BCM56070 Hardware Design Guidelines

Introduction to the BCM56070

This document outlines the essential hardware design guidelines for the Broadcom BCM56070 family of devices. It provides detailed information on the electrical characteristics of high-speed external I/O interfaces, including connection diagrams and routing examples where applicable.

The BCM56070 integrates advanced SerDes cores, such as Merlin (TSC4-MC) and Falcon (TSC4-FC), designed for high-performance networking applications. It also includes a PCIe core for host processor communication.

For a comprehensive understanding of the device's functional aspects, refer to the official BCM56070 data sheet.

Key Design Considerations

  • SerDes Cores: Details on TSC cores, including Merlin and Falcon, their configurations, and operational modes (QMODE and TSC mode).
  • Clock Requirements: Guidance on reference clock connections, including chip reference clock and PCIE_REFCLK.
  • Power Supply: Information on power supply filtering and fail-safe requirements.
  • PCB Layout: Best practices for PCB layout, including guidelines for 25G, 10G, and PCIe interfaces, as well as heat sink selection and attachment.
  • Debug and Bring-up: Recommendations for debugging and initial system bring-up.

About Broadcom

Broadcom Inc. is a global technology leader that provides industry-leading semiconductor and infrastructure software solutions. For more information, visit www.broadcom.com.

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