NXP UM12160 Wi-Fi Development Board User Manual

The NXP FRDM-RW612 board is a low-cost design and evaluation
board based on the RW612 MCU. The RW612 system integrates a dual
Arm Cortex microcontroller and Wi-Fi 6 + Bluetooth Low Energy (LE)
5.4 / 802.15.4 tri-radio wireless MCU designed for a broad array of
applications.

Board Features

RW612 MCU with integrated Wi-Fi 6, Bluetooth LE, and 802.15.4
radios
512 Mbit external serial flash and 64 Mbit PSRAM

Ethernet PHY, temperature sensor, RGB LED, push buttons,
high-speed USB circuit
Compatible with Arduino shield modules, mikroBUS, and Pmod
header

MCU-Link debug probe based on LPC55S69 MCU

Product Usage Instructions

1. Getting Started

Before using the FRDM-RW612 board, ensure that the MCU-Link
debug probe is programmed with the required firmware. Connect the
board to your development system using a USB cable.

2. Software Development

Download the necessary tools and software from the NXP website
to start developing applications for the RW612 MCU. Utilize the
provided example applications and drivers for a smoother
development process.

3. Hardware Connections

Utilize the various headers and connectors on the board to
interface with external components or modules. Refer to the block
diagram in the user manual for detailed pinout information.

4. Debugging and Testing

Use the MCU-Link debugger for debugging purposes. Utilize the
onboard features such as push buttons and LEDs for testing and
validation of your applications.

FAQ

Q: What is the main feature of the RW612 MCU?

A: The RW612 MCU is a highly integrated,
low-power tri-radio Wireless MCU with integrated Wi-Fi 6, Bluetooth
LE, and 802.15.4 radios.

Q: Is the FRDM-RW612 board compatible with Arduino shield
modules?

A: Yes, the FRDM-RW612 board is compatible with
Arduino shield modules, mikroBUS, and Pmod header for additional
functionality.

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UM12160
FRDM-RW612 Board User Manual
Rev. 1.0 — 20 September 2024

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Document information

Information

Content

Keywords

FRDM-RW612, UM12160, RW612

Abstract

The NXP FRDM-RW612 board is a low-cost design and evaluation board based on RW612 MCU. This document describes the hardware of the FRDM-RW612 board.

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1 FRDM-RW612 overview

The NXP FRDM-RW612 board is a low-cost design and evaluation board based on the RW612 device.
The RW612 system integrates a dual Arm Cortex microcontroller and Wi-Fi 6 + Bluetooth Low Energy (LE) 5.4 / 802.15.4 tri-radio wireless MCU designed for a broad array of applications. NXP supports the RW612 device with tools and software, including hardware evaluation boards, software development IDE, example applications, and drivers.
The FRDM-RW612 board consists of one RW612 device with 512 Mbit external serial flash (provided by Winbond). The board also features a 64 Mbit PSRAM (provided by Apmemory), Ethernet PHY, a P3T1755 I3C temperature sensor, RGB LED, push buttons, high-speed USB circuit, and MCU-Link debug probe circuit. The board is also compatible with the Arduino shield modules, mikroBUS, and Pmod header for an NXP low-cost LCD module PAR-LCD-S035.
The onboard MCU-Link debug probe is based on the LPC55S69 MCU. Before using the MCU-Link functionality, ensure that it is programmed with the required firmware. For details, see Section 3.5.

1.1 Block diagram
Figure 1 shows the FRDM-RW612 board block diagram.

SWD header

MCU-Link CMSIS-DAP

USB

/J-Link

VCOM

MCU-Link debugger

SWD SPI I2C

LPC55S69 UART

5 V USB1-VBUS
5 V

X TA L On board debugger

USB type C DCDC

USB 2.0 3.3 V

PMOD

Arduino J2

Arduino J1

mikroBUS header

Push buttons

LCD SPI I2C SPI I2S UART

SWD

RESET, WAKE UP, ISP

PCB ANT

RF connector

RF_CNTL3

SPDT

UART
USB OTG VIO, VPA, VIO_SD, VIO_RF

RW612

Wi-Fi 5 GHz Tx/Rx RF RF_CNTL[1:0] Wi-Fi 2.4 GHz Tx/Rx RF Bluetooth LE/802.15.4 Tx/Rx RF
GPIOs Clock

RMII

FLexSPI_0A

FLexSPI_0B

Diplexer SPDT XTAL

PDM

Ethernet PHY
RJ 45 connector

Arduino J3 Arduino J4

RGB LED

QSPI FLASH

p SR AM

Temperature sensor

Figure 1.FRDM-RW612 Block Diagram

1.2 Board features

Table 1 describes the features of the FRDM-RW612 board.

Table 1.FRDM-RW612 features

Board feature

Target MCU features used

RW612 MCU (Target MCU)

Description
The RW612 is a highly integrated, low-power tri-radio Wireless MCU with an integrated MCU and Wi-Fi 6 + Bluetooth Low Energy (LE) / 802.15.4 radios. The RW612 MCU subsystem includes a 260 MHz Arm Cortex-M33 core with TrustZone-M, 1.2 MB on-chip SRAM and a highbandwidth Quad SPI interface with an on-the-fly decryption engine for securely accessing off-chip XIP flash. The RW612 includes a full-featured 1×1 dual-band (2.4 GHz / 5 GHz)

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Table 1.FRDM-RW612 features…continued

Board feature

Target MCU features used

Description
20 MHz Wi-Fi 6 (802.11ax) subsystem bringing higher throughput, better network efficiency, lower latency, and improved range over previous generation Wi-Fi standards. The Bluetooth LE radio supports 2 Mbit/s high-speed data rate, long range, and extended advertising. The on-chip 802.15.4 radio supports the Thread and Zigbee networking protocols.
The RW612 is an ideal device for Matter applications running over Wi-Fi, Ethernet, and Thread. The RW612 can operate as a Matter controller and Thread Border Router. For details, see the RW612 Data Sheet.

Power supply

· 5 V input power supply using one of the following power sources:
MCU-Link USB2.0 Type-C connector Arduino Shield-compatible header 5 V regulator populated at 3-pin jumper · One DCDC converter for 3.3 V power supply · Jumpers and resistors configuration for different power supplies

Clock

· 40 MHz crystal for system reference clock · 32.768 kHz crystal for real-time clock (RTC) · 50 MHz Ethernet PHY clock from MAC · 16 MHz crystal for MCU-Link onboard debugger

USB

High-speed (HS) USB module

One USB Type-C connector interfaced with a high-speed USB controller and PHY module

Memory

FlexSPI controller

Supports both: · Winbond W25Q512JVFIQ 512 Mbit QSPI flash memory · APmemory APS6404L-3SQN-SN 64 Mbit QSPI PSRAM

Temperature sensor Inter-integrated circuit (I2C)

Supports NXP P3T1755 temperature sensor

Ethernet

Ethernet controller (ENET0)

10 / 100 Mbit/s (RMII) KSZ8081RNB Ethernet PHY and RJ45 connector

I/O headers

Headers compatible with:
· Arduino shields (outer rows) and FRDM header (inner rows)
· Mikroe click boards · LCD on peripheral module (Pmod)

Debug

· Onboard MCU-Link debug probe with CMSIS-DAP and SEGGER J-Link protocol options. It can connect to the target MCU through a USB-to-UART, USB-to-SPI, or USBto-I2C bridge.
· 10-pin Arm JTAG/SWD connector for connecting an external debug probe

RF front-end

Wi-Fi 6 / Bluetooth LE 5.4 / 802.15.4

Single-antenna configuration through either of the following:
· One PCB antenna · A coaxial connector (U.FL-R-SMT-1) for RF cable
connection

PCB

130 mm x 55 mm

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Table 1.FRDM-RW612 features…continued

Board feature

Target MCU features used

Orderable part number

Description FRDM-RW612

1.3 Board kit contents
The FRDM-RW612 board kit contains the following items: · FRDM-RW612 board hardware assembly · A 3 ft micro USB Type A to USB Type C cable
1.4 Board pictures
Figure 2 shows the FRDM-RW612 top view.

UM12160
FRDM-RW612 Board User Manual

RW612 MCU

LPC55S69 MCU-Link

Figure 2.FRDM-RW612 top view

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Figure 3 shows the top-side view of the FRDM-RW612 board, with connectors, push buttons, and LEDs highlighted.

D1 Reset LED

Arduino compatible

header (outer row) /

header(outer row) /

FRDM header (inner row) FRDM header (inner row) J6

mikroBUS

RW612 SWD

SW2

mikroBUS WAKEUP

SW1 RESET

J10 MCU-LINK USB

D2 RGB LED

J9 RW612 10/100 Ethernet connector
J8 HS USB

J11 U.FL connector

Arduino compatible

header(outer row) /

FRDM header

(inner row)

JP8

(DNP)

Power LED PMOD connector

for LCD

Figure 3.FRDM-RW612 connectors, push buttons, and LEDs

SW3 ISP

Figure 4 shows the jumpers on the FRDM-RW612 board.

JP1 JP3

JP2 JP4

JP5 (DNP)

Figure 4.FRDM-RW612 jumpers
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JP9 JP6 JP10 (DNP) (DNP)
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Figure 5 shows the FRDM-RW612 bottom view, with soldered jumpers highlighted.
SJ13 SJ16

SJ25

SJ21 SJ22

Figure 5.FRDM-RW612 bottom view

1.5 Connectors

Table 2 describes the FRDM-RW612 connectors. Figure 3 shows the connectors position on the board.

Table 2.FRDM-RW612 connectors

Part identifier

Connector type

2 x 8 pin header

2 x 10 pin header

2 x 8 pin header

2 x 6 pin header

1 x 8 position receptacles

2 x 6 position receptacles

USB Type-C connector

RJ45 connector

J10

USB Type-C connector

J11

U.FL connector

2 x 5 pin header

JP8

1 x 3 pin header

Description

Reference section

Arduino compatible I/O header (outer rows) and Section 2.7 FRDM header (inner rows)

mikroBUS socket connector

Section 2.8

mikroBUS socket connector

Section 2.8

Pmod connector

Section 2.9

USB-OTG High-speed connector

Section 2.3

Shielded RJ45 connector jack

Section 2.4

MCU-Link USB connector

Section 3.7

Micro Coaxial U. FL connector for RF connection Section 2.10

RW612 SWD connector

Section 2.11

5 V DC voltage regulator

Section 2.1

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1.6 Jumpers

Table 3 describes the FRDM-RW612 jumpers. Figure 4 and Figure 5 show the jumpers position on the board.

