IEI TANK-XM813 Industrial System

The IEI TANK-XM813 is a high-performance, fanless embedded computer designed for demanding industrial applications. It features a modular design for easy installation and expansion, supporting the latest Intel Core Ultra processors.

Features

Specifications

CategoryDetails
Model NameTANK-XM813
ColorBlack
Chassis Dimensions (WxDxH)230.6 x 255 x 68.7 mm
System FanFanless
Chassis ConstructionExtruded aluminum alloys
CPUIntel® Core™ Ultra 9 285T, Intel® Core™ Ultra 9 285, Intel® Core™ Ultra 7 265T, Intel® Core™ Ultra 7 265, Intel® Core™ Ultra 5 225T, Intel® Core™ Ultra 5 225
ChipsetW880
Memory2 x SO-DIMM DDR5 5600 (16GB pre-installed, up to 96GB)
Storage2 x 2.5" SATA 6Gb/s HDD/SSD bay (RAID 0/1 supported)
Ethernet2 x 2.5GbE (Intel® I226LM and I226-V controllers)
USB 3.2 Gen 2 (10Gb/s)7 ports
COM2 x RS-232/422/485, 4 x RS-232
Display Interface1 x DP++, 1 x HDMI™, 1 x USB4 (supports DisplayPort and USB 3.2 Gen 2)
Audio1 x Mic, 1 x Line out
TPM1 x Intel TPM, 1 x 20-pin TPM connector (Optional TPM-IN03 module)
Digital I/O12-bit (6-in/6-out) DB15 connector
Others1 x Power button, 1 x 2-pin terminal block for Remote Power Button, 1 x Reset button, 1 x AT/ATX switch, 1 x Power LED (red), 1 x HDD LED (green), 1 x 4-pin external system fan connector
M.21 x 2280 M-key (PCIe Gen4 x4), 1 x 2230 A-key (USB+PCIe Gen3 x1, supports vPro)
Expansion BackplaneOptional
Power Input12~28V DC
Power Consumption12V @ 8.8A (Intel® Core™ Ultra 9 285 with 16GB memory)
MountingWall mount
Operating Temperature-20°C to 60°C (35W TDP CPU), -20°C to 50°C (65W TDP CPU)
Storage Temperature-40°C to 85°C
Reliability (Operating Shock)MIL-STD-810H 514.8C-I with SSD
Reliability (Operating Vibration)IEC68-2-27 half-sine, 5G, 11ms, 100 shocks with SSD
Weight (Net/Gross)3.24 kg / 3.6 kg
Safety / EMCCE, FCC
Watchdog TimerProgrammable 1~255 sec/min
Supported OSWindows® 10/11 IoT Enterprise / Linux

Modular Design and Expansion

The TANK-XM813 features a modular design for easy installation and maintenance. The three-layer structure simplifies the installation of CPU, memory, and HDD.

High-Performance Graphics Card Support

With IEI's power board, the system can support full-height and full-length 3-slot high-end graphics cards, with a maximum length of 350mm. A specified power adapter is required.

Flexible Expansion Options

Various expansion options are available, including dual-slot and four-slot SKUs, allowing customers to choose based on their specific needs. Optional modules like M.2 expansion cards and 8-port PoE expansion cards are also supported.

External Fan Option

An external fan can be installed to enhance system performance in harsh environments.

I/O Interfaces

Top View

Includes DC IN (12-28V), 7 x USB 3.2 Gen 2, 2 x 2.5GbE ports, and connectors for expansion I/O boards.

Front View

Includes 2 x RS-232/422/485, Power Button, System Fan, Audio (Line out), and 4 x RS-232, 1 x DIO (6-in/6-out), AT/ATX Mode Switch, Reset Button, HDD/Power LEDs, and optional WiFi antennas.

Ordering Information

ModelDescription
TANK-XM813-U5AD-R10Ruggedized Fanless Embedded System with Intel® Ultra 5 225T 2.5GHz (35W TDP), 16GB RAM, 1xHDMI™, 1xDP++, USB4, 12~28V DC
TANK-XM813-U5BD-R10Ruggedized Fanless Embedded System with Intel® Ultra 5 225 3.4GHz (65W TDP), 16GB RAM, 1xHDMI™, 1xDP++, USB4, 12~28V DC
TANK-XM813-U7AD-R10Ruggedized Fanless Embedded System with Intel® Ultra 7 265T 1.5GHz (35W TDP), 16GB RAM, 1xHDMI™, 1xDP++, USB4, 12~28V DC
TANK-XM813-U7BD-R10Ruggedized Fanless Embedded System with Intel® Ultra 7 265 2.4GHz (65W TDP), 16GB RAM, 1xHDMI™, 1xDP++, USB4, 12~28V DC
TANK-XM813-U9AD-R10Ruggedized Fanless Embedded System with Intel® Ultra 9 285T 1.4GHz (35W TDP), 16GB RAM, 1xHDMI™, 1xDP++, USB4, 12~28V DC
TANK-XM813-U9BD-R10Ruggedized Fanless Embedded System with Intel® Ultra 9 285 2.5GHz (65W TDP), 16GB RAM, 1xHDMI™, 1xDP++, USB4, 12~28V DC

Options

Part No.Description
EMB-WIFI-KIT0213-R102T2R M.2 WiFi module kit with WiFi 6E and Bluetooth 5.2 (Intel AX210.NGWG)
63040-010180-200-RS180W AC/DC Adapter (FSP180-ABAN3)
32702-000202-100-RSEuropean Power Cord (VDE)
SF-TANK-XM81-R10External fan for TANK-XM81 Series
TPM-IN03-R1020-pin Infineon SPI TPM2.0 module

