Product Overview
The ESP32-C3 family is an ultra-low-power and highly-integrated MCU-based SoC solution that supports 2.4 GHz Wi-Fi and Bluetooth® Low Energy (Bluetooth LE). It offers:
- A complete Wi-Fi subsystem compliant with IEEE 802.11b/g/n protocol, supporting Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode.
- A Bluetooth LE subsystem supporting features of Bluetooth 5 and Bluetooth mesh.
- State-of-the-art power and RF performance.
- A 32-bit RISC-V single-core processor with a four-stage pipeline operating at up to 160 MHz.
- 400 KB of SRAM (16 KB for cache) and 384 KB of ROM on the chip.
- SPI, Dual SPI, Quad SPI, and QPI interfaces for connection to external flash.
- Reliable security features including cryptographic hardware accelerators (AES-128/256, Hash, RSA, HMAC, digital signature, secure boot), a random number generator, permission control for memory access, and external memory encryption/decryption.
- A rich set of peripheral interfaces and GPIOs suitable for various scenarios and complex applications.
Block Diagram Description
The block diagram illustrates the ESPressif ESP32-C3 Wi-Fi + BLE SoC. It features a Main CPU (RISC-V 32-bit Microprocessor) connected to Memory blocks (ROM, Cache, SRAM, RTC Memory). Connectivity is handled by WLAN (Wi-Fi MAC, Wi-Fi baseband) and RF (RF receiver, Clock generator, RF transmitter) modules, alongside BLE 5.0 (Link Controller, Baseband). Peripherals and Sensors include Embedded Flash, I2C, SPI, GPIO, LED PWM, TWAI, RMT, USB Serial/JTAG, RTC, PMU, Switch, Balun, Temperature sensor, GDMA, UART, and ADC. A dedicated section highlights Cryptographic Hardware Acceleration capabilities such as SHA, RSA, AES, RNG, HMAC, Digital Signature, and XTS-AES-128 flash encryption.
Features
Wi-Fi
- IEEE 802.11 b/g/n-compliant.
- Supports 20 MHz, 40 MHz bandwidth in the 2.4 GHz band.
- 1T1R mode with data rate up to 150 Mbps.
- Wi-Fi Multimedia (WMM).
- TX/RX A-MPDU, TX/RX A-MSDU.
- Immediate Block ACK.
- Fragmentation and defragmentation.
- Transmit opportunity (TXOP).
- Automatic Beacon monitoring (hardware TSF).
- 4 x virtual Wi-Fi interfaces.
- Simultaneous support for Infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode. (Note: SoftAP channel changes with Station channel when scanning).
- Antenna diversity.
- 802.11mc FTM.
Bluetooth
- Bluetooth LE: Bluetooth 5, Bluetooth mesh.
- Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps.
- Advertising extensions.
- Multiple advertisement sets.
- Channel selection algorithm #2.
CPU and Memory
- 32-bit RISC-V single-core processor, up to 160 MHz.
- 384 KB ROM.
- 400 KB SRAM (16 KB for cache).
- 8 KB SRAM in RTC.
- Embedded flash (details in Chapter 1: Family Member Comparison).
External Flash Interface
- SPI, Dual SPI, Quad SPI, and QPI interfaces for connection to multiple external flash.
Advanced Peripheral Interfaces
- 22 x programmable GPIOs.
- 2 x 12-bit SAR ADCs, up to 6 channels.
- 1 x temperature sensor.
- 3 x SPI.
- 2 x UART.
- 1 x I2C.
- 1 x I2S.
- Remote control peripheral, with 2 transmit channels and 2 receive channels.
- LED PWM controller, up to 6 channels.
- Full-speed USB Serial/JTAG controller.
- General DMA controller, with 3 transmit channels and 3 receive channels.
- 1 x TWAI® controller (compatible with ISO 11898-1).
Low Power Management
- Power Management Unit with five power modes.
Security
- Secure boot.
- Flash encryption.
- 4096-bit OTP, up to 1792 bits for users.
- Cryptographic hardware acceleration: AES-128/256 (FIPS PUB 197), SHA Accelerator (FIPS PUB 180-4), RSA Accelerator, Random Number Generator (RNG), HMAC, Digital signature.
- Permission Control.
Applications (A Non-exhaustive List)
With ultra-low power consumption, the ESP32-C3 family is an ideal choice for IoT devices in the following areas:
- Smart Home: Light control, Smart button, Smart plug, Indoor positioning.
- Industrial Automation: Industrial robot, Mesh network, Human machine interface (HMI), Industrial field bus.
- Health Care: Health monitor, Baby monitor.
- Consumer Electronics: Smart watch and bracelet, Over-the-top (OTT) devices.
- Connectivity Devices: Wi-Fi and Bluetooth speaker, Logger toys and proximity sensing toys.
- Smart Agriculture: Smart greenhouse, Smart irrigation, Agriculture robot.
- Retail and Catering: POS machines, Service robot.
- Audio Device: Internet music players, Live streaming devices, Internet radio players.
- IoT Infrastructure: Generic Low-power IoT Sensor Hubs, Generic Low-power IoT Data Loggers.
1 Family Member Comparison
1.1 Family Nomenclature
The ESP32-C3 family nomenclature follows the pattern ESP32-C3-[F]-[H/N]-[X], where:
- 'F' indicates the Flash size in MB.
- 'H' or 'N' indicates the Flash temperature rating (High or Normal).
- 'X' indicates the presence of embedded flash.
1.2 Comparison
Ordering Code | Embedded Flash | Ambient Temperature (°C) | Package (mm) |
---|---|---|---|
ESP32-C3 | -- | -40 ~ 105 | QFN32 (5*5) |
ESP32-C3FN4 | 4 MB | -40 ~ 85 | QFN32 (5*5) |
ESP32-C3FH4 | 4 MB | -40 ~ 105 | QFN32 (5*5) |
2 Pin Definition
2.1 Pin Layout
The pin layout diagram shows the top view of the ESP32-C3 chip package with 33 pins. Pins are numbered 1 through 33 and labeled with their functions, including power domains (VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU, GND), crystal interfaces (XTAL_P, XTAL_N, XTAL_32K_P, XTAL_32K_N), general-purpose input/output (GPIO) pins, and peripheral-specific signals (LNA_IN, CHIP_EN, MTMS, MTDI, MTCK, MTDO, SPIQ, SPID, SPICLK, SPICS0, SPIWP, SPIHD, VDD_SPI, U0RXD, U0TXD).