Table 3.FRDM-RW612 jumpers

Part identifier

Jumper type

JP1

1×2 jumper

JP10 (DNP) 1×2 pin jumper

JP2

1×2 jumper

JP3

1×2 pin header

JP4

1×2 pin jumper

JP5 (DNP) 1×2 pin jumper

JP6 (DNP) 1×2 pin jumper

JP7 (DNP) 1×2 pin jumper

Description

Reference section

· Open (default setting): Enables the MCU-Link SWD

Section 3.2

feature

· Shorted: Sends a low signal on HW_VER_7 to disable the onboard MCU-Link SWD feature
Note: This configuration is required to enable the target MCU to debug through an external debug probe.

RW612 VIO power supply
· Open (default setting): VIO_3_AON_PIN A5 is powered through the R207 zero-ohm shunt resistor
· Shorted: VIO_3_AON_PIN A5 is powered through the JP10 jumper

Section 2.1.1

MCU-Link (LPC55S69) force ISP mode jumper:
· Open (default setting): MCU-Link follows the normal boot sequence (MCU-Link boots from internal flash if a boot image is found). With the internal flash erased, the MCU-Link normal boot sequence falls through to ISP boot mode.
· Shorted: MCU-Link is forced to ISP mode (USB). Use this setting to reprogram the MCU-Link internal flash with a new image or use the MCUXpresso IDE with the CMSISDAP protocol.
Note: By default, the MCU-Link flash is preprogrammed with a version of J-Link firmware.

Section 3.5

· Open (default setting): MCU-Link VCOM port is enabled. Section 3.8
· Shorted: Sends a low signal on LPC_HW_VER_6 to disable MCU-Link VCOM port

MCU-Link SWD clock enable jumper:
· Open: MCU-Link SWD clock is disabled. · Shorted (default setting): MCU-Link SWD clock is
enabled.

For more information on this jumper, see the FRDM-RW612 schematic

RW612 VBAT power supply
· Open (default setting): RW612 internal buck regulator input VBAT is powered from the +3.3V_DUT supply through the R103 zero-ohm shunt resistor
· Shorted: RW612 internal buck regulator input VBAT is powered by +3.3V_DUT through the jumper

Section 2.1.1

External Battery supply for VIO_3_AON_PINA5
Open (default setting): VIO_3_AON_PINA5 is powered from the +3.3V_DUT Note: External battery can be connected to this jumper for always-on (AON) supply to target MCU RW612 AON supply domain VIO_3

For more information on this jumper, see the FRDM-RW612 schematic

RW612 VIO power supply

Section 2.1.1

· Open (default setting): VIO_DUT is powered from the +3. 3V_DUT supply through the R128 zero-ohm shunt resistor

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Table 3.FRDM-RW612 jumpers…continued

Part identifier

Jumper type

Description

· Shorted: VIO_DUT is powered by +3.3V_DUT through the jumper

Reference section

JP9

1×2 pin jumper

Pin 1-2 shorted (default setting): +3.3V_DUT supply to the Section 2.1

target MCU RW612 sourced from the 3.3 V power supply

SJ13

Soldered 3-pin Jumper · Pin 1-2 selection (default setting): Arduino connector J1 Pin 4 connects to GPIO[8] (FC1_UART_TXD)
· Pin 2-3 selection: Arduino connector J1 Pin 4 connects to GPIO[9] (FC1_UART_RXD)

For more information on this jumper, see the FRDM-RW612 schematic

SJ16

Soldered 3-pin jumper

· Pin 1-2 selection (default setting): Arduino connector J1 Pin 2 connects to GPIO[9] (FC1_UART_RXD)
· Pin 2-3 selection: Arduino connector J1 Pin 2 connects to GPIO[8] (FC1_UART_TXD)

For more information on this jumper, see the FRDM-RW612 schematic

SJ21

Soldered 3-pin jumper

· Pin 1-2 selection (default setting): GPIO[22] connects to Ethernet PHY Pin RXD0/DUPLEX through GPIO_22_ ENET_RX_DATA0 signal
· Pin 2-3 selection: Provides a provision to connect the 32.768 kHz crystal to the target MCU through GPIO[22] (AON_XTAL32K_IN)

Section 2.2

SJ22

Soldered 3-pin jumper

· Pin 1-2 selection (default setting): GPIO[23] connects to Ethernet PHY Pin RXD1/PHYAD2 through GPIO_23_ ENET_RX_DATA1 signal
· Pin 2-3 selection: Provides a provision to connect the 32.768 kHz crystal to the target MCU through GPIO[23] (AON_XTAL32K_OUT)

Section 2.4

SJ25

Soldered 3-pin jumper

· Pin 1-2 selection (default setting): RF front-end switch RTC7608U (U16) direct power supply from 3.3V_BRD
· Pin 2-3 selection: Provides RF_CNTL_2 as a second control line provision

Section 2.10

1.7 Push buttons

Tactile buttons are populated on the FRDM-RW612 board. Each of the SW [1:3] buttons have a provision for a 0.1 µF bypass capacitor for debouncing and pads for external pull-up resistors.
Table 4 describes the FRDM-RW612 push buttons. Figure 3 shows the push buttons available on the board.

Table 4.FRDM-RW612 push buttons Part identifier Switch name

SW1

Reset button (RW612 RST)

SW2

Wakeup button

SW3

In-system programming (ISP) mode switch

Description
Pressing SW1 resets the target MCU that causes board peripherals to reset to their default states and execute the boot code. When SW1 is pressed, the reset LED D1 (Red) turns ON.
SW2 is a general-purpose input and has provision to connect to low-power wake-up pin. Pressing SW2 gives a low level on MCU_ AONWAKEUP, otherwise, it is a high level on MCU_AONWAKEUP.
SW3 is an ISP mode switch. Pressing SW3 gives a low level on ISP_ MODEn, otherwise, it is a high level on ISP_MODEn.

Figure 6 shows the circuit diagrams of the FRDM-RW612 push buttons.

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MCU wakeup +3.3V_BRD

SW2 434123025826

R4 100 k R0402

C3 NL C0402

MCU_AONWAKEUP

PDn/reset +3.3V_BRD +3.3V_BRD

SW1 434123025826

R1 51 k R0402

R16 470 R0402

C1 0.1 µF C0402

1 RED
2

D1 MHT192CRCT
PDn

ISP +3.3V_BRD

Figure 6.FRDM-RW612 push buttons

SW3 434123025826

R199 51 k
C128 NL C0402

ISP_MODEn

1.8 LEDs

Table 5 describes the FRDM-RW612 light-emitting diodes (LEDs) that correspond to the target MCU. The board also has some MCU-Link-specific LEDs, which are described in Section 3.10. The LEDs are shown in Figure 3.

Table 5.FRDM-RW612 LEDs

Part identifier

LED color

Red

Red / Green / Blue

Green

LED name / function Description

Reset LED RGB LED
Power LED

Indicates system reset activity. When board reset is initiated, for example, by pressing the SW1 reset button, the D1 LED turns ON.
User application LEDs. Each of these LEDs can be controlled through a user application. · Red LED connects to target MCU pin GPIO_1 · Green LED connects to target MCU pin GPIO_12 · Blue LED connects to target MCU pin GPIO_0
Indicates 3.3V power-on status. When 3.3 V is available on board, D5 turns ON.

Figure 7 shows the circuit diagram of the RGB LEDs described in Table 5.

+3.3V_BRD
R34 0 R0402
Figure 7.FRDM-RW612 LEDs

R24

470 , R0402

R56

470 , R0402

R50

470 , R0402 MHPA2525RGBDT-S

GPIO_1_LED_RED GPIO_12_LED_GREEN GPIO_0_LED_BLUE

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2 FRDM-RW612 functional description

This section describes the features and functions of the FRDM-RW612 board. You can use the functionality described in this section as a reference while designing your own target board.
Note: For more details on the RW612 MCU, see the RW612 Data Sheet and RW61X User Manual.

2.1 Power supplies

The FRDM-RW612 board is powered with a SYS_5V (5 V) power supply using one of the following source options:
· 5V_MCU_LINK_USB supply from MCU-Link USB2.0 Type-C connector (J10) [Default selection] · SYS_5V supply from Arduino Shield compatible header, J3 (pin 10) · 5V_HDR_IN supply from 5 V regulator populated at 3-pin jumper (JP8) [Not populated by default] The SYS_5V supply is an input power supply on the board and is a source for secondary power supplies.
Other power supplies in the FRDM-RW612 board are through voltage regulators or are connected through jumpers, which can be used to enable/disable a power supply.
Figure 8 shows the system power circuit on the FRDM-RW612 board.

5V_USB_MCU_LINK 2 D4 1 MSS1P3L
5V_HDR_IN 2 D8 1

3.3 V DC-DC

SYS_5V

C66 10 µF, 25 V, X5R

VIN 3 C71 10 µF, 25 V, X5R

L8 1 µH +/- 20 %

6 OUT

R125 100 k R0402

C0805

EN 5

1 FB

R126 200 k, 1 %
R0402

+3.3 V_DCDC_EN MP1605GTF GND

MSS1P3L

R114 44.2 k, 1 %
R0402

+3.3V_BRD

+3.3V_DUT JP9

Power LED +3.3V_BRD

C82 NL C0402

C105 22 µF, 10 V, X5R C0805

HDR1x2_100MIL_TH
C108 NL C0805

R72 470 R0402

Vout = 0.6 (1 + R1/R2) 3.315 V = 0.6 (1 + 200 k/44.2 k)

1 GREEN
2

D5 MHT192DGCT

Figure 8.FRDM-RW612 power circuit 5 V power sources and selection Table 6 describes the 5 V input power sources and their output power supplies.

Table 6.5 V power sources Part identifier Device / power source Output power supply

J10

MCU-Link USB2.0 Type- 5V_USB_MCU_LINK

C connector

JP8

5 V power regulator

5V_HDR_IN

populated at JP8

–

5V_USB_MCU_LINK/ 5 SYS_5V

V_HDR_IN / J3 (pin 10)

[1]

Description
· One of the sources of SYS_5V (5 V) supply (default option)
· USB regulator input power supply for MCULink microcontroller LPC55S69
One of the sources for SYS_5V (5 V) supply
· mikroBUS connector (J5) · HS USB connector power switch NX5P3090UK
(U11)

[1] Pin 10 on connector J3 is a versatile pin that can be used either to output 5 V power from the EVK or to input 5 V power from an external source, depending on the requirements.

