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AR759x Specifications

Cellular

LTE Advanced (Cat-6) with 3G and 2G Fallback

AR7592 (NAM)
AR7594 (EMEA)
AR7596 (China)
AR7598 (ROW)

Hardware Specs

Dimensions: Auto Grade 32 x 37 x 3.6 mm

Chipset: Qualcomm MDM9x40

Main Interfaces:

Link: USB, UART, PCIe
Digital: SPI, I2C, GPIO's, Int, SDIO
Audio: Digital

Temperature Ranges:

-30°C to +70°C (operating class A)
-40°C to +85°C (operating class B)

Image of the AR759x module and its chipset.

Key Features

Automotive-grade manufacturing (TS-16949 certified)
Automotive quality processes (PPAP, 8D, PCN, FA, ...)
Reliable in extreme operating environments
GNSS (GPS, Glonass, Galileo, BeiDou)
Multicore Architecture: ARM Cortex-A7 (1.2GHz) application core dedicated to customer
Legato®: Open application framework based on Linux
Advanced voice quality according ITU P.1140

Certification and Approvals

Planned:

FCC, IC, PTCRB, AT&T, T-MO, Verizon, Rogers, RED, Telcel, CE/RED, GCF, Vodafone, CCC, JRF/JPA, Docomo NTT, KT, Telstra, HKT, TW Mobile, Malaysia Digi, SG, SA, ME

Models: AR759x Wireless Automotive Model

File Info : application/pdf, 1 Pages, 122.51KB

AR759x Datasheet Microsoft PowerPoint for Microsoft 365 Microsoft PowerPoint for Microsoft 365

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