2.2 Pin Description
Name | No. | Type | Power Domain | Function |
---|---|---|---|---|
LNA_IN | 1 | I/O | -- | RF input and output |
VDD3P3 | 2 | PA | -- | Analog power supply |
VDD3P3 | 3 | PA | -- | Analog power supply |
XTAL_32K_P | 4 | I/O/T | VDD3P3_RTC | GPIO0, ADC1_CH0, XTAL_32K_P |
XTAL_32K_N | 5 | I/O/T | VDD3P3_RTC | GPIO1, ADC1_CH1, XTAL_32K_N |
GPIO2 | 6 | I/O/T | VDD3P3_RTC | GPIO2, ADC1_CH2, FSPIQ |
CHIP_EN | 7 | I | VDD3P3_RTC | High: enables the chip. Low: powers off the chip. Note: Do not leave floating. |
GPIO3 | 8 | I/O/T | VDD3P3_RTC | GPIO3, ADC1_CH3 |
MTMS | 9 | I/O/T | VDD3P3_RTC | GPIO4, ADC1_CH4, FSPIHD, MTMS |
MTDI | 10 | I/O/T | VDD3P3_RTC | GPIO5, ADC2_CH0, FSPIWP, MTDI |
VDD3P3_RTC | 11 | PD | -- | Input power supply for RTC |
MTCK | 12 | I/O/T | VDD3P3_CPU | GPIO6, FSPICLK, MTCK |
MTDO | 13 | I/O/T | VDD3P3_CPU | GPIO7, FSPID, MTDO |
GPIO8 | 14 | I/O/T | VDD3P3_CPU | GPIO8 |
GPIO9 | 15 | I/O/T | VDD3P3_CPU | GPIO9 |
GPIO10 | 16 | I/O/T | VDD3P3_CPU | GPIO10, FSPICS0 |
VDD3P3_CPU | 17 | PD | -- | Input power supply for CPU IO |
VDD_SPI | 18 | I/O/T/PD | VDD3P3_CPU | GPIO11, output power supply for flash |
SPIHD | 19 | I/O/T | VDD3P3_CPU | GPIO12, SPIHD |
SPIWP | 20 | I/O/T | VDD3P3_CPU | GPIO13, SPIWP |
SPICS0 | 21 | I/O/T | VDD3P3_CPU | GPIO14, SPICS0 |
SPICLK | 22 | I/O/T | VDD3P3_CPU | GPIO15, SPICLK |
SPID | 23 | I/O/T | VDD3P3_CPU | GPIO16, SPID |
SPIQ | 24 | I/O/T | VDD3P3_CPU | GPIO17, SPIQ |
GPIO18 | 25 | I/O/T | VDD3P3_CPU | GPIO18, USB_D- |
GPIO19 | 26 | I/O/T | VDD3P3_CPU | GPIO19, USB_D+ |
U0RXD | 27 | I/O/T | VDD3P3_CPU | GPIO20, U0RXD |
U0TXD | 28 | I/O/T | VDD3P3_CPU | GPIO21, U0TXD |
XTAL_N | 29 | -- | -- | External crystal output |
XTAL_P | 30 | -- | -- | External crystal input |
VDDA | 31 | PA | -- | Analog power supply |
VDDA | 32 | PA | -- | Analog power supply |
GND | 33 | G | -- | Ground |
Notes:
- PA: analog power supply; PD: power supply for RTC IO; I: input; O: output; T: high impedance.
- Ports of embedded flash correspond to pins of ESP32-C3FN4 and ESP32-C3FH4: CS# = SPICS0, IO0/DI = SPID, IO1/DO = SPIQ, CLK = SPICLK, IO2/WP# = SPIWP, IO3/HOLD# = SPIHD. These pins are not recommended for other uses.
- For data port connection between ESP32-C3 family and external flash, refer to Section 3.4.2 Serial Peripheral Interface (SPI).
- Pin function refers to fixed settings and does not cover all GPIO matrix cases. Refer to ESP32-C3 Technical Reference Manual for GPIO matrix details.
2.3 Power Scheme
Digital pins are divided into four power domains: VDD3P3_CPU, VDD_SPI, VDD3P3_RTC. VDD3P3_CPU is the input power supply for the CPU. VDD_SPI can be an input or output power supply. VDD3P3_RTC is the input power supply for the RTC analog domain and CPU.
The power scheme diagram shows VDD3P3_RTC and VDD3P3_CPU powered by LDOs at 1.1V. VDD_SPI is a separate domain, capable of being powered by VDD3P3_CPU via RSPI (3.3V) and can operate as an output. It depicts RTC IO, RTC Domain, CPU Domain, and VDD_SPI Domain.
When VDD_SPI acts as an output, it can be powered by VDD3P3_CPU. VDD_SPI can be powered off via software to minimize current leakage in Deep-sleep mode.
2.4 Strapping Pins
The ESP32-C3 family has three strapping pins: GPIO2, GPIO8, GPIO9, and GPIO10. Their values are sampled during system reset to determine boot mode and other configurations. These pins function as normal pins after reset.
Types of system reset include: power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog reset, and crystal clock glitch detection reset.
GPIO9 has internal pull-up resistors by default. If unconnected, internal pull-up/pull-down determines its input level.
Pin | Default | SPI Boot | Download Boot |
---|---|---|---|
GPIO2 | N/A | 1 | 1 |
GPIO8 | N/A | Don't care | 1 |
GPIO9 | Pull-up | 1 | 0 |
Pin | Default | Functionality |
---|---|---|
GPIO8 | N/A | Enabling/Disabling ROM Code Print During Booting: When EFUSE_UART_PRINT_CONTROL is 0 (default), print is enabled and not controlled by GPIO8. |
1, if GPIO8 is 0, print is enabled; if GPIO8 is 1, it is disabled. | ||
2, if GPIO8 is 0, print is disabled; if GPIO8 is 1, it is enabled. | ||
3, print is disabled and not controlled by GPIO8. | ||
GPIO10 | N/A | Controlling JTAG Signal Source During Booting: When EFUSE bit EFUSE_STRAP_JTAG_SEL is 0 (default), JTAG signals come from USB Serial/JTAG controller. |
1, if GPIO10 is 0, JTAG signals come from chip pins; if GPIO10 is 1, JTAG signals come from USB Serial/JTAG controller. |
The strapping combination of GPIO8 = 0 and GPIO9 = 0 is invalid and will trigger unexpected behavior.