3.3 V power sources and selection Table 7 describes the 3.3 V input power sources and their output power supplies.

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Table 7.3.3 V power sources Part identifier Device/power source

MP1605GTF

Output power supply +3.3V_BRD

· Description
· One of the sources for +3.3V_DUT supply to target MCU RW612 through the JP9 jumper (default selection). For details, see Section 1.6
· Power supply for:
PTN5150A USB Type-C CC logic (U10) RGB LED (D2) P3T1755 I2C sensor (U2) Pmod connector (J7) mikroBUS connector (J6) MCU-Link LPC55S69 (U3) Arduino shield compatible header pin16 (J2) Single-buffer/inverter gate IC 74LVC1G07
GV,125 (U4) used for bootstrap configuration
RW612 SWD connector (P1) · +3.3V power source for VCC_Flash supplies for
IC_W25Q512JVFIQ QSPI flash (U13) through R139 zero-ohm resistor (default selection) · +3.3V power source for VCC_PSRAM APS6404 L-3SQN-SN PSRAM (U12) through R173 zeroohm resistor (default selection) · Power supply for RTC7608U (U16) through SJ25 (default selection) · Power source for ENET_3V3 supplies for Ethernet transceiver KSZ8081RNB (U5)

2.1.1 Power supply configuration
Once the main power configurations are set, the target MCU power configurations must be made. The MCU power is configured by a network of jumpers or by a combination of resistors, capacitors, and diodes as shown in Figure 9.

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+3.3V_DUT

JP5 NL

R103
0 R0805

C58 22 µF, 10 V, X5R C0603

C59 NL C0402

R218
0 R0805

VPA

C39 NL C0402

C38 10 µF, 6.3 V, X5R C0402

R196
0 R0402

C81 10 µF, 6.3 V, X5R C0402

+3.3V_DUT +1.8V_DUT

VIO_DUT

JP7 NL

R128 0 R0402

R112 0 , R0402
R111

Shared pad

NL, R0402 R136
0 , R0402 R147

Shared pad

NL, R0402

D18 BAT54C-7-F
1

JP10

R207

0 , R0402

JP6 1: BAT NL 2: GND

R208 0 , R0402

R209 0 , R0402

R216 0 , R0402

R217 0 , R0402

C125 NL C0402

RW612 SOC power

VBAT_PINB10
C61 0.1 µF C0201

+1.8 V_iBUCK

1.0 H +/- 20 %

VBAT_PINA10
C60 0.1 µF C0201

C41 22 F, 10 V, X5R C0603

VPA_PINR15
C50 100 pF C0201

VCORE_iBUCK

1.0 H +/- 20 %

VPA_PINR8
C73 100 pF C0201

C72 22 F, 10 V, X5R C0603

AVDD33_USB_PINB8
C79 0.1 µF C0201

VCORE_iBUCK VCORE_DUT
R113
0 R0805

+1.8 V_iBUCK +1.8 V_DUT

VIO_5_PINA4

R89
0 R0805

C90 0.1 µF C0201

FlexSpi1_pSRAM

U6B

VBAT_PINB10 VBAT_PINA10

VBAT VBAT B10
A10

BUCK18_VOUT BUCK18_SENSE A11 BUCK_11_VOUT C11 BUCK_11_SENSE A9
B9

VIO_1_PINK1 VIO_2_PINF1 VIO_3_AON_PINA5 VIO_4_PIND1 VIO_5_PINA4 VIO_6_PINB15

VIO_1 VIO_2 K1 VIO_3 F1 VIO_4 A5 VIO_5 D1 VIO_6 A4
B15

VIO_RF_PINR6

VIO_RF R6

VCORE_PIND4 VCORE_PINH1 VCORE_PIND15 VCORE_PINK10

VCORE VCORE D4 VCORE H1 VCORE D15
K10

VIO_4_PIND1

C97 0.1 µF C0201

FlexSpi0_Flash

VCORE_DUT

VIO_3_AON_PINA5
C84 0.1 µF C0201

C57 10 µF, 6.3 V, X5R
C0402

C54 NL C0402

VCORE_PIND15

C42 0.1 µF C0201

C35 330 pF C0201

VIO_6_PINB15
C34 0.1 µF C0201
VIO_1_PINK1
C101 0.1 µF C0201
VIO_RF_PINR6
C80 0.1 µF C0201
VIO_2_PINF1
C98 0.1 µF

Test points VCORE_DUT +1.8V_DUT

HD5 NL

HD4 NL

VCORE_PIND4

C124 0.1 µF C0201

C123 330 pF C0201

VCORE_PINH1

C99 0.1 µF C0201

C100 330 pF C0201

VCORE_PINK10

C120 0.1 µF C0201

C121 330 pF C0201

GND D10 GND G7 GND G8 GND G9 GND H13 GND H6 GND H7 GND H9 GND R13 GND R3 GND R5 GND R7 GND J5 GND J7 GND P9 GND P8 GND P4 GND P2 GND P15 GND P14 GND P14 GND P13 GND P12 GND P11 GND P10 GND M13 GND J9 GND J8

RW61x_BGA

C63 10 µF, 6.3 V, X5R
C0402

+1.8V_DUT
C94 NL C0402

AVDD18_PINM15

C37 NL C0201

C48 0.1 µF C0201

VPA R8 VPA R15
AVDD33_USB B8 AVDD18_USB A7
VDD18 B12 AVDD18 F14 AVDD18 F15
AVDD18 M15 AVDD18 N15 AVDD18 L15 AVDD18 J15 AVDD18 K15
AVDD18 R12 AVDD18 R10 AVDD18 P11
AVDD18 R2 AVDD18 R1 AVDD18 P1

VPA_PINR8 VPA_PINR15
AVDD33_USB_PINB8 AVDD18_USB_PINA7
VDD18_PINB12 AVDD18_PINF14 AVDD18_PINF15
AVDD18_PINM15 AVDD18_PINN15 AVDD18_PINL15 AVDD18_PINJ15 AVDD18_PINK15
AVDD18_PINR12 AVDD18_PINR10 AVDD18_PINP11
AVDD18_PINR2 AVDD18_PINR1 AVDD18_PINP1

AVDD18_PINN15
C49 0.1 µF C0201

AVDD18_PINR10
C62 0.1 µF C0201

AVDD18_PINR12
C55 0.1 µF C0201

AVDD18_PINR11

C68 0.1 µF C0201

C64 NL C0201

AVDD18_PINR2
C93 0.1 µF C0201

+1.8V_DUT

VDD18_PINB12
C33 0.1 µF C0201

AVDD18_USB_PINA7
C78 0.1 µF C0201

AVDD18_PINR1
C92 0.1 µF C0201
AVDD18_PINP1
C91 0.1 µF C0201

R90
2.0 , 1 % R0402

AVDD18_PINJ15

C36 2.2 µF

C45 0.1 µF C0201

AVDD18_PINF14
C43 0.1 µF C0201

AVDD18_PINK15
C46 0.1 µF C0201

AVDD18_PINF15
C44 0.1 µF C0201

AVDD18_PINL15
C47 0.1 µF C0201

Figure 9.Power configuration
These jumpers provide access to insert ammeters in all the supplies connecting to the RW612 device. They also provide a means of connecting external supplies to any of the RW612 power pins.
Table 8 describes the power supply configurations for MCU analog, USB, and other operations.

Table 8.MCU power supplies

Power source

Zero-ohm resistor or Jumper Power supply rail used

+3.3V_DUT

· R103 resistor (installed) · JP5 jumper (DNP)

· VBAT_PINA10 · VBAT_PINB10

· R218 resistor (installed)

VPA · VPA_PINR15 · VPA_PINR8

· R196 resistor (installed)

AVDD33_USB_PINB8

· R128 resistor (installed) · JP7 jumper (DNP) · R112 resistor (installed) · R111 resistor (DNP) · R136 resistor (installed) · R147 resistor (DNP) · R207 resistor (installed) · JP10 jumper (DNP) · R208 resistor (installed) · R209 resistor (installed) · R217 resistor (installed) · R216 resistor (installed)

VIO_DUT · VIO_5_PINA4 · VIO_4_PIND1 · VIO_3_AON_PINA5 · VIO_6_PINB15 · VIO_1_PINK1 · VIO_2_PINF1 VIO_RF · VIO_RF_PINR6

Description
Power source for MCU (RW612) VBAT
Power source for MCU (RW612) VPA
Power source for MCU (RW612) 3.3 V analog power AVDD33_USB pin · Power source for MCU (RW612)
3.3 V VIO digital power VIO_5, VIO_4, VIO_3, VIO_6, VIO_1, and VIO_2 · Power source for MCU (RW612) VIO_RF

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Table 8.MCU power supplies…continued

Power source

Zero-ohm resistor or Jumper Power supply rail used

VCORE iBuck R113 resistor (installed)

VCORE_DUT · VCORE_PIND15 · VCORE_PIND4 · VCORE_PINH1 · VCORE_PINK10

+1.8V_iBUCK

· R89 resistor (installed) · R90 resistor (installed) · R111 resistor · R147 resistor

+1.8V_DUT
· VDD18_PINB12 · AVDD18_PINF14 · AVDD18_PINF15 · AVDD18_PINM15 · AVDD18_PINN15 · AVDD18_PINR10 · AVDD18_PINR12 · AVDD18_PINR11 · AVDD18_PINR2 · AVDD18_PINR1 · AVDD18_PINP1 · AVDD18_PINJ15 · AVDD18_PINK15 · AVDD18_PINL15 · AVDD18_USB_PINA7 VIO
· VIO_5_PINA4 · VIO_4_PIND1

Description
· Power source for MCU (RW612) VCORE
· Power source for MCU (RW612) 1.8 V analog power AVDD18 pins
· Power source for MCU (RW612) 1.8 V analog power AVDD18_USB
· Power supply for MCU (RW612) 1.8 V VIO digital power VIO_5, VIO_4

2.1.2 RW612 iBuck
The FRDM-RW612 board uses internal Buck regulators through two DC-DC inductors L3, and L6 for VCORE and AVDD18 power supply. Figure 9 shows the iBUCK circuit diagram of the FRDM-RW612 board. Choosing the right DC-DC inductor for your target board is important. When selecting a DC-DC inductor, refer to the specifications mentioned in the RW612 Data Sheet.

