax)(ts) 60-120 sec 60-120 sec
Average ramp-up rate(Ts max to Tp) 3°C/second max 3°C/second max
Liquidous Temperature (TL) 183°C 217°C
Time ( to ) Maintained Above ITL ‘ 60-90 sec 30-90 sec
Peak temperature 1 Tp ) 220-235°C 230-250°C
Average ramp-down rate ( Tp to Tsmax i 6°C/second max 6°C/second max
Time 25°C to peak temperature 6 minutes                  max 8 minutes                  max

Figure 4: Reflow Soldering Curve

Pairlink Rabbit S Bluetooth 5 BLE Module - Figure 4

Federal Communications Commission (FCC) Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

RF exposure warning
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This product may not be collocated or operated in conjunction with any other antenna or transmitter.
Industry Canada (IC)
CAN ICES-003 (B)/NMB-003(B)

This device complies with Industry Canada’s license-exempt RSSs. Operation is subject
to the following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation.

IMPORTANT NOTE:
Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance
20cm between the radiator and your body.

OEM Integration Instructions:
This device is intended only for OEM integrators under the following conditions:
The module can be used for installation in another host. The transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the integral antenna(s) that has been originally tested and certified with this module. As long as the 3 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirement with this module installed (for example, digital device emission, PC peripheral requirements, etc.). OEM integrator is responsible for ensuring the end-user has no manual instruction to remove or install module.

IMPORTANT NOTE:
In the event that these conditions cannot be met (for example certain laptop configuration or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating. The end product (including the transmitter) and obtaining a separate FCC authorization. The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2AQV6RABBIT-S”.

Antenna Specification:

Antenna Type  Manufacturer  Frequency Range
(MHz) 
Maximum Peak
Antenna Gain(dBi) 
PCB Antenna N/A 2402 – 2480                                                   -0.41

IMPORTANT NOTE:
This Module (IC: 24210-RABBITS, PMN: Rabbit Bluetooth 5 BLE module) has been approved by Industry Canada to operate with the antenna types listed below with the
maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science, and Economic Development Canada certification label of a
the module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science, and Economic
Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: Contains IC: 24210-RABBITS.

Antenna Specification:

Antenna Type  Manufacturer  Frequency Range
(MHz) 
Maximum Peak Antenna Gain(dBi) 
PCB Antenna N/A 2402 – 2480                                                   -0.41

www.pairlink.com.cn

Suzhou Pair link Network Technology Ltd.

Documents / Resources

Pairlink Rabbit-S Bluetooth 5 BLE Module [pdf] User Guide
RABBIT-S, RABBITS, 2AQV6RABBIT-S, 2AQV6RABBITS, Rabbit-S Bluetooth 5 BLE Module, Bluetooth 5 BLE Module, 5 BLE Module, BLE Module

References

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