The setup and hold times diagram shows the timing relationship between the CHIP_PU signal and a strapping pin during power-up and reset. It indicates setup time (t0) before CHIP_PU goes high and hold time (t1) after CHIP_PU goes high.
Parameter | Description | Min (ms) |
---|---|---|
t0 | Setup time before CHIP_PU goes from low to high | 0 |
t1 | Hold time after CHIP_PU goes high | 3 |
3 Functional Description
3.1 CPU and Memory
3.1.1 CPU
The ESP32-C3 family features a low-power 32-bit RISC-V single-core microprocessor with a four-stage pipeline, supporting clock frequencies up to 160 MHz. It includes RV32IMC ISA, 32-bit multiplier/divider, up to 32 vectored interrupts, 8 hardware breakpoints/watchpoints, up to 16 PMP regions, and JTAG for debugging.
3.1.2 Internal Memory
Internal memory includes:
- 384 KB of ROM for booting and core functions.
- 400 KB of on-chip SRAM for data and instructions (16 KB configured for cache).
- 8 KB of RTC memory (SRAM) accessible by the main CPU, retaining data in Deep-sleep mode.
- 4 Kbit of eFuse (1792 bits reserved for user data, encryption keys, and device ID).
- Embedded flash (details in Chapter 1: Family Member Comparison).
3.1.3 External Flash
The ESP32-C3 family supports SPI, Dual SPI, Quad SPI, and QPI interfaces for connecting to external flash memory up to 16 MB. It features hardware encryption/decryption based on XTS-AES. High-speed caches support up to 8 MB of instruction memory space and 8 MB of data memory space, mappable from flash in 64 KB blocks with 8/16/32-bit reads.
After initialization, software can customize external flash mapping into the CPU address space.
3.1.4 Address Mapping Structure
The address mapping structure diagram illustrates memory organization. It shows address ranges for Cache (0x0000_0000 - 0x3BFF_FFFF), SRAM (0x3C00_0000 - 0x3C7F_FFFF), ROM (0x4000_0000 - 0x4005_FFFF), GDMA, RTC FAST Memory, and Peripherals. An MMU connects to External Memory. Memory spaces with gray background are unavailable.
3.1.5 Cache
The ESP32-C3 has an eight-way set associative, read-only cache with the following features: size of 16 KB, block size of 32 bytes, pre-load function, lock function, and critical word first and early restart.
3.2 System Clocks
3.2.1 CPU Clock
The CPU clock sources are: external main crystal clock, internal 20 MHz oscillator, and PLL clock. The application can select the clock source for the CPU clock.
3.2.2 RTC Clock
The RTC slow clock is used for RTC counter, watchdog, and low-power controller. Sources include: external low-speed (32 kHz) crystal, internal RC oscillator (~150 kHz), and internal 78.125 kHz clock. The RTC fast clock, used for RTC peripherals and sensor controllers, has two sources: external main crystal clock divided by 2, and internal 20 MHz oscillator.
3.3 Analog Peripherals
3.3.1 Analog-to-Digital Converter (ADC)
The ESP32-C3 integrates two 12-bit SAR ADCs supporting measurements on 6 channels. ADC characteristics are detailed in Table 14.
3.3.2 Temperature Sensor
A temperature sensor generates a voltage proportional to temperature, converted to a digital value by an ADC. It operates in the range of -40 °C to 125 °C and primarily senses internal chip temperature changes, which may be higher than ambient temperature.
3.4 Digital Peripherals
3.4.1 General Purpose Input / Output Interface (GPIO)
The ESP32-C3 has 22 GPIO pins, configurable for digital or analog functions (like ADC). GPIOs support selectable internal pull-up/pull-down resistors or high impedance. They can trigger CPU interrupts and are bi-directional with tristate control. Pins can be multiplexed with other functions (UART, SPI, etc.) and can be set to a holding state for low-power operations.
Interface | Signal | Pin | Function |
---|---|---|---|
ADC | ADC1_CH0 | XTAL_32K_P | Two 12-bit SAR ADCs |
ADC1_CH1 | XTAL_32K_N | ||
ADC1_CH2 | GPIO2 | ||
ADC1_CH3 | GPIO3 | ||
ADC1_CH4 | MTMS | ||
ADC2_CH0 | MTDI | ||
JTAG | MTDI | MTDI | JTAG for software debugging |
MTCK | MTCK | ||
MTMS | MTMS | ||
MTDO | MTDO | ||
UART | U0RXD_in | Any GPIO pins | Two UART channels with hardware flow control and GDMA |
U0CTS_in | |||
U0DSR_in | |||
U0TXD_out | |||
U0RTS_out | |||
U0DTR_out | |||
U1RXD_in | |||
U1CTS_in | |||
U1DSR_in | |||
U1TXD_out | |||
U1RTS_out | |||
U1DTR_out | |||
I2C | I2CEXT0_SCL_in | ||
I2CEXT0_SDA_in | |||
I2CEXT1_SCL_in | |||
I2CEXT1_SDA_in | One I2C channel in slave or master mode | ||
I2CEXT0_SCL_out | |||
I2CEXT0_SDA_out | |||
I2CEXT1_SCL_out | |||
I2CEXT1_SDA_out | |||
LED PWM | ledc_ls_sig_out0~5 | Any GPIO pins | Six independent PWM channels |
I2S | I2S0O_BCK_in | Any GPIO pins | Stereo input and output from/to the audiocodec |
I2S_MCLK_in | |||
I2SO_WS_in | |||
I2SI_SD_in | |||
I2SI_BCK_in | |||
I2SI_WS_in | |||
I2SO_BCK_out | |||
I2S_MCLK_out | |||
I2SO_WS_out | |||
I2SO_SD_out | |||
I2SI_BCK_out | |||
I2SI_WS_out | |||
I2SO_SD1_out | |||
Remote Control Peripheral | RMT_SIG_IN0~1 | Any GPIO pins | Two channels for an IR transceiver of various waveforms |
RMT_SIG_OUT0~1 | |||
SPI0/1 | SPICLK_out_mux | SPICLK | Support Standard SPI, Dual SPI, Quad SPI, and QPI that allow connection to external flash |
SPICS0_out | SPICS0 | ||
SPICS1_out | Any GPIO pins | ||
SPID_in/_out | SPID | ||
SPIQ_in/_out | SPIQ | ||
SPIWP_in/_out | SPIWP | ||
SPIHD_in/_out | SPIHD | ||
SPI2 | FSPICLK_in/_out_mux | Any GPIO pins | Master mode and slave mode of SPI, Dual SPI, Quad SPI, and QPI; Connection to external flash, RAM, and other SPI devices; Four modes of SPI transfer format; Configurable SPI frequency; 64-byte FIFO or GDMA buffer |
FSPICS0_in/_out | |||
FSPICS1~5_out | |||
FSPID_in/_out | |||
FSPIQ_in/_out | |||
FSPIWP_in/_out | |||
FSPIHD_in/_out | |||
USB Serial/JTAG | USB_D+ | GPIO19 | USB-to-serial converter, and USB-to-JTAG converter |
USB_D- | GPIO18 | ||
TWAI | twai_rx | Any GPIO pins | Compatible with ISO 11898-1 protocol |
twai_tx | |||
twai_bus_off_on | |||
twai_clkout |
3.4.2 Serial Peripheral Interface (SPI)
The ESP32-C3 family features three SPI interfaces (SPI0, SPI1, and SPI2). SPI0 and SPI1 are for SPI memory mode, while SPI2 supports both SPI memory and general-purpose SPI modes (master/slave). SPI memory mode supports up to 120 MHz clock frequency in STR mode. General-purpose SPI2 supports two-line full-duplex and single-/two-/four-line half-duplex communication, with configurable clock polarity and phase. It can connect to GDMA.