2.2 Clocks

The FRDM-RW612 board provides crystal oscillators to provide accurate time bases for the device and different components on the board.
Table 9 describes the clock sources available on the FRDM-RW612 board.

Table 9.FRDM-RW612 clocks

Clock generator

Clock frequency

Crystal oscillator, Y1 (8300064629, Würth Elektronik)

16 MHz

Destination
XTAL32M_N/P pins of LPC55S69 MCU-Link

Description Option for external clock input

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Table 9.FRDM-RW612 clocks…continued

Clock generator

Clock frequency

Destination

Crystal oscillator, Y2 (8Q40070007, TXC Corporation)

40 MHz

XTAL_IN/OUT of target MCU RW612

Crystal oscillator, Y3 (830009678, Würth Elektronik)

32.768 kHz

GPIO[22] / GPIO[23] of target MCU RW612

Description
· Drive a PLL to achieve higher clock rates for both high-gain mode and low-power mode
· A larger voltage swing is used at the crystal pin in high-gain mode
Provides sleep clock option for RW612 through GPIO[22] (AON_XTAL32K_IN) and GPIO[23] (AON_XTAL32K_OUT)

2.3 USB interface

The target MCU (RW612) features two USB modules (FS USB and HS USB), each with device and host capabilities and a built-in transceiver.
On the FRDM-RW612 board, only the HS USB controller and PHY interface are used, and are connected to the USB Type-C connector J8.
Figure 10 shows the HS USB circuit diagram.

USB_OTG high speed USB2.0 type C

USB_OTG_VBUS_5V

HS_USB_CC1 HS_USB_DP HS_USB_DN

J8 GND1 A1 VBUS1 A4
CC1 A5 DP1 A6 DN1 A7 SBU1 A8 VBUS2 A9 GND2 A12

B12 GND3 B9 VBUS3 B8 SBU2 B7 DN2 B6 DP2 B5 CC2 B4 VBUS4 B1 GND4

S1 S2 S3 S4 USB4085-GF-A

SH1 SH2 SH3 SH4

R172 0 , R0805
C95
NL, C0805

HS_USB_DN HS_USB_DP HS_USB_CC2

GND

VBUS USB ID DP DM

VBUS control

5V_USB_OTG

SYS_5V

L10
330 +/- 25 % L0603

R168

C115

4.7 µF, 10 V, X5R

C0805

R171

NL, R0402

USB_DM

0 , R0402 C106
10 µF, 10 V, X5R C0603
+3.3V_BRD

U15 1

DLW21SN900SQ2L

USB_DP

R162 NL, R0402

90 differential
pair

GPIO_20_USB_OTG_PWR_FLT

+3.3V_BRD

C103 0.22 µF, 10 V, X5R C0402
R132 10 k, R0402
R133 NL, R0402
R131

Layout note: 90 differential impedance

RClamp0854P.TCT

GPIO_12_USB_OTG_PWR

100 k, R0402
R130
NL, R0402 R145 NL
R0402

GND1 GND2 GND3

U11 VINT1 B1 VINT2 B2 VINT3 C1
FAULT A2

C2 VBUS1 D1 VBUS2 D2 VBUS3 A3 ILIM

EN A1 B3 C3 D3 NX5P3090UK

CC logic control

P3V3_PTN

+3.3V_BRD

P3V3_PTN

USB_ID USB_OTG_VBUS_5V

1
U9 2SK3018 2

5V_USB_OTG

C107 0.1 µF C0402

C112 10 µF, 10 V, X5R C0603

R151 100 k R0402

R141

R155 10 k R0402

R149 NL R0402

R154 NL R0402

0 R0402

GPIO_16_FC2_I2C_SDA_USBOTG_CC GPIO_17_FC2_I2C_SCL_USBOTG_CC
GPIO_50_ARD_DB

R157 R150 NL, R0402 NL, R0402 R156
NL, R0402

HS_USB_CC1

HS_USB_CC2

U10 SDA/OUT1 7 SCL/OUT2 8 INTB/OUT3 6

R148 R153 0 , R0402 0 , R0402

CC1 1 CC2 2

D10

PESD5V0F1BL

Layout note:

Place TVS and resistors

close to USB connector

D9 PESD5V0F1BL
1

C96 0.22 µF, 10 V, X5R C0402

C111 0.22 µF, 10 V, X5R C0402

R165
1.0 M R0402

P3V3_PTN

VDD 12

4 VBUS_DET 9 ID 5 ADR/CON_DET 11 EXT_SEL

R143 10 k R0402

R167 NL R0402

R142 10 k R0402

R164 NL R0402
R144
0 R0402

B4 PORT 10
GND PTN5150A

R166 NL R0402

R163 NL R0402

GND test points

HD3 NL

HD1 NL

HD2 NL

HD6 NL

USB_ID (5,6)

SH1 NL SHIELD
GND

ADR/CON_DET: When Power-up, ADR(input) function: ADR = 1: I2C address: 0x7A(ADR) ADR = 0: I2C address: 0x3A(ADR) ADR = MID/FLOATING: (Pin 6/7/8) configured as OUT1/2/3 in non-I2C mode
After TINPUTLATCH, CON_DET(output) function: CON_DET = 1: Connection detected CON_DET = 0: No connection

EXT_SEL: External selection High = CC1 orientation or no valid CC1/CC2 detection Low = CC2 orientation

Mounting holes

PCB10 PCB9 PCB2 PCB1

Fiducials

FD6 FD4 FD1 FD3 FD5 FD2

aaa-056937

Figure 10.High-speed USB circuit diagram

Table 10 describes the devices used for connection between HS USB controller and USB Type-C connector.

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Table 10.USB ports Part identifier Connector type

USB2.0 Type-C

connector

U11

NX5P3090UK

U10

PTN5150A

Description
Port can connect in both Host and Device mode. In Device mode, this port provides the 5 V power supply (5V_USB_HS) source to the board.
USB Power Delivery (PD) and type C current-limited power switch
CC Logic chip supporting the USB Type-C connector application with Configuration Channel (CC) control logic detection and indication functions · ADR/CON_DET pin configuration:
When pull up to P3V3_PTN with 10 k resistor (R167), ADR (input) function: ADR=1: I2C Address: 0x7A (ADR)
When pull down to GND with 10 k resistor (R166), ADR (input) function: ADR=0: I2C Address: 0x3A (ADR)
ADR=Mid/Floating (default setting), this pin automatically switches from input to CON_DET output in non-I2C mode. Pin 6/7/8 is configured as OUT1/2/3 in non-I2C mode
After TINPUTLATCH, CON_DET (output) function: CON_DET=1: Connection detected CON_DET=0: No connection
· PORT pin configuration: When pull up to P3V3_PTN with 10 k resistor (R164), PORT=1: DFP mode When pull down to GND with 10 k resistor (R163), PORT=0: UFP mode When Floating (default setting): DRP mode

On the FRDM-RW612 board, the USB_DM and USB_DP signals from the target MCU connect to the onboard USB connector (J8) directly through a common mode choke (L9). The common mode choke is included for noise suppression on the DM / DP signals.

2.4 Ethernet interface

The target MCU (RW612) features one Ethernet controller (ENET0) module.
On the FRDM-RW612 board, the Ethernet controller connects to an RJ45 connector through an Ethernet PHY transceiver. The transmit, receive, and other Ethernet signals are on the GPIO pins. The FRDM- RW612 only supports RMII configuration, therefore, the Ethernet PHY (KSZ8081RNB) has been chosen.
Table 11 describes the onboard devices supporting the Ethernet interface.

Table 11.Ethernet interface devices

Part identifier

Part name and Manufacturer

Heling MJ88B-B011-RVL11-P

Microchip Technology KSZ8081

RNB

BOURNS PT61018PEL

Description
Shielded RJ45 connector jack with magnetic built-in to connect to an Ethernet cable
Single-chip 10 /100 Mbit/s RMII Ethernet PHY compliant with IEEE802.3.
Dual-channel 16-pin Ethernet transformer for LAN 10/100 Base-Tx

The Ethernet PHY (KSZ8081RNB) receives the 50 MHz RMII reference clock at XI (Pin 9) from the MCU Ethernet controller through GPIO[25]. The Pin 19 (REF_CLK) of the PHY is a no connect.

2.5 I2C sensor interface

The FRDM-RW612 board includes one P3T1755 digital temperature sensor that communicates with the target MCU through FlexComm I2C interface (FC2 I2C). The P3T1755 is a temperature-to-digital converter from -40

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°C to +125 °C range. This sensor device allows for 32 I2C target addresses and an alert function that becomes active when the temperature exceeds the programmed limits.
The 8-bit I2C address of the sensor device is 0x1001000 (0x90).
Figure 11 shows the I2C sensor schematic diagram.

+3.3V_BRD

GPIO_16_FC2_I2C_SDA_TEMPSNS GPIO_17_FC2_I2C_SDL_TEMPSNS

R51
0 R0402
U2
A0 7 A1 6 A2 5
SDA 1 SCL 2

3V3_TSEN

VCC 8

C19 1 µF, 10 V, X5R
C0402

3 ALERT TP1

4 GND P3T1755

C18 0.1 µF C0402

I2C address: 0x90
Figure 11.Temperature sensor schematic diagram The sensor device is connected to the I2C controller of the device through the GPIO[16:17] pin.

2.6 Flash memory interface

The target MCU (RW612) features one Flexible Serial Peripheral Interface (FlexSPI) controller, which can support external memory. On the FRDM-RW612 board, the MCU RW612 FlexSPI controller can connect to an onboard QSPI flash memory (U13) and a PSRAM flash memory (U12).
The flash memory VCC_Flash and VCC_PSRAM can be supplied by the +3.3V_BRD rail (by default) or by 1.8V_DUT through zero-ohm resistors (DNP).
Table 12 provides the details of the flash memory used on the board.

Table 12.Flash memory

Part

Manufacturer and part name

identifier

U13

Winbond W25Q512JVFIQ

U12

AP Memory APS6404L-3SQN-

Description
It is a 3 V 512 Mbit serial flash memory with dual and quad SPI, which is intended for demonstrating FlexSPI boot applications, and general FlexSPI operation. For main features, refer to the datasheet. 64 Mbit, 2.7 V 3.6 V, Octal I/O type PSRAM Flash memory

Figure 12 shows the flash memory circuit diagram.

