MOKO MK18 Bluetooth Module Owner’s Manual

MK18 Bluetooth Module Datasheet
MK18 Bluetooth Module
Datasheet
MOKO TECHNOLOGY LTD.
www.mokosmart.com

 MK18 Bluetooth Module

Revision History

Instructions

MK18 is powerful, highly flexible and cost-effective Bluetooth module based on world-leading Nordic® Semiconductor nRF54L10 SoC solution, which integrates an ultra-low power multi-protocol 2.4GHz radio and MCU functionality featuring a 128 MHz Arm® Cortex™-M33 processor, comprehensive peripheral set. It is is the middle memory option in the nRF54L Series, with 1.0 MB NVM and 192 KB RAM. It is the option between the nRF54L05, the most optimized for cost-sensitive applications, and the nRF54L15, which can support more features and wireless protocols.
MK18 is suited to enable a broad range of applications. The multi-protocol 2.4 GHz radio supports the latest Bluetooth® 6.0 features including Bluetooth Channel Sounding, as well as 802.15.4-2020 for standards such as Thread, Matter, and Zigbee, and a proprietary 2.4 GHz mode supporting up to 4 Mbps for higher throughput.
MK18 module brings out all nRF54L10 hardware features and capabilities like RISC-V Coprocessor, high-speed SPI, SPIM, UART, Global RTC, NFC, and up to +7dBm Tx Power and more.
MK18 module follows the size and package of most MOKO Bluetooth modules such as the MK02 (nRF52832 SoC), MK07 (nRF52833 SoC), MK08 (nRF52840 SoC) and MK13 (nRF5340 SoC), allowing you to easily and quickly upgrade your hardware to the latest and powerful nRF54L10 Bluetooth solution without re-designing hardware.
MK18 module will be programmed using the default MOKO MKBN series firmware and client’s own firmware can be programmed for mass production. After you choose MK18 series module, MOKO Smart will provide technical support for your development. We can power demanding applications, while simplifying designs and reducing BOM costs.

1.1 Features and Benefits
Multi-protocol radio supporting

• Bluetooth 6.0-2 Mbps, 1 Mbps, 500 kbps, and 125 kbps
• IEEE 802.15.4-2020 (Thread, Matter, Zigbee)
• Proprietary 2.4 GHz (up to 4 Mbps data rates)

MCU

• Arm® Cortex™-M33, 128 MHz
• 1022 KB non-volatile memory (RRAM) and 192 KB RAM
• 505 EEMBC CoreMark® score running from non-volatile memory, 3.95 CoreMark per MHz
• Single-precision floating-point unit (FPU)Memory protection unit (MPU)
• Digital signal processing (DSP) instructions

Peripherals

• 128 Mhz RISC-V Coprocessor
• Two realtime counters (RTC), and one global RTC (GRTC) that can run in System OFF mode and implement a shared system timer.
• Five fully featured serial interfaces with EasyDMA, supporting I2C, SPI | controller/peripheral, and UART
• 14-bit ADC
• Three pulse width modulator (PWM) units with EasyDMA
• I2S two channel Inter-IC sound interface 0
• Pulse density modulation (PDM) interface 0
• Near field communication (NFC)
• Two quadrature decoders (QDEC)
• Embedded inductors for DC/DC converter
• 32.768 kHz crystal oscillator
• 34 half-hole pins and 4 debug pads
• 28 GPIOS
• 1.7V to 3.6V supply voltage

1.2 Applications
Internet of things (IOT)

• Smart home sensors and controllers
• Industrial IoT sensors and controllers

Advanced wearables

• Health/fitness sensor and monitor devices
• Wireless payment enabled devices

Advanced computer peripherals and I/O devices

• Mouse
• Keyboard
• Multi-touch trackpad

Interactive entertainment devices

• Remote controls
• Gaming controllers

1.3 Product Options
1.3.1 Hardware Options
There are two different models (MK18A and MK18B) of MK18 series Bluetooth modules. Both models have same dimensions and pin assignments. The difference is in the antenna design.
MK18A embeds a high-performance PCB antenna.
MK18B uses a u.FL connector (receptacle) and requires an external 2.4Ghz antenna.
MOKO smart development team can assist you in selecting high-performance antennas that suit your needs.

	MK18A PCB antenna is used. No need to design another antenna. u.FL connector will not be mounted on the PCB.
	MK18B The PCB antenna is disabled. You need to select an external 2.4Ghz antenna to connect to the u.FL connector.

Figure 1: MK18A and MK18B
1.3.2 Firmware Options
For customers to use, MK18 series modules will be programmed default MOKO MKBN-L01 series firmware, which has the functions of UART Wireless Transparent Transmission.
MOKO Smart can help you develop the firmware and can also program your own firmware to modules when manufacture.

Note: This document is a Hardware Datasheet only it does not cover the software aspects of the MK18 If you want to get more information about firmware or SDKs of MK18, please contact sales of MOKO Smart.
1.3.3 Ordering Information

MOKO Smart can provide the default model modules as samples to you to test or develop without MOQ. But if you want the custom models, there will be a MOQ requirement. Please contact sales team of MOKO Smart to get more ordering information.

Specifications

Hardware Design

3.1 Block Diagram3.2 Pin-out and Pin Assignments

Note:

1. Please refer to Nordic nRF54L10 / nRF54L10 / nRF54L10 Datasheet for detailed descriptions and features supported about the SoC pin assignments.
2. Package of nRF54L10 SoC embedded on MK18 Bluetooth module is QFN48 0x6.0 mm.