Chip Pin | External Flash Data Port | ||
---|---|---|---|
SPI Single-Line Mode | SPI Two-Line Mode | SPI Four-Line Mode | |
SPID (SPID) | DI | IO0 | IO0 |
SPIQ (SPIQ) | DO | IO1 | IO1 |
SPIWP (SPIWP) | WP# | -- | IO2 |
SPIHD (SPIHD) | HOLD# | -- | IO3 |
3.4.3 Universal Asynchronous Receiver Transmitter (UART)
Two UART interfaces (UART0, UART1) support IrDA and asynchronous communication (RS232, RS485) up to 5 Mbps. They provide hardware flow control (CTS/RTS) and software flow control (XON/XOFF), connecting to GDMA via UHCI0.
3.4.4 I2C Interface
The I2C interface supports master or slave mode, with standard mode (100 Kbit/s), fast mode (400 Kbit/s), and up to 800 Kbit/s. It supports 7-bit and 10-bit addressing, double addressing, and 7-bit broadcast address.
3.4.5 I2S Interface
A standard I2S interface operates as master or slave in full-duplex or half-duplex mode, configurable for 8/16/24/32-bit serial communication. BCK clock frequency ranges from 10 kHz to 40 MHz. It supports TDM PCM, TDM MSB alignment, TDM standard, and PDM TX, connecting to GDMA.
3.4.6 Remote Control Peripheral
The RMT supports two channels for infrared remote transmission and two for reception, using pulse waveform control. It shares a 192 × 32-bit memory block for waveform storage.
3.4.7 LED PWM Controller
The LED PWM controller generates independent digital waveforms on six channels with configurable periods and duty cycles (up to 18 bits). It uses multiple clock sources and can operate in Light-sleep mode, supporting gradual duty cycle changes for effects like RGB color gradients.
3.4.8 General DMA Controller
A general DMA controller (GDMA) has six independent channels (3 transmit, 3 receive), shared by peripherals with DMA features. It implements a fixed-priority scheme and uses linked lists for high-speed peripheral-to-memory and memory-to-memory data transfers. Peripherals with DMA include SPI2, UHCI0, I2S, AES, SHA, and ADC.
3.4.9 USB Serial/JTAG Controller
The integrated USB Serial/JTAG controller is USB 2.0 full speed compliant (12 Mbit/s), offering CDC-ACM virtual serial port, JTAG adapter functionality, flash programming, and CPU debugging. It includes a full-speed USB PHY.
3.4.10 TWAI® Controller
The TWAI® controller is compatible with ISO 11898-1, supporting standard (11-bit ID) and extended (29-bit ID) frames. Bit rates range from 1 Kbit/s to 1 Mbit/s. It operates in Normal, Listen Only, and Self-Test modes, features a 64-byte receive FIFO, acceptance filters, and error detection/handling.
3.5 Radio and Wi-Fi
The ESP32-C3 radio consists of a 2.4 GHz receiver, 2.4 GHz transmitter, bias and regulators, balun, transmit-receive switch, and clock generator.
3.5.1 2.4 GHz Receiver
The receiver demodulates 2.4 GHz RF signals to quadrature baseband signals using high-resolution ADCs. It integrates RF filters, Automatic Gain Control (AGC), DC offset cancelation, and baseband filters.
3.5.2 2.4 GHz Transmitter
The transmitter modulates baseband signals to 2.4 GHz RF, driving an antenna with a high-powered CMOS amplifier. Digital calibration improves linearity and cancels imperfections like carrier leakage, I/Q amplitude/phase mismatch, baseband/RF nonlinearities, and antenna matching.
3.5.3 Clock Generator
The clock generator produces quadrature clock signals for the receiver and transmitter. It integrates inductors, varactors, filters, regulators, and dividers. Built-in calibration and self-test circuits optimize quadrature clock phases and phase noise.
3.5.4 Wi-Fi Radio and Baseband
Supports 802.11b/g/n, 20/40 MHz bandwidth, MCS0-7, MCS32, 0.4 µs guard interval, data rates up to 150 Mbps, RX STBC, adjustable transmit power, and antenna diversity via an external RF switch controlled by GPIOs.
3.5.5 Wi-Fi MAC
Implements the 802.11 b/g/n MAC protocol, supporting BSS STA and SoftAP operations. Features include 4 virtual Wi-Fi interfaces, infrastructure BSS modes, RTS/CTS protection, Block ACK, fragmentation, TX/RX A-MPDU/A-MSDU, TXOP, WMM, various security protocols (GCMP, CCMP, WPA2/3), hardware TSF, and 802.11mc FTM.
