User Manual for BDE models including: BDE-BLEM401P, BDE-BLEM401P-U, BDE-BLEM401P Bluetooth Low Energy Module, Bluetooth Low Energy Module, Low Energy Module, Module

Bluetooth Low Energy

PDF Bluetooth Low Energy

BDE-BLEM401P Guangzhou BDE Technology Inc. 14 NC NC 15 P17 GPIO, UART2 RX 16 P14 GPIO, PWM 17 P34 GPIO, ADC CH4 18 NC NC 19 VDD Power Supply

Bluetooth Low Energy


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20220826145079887988
BDE-BLEM401P
Bluetooth Low Energy Module (BT4.2)

BDE-BLEM401P
Key Features

BDE-BLEM401P-U

 Bluetooth Dual Mode 4.2 compliant  Low-power 2.4GHz Transceiver  ARM968E Core Microprocessor integrated  160 KB programmable Flash for Program and 20 KB RAM for Data  Program code read protection  Operation voltage from 0.9 V to 3.6 V  Clock
 16 MHz crystal reference clock  64 MHz digital PLL clock  32 kHz ring oscillator  External 32 kHz crystal oscillator  MCU can run with any clock source with internal frequency divider  Interface and peripheral units  JTAG, SPI interface  UART  Multi-channels PWM output  On-chip 10 bit general ADC  13 GPIO with multiplexed interface functions  True random number generator  RF Performance  TX Power: up to 4dBm  RX Sensitivity: up to -96dBm  Communication Range: 30 meters (LOS)  Antenna:  Integrated PCB antenna ­ 401P  IPEX/U.FL connector for external antenna ­ 401P-U  Size: 16.55mm x 10.8mm x 1.5mm (Without Shielding)
16.55mm x 10.88 mm x 2.3mm (With Shielding)  Power Consumption:
Guangzhou BDE Technology Inc.

 Shutdown: 1uA (Wake up on External Events)  Standby: 8.5uA (RTC Running and RAM/CPU Retention)  RX Current: 5.1mA  TX Current @ -1dBm: 4.8mA  BQB (DID: D049515), FCC ID: 2ABRUBDLEM401P, CE, RoHS compliant
Descriptions

BDE-BLEM401P

BDE-BLEM401P is a Bluetooth 4.2 dual mode compliant module targeted at low power sensors and PC/Phone accessories.
BDE-BLEM401P highly integrates a high-performance RF transceiver, baseband, ARM9E core, programmable protocol and profile to support BLE application. The module also offers flexible hardware interfaces for the sensor application.
It enables ultra-low power connectivity and data transfer for the applications that are sensitive to power consumption, size and cost.

Block Diagram

Applications

Fig. 1: The Block Diagram of BDE-BLEM401P

 Home and Building Automation  Industrial  Retail  Health and Medical  Sports and Fitness  HID

Guangzhou BDE Technology Inc.

BDE-BLEM401P

Electrical Characteristics

 Recommended operating conditions

Rating

Min

Typ

Max

Unit

Operating Temperature

-40

-

85



VDDS

1.6

3.3

3.6

V

Pin Out

Pin Number 1 2
3
4
5 6 7 8 9 10 11 12 13

Fig. 2: The pinout of BDE-BLEM401P (TOP VIEW)

Table 1: Pin definitions of BDE- BLEM203P

Pin Name GND VDD
P04
P05
NC P32 NC NC NC NC GND NC NC

Definitions Power Ground Power Supply GPIO, SPI_SCK, SPI_MOSI (Program mode), JTAG_TDI (JTAG
mode) GPIO, SPI_MOSI, SPI_MISO (Program mode), JTAG_TDO (JTAG
mode) NC
GPIO, ADC CH2 NC NC NC NC
Power Ground NC NC
Guangzhou BDE Technology Inc.

14

NC

15

P17

16

P14

17

P34

18

NC

19

VDD

20

GND

21

P12

22

P10

23

P16

24

P00

25

P01

26

P07

27

P06

28

RST

29

GND

Overall Dimensions

BDE-BLEM401P
NC GPIO, UART2_RX
GPIO, PWM GPIO, ADC CH4
NC Power Supply Power Ground GPIO, PWM GPIO, PWM (20mA) GPIO, UART2_TX GPIO, UART_TX GPIO, UART_RX GPIO, SPI_NSS, SPI_CS (Program mode), JTAG_TMS (JTAG
mode) GPIO, SPI_MISO, SPI_SCK (Program mode), JTAG_TCK (JTAG
mode) Reset, active low Power Ground

Fig. 1 shows the overall dimensions of BDE-BLEM401P. The module measures 16.55mm long by 10.88mm wide by 2.3mm high with the shield.

Fig. 3: Overall Dimensions of BDE-BLEM401P
Guangzhou BDE Technology Inc.

Module Location for Reference

BDE-BLEM401P

In order to get a fine performance when integrate the module to your product, it is advised to use the recommended module location to the respective PCB.
 Location in X-Y plane

Fig. 4: Recommended location in X-Y plane

 Location in Z plane

Fig. 5: Not recommended location in X-Y plane

Fig. 6: Recommended location in Z plane
Guangzhou BDE Technology Inc.

BDE-BLEM401P
Fig. 7: Not recommended location in Z plane
Typical Solder Reflow Profile
Fig. 8: Typical Solder Reflow Profile
Guangzhou BDE Technology Inc.

Package Information

BDE-BLEM401P

FCC statements

Fig. 9: Package

This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and

(2) This device must accept any interference received, including interference that may cause undesired operation.

NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user's authority to operate the equipment.

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

Guangzhou BDE Technology Inc.

BDE-BLEM401P
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. The SAR limit of USA (FCC) is 1.6 W/kg averaged over one gram of tissue. Device types Panasonic ELUGA Ray 600 (FCC ID: 2APTIS60ER6) has also been tested against this SAR limit.The highest SAR value reported under this standard during product certification for use when properly worn on the body is 0.681 W/kg and for head is 0.898 W/kg. Simultaneous RF exposure is 1.233W/Kg. This device was tested for typical body-worn operations with the back of the handset kept 10mm from the body. To maintain compliance with FCC RF exposure requirements, use accessories that maintain a 10mm separation distance between the user's body and the back of the handset. The use of belt clips, holsters and similar accessories should not contain metallic components in its assembly. The use of accessories that do not satisfy these requirements may not comply with FCC RF exposure requirements, and should be avoided.
Contacts
Guangzhou BDE Technology Inc.
Address: Originality Building B2-403, 162 Science Ave, Huangpu District, Guangzhou, 510663, China 494 E Thornhill Ln, Palatine, IL 60074, USA Tel: +86-020-28065335 Fax: +86-020-28065338 Website: www.bdecomm.com Email: info@bdecomm.com
Guangzhou BDE Technology Inc.



References

Microsoft Word 2013