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VCC_Flash

QSPI Flash

VCC_Flash

GPIO_34_QSPI_flash_CLK0 GPIO_30_QSPI_flash_D0

GPIO_32_QSPI_flash_D2

+3.3V_BRD

+1.8V_DUT

R139 0 , R0402

R175 51 k R0402

TP6

U13

CLK 16

DI(IO0) 15

TP5

n.c. 14

n.c. 13

TP7

n.c. 12

n.c. 11

GND 10

WP(IO2) 9

IC_W25Q512JVFIQ VCC_Flash

C102
0.1 µF C0402
HOLD (IO3) VCC RESET n.c. n.c. n.c. CS DO(IO1)

R169 51 k R0402

R170 51 k R0402

TP4 TP3

GPIO_33_QSPI_flash_D3

GPIO_28_QSPI_flash_SSEL0 GPIO_31_QSPI_flash_D1 TP2

TP11 NL

GPIO_29_QSPI_flash_DQS

R140

Shared pad

NL, R0402

VCC_PSRAM

PSRAM VCC_PSRAM

R160 NL
R0402

R159 NL R0402

R158 10 k R0402

C109 0.1 µF C0402

C110 4.7 µF, 10 V, X5R C0402

VCC_PSRAM

GPIO_36_QSPI_SRAM_SSL0 GPIO_39_QSPI_SRAM_D1 GPIO_40_QSPI_SRAM_D2

U12 CS 16 SO/SIO 15 SIO 14 VSS 10

8 VDD 7 SIO 6 SCLK 5 SI/SIO

APS6404L-3SQN-SN

R161 NL
R0402

R174 NL R0402
GPIO_41_QSPI_SRAM_D3
GPIO_35_QSPI_SRAM_CLK0
GPIO_38_QSPI_SRAM_D0

+3.3V_BRD

VCC_PSRAM

+1.8V_DUT

R173 0 , R0402

R176

Shared pad

NL, R0402

Figure 12.Flash memory circuit diagram

TP12 NL

GPIO_37_QSPI_SRAM_DQS

The FlexSPI data and clock signals for the Flash memory interface are available on GPIO[30:33] and GPIO[34] pins, for the PSRAM memory interface are available on GPIO[38:41] and GPIO[35] pins.

2.7 Arduino compatible I/O headers

The FRDM-RW612 board provides Arduino Uno-compatible headers to support the Arduino and FRDM ecosystem shield modules. To get a list of shield modules that are compatible with these headers, see NXP Expansion Board Hub.
Table 13 describes the connectors of the Arduino socket.

Table 13.Arduino socket connectors Part identifier
J1

Connector type 2×8 position receptacle

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Table 13.Arduino socket connectors…continued

Part identifier

Connector type

2×10 position receptacle

2×8 position receptacle

2×6 position receptacle

Figure 13 shows the pinout of the Arduino socket connectors.

GPIO_9_FC1_UART_RXD_ARD_D0 GPIO_8_FC1_UART_TXD_ARD_D1
GPIO_11_ARD_D2 GPIO_15_ARD_D3 GPIO_18_ARD_D4_PMOD_INT GPIO_27_ARD_D5
GPIO_0_ARD_D6 GPIO_20_ARD_D7

D0/UART_RX D1/UART_TX
D2 D3/PWM
D4 D5/PWM D6/PWM
D7

GPIO_50_ARD_D8 GPIO_52_ARD_D9 GPIO_6_FC1_SPI_SSELN0 GPIO_9_FC1_SPI_MOSI GPIO_8_FC1_SPI_MISO GPIO_7_FC1_SPI_SCK

D8 D9/PWM D10/PWM/SPI_CS D11/PWM/SPI_MOSI D12/SPI_MISO D13/SPI_CLK
GND

C12 +3.3V_BRD C0603
10 µF, 10 V, X5R GPIO_16_FC2_I2C_SDA_ARD GPIO_17_FC2_I2C_SCL_ARD

AREF

R25

0 D18/I2C_SDA
D19/I2C_SCL

J2 SSQ-110-03-G-D

J1 SSQ-108-03-G-D

GPIO_9_FC1_I2S_DA TA GPIO_8_FC1_I2S_WS
GPIO_7_FC1_I2S_SCK GPIO_5_MCLK
GPIO_2_FC0_I2S_DA TA GPIO_3_FC0_I2S_WS
GPIO_4_FC0_I2S_SCK

I2S_DO I2S_WCLK I2S_BCLK
MCLK I2S_DI I2S_WCLK I2S_BCLK

ARD_VIN_5-9V

5 V DC VR support

JP8

5V_HDR_IN

OUT

GPIO_51_PDM_DATA01 GPIO_53_PDM_CLK01
GPIO_52_PDM_DATA23
J3 SSQ-108-03-G-D

C113 NL
C0603

C104 NL
C0603

C77 NL C0603

C126 C0603

+3.3V_BRD PDn

IOREF RESETn 3V3_OUT

NL
C127 C0603

SYS_5V

NL ARD_VIN_5-9V

5V_OUT GND GND
VIN

GPIO_42_ARD_A0

GPIO_43_ARD_A1

GPIO_45_ARD_A2

Figure 13.Arduino headers

PDM_DATA0 PDM_CLK
PDM_DATA1
J4 SSQ-108-03-G-D

To allow for flexibility in the design, some of the signals on the I/O headers can be swapped for other connections using zero-ohm resistors or jumpers. Table 14 to Table 17 describe such signals.

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Table 14.Arduino compatible header J1 pinout

Device pin / Function / Signal name

number GPIO

GPIO[4]

FC0_I2S_SCK

GPIO[9]

FC1_UART_RXD_ARD_D0

GPIO[3]

FC0_I2S_WS

GPIO[8]

FC1_UART_TXD_ARD_D1

GPIO[2]

FC0_I2S_DATA

GPIO[11]

ARD_D2

GPIO[5]

MCLK

GPIO[15]

ARD_D3

GPIO[7]

FC1_I2S_SCK

GPIO[18]

ARD_D4_PMOD_INT

–

GPIO[27]

ARD_D5

GPIO[8]

FC1_I2S_WS

GPIO[0]

ARD_D6

GPIO[9]

FC1_I2S_DATA

GPIO[20]

ARD_D7

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Jumper setting SJ16 Pin 1-2 selection (Default setting)
SJ7 Pin 1-2 selection SJ13 Pin 1-2 selection (Default setting)
SJ5 Pin 1-2 selection SJ10 Pin 1-2 selection
SJ12 Pin 1-2 selection
SJ2 Pin 1-2 selection (Default setting) SJ15 Pin 1-2 selection
SJ19 Pin 1-2 selection (Default setting)

Potential conflict
–
· Arduino header J1 pin 15 (GPIO_9_ FC1_I2S_DATA)
· Arduino header J2 pin 8 / mikroBUS J6 pin 6 / MCU_LINK_USB_Bridge (GPIO_9_FC1_SPI_MOSI)
mikroBUS header J5 pin 4 (GPIO_3_ FC0_UART_TXD_ME)
· Arduino header J1 pin 13 (GPIO_8_ FC1_I2S_WS)
· Arduino header J2 pin 10 / mikroBUS J6 pin 5 / MCU_LINK_USB_Bridge (GPIO_8_FC1_SPI_MISO)
mikroBUS header J5 pin 3 (GPIO_2_ FC0_UART_RXD_ME)
–
–
–
Arduino header J1 pin 12 / mikroBUS header J6 pin 4 / MCU_LINK_USB_ Bridge (GPIO_7_FC1_SPI_SCK)
Pmod J7 pin 2 (GPIO_18_ARD_D4_ PMOD_INT)
–
–
· Arduino header J1 pin 4 (GPIO_8_ UART_TXD_ARD_D1)
· Arduino header J2 pin 10 / mikroBUS J6 pin 5 / MCU_LINK_USB_Bridge (GPIO_8_FC1_SPI_MISO)
RGB LED D2 pin 4 (GPIO_0_LED_BLUE)
· Arduino header J1 pin 2 (GPIO_9_ FC1_UART_RXD_ARD_D0)
· Arduino header J2 pin 8/mikroBUS J6 pin 6/MCU_LINK_USB_Bridge (GPIO_ 9_FC1_SPI_MOSI)
USB power control (GPIO_20_USB_ OTG_PWR_FLT through zero-ohm resistor R133 (DNP by default))

Table 15.Arduino compatible header J2 pinout

Device pin / Function / Signal name

number GPIO

–

GPIO[50]

ARD_D8

–

Jumper setting
–

Potential conflict
–

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Table 15.Arduino compatible header J2 pinout…continued

Device pin / Function / Signal name

number GPIO

Jumper setting

Potential conflict

GPIO[52]

ARD_D9

SJ24 Pin 1-2 selection (default setting)

Arduino header J4 pin 5 (GPIO_52_ PDM_DATA23)

–

GPIO[6]

FC1_SPI_SSELN0

–

GPIO[9]

FC1_SPI_MOSI

SJ14 Pin 1-2 selection

· Arduino header J1 pin 2 (GPIO_9_ FC1_UART_RXD_ARD_D0)
· Arduino header J1 pin 15 (GPIO_9_ FC1_I2S_DATA)

–

GPIO[8]

FC1_SPI_MISO

SJ11 Pin 1-2 selection

· Arduino header J1 pin 13 (GPIO_8_ FC1_I2S_WS)
· Arduino header J1 pin 4 (GPIO_8_ UART_TXD_ARD_D1)

–

GPIO[7]

FC1_SPI_SCK

SJ9 Pin 1-2 selection (default · Arduino header J1 pin 9 (GPIO_7_

setting)

FC1_I2S_SCK)

–

GND

–

+3.3V_BRD

–

GPIO[16]

FC2_I2C_SDA_ARD

–

· Pmod connector J7 pin 8 (GPIO_16_ FC2_I2C_SDA_PMOD)
· mikroBUS header J5 pin 6 (GPIO_16_ FC2_I2C_SDA_ME)
· I2C sensor device (GPIO_16_FC2_I2 C_SDA_TEMPSNS)
· MCU-Link USB-to-I2C bridge (GPIO_ 16_FC2_I2C_SDA_MLINK)

–

GPIO[17]

FC2_I2C_SCL_ARD

–

· Pmod connector J7 pin 6 (GPIO_17_ FC2_I2C_SCL_PMOD)
· mikroBUS header J5 pin 5 (GPIO_17_ FC2_I2C_SCL_ME)
· I2C sensor device (GPIO_17_FC2_I2 C_SCL_TEMPSNS)
· MCU-Link USB-to-I2C bridge (GPIO_ 17_FC2_I2C_SCL_MLINK)

Table 16.Arduino compatible header J3 pinout

Device pin / Function / Signal name

number GPIO

–

Jumper setting
–

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Table 16.Arduino compatible header J3 pinout…continued

Device pin / Function / Signal name

number GPIO

Jumper setting

–

+3.3V_BRD

–

PDn

–

+3.3V_BRD

–

SYS_5V

–

GND

–

GND

–

ARD_VIN_5-9V

–

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Potential conflict
–

Table 17.Arduino compatible header J4 pinout

Device pin /

number GPIO

Function / Signal name

–

GPIO[42]

ARD_A0

–

GPIO[43]

ARD_A1

GPIO[52]

PDM_DATA23

GPIO[45]

ARD_A2

GPIO[53]

PDM_CLK01

–

GPIO[51]

PDM_DATA01

–

Jumper setting

Potential conflict

SJ23 Pin 1-2 selection (default setting) –

Arduino J2 pin 4 (GPIO_52_ARD_ D9) –

2.8 mikroBUS headers

Table 18 and Table 19 describe the pinout of the mikroBUS headers (J6 and J5).