3.5.6 Networking Features
Espressif provides libraries for TCP/IP networking, ESP-WIFI-MESH, and other Wi-Fi protocols. TLS 1.0, 1.1, and 1.2 are supported.
3.6 Bluetooth LE
The Bluetooth Low Energy subsystem integrates a hardware link layer controller, RF/modem block, and software protocol stack, supporting Bluetooth 5 and mesh features.
3.6.1 Bluetooth LE Radio and PHY
Supports 1 Mbps PHY, 2 Mbps PHY for high throughput, and coded PHY (125/500 Kbps) for sensitivity and range. Includes Listen Before Talk (LBT) and antenna diversity.
3.6.2 Bluetooth LE Link Layer Controller
Supports LE advertising extensions, multiple advertisement sets, simultaneous advertising/scanning, multiple connections, adaptive frequency hopping, LE channel selection algorithm #2, connection parameter update, high duty cycle non-connectable advertising, LE privacy 1.2, LE data packet length extension, link layer extended scanner filter policies, low duty cycle directed advertising, link layer encryption, and LE Ping.
3.7 Low Power Management
The ESP32-C3 family supports multiple power modes:
- Active mode: CPU and radio are powered on for receive, transmit, or listen operations.
- Modem-sleep mode: CPU is operational at reduced speed; Wi-Fi/Bluetooth baseband and radio are disabled, but connections can remain active.
- Light-sleep mode: CPU is paused; wake-up events (MAC, host, RTC, external interrupts) reactivate the chip. Wi-Fi/Bluetooth connections can remain active.
- Deep-sleep mode: CPU and most peripherals are powered down; only RTC memory is powered. Wi-Fi connection data is stored in RTC memory.
- Hibernation mode: Internal 20 MHz oscillator is disabled; only an RTC timer on the slow clock is active. RTC timer or RTC GPIOs can wake the chip.
For power consumption details in different modes, refer to Table 16.
3.8 Timers
3.8.1 General Purpose Timers
Two 54-bit general-purpose timers are embedded, based on 16-bit prescalers and 54-bit auto-reload up/down timers. Features include a 16-bit clock prescaler (1 to 65536), a 54-bit time-base counter (programmable increment/decrement), real-time value reading, halting/resuming, programmable alarm generation, and level interrupt generation.
3.8.2 System Timer
A 52-bit system timer integrates two 52-bit counters and three comparators. It operates with a fixed 16 MHz clock and supports three types of interrupts. Alarm modes include target and period modes, with 52-bit target alarm and 26-bit periodic alarm values. Counters auto-reload and can stall if the CPU stalls or is in OCD mode.
3.8.3 Watchdog Timers
Three watchdog timers exist: two Main System Watchdog Timers (MWDT) in timer groups and one RTC Watchdog Timer (RWDT). They are enabled during flash boot to detect and recover from errors. Watchdog timers have four stages, each configurable for timeout, enabled/disabled status, and interrupt/reset actions. They feature a 32-bit expiry counter, write protection, and flash boot protection.
3.9 Cryptographic Hardware Accelerators
The ESP32-C3 is equipped with hardware accelerators for AES-128/256, SHA1/224/256, RSA3072, and ECC. It supports Big Integer Multiplication and Big Integer Modular Multiplication (up to 3072 bits).
3.10 Physical Security Features
- Transparent external flash encryption (AES-XTS) with software-inaccessible keys prevents unauthorized readout.
- Secure boot uses a hardware root of trust for signed firmware verification (RSA-PSS signature).
- HMAC module generates MAC signatures using software-inaccessible keys.
- Digital Signature module generates RSA signatures using software-inaccessible secure keys.
- World Controller provides two secure and general environments for software, establishing a security boundary.
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Stresses beyond these ratings may cause permanent damage. These are stress ratings only.
Symbol | Parameter | Min | Max | Unit |
---|---|---|---|---|
VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDD_SPI | Voltage applied to power supply pins per power domain | -0.3 | 3.6 | V |
TSTORE | Storage temperature | -40 | 150 | °C |
4.2 Recommended Operating Conditions
Symbol | Parameter | Min | Typ | Max | Unit |
---|---|---|---|---|---|
VDDA, VDD3P3, VDD3P3_RTC | Voltage applied to power supply pins per power domain | 3.0 | 3.3 | 3.6 | V |
VDD_SPI (working as input power supply)¹ | 3.0 | 3.3 | 3.6 | V | |
VDD3P3_CPU² | Voltage applied to power supply pin | 3.0 | 3.3 | 3.6 | V |
IVDD3 | Current delivered by external power supply | -- | 0.5 | -- | A |
TA | Ambient temperature | -40 | -- | 105 | °C |
¹ For more information, refer to Section 2.3 Power Scheme. ² When VDD_SPI drives peripherals, VDD3P3_CPU must comply with peripheral specifications. ³ If using a single power supply, recommended output current is 500 mA or more.
4.3 VDD_SPI Output Characteristics
Symbol | Parameter | Typ | Unit |
---|---|---|---|
RSPI | On-resistance in 3.3 V mode | 7.5 | Ω |
In 3.3 V output mode, VDD3P3_CPU may be affected by RSPI. Specification: VDD3P3_CPU > VDD_flash_min + I_flash_max*RSPI. For more information, refer to Section 2.3 Power Scheme.
4.4 DC Characteristics (3.3 V, 25 °C)
Symbol | Parameter | Min | Typ | Max | Unit |
---|---|---|---|---|---|
CIN | Pin capacitance | -- | 2 | -- | pF |
VIH | High-level input voltage | 0.75 x VDD¹ | -- | VDD¹+ 0.3 | V |
VIL | Low-level input voltage | -0.3 | -- | 0.25 x VDD¹ | V |
IIH | High-level input current | -- | -- | 50 | nA |
IIL | Low-level input current | -- | -- | 50 | nA |
VOH² | High-level output voltage | 0.8 x VDD¹ | -- | -- | V |
VOL² | Low-level output voltage | -- | -- | 0.1 x VDD¹ | V |
IOH | High-level source current (VDD¹= 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3) | -- | 40 | -- | mA |
IOL | Low-level sink current (VDD¹= 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3) | -- | 28 | -- | mA |
RPU | Pull-up resistor | -- | 45 | -- | kΩ |
RPD | Pull-down resistor | -- | 45 | -- | kΩ |
VIH_nRST | Chip reset release voltage | 0.75 x VDD¹ | -- | VDD¹+ 0.3 | V |
VIL_nRST | Chip reset voltage | -0.3 | -- | 0.25 x VDD¹ | V |
¹ VDD is the I/O voltage for a particular power domain. ² VOH and VOL are measured using high-impedance load.