Mechanical Details

4.1 PCBA Mechanical Dimensions
MK18A and MK18B Bluetooth modules have the same dimensions.

4.2 PCB Land Pads Dimensions

4.3 u.FL Connector Dimensions
MK18B has mounted a micro SMT u.FL series connector (receptacle), which needs an external 2.4Ghz antenna to connect. The model of the connector is u.FL-R-SMT-1(80).
According to the dimensions of the connector to choose an antenna with a right plug which can connect to the receptacle appropriately.

Mounting Design Suggestions

5.1 Recommended Mounting and PCB Layout
You can refer to the following references for the mounting design and PCB layout of the MK18 module, especially for the MK18A model which has PCB on-board antenna.
For external antenna modules (MK18B needs to connect an external antenna to the u.FL connector), you also need to refer to the external antenna design requirements.
The recommended mounting and PCB layout suggestion:

• Locate MK18 series module close to the edge of the host PCB (mandatory for MK18A for on-board PCB trace antenna to radiate properly).
• Ensure there is no copper in the antenna keep-out area on any layers of the host Keep all mounting hardware and metal clear of the area to allow proper antenna radiation.
• Keep the antenna area as far away as possible from the power supply and metal components.
• Ensure no exposed copper is on the underside of the module.
• A different host PCB thickness dielectric will have small effect on antenna.
• Use solid GND plane on inner layer (for best EMC and RF performance).
• All module GND pins must be connected to the host PCB GND.
• Place GND vias close to module GND pads as possible.
• Unused PCB area on surface layer can flooded with copper but place GND vias regularly to connect the copper flood to the inner GND If GND flood copper is on the bottom of the module, then connect it with GND vias to the inner GND plane.
• Use a good layout method to avoid excessive noise coupling with signal lines or supply voltage lines.

5.2 Mechanical Enclosure
Care should be taken when designing and placing the MK18 series module into an enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the module can negatively impact RF performance.
The module is designed and tuned for the antenna and RF components to be in free air. Any potting, epoxy fill, plastic over-molding, or conformal coating can negatively impact RF performance and must be evaluated by the customer.
Placement of metal/plastic enclosure:

• Minimum safe distance for metal parts without seriously compromising the antenna (tuning) is 40 mm top/bottom and 30 mm left or right.
• Metal close to the series module antenna (bottom, top, left, right, any direction) will have degradation on the antenna The amount of that degradation is entirely system dependent, meaning you will need to perform some testing with your host application.
• Any metal closer than 20 mm will begin to significantly degrade performance (S11, gain, radiation efficiency).
• It is best that you test the range with a mock-up (or actual prototype) of the product to assess effects of enclosure height (and materials, whether metal or plastic).

Cautions

6 .1 Reflow Soldering

Reflow soldering is a vitally important step in the SMT process. The temperature curve associated with the reflow is an essential parameter to control to ensure the correct connection of parts. The parameters of certain components will also directly impact the temperature curve selected for this step in the process.

• The standard reflow profile has four zones: ①preheat, ②soak, ③reflow, ④cooling. The profile describes the ideal temperature curve of the top layer of the PCB.
• During reflow, modules should not be above 260°C and not for more than 30 seconds.

6.2 Usage Condition Notes

• Follow the conditions written in this specification, especially the recommended condition ratings about the power supply applied to this product.
• The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least
• 47Uf directly at the module).
• Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation before assembly on the final products.
• The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes.
• This product away from other high frequency circuits.
• Keep this product away from heat. Heat is the major cause of decreasing the life of these products.
• Avoid assembly and use of the target equipment in conditions where the products’ temperature may exceed the maximum tolerance.
• This product should not be mechanically stressed when installed.
• Do not use dropped products.
• Do not touch, damage or soil the pins.
• Pressing on parts of the metal shield or fastening objects to the metal shield will cause damage.

6.3 Storage Notes

• The module should not be stressed mechanically during storage.
• Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected:
• Storage in salty air or in an environment with a high concentration of corrosive gas.
• Storage in direct sunlight
• Storage in an environment where the temperature may be outside the range specified.
• Storage of the products for more than one year after the date of delivery storage period.
• Keep this product away from water, poisonous gas and corrosive gas.
• This product should not be stressed or shocked when transported.

MK18 Bluetooth Module Datasheet
Copyright 2025 MOKO TECHNOLOGY. All Rights Reserved. Any information furnished by MOKO TECHNOLOGY LTD. is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of MOKO TECHNOLOGY LTD. materials or products rests with the end user since MOKO TECHNOLOGY LTD. cannot be aware of all potential uses. MOKO TECHNOLOGY LTD. makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any MOKO TECHNOLOGY LTD. materials or products for any specific or general uses. MOKO TECHNOLOGY LTD. or any of its affiliates shall not be liable for incidental or consequential damages of any kind. All MOKO TECHNOLOGY LTD. products are sold pursuant to the MOKO TECHNOLOGY LTD. Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. Other marks may be the property of third parties. Nothing herein provides a license under any MOKO TECHNOLOGY LTD. or any third-party intellectual property right.
FCC Statements
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and
2. this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
The device has been evaluated to meet general RF exposure requirement. The device can be used
in portable exposure condition without restriction.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
“Contains Transmitter Module FCC ID: 2A094-MK17Or Contains

1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
   1. This device may not cause harmful interference, and
   2. This device must accept any interference received, including interference that may cause undesired operation.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user documentation that comes with the product.
The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

Contact
MOKO TECHNOLOGY LTD.
An original manufacturer for loT smart devices
Address: 4F, Building 2, Guanghui Technology
Park, MinQing Rd, Longhua, Shenzhen, Guangdong, China
E-mail: Support_BLE@mokotechnology.com
Website: www.mokosmart.com