Table 18.J6 header pinout

Net name GPIO

number

GPIO[61]

RST

GPIO[19]

GPIO[10]

Function / Signal name Jumper setting

ADC1_ME_AN

–

ME_RST

–

FC1_SPI_SSELN1

–

Potential conflict
–

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Table 18.J6 header pinout…continued

Net name GPIO

number

Function / Signal name

SCK

GPIO[7]

FC1_SPI_SCK

MISO

GPIO[8]

FC1_SPI_MISO

Jumper setting
SJ9 Pin 1-2 selection (default setting) SJ11 Pin 1-2 selection

MOSI

GPIO[9]

FC1_SPI_MOSI

SJ14 Pin1-2 selection

VDD_TGT +3.3V_BRD 3.3 V power line

–

GND

Ground

–

Potential conflict
Arduino connector (J1) pin 9 (GPIO_ 7_FC1_I2S_SCK)
· Arduino connector (J1) pin 13 (GPIO_8_FC1_I2S_WS)
· Arduino connector (J1) pin 4 (FC1_ UART_TXD_ARD_D1)
· Arduino connector (J1) pin 15 (GPIO_9_FC1_I2S_DATA)
· Arduino connector (J1) pin 2 (FC1_ UART_RXD_ARD_D1)
–
–

Table 19.J5 header pinout

Net name

number

GPIO

PWM

GPIO[1]

INT

GPIO[54]

GPIO[2]

GPIO[3]

SCL

GPIO[17]

Function / Signal name Jumper setting

ME_PWM ME_INT FC0_UART_RXD_ME

SJ4 Pin1-2 selection SJ6 Pin1-2 selection

FC0_UART_TXD_ME

SJ8 Pin1-2 selection

FC2_I2C_SCL_ME

–

SDA

GPIO[16] FC2_I2C_SDA_ME

–

Potential conflict
RGB LED (GPIO_1_LED_RED)
–
Arduino connector J1 pin 5 (GPIO_2_ FC0_I2S_DATA)
Arduino connector J1 pin 3 (GPIO_3_ FC0_I2S_WS)
· Arduino connector (J2) pin 20 (GPIO_17_FC2_I2C_SCL_ARD)
· Pmod connector J7 pin 6 (GPIO_ 17_FC2_I2C_SCL_PMOD)
· I2C sensor device (GPIO_17_FC2_ I2C_SCL_TEMPSNS)
· MCU-Link USB-to-I2C bridge (GPIO_17_FC2_I2C_SCL_MLINK)
· Arduino connector (J2) pin 18 (GPIO_16_FC2_I2C_SDA_ARD)
· Pmod connector J7 pin 8 (GPIO_ 16_FC2_I2C_SDA_PMOD)
· I2C sensor device (GPIO_16_FC2_ I2C_SDA_TEMPSNS)
MCU-Link USB-to-I2C bridge (GPIO_ 16_FC2_I2C_SDA_MLINK)

2.9 Pmod header

The FRDM-RW612 board supports a Pmod header J7 (Sullins PPPC062LJBN-RC) for connecting peripheral modules. Table 20 describes the pinout of the Pmod header.

Table 20.Pmod header pinout

Pin number GPIO

Function name / Signal name

GPIO[49]

LCD_SPI_SS

GPIO[18]

ARD_D4_PMOD_INT

Resistor setting –

Potential conflict –

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Table 20.Pmod header pinout…continued

Pin number GPIO

Function name / Signal name

GPIO[46]

LCD_SPI_SDIO

GPIO[44]

LCD_SPI_RESETn

GPIO[47]

LCD_SPI_DC

GPIO[17]

FC2_I2C_SCL_PMOD

Resistor setting –

GPIO[48]

LCD_SPI_SCK

–

GPIO[16]

FC2_I2C_SDA_PMOD

–

GND

–

GND

–

+3.3V_BRD

–

+3.3V_BRD

–

Potential conflict
–
–
–
· Arduino connector (J2) pin 20 (GPIO_17_FC2_I2C_SCL_ARD)
· mikroBUS header J5 pin 5 (GPIO_ 17_FC2_I2C_SCL_ME)
· I2C sensor device (GPIO_17_FC2_ I2C_SCL_TEMPSNS)
· MCU-Link USB-to-I2C bridge (GPIO_17_FC2_I2C_SCL_MLINK)
–
· Arduino connector (J2) pin 18 (GPIO_16_FC2_I2C_SDA_ARD)
· mikroBUS header J5 pin 6 (GPIO_ 16_FC2_I2C_SDA_ME)
· I2C sensor device (GPIO_16_FC2_ I2C_SDA_TEMPSNS)
· MCU-Link USB-to-I2C bridge (GPIO_16_FC2_I2C_SDA_MLINK)
–
–
–
–

2.10 RF front-end interface
The RW612 MCU includes a full-featured 1×1 dual-band (2.4 GHz / 5 GHz) 20 MHz Wi-Fi 6 (802.11ax) and Bluetooth LE 5.4/802.15.4 subsystem.
By default, the FRDM-RW612 is designed as a single antenna configuration. On the FRDM-RW612 board, the RF signals from the target MCU connect either to a PCB antenna (ANT1) or to an antenna connected to the U.FL connector (J11). The default configuration is to use PCB Antenna. The RF front-end control signals RF_CNTL_[0:3] from the target MCU are used for the RF front-end SPDT switch controls.
Figure 14 shows the FRDM-RW612 RF front-end design.

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SOC_RF5G_TR

L4 1.6 nH +/-0.1
L0201

C51 0.3 pF RF C0201

C52 0.3 pF RF C0201

Pi-filter components must be placed close to one another and
share the same ground

SOC_RF2G_TR

C69 10 pF RF
C0201

C67 NL C0201

C70 NL C0201

Pi-filter components must be placed close to one another and
share the same ground

SOC_BLE_15.4_TR

L7 3.3 nH +/-0.1
L0201

C85 1.6 pF RF C0201

C86 1.6 pF RF C0201

Pi-filter components must be placed close to one another and
share the same ground

C74

10 pF

C0201

OUTPUT1 1

6 VCTL1

GND 2 EPAD 5 INPUT

OUTPUT2 3

4 VCTL2

C87 10 pF C0201

7 SKY13323-378LF

RF_CNTL_2

+3.3 V_BRD

SJ25

VDD_RFSW

DP1
H-B 4 GND 5
L-B 6

C129 100 pF C0201
3 GND 2 COM 1 GND

U16
VVD 6 RFC 5
VC 4

1 RF1 2 GND 3 RF2

C75 100 pF C0201

RF_CNTL_0

DPX165850DT-8085D3 RF_CNTL_3

C130 100 pF C0201

RTC7608U

C65 10 pF C0201

State

RFC to RF1

0 RFC to RF2 (default)

C88 100 pF C0201

RF_CNTL_1

Wi-Fi 2G-Bluetooth LE/802.15.4 TDM switch

VCTL1 VCTL2

State

Input to Out1

Input to Out2

C56 5.6 pF RF
C0201

C134 NL C0201

C135 NL C0201

J11 U.FL-R_SMT-1
L5 NL L0201

C131 5.6 pF RF
C0201

C132 NL C0201

C133 NL C0201

ANT1 1 PCB

Figure 14.RF front-end interface

Table 21 describes the devices and connectors used for the RF interface on the board.

Table 21.RF interface device configuration
Part identifier Manufacturer name Description and part name

Configuration

RF signals and control signals

SKYWORKS

Wi-Fi 2G – Bluetooth · VCTL1: 1, VCTL2: 0

· RF signals:

SKY13323-378LF

LE / 802.15.4 TDM SPDT switch is used to transmit/receive by connecting the RF common port (INPUT, pin 5) to either the

Transmit and receive is for Wi- SOC_RF2G_TR

Fi 2G signals

SOC_BLE_15.4_TR

· VCTL1: 0, VCTL2: 1

· Control signals:

Transmit and receive is for Bluetooth LE / 802.15.4 signals

RF_CNTL_0 RF_CNTL_1

OUTPUT1 or OUTPUT2

port

DP1

TDK Corporation

Diplexer to allow both

DPX165850DT-8085 Wi-Fi 5G and either of

Wi-Fi 2G or Bluetooth

LE/802.15.4 signals to

transmit and receive

simultaneously

· RF signals: SOC_RF5G_TR SOC_RF2G_TR SOC_BLE_15.4_TR

U16

RichWave

RF SPDT switch for

· VC: 1 RFC to RF1

· RF signals:

Technology Corp RTC7608U

switching the RF signal between PCB antenna and u.FL connector

Transmission/Receiver channel is available for U.FL connector
· VC: 0 (Default setting) RFC to RF2 Transmission/ Receiver channel is available

SOC_RF5G_TR SOC_RF2G_TR SOC_BLE_15.4_TR · Control signals: RF_CNTL_3

for PCB antenna

J11

Hirose U.FL-R-SMT- U.FL RF connectors / –

–

Coaxial connectors

ANT1

–

PCB antenna connected –

–

by default

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2.11 SWD header
The FRDM-RW612 board supports the Arm serial wire debug (SWD) and JTAG interface. SWD is the default function for pins GPIO[13] (SWCLK) and GPIO[14] (SWDIO) after a reset. For details, see FRDM-RW612 schematic.

