MS-Challenger B760ITX D5
Manual
Version: A0
Edited on: February 28, 2024
Editing Department: Technology Department
FCC Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
FCC Warning
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
NOTE 2: Any changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
1.1. Motherboard hardware specifications
| Specification | Details |
|---|---|
| Motherboard Size | Mini-ITX (170*170mm) |
| CPU | Supports LGA1700 slot Intel® 14th, 13th, 12th Processors 8+1 phase power supply; TDP: PL1 168W; PL2 241W |
| Chipset | Intel® B760 High Speed Chipset |
| RAM | 2* DIMM DDR5 memory slots Maximum capacity 96GB Supports dual-channel memory technology Supports 4800Mhz/XMP/OC memory frequencies |
| Display | Shared display memory technology based on display capabilities with integrated graphics processor 2* DP1.4 display ports supporting up to 4096x2160@60Hz resolution 1* HDMI 2.0 display interface, support up to 4096x2160@60Hz resolution 1* HDMI 1.4 display interface, support up to 4096x2160@30Hz resolution |
| Extended Interface | 1* PCIEX16 5.0 slot Supports AMD and NVidia discrete graphics cards |
| Audio | Integrated REALTEK ALC897 HD Audio Codec |
| Network | 1* Realtek RTL8125BG 2.5G LAN 1* INTEL i219V 1Gb LAN 1* M.2_WIFI slot (KEY_E): supports PCIe×1/CNVio2/USB channel for installing wireless |
| SSD | 1x M.2_SSD_A Front Socket M.2 slot with Gen4 x4 support 1x M.2_SSD_B backside slot M.2 slot with Gen4 x4 support 4x SATA 3.0 ports |
| USB | Onboard USB pins (5 ports total): 1* USB3.2 Gen2 Type-C (10G) front port 1* USB3.2 Gen1 (5G) connector pin, supports 2 additional USB3.2 Gen1 ports 1* USB 2.0 connector pin to support 2 additional USB 2.0 ports Rear USB ports (6 ports in total): 2* USB3.2 Gen1 Type-A (5G) ports 4* USB2.0 Type-A ports |
| In-board sockets | 1* COM pin 3* sets of system fan pins, 1 set of CPU fan pins 1* set of chassis front control panel pins (F_PANEL) 1* set of front audio pins F_Audio 1* set of TPM_SPI pins, support external TPM2.0 module or SPI burn-in function (BIOS burn-in) 1* set of Debug pins 1* set of CASE_OPEN pins 1* set of SPDIF pins 1* set of 5V_ARGB pins |
| Power | 1* 24-PIN motherboard ATX power 1* 8-PIN motherboard ATX power |
| Hardware monitoring | Voltage monitoring Temperature monitoring Fan monitoring Intelligent fan speed control (supported by the motherboard, intelligent fan speed control also requires fan support) |
| Operating system | Support Windows 10 64bit, Windows 11 64bit Ubuntu 64bit support |
| ESD protection | Air discharge ± 8KV Class C ±6KV Class B Contact discharge ± 6KV Class C ± 3KV Class B *Tested with the whole machine well grounded |
| Package | Single piece packaging weight: 736.2g Packing quantity: 20PCS Outer box size: 505(L)mm*425(W)mm*337(H)mm Full box gross weight: 16.8kg |
1.2 Motherboard I/O interface function description
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A: DP port
DP1.4 port, supports up to 4096x2160@60Hz resolution, for connecting to DP monitor port.
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B: DP port
DP1.4 port, supports up to 4096x2160@60Hz resolution, for connecting to DP monitor port.
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C: HDMI port
HDMI 2.0 port, supports up to 4096x2160 @60Hz resolution for connecting to HDMI monitor ports.
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D: HDMI port
HDMI 1.4 port, supports up to 4096x2160 @30Hz resolution for connecting to HDMI monitor ports.
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E: 2-layer USB 2.0 interface
Supports up to 480Mb theoretical transfer speed and is backward compatible with USB1.1 standard for connecting USB TYPE A devices.
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F: Audio
Audio-in connector (blue) for receiving audio input devices, such as cell phone audio input.
Audio-out connector (light green) for accessing audio output devices, such as headphones, speakers and other external amplification devices.
Audio-Microphone connector (pink) for accessing audio input devices such as microphones and other radio devices.
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G: Intel 1Gb LAN
Network cable interface for accessing the network cable to connect the host system to the network.
Activity Link LED Speed LED Status Description Status Description Off No link Off 10Mbps connection Yellow Linked Green 100Mbps connection Blinking Data activity Orange 1000Mbps connection -
H: Realtek 2.5Gb LAN
Network cable interface for accessing the network cable to connect the host system to the network.
Activity Link LED Speed LED Status Description Status Description Off No link Off 10Mbps connection Yellow Linked Green 100Mbps connection Blinking Data activity Orange 1000Mbps/2.5Gbps connection -
I: 2-layer USB 2.0 interface
Supports up to 480Mb theoretical transfer speed and is backward compatible with USB1.1 standard for connecting USB TYPE A devices.
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J: Layer 2 USB3.2 GEN1 Type-A connector
Supports up to 5Gb theoretical transfer speed and is backward compatible with USB 1.1 standard for connecting USB TYPE A devices.
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K: CLR_CMOS shortcut button
CLR CMOS shortcut button.