4.5 ADC Characteristics
Symbol | Parameter | Min | Max | Unit |
---|---|---|---|---|
DNL (Differential nonlinearity)¹ | ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi off | -7 | 7 | LSB |
INL (Integral nonlinearity) | -12 | 12 | LSB | |
Sampling rate | -- | 2 | Msps | |
Effective Range | ATTEN0 | 0 | 750 | mV |
ATTEN1 | 0 | 1050 | mV | |
ATTEN2 | 0 | 1300 | mV | |
ATTEN3 | 0 | 2500 | mV |
¹ To get better DNL results, sample multiple times and apply a filter, or calculate the average value.
4.6 Current Consumption
Current consumption is measured with a 3.3 V supply at 25 °C ambient temperature at the RF port. All transmitters' measurements are based on a 100% duty cycle.
Work mode | Description | Peak (mA) | |
---|---|---|---|
Active (RF working) | TX | 802.11b, 1 Mbps, @21 dBm | 325 |
802.11g, 54 Mbps, @19 dBm | 272 | ||
802.11n, HT20, MCS 7, @18.5 dBm | 260 | ||
802.11n, HT40, MCS 7, @18.5 dBm | 262 | ||
RX | 802.11b/g/n, HT20 | 84 | |
802.11n, HT40 | 87 |
Work mode | Description | Typ | Unit |
---|---|---|---|
Modem-sleep¹, ² | The CPU is powered on³ | 160 MHz: 20 mA Normal speed: 80 MHz: 15 mA |
mA |
Light-sleep | -- | 130 | µA |
Deep-sleep | RTC timer + RTC memory | 5 | µA |
Power off | CHIP_PU is set to low level, the chip is powered off | 1 | µA |
¹ Current consumption in Modem-sleep mode assumes CPU is powered on and cache is idle. ² When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. ³ In Modem-sleep mode, CPU frequency changes based on load and peripherals used.
4.7 Reliability
Test Item | Test Conditions | Test Standard |
---|---|---|
HTOL (High Temperature Operating Life) | 125 °C, 1000 hours | JESD22-A108 |
ESD (Electro-Static Discharge Sensitivity) | HBM (Human Body Mode)¹ ± 2000 V CDM (Charge Device Mode)² ± 500 V |
JESD22-A114 JESD22-C101F |
Latch up | Current trigger ± 200 mA Voltage trigger 1.5 × VDDmax |
JESD78 |
Preconditioning | Bake 24 hours @125 °C Moisture soak (level 3: 192 hours @30 °C, 60% RH) IR reflow solder: 260 + 0 °C, 20 seconds, three times |
J-STD-020, JESD47, JESD22-A113 |
TCT (Temperature Cycling Test) | -65 °C / 150 °C, 500 cycles | JESD22-A104 |
Autoclave Test | 121 °C, 100% RH, 96 hours | JESD22-A102 |
uHAST (Highly Accelerated Stress Test, unbiased) | 130 °C, 85% RH, 96 hours | JESD22-A118 |
HTSL (High Temperature Storage Life) | 150 °C, 1000 hours | JESD22-A103 |
¹ JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ² JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.
4.8 Wi-Fi Radio
Parameter | Min (MHz) | Typ (MHz) | Max (MHz) |
---|---|---|---|
Center frequency of operating channel | 2412 | -- | 2484 |
4.8.1 Wi-Fi RF Transmitter (TX) Specifications
Rate | Min (dBm) | Typ (dBm) | Max (dBm) |
---|---|---|---|
802.11b, 1 Mbps | -- | 21.0 | -- |
802.11b, 11 Mbps | -- | 21.0 | -- |
802.11g, 6 Mbps | -- | 21.0 | -- |
802.11g, 54 Mbps | -- | 19.0 | -- |
802.11n, HT20, MCS 0 | -- | 20.0 | -- |
802.11n, HT20, MCS 7 | -- | 18.5 | -- |
802.11n, HT40, MCS 0 | -- | 20.0 | -- |
802.11n, HT40, MCS 7 | -- | 18.5 | -- |
Rate | Min (dB) | Typ (dB) | SL¹ (dB) |
---|---|---|---|
802.11b, 1 Mbps, @21 dBm | -- | -24.8 | -10 |
802.11b, 11 Mbps, @21 dBm | -- | -24.7 | -10 |
802.11g, 6 Mbps, @21 dBm | -- | -22.1 | -5 |
802.11g, 54 Mbps, @19 dBm | -- | -28.0 | -25 |
802.11n, HT20, MCS 0, @20 dBm | -- | -26.4 | -5 |
802.11n, HT20, MCS 7, @18.5 dBm | -- | -29.4 | -27 |
802.11n, HT40, MCS 0, @20 dBm | -- | -27.8 | -5 |
802.11n, HT40, MCS 7, @18.5 dBm | -- | -29.3 | -27 |
¹ SL stands for standard limit value.