2.12 Board operating conditions
The operating temperature range for the FRDM-RW612 board is -40 °C to +85 °C. For further details on device operating conditions, see RW612 Data Sheet.

3 MCU-Link OB debug probe

This section describes the MCU-Link onboard (OB) debug probe, its features, how to install software and how to update its firmware.

3.1 MCU-Link overview
MCU-Link is a debug probe architecture jointly developed by NXP and Embedded Artists. The MCU-Link architecture is based on the LPC55S69 MCU, which is based on the Arm Cortex-M33 core.
The MCU-Link architecture is configurable to support different debug feature options, and to support both standalone probes (such as MCU-Link Pro) and for use on-board evaluation boards such as FRDM-RW612. These on-board implementations are referred to as MCU-Link OB.
The FRDM-RW612 board implements a subset of the MCU-Link architecture features, as described in Section 3.2. For more information on MCU-Link visit MCU-Link Debug Probe Architecture.
The MCU-Link OB on the FRDM-RW612 board is factory programmed with the J-Link firmware. NXP CMSISDAP is also available to add extra debug features. For information on how to update the MCU-Link firmware, see Section 3.5.

3.2 Supported MCU-Link features

MCU-Link includes several mandatory and optional features. Table 22 summarizes the MCU-Link features supported on the FRDM-RW612 board.

Table 22.Supported MCU-Link features Feature Serial wire debug (SWD) / serial wire debug trace output (SWO) Virtual communication (VCOM) serial port
USB serial input/output (USBSIO)[1] External debug probe support

Description
Allows SWD-based debugging with SWO for profiling and/or low overhead debug standard I/O communication
Adds a serial COM port on the host computer, and connects it to the target MCU by using MCU-Link as a USB-to-UART bridge
Adds a USB serial I/O port on the host computer, and connects it to the target MCU by using MCU-Link as a USB-to-SPI bridge or USB-to-I2C bridge
Allows debugging the target MCU (RW612) using an external debug probe, instead of MCU-Link. Support for an external debug probe is enabled by disabling the SWD feature. While using an external debug probe, the VCOM and USBSIO features can be used.

[1] J-Link firmware does not support this feature.

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3.3 Supported debug scenarios

In the FRDM-RW612 board, the MCU-Link debug probe target is RW612 MCU. The board also allows the external debugger to debug the RW612 MCU in place of the MCU-Link debug probe.
Table 23 describes the debug scenarios supported on the FRDM-RW612 board.

Table 23.Supported debug scenarios

Debug scenario

Feature support

Use MCU-Link as a debugger for · SWD is enabled

the target MCU (RW612)

· VCOM is enabled

· USBSIO is enabled

Use an external debugger to debug the target MCU (RW612)

· SWD is disabled · VCOM is enabled · USBSIO is enabled

Jumper / Resistor settings
· JP3 must be open · JP1 must be open · R78 must be unpopulated
· JP1 must be shorted · JP3 must be open · R78 must be unpopulated · Connect an external debugger
to the target MCU SWD connector P1

3.4 MCU-Link host driver and utility installation

The MCU debug probe is supported on Windows 10/11, MacOS X, and Ubuntu Linux platforms. The probe uses standard OS drivers. For Windows, the installation program also includes information files to provide userfriendly device names.
MCU-Link is supported by the LinkServer utility. Running the LinkServer installer also installs all the drivers and a firmware update utility required for MCU-Link. The LinkServer utility is a GDB server and flash utility from NXP with support for many NXP debug probes. You are recommended to use the LinkServer installer unless you are using MCUXpresso IDE version 11.6.1 or earlier. For details on this utility, refer https://nxp.com/linkserver.
Note: If the firmware version of the onboard MCU-Link probe is 3.122 or later, LinkServer version 1.4.85 or later provides the support of automatic firmware update. For further details on automatic firmware update, refer to the readme markdown file in the LinkServer package. However, If the current firmware version is earlier than 3.122, you can update the firmware (see Section 3.5 ) for the MCU-Link probe using the MCU-Link firmware update utility, which is included in the LinkServer installation package.
Note: In case you are using MCUXpresso IDE version 11.6.1 or earlier, you must install the firmware update utility version 2.263, which is not included in the LinkServer installation.
You are recommended to update the MCU-Link firmware on the board to the latest firmware version to get the latest functionality. However, before updating the firmware, check compatibility with the MCUXpresso IDE and LIBUSBIO versions in Table 24 (if you are using these tools). If you are using the MCUXpresso for Visual Studio Code extension or third-party IDEs from IAR or Keil, the latest firmware version is recommended.

Table 24.Compatibility between MCU-Link firmware and MCUXpresso IDE

MCU-Link firmware version

USB driver type

CMSIS-SWO support

FreeMASTER support via SWD / JTAG USB bridge

V1.xxx and

HID

V2.xxx

Yes

V3.xxx (up to

WinUSB

and including

V3.108)

Yes

FreeMASTER V3.2.2

or later

Supported MCUXpresso IDE versions
MCUXpresso 11.3 or later
MCUXpresso 11.7.0 or later

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Table 24.Compatibility between MCU-Link firmware and MCUXpresso IDE…continued

MCU-Link firmware version

USB driver type

CMSIS-SWO support

FreeMASTER support via SWD / JTAG USB bridge

V3.117 and later WinUSB

Yes

FreeMASTER V3.2.2

or later

Supported MCUXpresso IDE versions
MCUXpresso 11.7.1 or later

3.5 Updating MCU-Link firmware using firmware update utility
To update the MCU-Link firmware using the firmware update utility included in the LinkServer installation package, the MCU-Link must be powered up in ISP mode. Follow these steps to configure MCU-Link in ISP mode and update MCU-Link firmware:
1. Disconnect the board from the host computer, short jumper JP2, and reconnect the board. The red MCULink status D6 LED lights up and stays on. For more details on MCU-Link LEDs, see Section 3.10.
2. Download the LinkServer installation package from https://nxp.com/linkserver and install the LinkServer utility. For example, download and install “Linkserver 1.4.85 installer for Windows”.
3. Navigate to the MCU-LINK_installer_Vx_xxx directory, where Vx_xxx indicates the version number. For example, MCU-LINK_installer_3.119.
4. Follow the instructions in the readme.txt to find and run the firmware update utilities for CMSIS-DAP or JLink versions.
5. Disconnect the board from the host computer, open jumper JP2, and reconnect the board. The board enumerates on the host computer as a WinUSB or HID device (depending on the firmware version).
Note:
· Starting version V3.xxx, the MCU-Link firmware uses WinUSB instead of HID for higher performance; however, it is not compatible with MCUXpresso IDE versions earlier than 11.7.0.
· To enable SWO-related features in non-NXP IDEs, CMSIS-SWO support was introduced in firmware version V3.117.

3.6 Using MCU-Link with development tools
The MCU-Link debug probe can be used with IDEs supported within the MCUXpresso ecosystem, such as MCUXpresso IDE, MCUXpresso for Visual Studio Code, IAR Embedded Workbench, and Arm Keil MDK.
3.6.1 Using MCU-Link with MCUXpresso IDE
The MCUXpresso IDE recognizes any type of MCU-Link probe that uses either CMSIS-DAP or J-Link firmware. When you start a new debug session, the IDE checks for all the available debug probes. For all the probes it finds, the IDE displays the probe types and unique identifiers in the Probes discovered dialog box.
If a debug probe requires a firmware update, the probe is displayed with a warning in the Probes discovered dialog box. For each such probe, the latest firmware version is indicated and a link to download the latest firmware package is provided. To update the firmware for the MCU-Link debug probe, see the instructions provided in Section 3.5.
You are advised to use the latest MCU-Link firmware to take the benefit of the latest functionality. However, the MCU-Link firmware version you can use depends on the MCUXpresso IDE version you are using. Table 24 shows the compatibility between the MCU-Link firmware and the MCUXpresso IDE.

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3.6.2 Using MCU-Link with MCUXpresso for Visual Studio Code
The MCU-Link debug probe can be used with the MCUXpresso for Visual Studio Code extension from NXP. This extension uses the Linkserver debug server. To work with MCUXpresso for Visual Studio Code, install the Linkserver utility using the MCUXpresso Installer tool or as described in Section 3.4. For more details on MCUXpresso for Visual Studio Code, visit the MCUXpresso for Visual Studio Code page.
3.6.3 Using MCU-Link with third-party IDEs
The MCU-Link debug probe can be used with IAR Embedded Workbench and Arm Keil MDK, and may also work with other third-party tools. Refer to the documentation for these products, covering the use of generic CMSIS-DAP probes or J-Link probes (depending on the firmware image you are using.)
3.7 MCU-Link USB connector
The FRDM-RW612 board has a universal serial bus (USB) 2.0 Type-C connector (J10). This USB connector is used to create an MCU-Link high-speed USB connection with the host computer. The MCU-Link receives power when the USB connector (J10) is plugged into a USB host.
3.8 Connecting to a target through a USB-to-UART bridge
The MCU-Link supports the VCOM serial port feature, which adds a serial COM port on the host computer, and connects it to the target MCU using MCU-Link as a USB-to-UART bridge.
On the FRDM-RW612 board, the MCU-Link LPC55S69 is connected to the GPIO[26] and GPIO[24] pins of the target MCU through the R77 and R69 resistors, respectively. Note: The GPIO[26] and GPIO[24] pins are also the UART ISP pins to allow for ISP connection through the MCU-Link VCOM.
To use MCU-Link as a USB-to-UART bridge, ensure that the JP3 jumper is open and connect the J10 connector on the board to the USB port of the host computer.
When you boot the FRDM-RW612 board, a VCOM port with the name MCU-Link Vcom Port (COMxx) is enumerated on the host computer, where “xx” may vary from one computer to another. Each MCU-Link based board has a unique VCOM number associated with it.
3.9 Connecting to a target through a USB-to-SPI or USB-to-I2C bridge
MCU-Link supports the USB serial input/output (USBSIO) port feature, which adds a USB serial I/O port on the host computer, and connects it to the target MCU by using MCU-Link as a USB-to-SPI bridge or USB-to-I2C bridge. Support for the USBSIO feature can be enabled on the host computer using the libusbsio library, which is a free host library from NXP for Windows/Linux/MacOS systems. For more details on the libusbsio library, see https://www.nxp.com/libusbsio.
In the FRDM-RW612 board, the MCU-Link connects to the GPIO[6:9] pins of the target MCU using the FC1 SPI interface connection, through zero-ohm resistors (DNP by default). Populating these resistors enables the communication between MCU-Link and the target MCU through the USB-to-SPI bridge.
The SPI interface connections for this functionality are shared with the SPI connections on the Arduino compatible connectors and Mikroe connector connections. To prevent contention with these connectors, zeroohm resistors are used to isolate the connections from the MCU-Link circuit by default.
A USB-to-SPI bridge can be used to emulate the host system. To use MCU-Link as a USB-to-SPI bridge, the board must be connected to the host computer through a USB cable from its J10 connector. Also, ensure the following resistor configuration on the board to enable the USBSIO bridge feature for SPI:

