MINEWSEMI MS21SF1 LoRa Module Owner's Manual

Owner's Manual for MINEWSEMI models including: MS21SF1-LLCC68, MS21SF1-SX1262, MS21SF1 LoRa Module, MS21SF1, LoRa Module, Module

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Users Manual

SHENZHEN MINEWSEMI CO., LTD MS21SF1 2BDJ6-MS21SF1 2BDJ6MS21SF1 ms21sf1

File Info : application/pdf, 21 Pages, 1.96MB

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LoRa Module
MS21SF1 DateSheet
V 1.1.0
Applicable Product Model MS21SF1-LLCC68 MS21SF1-SX1262
Copyright© Shenzhen Minewsemi Co., Ltd.

MS21SF1 Datesheet

Version Note

Version
1.0.0 1.1.0

Details

Contributor(s)

Date

First edit
Addition of modules TX, RX mode control

Vincle Vincle

2023.08.29 2023.09.29

Notes

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MS21SF1 Datesheet

MS21SF1-LLCC68/SX1262
Low-power,ultra-long-range,Small and easy to operate,high-sensitivity
MS21SF1 module is based on Semtech's LoRa wireless half-duplex transceiver chip, LLCC68/SX1262, and supports global ISM frequencies. It is a low-power, ultra-long-range, small and easy-to-use SPI-interfaced LoRa® transceiver module, with a current of only 4.7mA in receive mode, and achieves a high transmission power through the internal integrated high-efficiency power amplifier. Higher reception sensitivity down to -146dBm, compliance with the physical layer requirements of the LoRaWAN® standard specification, and support for LoRa® P2P (points-to-point ).Supporting customers in the rapid set-up of their private, long-range LoRa® networks.

Features

Application

Non-MCU Control, external MCU is required to

Security and early

connect and control through SPI interface

warning equipment

Programmable bit rates, with bit rates reaching

Instrumentation

up to 62.5 kbps for both LoRa and FSK

smart metering

modulation

Agricultural sensors

Transmission Range up to 5KM

Retail Store Sensor

Support SPI interface, can be connected directly

street

to a variety of MCUs Application

Key parameter

Chip Model Module size Receiving Sensitivity Current(TX)

LLCC68/SX1262 16.4x15x3mm -146dBm 118mA

Antenna GPIO

IPEX 5

Current(RX)

4.7mA

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MS21SF1 Datesheet
INDEX
1 Block Diagram ..................................................................................................................5 2 Electrical Specification .................................................................................................. 5 3 Pin Description .................................................................................................................6 4 Pin Definition .................................................................................................................... 7 5 Mechanical Drawing ......................................................................................................8 6 Module Connection Description ................................................................................ 8
6.1 Connection diagram ........................................................................................... 8 6.2 Power supply .........................................................................................................9 6.3 SPI Interface character ...................................................................................... 9
6.3.1 DIO with IRQ control .............................................................................10 6.3.2 Module TX,RX Mode controls ............................................................ 11 Module power consumption description .................................................. 11 7 Electrical Schematic .................................................................................................... 12 8 PCB Layout .....................................................................................................................13 9 Reflow and Soldering ................................................................................................. 14 10 Package Information ................................................................................................15 Quality ............................................................................................................................ 16 Contact Us .................................................................................................................... 16 Copyright Statement .................................................................................................17

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MINEWSMi
1BlockDiagram

MS21SF1Datesheet

A9nt1e5nMga
LC filter

SX_NRESET3V Dc/Dc

Semtech

System
power

SX1262/LLCC68
DC/DC and LDO regulator

Vcc(1.8~3.6V)

RADIO CLOCK

SPI

DIO1

DIO2

l o

DIO3

BUSY

SPI DIO1 DIO2 DIO3 BUSY

32MHz

2 ElectricalSpecification

Parameter
OperationVoltage OperationTemperature
ISM Frequency Current(RX) Current(TX)
ModuleDimension
QuantityoflOPort

Values
1.7V-3.7V

Notes
ToensureRFwork,supplyvoltagesuggestnot
lowerthan3.3V

-40~+85
903.2~ 927.5M HZ
4.7mA 118mA 16.4x15x3mm

Configurable Optional, default 915M HZ
RXmode TXmode

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CopyrightOShenzhenMinewsemiCo.,Ltd.