4.8.2 Wi-Fi RF Receiver (RX) Specifications
Rate | Min (dBm) | Typ (dBm) | Max (dBm) |
---|---|---|---|
802.11b, 1 Mbps | -- | -98.4 | -- |
802.11b, 2 Mbps | -- | -96.0 | -- |
802.11b, 5.5 Mbps | -- | -93.0 | -- |
802.11b, 11 Mbps | -- | -88.6 | -- |
802.11g, 6 Mbps | -- | -93.8 | -- |
802.11g, 9 Mbps | -- | -92.2 | -- |
802.11g, 12 Mbps | -- | -91.0 | -- |
802.11g, 18 Mbps | -- | -88.4 | -- |
802.11g, 24 Mbps | -- | -85.8 | -- |
802.11g, 36 Mbps | -- | -82.0 | -- |
802.11g, 48 Mbps | -- | -78.0 | -- |
802.11g, 54 Mbps | -- | -76.6 | -- |
802.11n, HT20, MCS 0 | -- | -93.6 | -- |
802.11n, HT20, MCS 1 | -- | -90.8 | -- |
802.11n, HT20, MCS 2 | -- | -88.4 | -- |
802.11n, HT20, MCS 3 | -- | -85.0 | -- |
802.11n, HT20, MCS 4 | -- | -81.8 | -- |
802.11n, HT20, MCS 5 | -- | -77.8 | -- |
802.11n, HT20, MCS 6 | -- | -76.0 | -- |
802.11n, HT20, MCS 7 | -- | -74.8 | -- |
802.11n, HT40, MCS 0 | -- | -90.0 | -- |
802.11n, HT40, MCS 1 | -- | -88.0 | -- |
802.11n, HT40, MCS 2 | -- | -85.2 | -- |
802.11n, HT40, MCS 3 | -- | -82.0 | -- |
802.11n, HT40, MCS 4 | -- | -78.8 | -- |
802.11n, HT40, MCS 5 | -- | -74.6 | -- |
802.11n, HT40, MCS 6 | -- | -73.0 | -- |
802.11n, HT40, MCS 7 | -- | -71.4 | -- |
Rate | Min (dBm) | Typ (dBm) | Max (dBm) |
---|---|---|---|
802.11b, 1 Mbps | -- | 5 | -- |
802.11b, 11 Mbps | -- | 5 | -- |
802.11g, 6 Mbps | -- | 5 | -- |
802.11g, 54 Mbps | -- | 0 | -- |
802.11n, HT20, MCS 0 | -- | 5 | -- |
802.11n, HT20, MCS 7 | -- | 0 | -- |
802.11n, HT40, MCS 0 | -- | 5 | -- |
802.11n, HT40, MCS 7 | -- | 0 | -- |
Rate | Min (dB) | Typ (dB) | Max (dB) |
---|---|---|---|
802.11b, 1 Mbps | -- | 35 | -- |
802.11b, 11 Mbps | -- | 35 | -- |
802.11g, 6 Mbps | -- | 31 | -- |
802.11g, 54 Mbps | -- | 14 | -- |
802.11n, HT20, MCS 0 | -- | 31 | -- |
802.11n, HT20, MCS 7 | -- | 13 | -- |
802.11n, HT40, MCS 0 | -- | 19 | -- |
802.11n, HT40, MCS 7 | -- | 8 | -- |
4.9 Bluetooth LE Radio
4.9.1 Bluetooth LE RF Transmitter (TX) Specifications
Parameter | Min | Typ | Max | Unit |
---|---|---|---|---|
RF transmit power | -- | 0 | -- | dBm |
Gain control step | -- | 3 | -- | dB |
RF power control range | -27 | -- | 18 | dBm |
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
In-band emissions | F = F0 ± 2 MHz | -- | -37.62 | -- | dBm |
F = F0 ± 3 MHz | -- | -41.95 | -- | dBm | |
F = F0 ± > 3 MHz | -- | -44.48 | -- | dBm | |
Modulation characteristics | Δ f1avg | -- | 245.00 | -- | kHz |
Δ f2max | -- | 208.00 | -- | kHz | |
Δ f2avg/ Δ f1avg | -- | 0.93 | -- | -- | |
Carrier frequency offset | -- | -9.00 | -- | kHz | |
Carrier frequency drift | |f0 - fn|n=2, 3, 4, ..k | -- | 1.17 | -- | kHz |
|f1 - f0| | -- | 0.30 | -- | kHz | |
|fn - fn-5|n=6, 7, 8, ..k | -- | 4.90 | -- | kHz |
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
In-band emissions | F = F0 ± 4 MHz | -- | -43.55 | -- | dBm |
F = F0 ± 5 MHz | -- | -45.26 | -- | dBm | |
F = F0 ± > 5 MHz | -- | -47.00 | -- | dBm | |
Modulation characteristics | Δ f1avg | -- | 497.00 | -- | kHz |
Δ f2max | -- | 398.00 | -- | kHz | |
Δ f2avg/ Δ f1avg | -- | 0.95 | -- | -- | |
Carrier frequency offset | -- | -9.00 | -- | kHz | |
Carrier frequency drift | |f0 - fn|n=2, 3, 4, ..k | -- | 0.46 | -- | kHz |
|f1 - f0| | -- | 0.70 | -- | kHz | |
|fn - fn-5|n=6, 7, 8, ..k | -- | 6.80 | -- | kHz |
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
In-band emissions | F = F0 ± 2 MHz | -- | -37.90 | -- | dBm |
F = F0 ± 3 MHz | -- | -41.00 | -- | dBm | |
F = F0 ± > 3 MHz | -- | -42.50 | -- | dBm | |
Modulation characteristics | Δ f1avg | -- | 252.00 | -- | kHz |
Δ f1max | -- | 200.00 | -- | kHz | |
Carrier frequency offset | -- | -13.70 | -- | kHz | |
Carrier frequency drift | |f0 - fn|n=1, 2, 3, ..k | -- | 1.52 | -- | kHz |
|f0 - f3| | -- | 0.65 | -- | kHz | |
|fn - fn-3|n=7, 8, 9, ..k | -- | 0.70 | -- | kHz |
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
In-band emissions | F = F0 ± 2 MHz | -- | -37.90 | -- | dBm |
F = F0 ± 3 MHz | -- | -41.30 | -- | dBm | |
F = F0 ± > 3 MHz | -- | -42.80 | -- | dBm | |
Modulation characteristics | Δ f2avg | -- | 220.00 | -- | kHz |
Δ f2max | -- | 205.00 | -- | kHz | |
Carrier frequency offset | -- | -11.90 | -- | kHz | |
Carrier frequency drift | |f0 - fn|n=1, 2, 3, ..k | -- | 1.37 | -- | kHz |
|f0 - f3| | -- | 1.09 | -- | kHz | |
|fn - fn-3|n=7, 8, 9, ..k | -- | 0.51 | -- | kHz |
4.9.2 Bluetooth LE RF Receiver (RX) Specifications
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Sensitivity @30.8% PER | -- | -- | -97 | dBm | |
Maximum received signal @30.8% PER | -- | -- | 10 | dBm | |
Co-channel C/I | -- | -- | 8 | dB | |
F = F0 + 1 MHz | -- | -4 | -- | dB | |
F = F0 - 1 MHz | -- | -3 | -- | dB | |
F = F0 + 2 MHz | -- | -32 | -- | dB | |
F = F0 - 2 MHz | -- | -36 | -- | dB | |
Adjacent channel selectivity C/I | F > F0 + 3 MHz¹ | -- | -- | -- | dB |
F ≤ F0 - 3 MHz | -- | -39 | -- | dB | |
Image frequency | -- | -29 | -- | dB | |
Adjacent channel to image frequency | F = Fimage + 1 MHz | -- | -38 | -- | dB |
F = Fimage - 1 MHz | -- | -34 | -- | dB | |
Out-of-band blocking performance | 30 MHz ~ 2000 MHz | -- | -9 | -- | dBm |
2003 MHz ~ 2399 MHz | -- | -18 | -- | dBm | |
2484 MHz ~ 2997 MHz | -- | -16 | -- | dBm | |
3000 MHz ~ 12.75 GHz | -- | -6 | -- | dBm | |
Intermodulation | -- | -44 | -- | dBm |
¹ Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz.