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· Resistors R40, R76, R80, and R18 are populated · Resistor R78 is DNP (default setting)
On the FRDM-RW612 board, the MCU-Link is also connected to the GPIO[17:16] pins of the target MCU using the FC2 I2C interface connection through zero-ohm resistors (DNP by default). Populating these resistors enables the communication between MCU-Link and the target MCU through the USB-to-I2C bridge.
A USB-to-I2C bridge can be used to emulate the host system/board peripherals. To use MCU-Link as a USBto-I2C bridge, the board must be connected to the host computer through a USB cable from its J10 connector. Also, ensure the following resistor configuration on the board to enable the USBSIO bridge feature for I2C:
· Zero-ohm resistors R65 and R47 are populated · Resistor R78 is DNP (default setting) · 2.2 k resistors R48 and R67 should be populated

3.10 MCU-Link status LEDs

The FRDM-RW612 board has three status indicator LEDs for MCU-Link. Table 25 lists these LEDs and describes how each LED behaves in different MCU-Link modes. These LEDs are shown in Figure 3.

Table 25.MCU-Link LEDs

Part identifier

LED name / color

USB COMM /

green

Status / red

VCOM ACT /

green

MCU-Link mode

Normal mode (with CMSIS-DAP Normal mode (with J-

firmware)

Link firmware)

Firmware update (ISP) mode

Lights up after successful USB Remains OFF enumeration at startup. Afterward, the LED stays ON.

Remains OFF

Indicates heartbeat (fades in/out repeatedly), with SWD activity overlaid.
The LED blinks rapidly at startup, if an error occurs.

Remains OFF

Lights up when MCU-Link target (LPC55S69) boots in ISP mode

Indicates if the VCOM port is transmitting/receiving data

Lights up when MCU-Link Remains OFF boots, and blinks when debug activity happens

4 European declaration of conformity

The following information is provided per Article 10.8 of the Radio Equipment Directive 2014/53/EU:
· Frequency band in which the equipment operates · The maximum RF power transmitted

Table 26.FRDM-RW612 RF certificated Part number RF technology FRDM-RW612 Bluetooth LE
802.15.4 Wi-Fi (IEEE 802.11)

Frequency band (EU) 2400 MHz – 2483.5 MHz 2400 MHz – 2483.5 MHz 2400 MHz – 2483.5 MHz 5150 MHz – 5350 MHz 5470 MHz – 5725 MHz

Max RF transmitted power 2 dBm 6 dBm 16 dBm 16 dBm 15 dBm

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Table 26.FRDM-RW612 RF certificated…continued

Part number RF technology

Frequency band (EU)

5725 MHz – 5850 MHz

5850 MHz – 5850 MHz

Max RF transmitted power 12 dBm 9 dBm

EUROPEAN DECLARATION OF CONFORMITY (Simplified DoC per Article 10.9 of the Radio Equipment Directive 2014/53/EU)
This apparatus, namely FRDM-RW612 conforms to the Radio Equipment Directive 2014/53/EU. The full EU Declaration of Conformity for this apparatus is available at European Union Declaration of Conformity for FRDM-RW612 board Kit.

5 Related documentation

Table 27 lists and explains the additional documents and resources that you can refer to for more information on the FRDM-RW612 board. Some of the documents listed below may be available only under a non-disclosure agreement (NDA). To request access to these documents, contact your local field applications engineer (FAE) or sales representative.

Table 27.Related documentation Document RW612 Data Sheet – RW612-Wireless MCU with Integrated Tri-radio Wi-Fi 6 + Bluetooth Low Energy 5.4 / 802.15.4
RW61X User Manual
FRDM-RW612 design files
LPC55S6x/LPC55S2x/LPC552x User manual (UM11126)

Description

Link / how to access

It provides information about electrical characteristics, hardware design considerations, and ordering information

RW612

It is intended for the board-level

UM11865

product designers and product software

developers who want to develop

products with RW61X MCU

A zip file including *.DSN, ASY, Layout, FRDM-RW612 design files schematic files, and so on

Intended for system software and hardware developers and application programmers who want to develop products with LPC55S6x/ LPC55S2x/ LPC552x MCU

UM11126.pdf

6 Acronyms

Table 28 lists and defines the acronyms used in this document.

Table 28.Acronyms Term ADC DNP ESR GPIO I2C

Description Analog-to-digital converter Do not populate Equivalent series resistor General-purpose input/output Inter-integrated circuit

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UM12160
FRDM-RW612 Board User Manual

Table 28.Acronyms…continued Term I3C ISP PCB PHY PMIC POR PSRAM PWM QSPI RGMII RTC SDHC SPI SWD SWO UART USB USBSIO VCOM WUU

Description Improved inter-integrated circuit In-system programming Printed-circuit board Physical interface of the OSI model Power management integrated circuit Power-on reset Pseudo-Static Random Access Memory Pulse width modulation Quadruple serial peripheral interface Reduced gigabit media independent interface Real-time clock Secured digital host controller Serial peripheral interface Serial wire debug Serial wire debug trace output Universal asynchronous receiver/transmitter Universal serial bus USB serial input/output Virtual communication Wake-up unit

7 Revision history

Table 29 summarizes the revisions to this document.

Table 29.Revision history

Document ID

Release date

UM12160 v.1.0

20 September 2024

Description Initial public release

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Legal information
Definitions
Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information.
Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including – without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.
Suitability for use in non-automotive qualified products — Unless this document expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
HTML publications — An HTML version, if available, of this document is provided as a courtesy. Definitive information is contained in the applicable document in PDF format. If there is a discrepancy between the HTML document and the PDF document, the PDF document has priority.
Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products.
NXP B.V. — NXP B.V. is not an operating company and it does not distribute or sell products.
Trademarks
Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners.
NXP — wordmark and logo are trademarks of NXP B.V.

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UM12160
FRDM-RW612 Board User Manual

AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle, Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore, Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINKPLUS, ULINKpro, Vision, Versatile — are trademarks and/or registered trademarks of Arm Limited (or its subsidiaries or affiliates) in the US and/or
elsewhere. The related technology may be protected by any or all of patents,
copyrights, designs and trade secrets. All rights reserved.

Bluetooth — the Bluetooth wordmark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by NXP Semiconductors is under license.
IAR — is a trademark of IAR Systems AB.
J-Link — is a trademark of SEGGER Microcontroller GmbH.
Matter, Zigbee — are developed by the Connectivity Standards Alliance. The Alliance’s Brands and all goodwill associated therewith, are the exclusive property of the Alliance.

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NXP Semiconductors

Contents

1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 2 2.1 2.1.1 2.1.2 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 3 3.1 3.2 3.3 3.4 3.5
3.6 3.6.1 3.6.2
3.6.3 3.7 3.8
3.9
3.10 4 5 6 7

FRDM-RW612 overview …………………………….. 2 Block diagram …………………………………………….2 Board features …………………………………………… 2 Board kit contents ……………………………………….4 Board pictures …………………………………………… 4 Connectors …………………………………………………6 Jumpers ……………………………………………………. 7 Push buttons ………………………………………………8 LEDs ………………………………………………………… 9 FRDM-RW612 functional description ……….. 10 Power supplies ………………………………………… 10 Power supply configuration ……………………….. 11 RW612 iBuck …………………………………………… 13 Clocks …………………………………………………….. 13 USB interface ………………………………………….. 14 Ethernet interface …………………………………….. 15 I2C sensor interface …………………………………. 15 Flash memory interface …………………………….. 16 Arduino compatible I/O headers …………………. 17 mikroBUS headers …………………………………….21 Pmod header …………………………………………… 22 RF front-end interface ………………………………..23 SWD header ……………………………………………. 25 Board operating conditions ………………………… 25 MCU-Link OB debug probe ………………………25 MCU-Link overview ……………………………………25 Supported MCU-Link features ……………………. 25 Supported debug scenarios ………………………..26 MCU-Link host driver and utility installation ….. 26 Updating MCU-Link firmware using firmware update utility ………………………………..27 Using MCU-Link with development tools ……… 27 Using MCU-Link with MCUXpresso IDE ………. 27 Using MCU-Link with MCUXpresso for Visual Studio Code …………………………………… 28 Using MCU-Link with third-party IDEs …………. 28 MCU-Link USB connector …………………………. 28 Connecting to a target through a USB-toUART bridge ……………………………………………. 28 Connecting to a target through a USB-toSPI or USB-to-I2C bridge ………………………….. 28 MCU-Link status LEDs ……………………………… 29 European declaration of conformity ………… 29 Related documentation …………………………… 30 Acronyms ………………………………………………. 30 Revision history ………………………………………31 Legal information …………………………………….32

UM12160
FRDM-RW612 Board User Manual

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: https://www.nxp.com

Document feedback

Date of release: 20 September 2024 Document identifier: UM12160

Documents / Resources

NXP UM12160 Wi-Fi Development Board [pdf] User Manual
UM12160 Wi-Fi Development Board, UM12160, Wi-Fi Development Board, Development Board, Board

References

User Manual

UM12160 Wi-Fi Development Board

Specifications

Product Information

FRDM-RW612 Overview

Board Features

Product Usage Instructions

1. Getting Started

2. Software Development

3. Hardware Connections

4. Debugging and Testing

FAQ

Q: What is the main feature of the RW612 MCU?

Q: Is the FRDM-RW612 board compatible with Arduino shield
modules?

Documents / Resources

References

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