3 Pin Description

MS21SF1 Datesheet

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MS21SF1 Datesheet

4 Pin Definition

Number Symbol

GND

Type
-

Function description
Grounded

Notes

RF TX signal Control Switchconnect the

ANT_SW1 SWITCH Antenna switch control external MCU IO or DIO2, and the high level is

valid

Multi-purpose digital I/O /

DIO2

I/O

RF Switch control

DIO1

I/O

Multi-purpose digital I/O

Multi-purpose digital I/O -

DIO3

I/O

external TCXO supply

voltage

BUSY

Busy instruct

GND

Ground

Input voltage for power

VDD

amplifier regulator

SX_NRESET

I/O

Reset signal

Power supply to voltage 3.3V Active low

MISO

SPI Slave output

MOSI

SPI Slave input

SCK

SPI clock

NSS

SPI chip select (CS)

ANT_SW2 SWITCH Antenna switch control

GND

Grounded

RF switch receiving control pin, connected to external MCU IO, active at high level

ANT

Antenna connect pin

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5 Mechanical Drawing

MS21SF1 Datesheet

*Default unitmm Default tolerance±0.1
6 Module Connection Description
6.1 Connection diagram

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MS21SF1 Datesheet

6.2 Power supply
The chip-sets operating voltage range is 1.8V-3.6V, to ensure normal use, the power supply voltage shall be 3.3V as far as possible.

6.3 SPI Interface character

The SPI runs on an external SCK clock, allowing it to reach 16MHz.

Transmission is initiated when the NSS pin level goes low. When NSS is high, MISO is

in a high impedance state.

SPI Timing Requirements (The chip implements only the Slave side function.)

Symbol

Description

Minimum Typical Maximum unit

NSS falling edge to SCK setup time

SCK period

62.5

SCK high time

31.25

MOSI to SCK hold time

MOSI to SCK setup time

SCK falling to MISO delay

SCK to NSS rising edge hold time

31.25

NSS high time

125

NSS falling edge to SCK setup time when

t10

100

switching from SLEEP to STDBY_RC mode

NSS falling to MISO delay when switching

t11

from

SLEEP to STDBY_RC mode

150

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Active Timing

MS21SF1 Datesheet

6.3.1 DIO with IRQ control

Commands Controlling the Radio IRQs and DIOs(At least one DIO is required for IRQ,

and BUSY cable is also required to be used compulsorily.

Command

Operate code

Parameters

Description

IrqMask[15:0],

SetDioIrqParams

0x08

Dio1Mask[15:0], Dio2Mask[15:0],

Configure the IRQ and the DIOs attached to each IRQ

Dio3Mask[15:0],

GetIrqStatus

0x12

Get the values of the triggered IRQs

ClearIrqStatus

0x02

Clear one or several of the IRQs

SetDIO2AsRfSwitchCtrl

0x9D

Enable

Configure radio to control an RF switch from DIO2

SetDIO3AsTcxoCtrl

0x97

tcxoVoltage, timeout[23:0]

Configure the radio to use a TCXO controlled by DIO3

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MS21SF1 Datesheet

6.3.2 Module TX,RX Mode controls

In ANT_SW1 and DIO2 connection Point, the two connection points are IO pin and external MCU GPIO for detecting TX and RX level pins, ANT_SW2 is the synchronization control pin:
1) When IO pin detects a high level, pin ANT_SW2 sets the level to low, the mode is TX mode .
2) When IO pin detects a low level, pin ANT_SW2 sets the level to high, the mode is RX mode

Mode

ANT_SW2

Module power consumption description
The following power consumption test is conducted under the normal temperature condition when the power supply voltage is 3.3V. The power consumption in the 915MHz frequency band is measured.

Mode

Power

SF Mode
SF7 SF12

Peak
112.01mA 123.32mA

Avg
98.60mA 115.62mA

Mode

Power

Sleep

Peak
538.41uA 4.76mA

Avg
0.85uA 4.22mA

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7 Electrical Schematic

MS21SF1 Datesheet

NoticeBefore placing an order, please confirm the specific configuration required with the salesperson.

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MS21SF1 Datesheet
8 PCB Layout
Module antenna area couldn't have GND plane or metal cross line, couldn't place components nearby. It is better to make hollow out or clearance treatment or place it on the edge of PCB board.
Layout notes 1) Preferred Module antenna area completely clearance and not be prevented by
metals, otherwise it will influence antenna's effect (as above DWG. indication). 2) Cover the external part of module antenna area with copper as far as possible to
reduce the main board's signal cable and other disturbing. 3) It is preferred to have a clearance area of 4 square meter or more area around the
module antenna (including the shell) to reduce the influence to antenna. 4) Device should be grounded well to reduce the parasitic inductance. 5) Do not cover copper under module's antenna in order to avoid affect signal
radiation or lead to transmission distance affected. 6) Antenna should keep far from other circuits to prevent radiation efficiency reduction
or affects the normal operation of other lines. 7) Module should be placed on edge of circuit board and keep a distance away from
other circuits.
8) Suggesting to use magnetic beads to insulate module's access power supply.

