Qualcomm Dragonwing™ Mobile Broadband (MBB) Platform Gen 3

Overview

The Dragonwing MBB Platform Gen 3, featuring the Snapdragon® X75 5G Modem-RF, offers a range of groundbreaking features that drive unmatched design flexibility, low power consumption, and compact size.

This fully integrated platform architecture includes a 5G modem-RF with support for Sub-6GHz and mmWave frequencies, a GNSS receiver, and Tri-Band Wi-Fi 7, ensuring advanced connectivity options.

Robust mmWave performance starts with Qualcomm's third-generation mmWave module, the Qualcomm® QTM567 mmWave Antenna Module, and is enhanced by Qualcomm® RF Sensing Suite technology, which helps provide a reliable and robust mmWave connection in indoor environments.

Highlights

A GLOBAL MBB ACCELERATOR:

The Dragonwing MBB Platform Gen 3 is designed for high-throughput broadband in mobile, high-demand environments. It features the Snapdragon X75 5G Modem-RF, supporting mmWave + Sub-6GHz aggregation and Wi-Fi 6E with 4-stream DBS. This platform is ideal for OEMs delivering next-gen mobile broadband solutions with robust AI and spectrum flexibility.

BREAKTHROUGH, NEXT-GENERATION CONNECTIVITY FEATURES

The fully integrated platform architecture features the Snapdragon X75 5G modem-RF with 5G Sub-6GHz and mmWave, a GNSS receiver, and Tri-Band Wi-Fi 7. Excellent 5G speeds and flexibility are supported by: a 3GPP Rel-17 5G modem, 10 CC aggregation (mmWave), 256 QAM support on ten 100MHz carriers, 5x carrier aggregation (Sub-6), FDD Uplink MIMO, Uplink CA with FDD+FDD, and eight Rx with support for 2 CC aggregation. Unmatched power efficiency comes from Qualcomm® 5G PowerSave Gen 4.

Features

Integrated 3GPP Rel-17 5G modem (2G to 5G and including GNSS) with support for Sub-6GHz and mmWave connectivity, a quad-core CPU, and Tri-Band Wi-Fi 7.
Extended-range mmWave and Sub-6GHz with eight receiver antennas and support for power class 1.5 (PC 1.5).
Sub6-mmWave convergence (one transceiver).
8 Rx enhancements - 3CC (F+T).
Excellent carrier aggregation and dual-connectivity support for Qualcomm® Tri-Band Wi-Fi 7 with expert Multi-Link Operation (MLO) for blazing-fast lower latency, reliable connections, and mesh capability for seamless coverage.
Support for 5G Dual-SIM Dual-Standby (DSDS) configurations.
Flexible software architecture with support for multiple frameworks, including OpenWRT and RDK-B.
Global 5G band support, including n259 (41GHz), n70, and n53.

Specifications

Modem

Snapdragon X75 5G Modem-RF
Cellular:
- mmWave: QTM567
- Modem-RF specs: 300MHz bandwidth (Sub-6GHz), 8 carriers (mmWave), 800MHz bandwidth (mmWave), 2x2 MIMO (mmWave), 4x4 MIMO (Sub-6)
- Performance Enhancement Technologies: Qualcomm® 5G Ultra-Low Latency Suite, Dual-layer polarization in downlink and uplink (mmWave), Beam tracking (mmWave), Beam steering (mmWave), Beam forming (mmWave), Qualcomm® Smart Transmit™ Gen 4 technology, Qualcomm 5G PowerSave Gen 4, Wide Scan Angle (mmWave), Qualcomm® 5G RF Sensing Suite, Qualcomm® Dynamic Antenna Steering Gen 2
- Technology: 5G NR, Sub-6GHz, Dynamic Spectrum Sharing (DSS), SA (standalone), NSA (non-standalone), 5G mmWave, WCDMA (DB-DC-HSDPA), WCDMA (DC-HSUPA), Sub-6 carrier aggregation (FDD-FDD), Sub-6 carrier aggregation (TDD-TDD), 5G FDD, 5G TDD, Sub-6 carrier aggregation (FDD-TDD), mmWave-Sub6 aggregation
Peak 5G DL/UL:
- Download: 10 Gbps
- Upload: 3.7 Gbps
Wi-Fi/Bluetooth®:
- Generation: Wi-Fi 7, Wi-Fi 6E, Wi-Fi 6, Wi-Fi 5, Wi-Fi 4
- Standards: 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
- Spectral bands: 6GHz, 5GHz, 2.4GHz
- Peak QAM: Up to 4K QAM
- Features: OFDMA (UL/DL), MU-MIMO (UL/DL), Simultaneous & Alternating Multi-Link, Adaptive Interference Puncturing
- 4-stream DBS
- Peak Wi-Fi DL/UL: 3.6 Gbps/2.9 Gbps
- 160MHz channels
- Bluetooth 5.2

Related Products

The Snapdragon X75 5G Modem-RF is a modem-RF system with an integrated AI tensor accelerator, enabling breakthrough 5G performance and continuous enhancements.

To learn more visit: qualcomm.com

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