Optional Expansion Backplane

Part No.Description
TXCBP-XM81-2A-R10Expansion backplane for TANK 81 Series, 2 slots, 1 x PCIe Gen4 x16 & 1 x PCIe Gen3 x4
TXCBP-XM81-2B-R10Expansion backplane for TANK 81 Series, 2 slots, 1 x PCIe Gen4 x16 (x8 signal) & 1 x PCIe Gen3 x16 (x8 signal)
TXCBP-XM81-4A-R11Expansion backplane for TANK 81 Series, 4 slots, 1 x PCIe Gen4 x16 & 2 x PCIe Gen3 x4 & 1 x PCIe Gen3 x1 w/ Ext. PWR Conn.
TXCBP-XM81-4B-R11Expansion backplane for TANK 81 Series, 4 slots, 1 x PCIe Gen4 x16 (x8 signal) & 1 x PCIe Gen3 x16 (x8 signal) & 2 x PCIe Gen3 x4 w/ Ext.PWR Conn.
TXCBP-XM81-4C-R10Expansion backplane for TANK 81 Series, 4 slots, 1 x PCIe Gen4 x16 & 2 x PCI & 1 x PCIe Gen3 x4
TXCBP-XM81-G2-PW-R11Expansion backplane for TANK 81 Series, 6 slots, 1 x PCIe Gen4 x16 (x8 signal) & 1 x PCIe Gen3 x16 (x8 signal) & 2 x PCIe Gen3 x4 w/ Ext. PWR Conn.
IDD-X1228150-R10Extended Power Board for TANK-XM81 Series, 150W@16~28V or 380W@12V DC input 12V output Power Module

Optional Expansion Chassis

Part No.Description
TXC-XM81-3S-R103-slot expansion chassis for TANK 81 Series
TXC-XM81-4S-R104-slot expansion chassis for TANK 81 Series
TXC-XM81-G1-R104-slot One GPU expansion chassis for TANK 81 Series
TXC-XM81-G2-R106-slot Dual GPU expansion chassis for TANK 81 Series

Optional Internal Expansion Boards

Part No.Description
GPOE-XM81-8P-R11I/O expansion module for TANK 81 Series, 8 x 2.5G LAN with PoE
TXIOB-XM81-A-R10I/O expansion module for TANK 81 Series, 2 x M.2 B Key, 1 x M.2 A Key, 1 x PCIe Mini

Dimensions

Diagram showing the dimensions of the TANK-XM813 unit.

Width: 230.6 mm

Depth: 255 mm

Height: 68.7 mm

Packing List

PDF preview unavailable. Download the PDF instead.

TANK-XM813 Adobe PDF Library 17.0 Adobe InDesign 20.4 (Windows)

Related Documents

Preview IEI TANK-870-Q170-QGW Fanless Box PC with QTS Gateway OS
High-performance fanless box PC featuring 6th/7th Gen Intel Core processors, QTS Gateway OS, extensive I/O, and rugged design for industrial applications.
Preview IEI DRPC-W-TGL Fanless DIN-Rail Embedded System Datasheet
Detailed specifications and features of the IEI DRPC-W-TGL, a fanless DIN-rail embedded system powered by Intel Tiger Lake processors, offering robust I/O and flexible configuration options for industrial applications.
Preview IEI GRAND-AL Storage Server System | Intel Celeron J3455 Specifications
Detailed specifications and ordering information for the IEI GRAND-AL series rackmount storage server systems, featuring Intel Celeron J3455 CPU, multiple HDD bays, and high-speed networking options.
Preview IEI GRAND-BDE Rackmount Storage Server | Intel Xeon D-1500 Series
Explore the IEI GRAND-BDE series, a high-performance 2U rackmount storage server system featuring Intel® Xeon® D-1500 processors, up to 128GB DDR4 memory, and extensive storage expandability up to 1PB. Ideal for demanding data center applications.
Preview IEI PPC2-C19-ADL Heavy Industrial Panel PC - Technical Specifications
Detailed specifications for the IEI PPC2-C19-ADL Heavy Industrial Panel PC, featuring a 19-inch display, 12th Gen Intel Core processors, HDMI 2.0, dual 2.5G Ethernet, PCIe Gen4 x16 slot, M.2 expansion, and IP65 front panel.
Preview IEI IOVU-17F-AD Industrial Panel PC - 17" Freescale i.MX6 Quad Core
Detailed specifications and features of the IEI IOVU-17F-AD industrial panel PC, featuring a 17-inch Freescale i.MX6 Cortex-A9 Quad Core 1.0 GHz processor, projected capacitive touchscreen, and IP65 rating.
Preview IEI SBOX-100-QM87i-QGW Fanless Marine Box PC
Detailed specifications and features of the IEI SBOX-100-QM87i-QGW, a fanless marine box PC with a 4th Generation Intel Core i5 processor, designed for maritime environments with wide temperature support and isolation protection.
Preview IEI SBOX-100-QM87i-QGW Fanless Marine Computer Specifications
Detailed specifications for the IEI SBOX-100-QM87i-QGW, a fanless marine embedded system featuring a 4th Generation Intel Core i5 processor, wide temperature range, isolation protection, and multiple I/O interfaces.