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9 Reflow and Soldering

MS21SF1 Datesheet

1) Do SMT according to above reflow oven temperature deal curve. Max. Temperature is 260; Refer to IPC/JEDEC standardPeak TEMP<260Times2 timessuggest only do once reflow soldering on module surface in case of SMT double pad involved. Contact us if special crafts involved.

2) Suggesting to make 0.2mm thickness of module SMT for partial ladder steel mesh, then make the opening extend 0.8mm
3) After unsealing, it cannot be used up at one time, should be vacuumed for storage, couldn't be exposed in the air for long time. Please avoid getting damp and soldering-pan oxidizing. If there are 7 to 30 days interval before using online SMT, suggest to bake at 65-70 for 24 hours without disassembling the tape.
4) Before using SMT, please adopt ESD protection measure.

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10 Package Information

MS21SF1 Datesheet

*Default unitmm Default tolerance±0.1

Packing detail Specification

Quantity

850PCS

Net weight 935g

Gross weight

Dimension

1475g

W=44mmT=0.35mm

* Note: Default weight tolerance all are within 10gexcept the special notes)

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Quality

MS21SF1 Datesheet

Cognizant of our commitment to quality, we operate our own factory equipped with state-of-the-art production facilities and a meticulous quality management system. We hold certifications for ISO9001, ISO14001, ISO27001, OHSA18001, BSCI.
Every product undergoes stringent testing, including transmit power, sensitivity, power consumption, stability, and aging tests. Our fully automated module production line is now in full operation, boasting a production capacity in the millions, capable of meeting high-volume production demands.

Shenzhen Minewsemi Co., Ltd. is committed to swiftly delivering top-quality connectivity modules to our customers. For assistance and support, please feel free to contact our relevant personnel, or contact us as follows: Webwww.minewsemi.com Emailminewsemi@minew.com Linkedinwww.linkedin.com/company/minewsemi
Shop https://minewsemi.en.alibaba.com/
Tel+86 0755-28010353 Address3rd Floor,I Building, Gangzhilong Science Park, NO.6, Qinglong Road,Longhua District, Shenzhen, China

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MS21SF1 Datesheet

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to copyright laws.

The certified trademarks included in this product and related documents have been licensed for use by MinewSemi. This includes but is not limited to certifications such as BQB, RoHS, REACH, CE, FCC, BQB, IC, SRRC, TELEC, WPC, RCM, WEEE, etc. The respective textual trademarks and logos belong to their respective owners. For example, the Bluetooth® textual trademark and logo are owned by Bluetooth SIG, Inc. Other trademarks and trade names are those of their respective owners. Due to the small size of the module product, the "®" symbol is omitted from the Bluetooth Primary Trademarks information in compliance with regulations.
The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise. Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the contents of this manual in other ways. Violators will be held accountable in accordance with the law.

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Science

Park,

Qinglong

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This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
FCC warning: Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/ TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional- radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 15C(15.24 9). 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point- to- point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer s instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. Explanation: This module is stand-alone modular. If the end product will involve the Multiple simultaneously transmitting condition or different operational conditions for a stand-alone modular transmitter in a host, host manufacturer have to consult with module manufacturer for the installation method in end system. 2.4 Limited module procedures If a modular transmitter is approved as a limited moduleth, en the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/ data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module.

2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro- Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna); b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered); c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout; d) Appropriate parts by manufacturer and specifications; e) Test procedures for design verification; and f) Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. Explanation: The antenna is not a trace antenna. 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a person s body); and (2) additional text needed for the host product manufacturer to provide to end users in their end- product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled environment, This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body." This module is designed to comply with the FCC statement, FCC ID is:2BDJ6- MS21SF1.

2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an omni- directional antenna is not considered to be a specific antenna type ). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The EUT has a External Antenna, If you desire to increase antenna gain and either change antenna type or use same antenna type certified, a Class II permissive change application is required to be filed by us, or you (host manufacturer) can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e- label stating Contains FCC ID with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. Explanation:The host system using this module, should have label in a visible area indicated the following texts: "Contains FCC ID: 2BDJ6- MS21SF1. 2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand- alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand- alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturer s determination that a module as installed in a host complies with FCC req uirem ent s. Explanation: MS21SF1 can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter.

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Users Manual

References