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Sensitivity @30.8% PER | -- | -- | -94 | dBm | |
Maximum received signal @30.8% PER | -- | -- | -1 | dBm | |
Co-channel C/I | -- | -- | 10 | dB | |
F = F0 + 2 MHz | -- | -7 | -- | dB | |
F = F0 - 2 MHz | -- | -7 | -- | dB | |
F = F0 + 4 MHz¹ | -- | -34 | -- | dB | |
Adjacent channel selectivity C/I | F = F0 - 4 MHz | -- | -34 | -- | dB |
F ≥ F0 + 6 MHz | -- | -39 | -- | dB | |
F < F0 – 6 MHz | -- | -39 | -- | dB | |
Image frequency | -- | -27 | -- | dB | |
Adjacent channel to image frequency | F = Fimage + 2 MHz | -- | -39 | -- | dB |
F = Fimage - 2 MHz² | -- | -- | -- | dB | |
Out-of-band blocking performance | 30 MHz ~ 2000 MHz | -- | -17 | -- | dBm |
2003 MHz ~ 2399 MHz | -- | -19 | -- | dBm | |
2484 MHz ~ 2997 MHz | -- | -16 | -- | dBm | |
3000 MHz ~ 12.75 GHz | -- | -22 | -- | dBm | |
Intermodulation | -- | -40 | -- | dBm |
¹ Refer to the value of Image frequency. ² Refer to the value of Adjacent channel selectivity C/I when F = F0 + 2 MHz.
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Sensitivity @30.8% PER | -- | -- | -105 | dBm | |
Maximum received signal @30.8% PER | -- | -- | 10 | dBm | |
Co-channel C/I | -- | -- | 2 | dB | |
F = F0 + 1 MHz | -- | -6 | -- | dB | |
F = F0 - 1 MHz | -- | -5 | -- | dB | |
F = F0 + 2 MHz | -- | -40 | -- | dB | |
F = F0 - 2 MHz | -- | -42 | -- | dB | |
Adjacent channel selectivity C/I | F > F0 + 3 MHz¹ | -- | -- | -- | dB |
F ≤ F0 - 3 MHz | -- | -46 | -- | dB | |
Image frequency | -- | -34 | -- | dB | |
Adjacent channel to image frequency | F = Fimage + 1 MHz | -- | -44 | -- | dB |
F = Fimage - 1 MHz | -- | -37 | -- | dB |
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Sensitivity @30.8% PER | -- | -- | -100 | dBm | |
Maximum received signal @30.8% PER | -- | -- | 10 | dBm | |
Co-channel C/I | -- | -- | 3 | dB | |
F = F0 + 1 MHz | -- | -5 | -- | dB | |
F = F0 - 1 MHz | -- | -7 | -- | dB | |
F = F0 + 2 MHz | -- | -39 | -- | dB | |
F = F0 - 2 MHz | -- | -40 | -- | dB | |
Adjacent channel selectivity C/I | F ≥ F0 + 3 MHz¹ | -- | -- | -- | dB |
F ≤ F0 - 3 MHz | -- | -40 | -- | dB | |
Image frequency | -- | -34 | -- | dB | |
Adjacent channel to image frequency | F = Fimage + 1 MHz | -- | -43 | -- | dB |
F = Fimage - 1 MHz | -- | -38 | -- | dB |
¹ Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz.
5 Package Information
The QFN32 (5x5 mm) package diagram shows the physical dimensions and pin layout of the chip. It includes top, bottom, and side views, with detailed dimensional references (A, A1, A3, D, E, E2, b, e, bbb, ddd, eee) and notes regarding all dimensions being in millimeters and conforming to JEDEC MO-220 standards.
For information about tape, reel, and product marking, please refer to Espressif Chip-Packing Information.
Revision History
Date | Version | Release Notes |
---|---|---|
2021-04-07 | V0.7 | Updated information about USB Serial/JTAG Controller; Added GPIO2 to Section 2.4 Strapping Pins; Updated Figure Address Mapping Structure; Added Table General Purpose Input / Output Interface (GPIO) and Table General Purpose Input / Output Interface (GPIO) in Section 3.4.1 General Purpose Input / Output Interface (GPIO); Updated information about SPI2 in Section 3.4.2 Serial Peripheral Interface (SPI); Updated fixed-priority channel scheme in Section 3.4.8 General DMA Controller; Updated Table Reliability. |
2021-01-18 | V0.6 | Clarified that of the 400 KB SRAM, 16 KB is configured as cache; Updated maximum value to standard limit value in Table Wi-Fi RF Transmitter (TX) Specifications in Section 4.8.1 Wi-Fi RF Transmitter (TX) Specifications. |
2021-01-13 | V0.5 | Updated information about Wi-Fi; Added connection between embedded flash ports and chip pins to table notes in Section 2.2 Pin Description; Updated Figure ESP32-C3 Family Power Scheme, added Figure ESP32-C3 Family Power-up and Reset Timing and Table Power Scheme in Section 2.3 Power Scheme; Added Figure Setup and Hold Times for the Strapping Pin and Table Strapping Pins in Section 2.4 Strapping Pins; Updated Table Peripheral Pin Configurations in Section 3.11 Peripheral Pin Configurations; Added Chapter 4 Electrical Characteristics; Added Chapter 5 Package Information. |
2020-11-27 | V0.4 | Preliminary version. |
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- ESP32-C3 Technical Reference Manual
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