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Owner's Manual for ICECO models including: IBS23, IBS23 Bluetooth Module, Bluetooth Module, Module
GUANGDONG ICECO ENTERPRISE CO., LTD. IBS23 Bluetooth Module 2ATOGIBS23 2ATOGIBS23 ibs23
File Info : application/pdf, 5 Pages, 544.80KB
DocumentDocumentIBS23 Bluetooth Module Product Specification 1. Description The IBS23 Bluetooth module utilizes the JieLi AC6328A2 Bluetooth chip, featuring a built-in 96M 32-bit high-performance processor, 73KB large-capacity RAM, and 256Kb FLASH. Supports 2GPIOs, which can be software-configured as peripherals such as UART (default), GPIO, ADC, PWM, etc. Low-power Bluetooth technology, with minimum power consumption as low as 18uA (in power down mode). Supports Bluetooth 5.3 BLE, enabling direct communication with apps and mini-programs. 2. Basic Features: Bluetooth 5.3, BLE Bluetooth RISC 32-bit 96MHz CPU 256bit Flash 73KB RAM Voltage Input: 1.8V-3.4V Dimensions: 17*12.6*0.8mm Operating Temperature: -20 to 85 2.1 Recommended Operating Conditions Parameter Min Operating temperature -20 Voltage input -1.8 Frequency range 2402 Typica - +3.0 Max +85 +3.4 2480 Unit °C V MHz 2.2 Bluetooth Performance Parameter Bluetooth transmit power Receive sensitivity Index 0dBm -92dBm Test Conditions 25°C VCC=3.3V, fixed frequency mode, test point at chip transmit pin 25°C VCC=3.3V 2.4 IO Characteristics Symbol Parameter VIL Low-Level Input Voltage VIH High-Level Input Voltage VOL Low-Level Output Voltage VOH High-Level Output Voltage Min -0.3 0.7*VDDIO 2.7 Typ - Max 0.3* VDDIO VDDIO+0.3 0.33 - Unit V V V V Test Conditions VDDIO = 3.3V VDDIO = 3.3V VDDIO = 3.3V VDDIO = 3.3V 3 . The size of the module graph 4 . Device pin out diagram 5 . Pin definition Pin Symb 1 GND 2 GND 3 VCC3V 4 VCC3V 5 VCC3V 6 - 7 - 8 GND 9 - 10 - 11 USB0DM 12 USB0DP I/O GND GND Analog Analog Analog GND Digital I/O Digital I/O Description GND GND Power, 3 V Power, 3 V Power, 3 V GND - General purpose IO/RXD General purpose IO/TXD 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 GND 25 GND 26 - - - - - - - - - - - - - - - - - - - - - - - GND GND GND GND - - 6 . Design notes Please avoid the impact of interference sources such as power amplifiers, boost circuits, and DC/DC circuits on the module. Avoid forming a series circuit between the module's power supply loop and high-power circuit units to improve the overall SNR. 7 . Note A. Regarding the usage environment of wireless Bluetooth, wireless signals, including Bluetooth applications, are greatly affected by the surrounding environment. Obstacles such as trees and metal can absorb wireless signals, thus affecting the data transmission distance in practical applications. B. Since Bluetooth modules are typically integrated into existing systems and placed within enclosures, and metal enclosures can shield wireless RF signals, it is recommended not to install the module in a metal enclosure. C. PCB Layout: The antenna part of the Bluetooth module is a PCB antenna. Since metal can weaken the antenna's functionality, it is strictly prohibited to lay ground or route traces under the module's antenna during PCB layout. If possible, it is better to hollow out the area. D. If there are batteries, metal objects, LCD screens, speakers, etc., near the module's antenna, ensure they are at least 15mm away from the antenna. E. During layout, it is recommended to use star routing for the power supply lines and ensure good linearity of the Bluetooth module's power supply. Additionally, the BT ground must be separated from the grounds of amplifiers, power amplifiers, MCUs, etc., and there should be no other interfering grounds under the BT module. F. Do not route control lines, power lines, audio lines, MIC lines, or other interfering lines near the antenna. 8 . Recommended reflow temperature Key features of the profile: -Initial Ramp=1-2.5/sec to 175 equilibrium -Equilibrium time=60 to 80 seconds -Ramp to Maximum temperature (250)=3/sec Max -Time above liquidus temperature(217): 45 - 90 seconds -Device absolute maximum reflow temperature: 250 Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the followingmeasures: -- Reorient or relocate the receiving antenna. -- Increase the separation between the equipment and receiver. -- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -- Consult the dealer or an experienced radio/TV technician for help. 9.Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules FCC Part 15.247 2.3 Specific operational use conditions This transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This information also extends to the host manufacturer s instruction manual. 2.4 Limited module procedures Not applicable 2.5 Trace antenna designs It is not applicable as trace antenna which is not used on the module. 2.6 RF exposure considerations The equipment complies with FCC Radiation exposure limit set forth for uncontrolled environment.The device shall be operated and installed without restrcition. The host product manufacturer would provide the above information to end users in their endproduct manuals. 2.7 Antennas PCB antenna -7.19dBi 2.402 GHz 2.480GHz 2.8 Label and compliance information The end product must carry a physical label or shall use e-labeling followed KDB784748D01 and KDB 784748 stating Contains Transmitter Module FCC ID: 2ATOGIBS223 . 2.9 Information on test modes and additional testing requirements For more information on testing, please contact the manufacturer. manufacturerGUANGDONG ICECO ENTERPRISE CO.,LTD. Address23 Health Rd., National Health Technology Park,Torch Development Zone, Zhongshan, Guangdong, P.R. China ContactsLiu yanping Mobile: +86-198-6083-2010 e-mailyp.liu@iceco.com https://www.iceco.cn 2.10 Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed when contains digital circuity.